MPC17517DTB

Freescale Semiconductor Advance Information Document Number: MPC17517 Rev. 2.0, 7/2006 1.0 A 6.8 V Dual Motor Driver IC The 17517 is a monolithic triple totem-pole-output power IC designed to be used in portable electronic applications to control small DC motors and solenoids. The 17517 can operate efficiently with supply voltages as low as 2.0 V to as high as 6.8 V. Its low RDS(ON) totem-pole output MOSFETs (0.46 Ω typical) can provide continuous drive currents of 1.0 A and handle peak currents up to 3.0 A. It is easily interfaced to low-cost MCUs via parallel 3.0 V- or 5.0 V-compatible logic. The device can be pulse width modulated (PWM-ed) at up to 200 kHz. The 17517 can drive two motors in two directions one at a time or drive one motor in two directions and one solenoid with synchronous rectification of freewheeling currents one at a time. Two-motor operation is accomplished by hooking one motor between OUTA and OUTB and hooking the other motor between OUTB and OUTC. Motor plus solenoid operation is accomplished by hooking a motor between OUTA and OUTB and a solenoid between OUTC and GND. This device contains an integrated charge pump and level shifter (for gate drive voltages), integrated shoot-through current protection (cross-conduction suppression logic and timing), and undervoltage detection and shutdown circuitry. The 17517 has four operating modes: Forward, Reverse, Brake, and Tri-Stated (High Impedance). Features • 2.0 V to 6.8 V Continuous Operation • Output Current 1.0 A (DC), 3.0 A (Peak) • MOSFETs < 600 mΩ RDS(ON) @ 25°C Guaranteed • 3.0 V/ 5.0 V TTL- / CMOS-Compatible Inputs • PWM Frequencies up to 200 kHz • Undervoltage Shutdown 17517 DUAL MOTOR DRIVER DTB SUFFIX 98ASH70247A 16-PIN TSSOP ORDERING INFORMATION Device MPC17517DTB/R2 Temperature Range (TA) -20°C to 65°C Package 16 TSSOP 5.0 V 17517 VDD C1L C1H C2L C2H Cres EN1 EN2 IN1 IN2 5.0 V VM OUTC OUTA Solenoid MOTOR MCU OUTB GND Figure 1. 17517 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2006. All rights reserved. INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM C2L OSC, Charge Pump C2H C1H Low Voltage Detector C1L VG VMAB VC VMC IN1 Level Shifter Predriver OUTC EN1 Control Logic IN2 OUTB OUTA EN2 GND Figure 2. 17517 Simplified Internal Block Diagram 17517 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS VDD VM OUTA CRES C2H C2L IN1 IN2 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 OUTC GND OUTB VM C1H C1L EN2 EN1 Figure 3. 17517 Pin Connections Table 1. 17517 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 9. Pin Number 1 2, 13 3 4 5 6 7 8 9 10 11 12 14 15 16 Pin Name VDD VM OUTA CRES C2H C2L IN1 IN2 EN1 EN2 C1L C1H OUTB GND OUTC Formal Name Control Circuit Power Supply Motor Drive Power Supply Output A Charge Pump Output Capacitor Connection Charge Pump 2H Charge Pump 2L Input Control 1 Input Control 2 Enable Control Signal Input 1 Enable Control Signal Input 2 Charge Pump 1L Charge Pump 1H Output B Ground Output C Definition Positive power source connection for control circuit. Motor power supply voltage input pins. Driver output A pin. Charge pump reservoir capacitor pin. Charge pump bucket capacitor 2 (positive pole). Charge pump bucket capacitor 2 (negative pole). Control signal input 1 pin. Control signal input 2 pin. Enable control signal input 1 pin. Enable control signal input 2 pin. Charge pump bucket capacitor 1 (negative pole). Charge pump bucket capacitor 1 (positive pole). Driver output B pin. Ground connection. Driver output C pin. 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 3 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings ELECTRICAL RATINGS Motor Supply Voltage Charge Pump Output Voltage Logic Supply Voltage Signal Input Voltage Driver Output Current Continuous Peak (1) ESD Voltage (2) Symbol Value Unit VM -0.5 to 8.0 -0.5 to 14 -0.5 to 7.0 -0.5 to VDD + 0.5 1.0 3.0 V V V V A V CRES VDD VIN IO IOPK V VESD1 VESD2 ± 2000 ± 100 Human Body Model Machine Model THERMAL RATINGS Storage Temperature Range Operating Junction Temperature Operating Ambient Temperature Thermal Resistance Power Dissipation (3) TSTG TJ TA RθJA PD -65 to 150 -20 to 150 -20 to 65 190 657 245 °C °C °C °C/W mW °C (4) (5) Soldering Temperature TSOLDER Notes 1. TA = 25°C, 10 ms pulse width at 200 ms intervals. 