Freescale Semiconductor
Technical Data
MPC8280EC Rev. 1.7, 12/2006
MPC8280 PowerQUICC II™ Family Hardware Specifications
This document contains detailed information about power considerations, DC/AC electrical characteristics, and AC timing specifications for .13µm (HiP7) members of the PowerQUICC II™ family of integrated communications processors—the MPC8280, the MPC8275, and the MPC8270 (collectively called 'the MPC8280' throughout this document).
Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . 7 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . 8 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 11 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC Electrical Characteristics . . . . . . . . . . . . . . . . . . 14 Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 24 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 73 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 76 Document Revision History . . . . . . . . . . . . . . . . . . . 76
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11.
© Freescale Semiconductor, Inc., 2004, 2006. All rights reserved.
Overview
1
Overview
Table 1. MPC8280 PowerQUICC II Family Functionality
Devices Functionality MPC8270 Package 1 480 TBGA Serial communications controllers (SCCs) QUICC multi-channel controller (QMC) Fast communication controllers (FCCs) I-Cache (Kbyte) D-Cache (Kbyte) Ethernet (10/100) UTOPIA II Ports Multi-channel controllers (MCCs) PCI bridge Transmission convergence (TC) layer Inverse multiplexing for ATM (IMA) Universal serial bus (USB) 2.0 full/low rate Security engine (SEC)
1
Table 1 shows the functionality supported by each device in the MPC8280 family.
MPC8275 516 PBGA 4 — 3 16 16 3 2 1 Yes — — 1 —
MPC8280 480 TBGA 4 — 3 16 16 3 2 2 Yes Yes Yes 1 —
516 PBGA 4 — 3 16 16 3 0 1 Yes — — 1 —
4 — 3 16 16 3 0 1 Yes — — 1 —
Refer to Table 2.
Devices in the MPC8280 family are available in three packages—the standard ZU package and the alternate VR or ZQ packages—as shown in Table 2. Note that throughout this document references to the MPC8280 and the MPC8270 are inclusive of VR and ZQ package devices unless otherwise specified. For more information on VR and ZQ packages, contact your Freescale sales office. For package ordering information, refer to Section 10, “Ordering Information.”
Table 2. HiP7 PowerQUICC II Device Packages
Code (Package) Device MPC8270 MPC8270VR MPC8270ZQ ZU (480 TBGA—Leaded) MPC8280 VR (516 PBGA—Lead free) MPC8275VR ZQ (516 PBGA—Lead spheres) MPC8275ZQ
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 2 Freescale Semiconductor
Overview
Figure 1 shows the block diagram. Shaded portions are device-specific; refer to the notes below.
16 Kbytes I-Cache I-MMU G2_LE Core System Interface Unit (SIU) 16 Kbytes D-Cache D-MMU Bus Interface Unit 60x-to-PCI Bridge 60x-to-Local Bridge Memory Controller Serial DMAs 4 Virtual IDMAs Clock Counter System Functions 60x Bus
PCI Bus
32 bits, up to 66 MHz or
Local Bus
32 bits, up to 100 MHz
Communication Processor Module (CPM) Timers Parallel I/O Baud Rate Generators Interrupt Controller 32 KB Instruction RAM 32 KB Data RAM
32-bit RISC Microcontroller and Program ROM
IMA 1 Microcode
MCC11
MCC2
FCC1
FCC2
FCC3
SCC1
SCC2
SCC3
SCC4/ USB
SMC1
SMC2
SPI
I2C
TC Layer Hardware1
Time Slot Assigner Serial Interface2
8 TDM Ports2
3 MII or RMII Ports
2 UTOPIA Ports3
Non-Multiplexed I/O
Notes: 1 MPC8280 only (not on MPC8270, the VR package, nor the ZQ package) 2 MPC8280 has 2 serial interface (SI) blocks and 8 TDM ports. MPC8270 and the VR and ZQ packages have only 1 SI block and 4 TDM ports (TDM2[A–D]). 3 MPC8280, MPC8275VR, MPC8275ZQ only (not on MPC8270, MPC8270VR, nor MPC8270ZQ)
Figure 1. MPC8280 Block Diagram
1.1 Features
The major features of the MPC8280 are as follows: • Dual-issue integer (G2_LE) core — A core version of the EC603e microprocessor — System core microprocessor supporting frequencies of 166–450 MHz — Separate 16-Kbyte data and instruction caches: – Four-way set associative – Physically addressed – LRU replacement algorithm — Architecture-compliant memory management unit (MMU) — Common on-chip processor (COP) test interface
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 3
Overview
• •
•
•
•
•