2. 3. 4. 5. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 37 mm x 50 mm Cu area (1.6 mm FR-4 PCB). Maximum at TA = 25°C. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 17517 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions TA = 25°C, VDD = VM = 5.0 V, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic POWER Motor Supply Voltage Logic Supply Voltage Capacitor for Charge Pump Standby Power Supply Current Motor Supply Standby Current Logic Supply Standby Current Operating Power Supply Current Logic Supply Current (7) (6) Symbol Min Typ Max Unit VM VDD C1, C2, C3 I I VMSTBY 2.0 2.7 0.01 5.0 5.0 0.1 6.8 5.7 1.0 V V µF µA mA mA – – – – 1.0 1.0 VDDSTBY I Charge Pump Circuit Supply Current Low-Voltage Detection Circuit Detection Voltage (VDD) (8) IC VDD RES – – – – 3.0 0.7 V VDDDET 1.5 RDS(ON) – 2.0 0.46 2.5 0.60 Driver Output ON Resistance (9) GATE DRIVE Gate Drive Voltage (10) No Current Load Gate Drive Ability (Internally Supplied) I CRES = -1.0 mA V W VC RES 12 CRESLOAD 10 11.2 – 13 13.5 V V CONTROL LOGIC Logic Input Voltage Logic Input Function (2.7 V < VDD < 5.7 V) High-Level Input Voltage Low-Level Input Voltage High-Level Input Current Low-Level Input Current Notes 6. 7. 8. 9. 10. IV I DDSTBY includes current to the predriver circuit. VIN VIH VIL IIH IIL 0 – VDD – VDD x 0.3 1.0 – V VDD x 0.7 – – -1.0 – – – – V V µA µA VDD includes current to the predriver circuit. Detection voltage is defined as when the output becomes high-impedance after VDD drops below the detection threshold. When the gate V V voltage CRES is applied from an external source, CRES = 7.5 V. IO = 1.0 A source + sink. Input logic signal not present. 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions TA = 25°C, VDD = VM = 5.0 V, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic INPUT (IN1, IN2, EN1, EN2) Pulse Input Frequency Input Pulse Rise Time Input Pulse Fall Time OUTPUT Propagation Delay Time Turn-ON Time Turn-OFF Time Charge Pump Wake-Up Time (14) Low-Voltage Detection Time Notes 11. 12. 13. 14. tPLH tPHL tVGON tV DET DD (11) Symbol Min Typ Max Unit fIN tR tF – – – – – – 200 1.0 1.0 (12) (12) kHz µs µs (13) µs – – – – 0.1 0.1 0.1 – 0.5 0.5 3.0 10 ms ms Time is defined between 10% and 90%. That is, the input waveform slope must be steeper than this. Time is defined between 90% and 10%. When C1 = C2 = C3 = 0.1 µF. 17517 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS IN1, IN2, EN1, EN2 50% VDD 0.8 V/ 1.5 V VDDDETon 2.5 V/3.5 V 50% VDDDEToff tPLH OUTA, OUTB, OUTC 90% tPHL tV DDDET tV 90% DDDET 10% IM 0% ( VCRES /0.02 Ω RG NC NC NC NC C1L C1H C2L C2H CRES VDD VM OUTA 0.01 µF EN1 OUTB MCU EN2 IN1 IN1 GND OUTC NC = No Connect Figure 7. 17517 Typical Application Diagram CEMF SNUBBING TECHNIQUES Care must be taken to protect the IC from potentially damaging CEMF spikes induced when commutating currents in inductive loads. Typical practice is to provide snubbing of voltage transients by placing a capacitor or zener at the supply pin (VM) (see Figure 8). PCB LAYOUT When designing the printed circuit board (pcb), connect sufficient capacitance between power supply and ground pins to ensure proper filtering from transients. For all highcurrent paths, use wide copper traces and shortest possible distances. 5.0 V 5.0 V 17517 VDD VM C1L C1H C2L C2H CRES OUT OUT 5.0 V 5.0 V 17517 VDD VM C1L C1H C2L C2H CRES OUT OUT GND GND Figure 8. CEMF Snubbing Techniques 17517 10 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. DTB SUFFIX 16-PIN PLASTIC PACKAGE 98ASH70247A ISSUE B 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 11 PACKAGING PACKAGE DIMENSIONS DTB SUFFIX 16-PIN PLASTIC PACKAGE 98ASH70247A ISSUE B 17517 12 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY REVISION 2.0 DATE 7/2006 DESCRIPTION OF CHANGES • Implemented Revision History page • Converted to Freescale format and updated to the prevailing form and style 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http:// www.freescale.com/epp. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2006. All rights reserved. MPC17517 Rev. 2.0 7/2006