— High-performance (SPEC95 benchmark at 450 MHz; 855 Dhrystones MIPS at 450 MHz) — Supports bus snooping for data cache coherency — Floating-point unit (FPU) Separate power supply for internal logic and for I/O Separate PLLs for G2_LE core and for the CPM — G2_LE core and CPM can run at different frequencies for power/performance optimization — Internal core/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1, 6:1, 7:1, 8:1 ratios — Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1, 8:1 ratios 64-bit data and 32-bit address 60x bus — Bus supports multiple master designs — Supports single- and four-beat burst transfers — 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller — Supports data parity or ECC and address parity 32-bit data and 18-bit address local bus — Single-master bus, supports external slaves — Eight-beat burst transfers — 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller 60x-to-PCI bridge — Programmable host bridge and agent — 32-bit data bus, 66.67/83.3/100 MHz, 3.3 V — Synchronous and asynchronous 60x and PCI clock modes — All internal address space available to external PCI host — DMA for memory block transfers — PCI-to-60x address remapping PCI bridge — PCI Specification Revision 2.2 compliant and supports frequencies up to 66 MHz — On-chip arbitration — Support for PCI-to-60x-memory and 60x-memory-to-PCI streaming — PCI host bridge or peripheral capabilities — Includes 4 DMA channels for the following transfers: – PCI-to-60x to 60x-to-PCI – 60x-to-PCI to PCI-to-60x – PCI-to-60x to PCI-to-60x – 60x-to-PCI to 60x-to-PCI — Includes all of the configuration registers (which are automatically loaded from the EPROM and used to configure the MPC8280) required by the PCI standard as well as message and doorbell registers — Supports the I2O standard — Hot-swap friendly (supports the hot swap specification as defined by PICMG 2.1 R1.0 August 3, 1998) — Support for 66.67/83.33/100 MHz, 3.3 V specification — 60x-PCI bus core logic that uses a buffer pool to allocate buffers for each port
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
4
Freescale Semiconductor
Overview
•
•
• •
— Uses the local bus signals, removing need for additional pins System interface unit (SIU) — Clock synthesizer — Reset controller — Real-time clock (RTC) register — Periodic interrupt timer — Hardware bus monitor and software watchdog timer — IEEE 1149.1 JTAG test access port 12-bank memory controller — Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other user- definable peripherals — Byte write enables and selectable parity generation — 32-bit address decodes with programmable bank size — Three user-programmable machines, general-purpose chip-select machine, and page-mode pipeline SDRAM machine — Byte selects for 64-bus width (60x) and byte selects for 32-bus width (local) — Dedicated interface logic for SDRAM CPU core can be disabled and the device can be used in slave mode to an external core Communications processor module (CPM) — Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support for communications protocols — Interfaces to G2_LE core through an on-chip 32-Kbyte dual-port data RAM, an on-chip 32-Kbyte dual-port instruction RAM and DMA controller — Serial DMA channels for receive and transmit on all serial channels — Parallel I/O registers with open-drain and interrupt capability — Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers — Three fast communications controllers supporting the following protocols: – 10/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent interface (MII) or reduced media independent interface (RMII) – ATM—Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5, AAL1, AAL0 protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 64 K external connections (no ATM support for the MPC8270) – Transparent – HDLC—Up to T3 rates (clear channel) – FCC2 can also be connected to the TC layer (MPC8280 only) — Two multichannel controllers (MCCs) (one MCC on the MPC8270) – Each MCC handles 128 serial, full-duplex, 64-Kbps data channels. Each MCC can be split into four subgroups of 32 channels each. – Almost any combination of subgroups can be multiplexed to single or multiple TDM interfaces up to four TDM interfaces per MCC
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 5
Overview
— Four serial communications controllers (SCCs) identical to those on the MPC860, supporting the digital portions of the following protocols: – Ethernet/IEEE 802.3 CDMA/CS – HDLC/SDLC and HDLC bus – Universal asynchronous receiver transmitter (UART) – Synchronous UART – Binary synchronous (BISYNC) communications – Transparent — Universal serial bus (USB) controller – Supports USB 2.0 full/low rate compatible – USB host mode – Supports control, bulk, interrupt, and isochronous data transfers – CRC16 generation and checking – NRZI encoding/decoding with bit stuffing – Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and data rate configuration). Note that low-speed operation requires an external hub. – Flexible data buffers with multiple buffers per frame – Supports local loopback mode for diagnostics (12 Mbps only) – Supports USB slave mode – Four independent endpoints support control, bulk, interrupt, and isochronous data transfers – CRC16 generation and checking – CRC5 checking – NRZI encoding/decoding with bit stuffing – 12- or 1.5-Mbps data rate – Flexible data buffers with multiple buffers per frame – Automatic retransmission upon transmit error — Two serial management controllers (SMCs), identical to those of the MPC860 – Provide management for BRI devices as general circuit interface (GCI) controllers in timedivision-multiplexed (TDM) channels – Transparent – UART (low-speed operation) — One serial peripheral interface identical to the MPC860 SPI — One inter-integrated circuit (I2C) controller (identical to the MPC860 I2C controller) – Microwire compatible – Multiple-master, single-master, and slave modes — Up to eight TDM interfaces (four on the MPC8270) – Supports two groups of four TDM channels for a total of eight TDMs (one group of four on the MPC8270 and the MPC8275) – 2,048 bytes of SI RAM – Bit or byte resolution – Independent transmit and receive routing, frame synchronization
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 6 Freescale Semiconductor
Operating Conditions
• •
– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN primary rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and user-defined TDM serial interfaces — Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs, SCCs, SMCs, and serial channels — Four independent 16-bit timers that can be interconnected as two 32-bit timers Inverse multiplexing for ATM capabilities (IMA) (MPC8280 only).Supported by eight transfer transmission convergence (TC) layers between the TDMs and FCC2. Transmission convergence (TC) layer (MPC8280 only)
2
Operating Conditions
Table 3. Absolute Maximum Ratings 1
Rating Core supply voltage 2 PLL supply voltage2
3 4
Table 3 shows the maximum electrical ratings.
Symbol VDD VCCSYN VDDH VIN Tj TSTG
Value -0.3 – 2.25 -0.3 – 2.25 -0.3 – 4.0 GND(-0.3) – 3.6 120 (-55) – (+150)
Unit V V V V °C °C
I/O supply voltage Input voltage
Junction temperature Storage temperature range
1
Absolute maximum ratings are stress ratings only; functional operation (see Table 4) at the maximums is not guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage. 2 Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V during normal operation. It is recommended that VDD/VCCSYN should be raised before or simultaneous with VDDH during power-on reset. VDD/VCCSYN may exceed VDDH by more than 0.4 V during power-on reset for no more than 100 ms. 3 Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH should not exceed VDD/VCCSYN by more than 2.5 V during normal operation. 4 Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset.
Table 4 lists recommended operational voltage conditions.
Table 4. Recommended Operating Conditions 1
Rating Core supply voltage PLL supply voltage I/O supply voltage Input voltage Junction temperature (maximum) Ambient temperature
1
Symbol VDD VCCSYN VDDH VIN Tj TA
Value 1.45 – 1.60 1.45 – 1.60 3.135 – 3.465 GND (-0.3) – 3.465 105 2 0–702
Unit V V V V °C °C
Caution: These are the recommended and tested operating conditions. Proper operation outside of these conditions is not guaranteed. 2 Note that for extended temperature parts the range is (-40)T – 105Tj.
A
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 7
DC Electrical Characteristics
This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (either GND or VCC). Figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the MPC8280. Note that in PCI mode the I/O interface is different.
4V GVDD + 5% GVDD
VIH
VIL
GND GND – 0.3 V GND – 1.0 V Not to exceed 10% of tSDRAM_CLK
Figure 2. Overshoot/Undershoot Voltage
3
DC Electrical Characteristics
Table 5. DC Electrical Characteristics 1
Characteristic Input high voltage— all inputs except TCK, TRST and PORESET 2 Input low voltage CLKIN input high voltage CLKIN input low voltage Input leakage current, VIN = VDDH 3 V4 Hi-Z (off state) leakage current, VIN = VDDH3 Signal low input current, VIL = 0.8 Signal high input current, VIH = 2.0 V Output high voltage, IOH = –2 mA except UTOPIA mode, and open drain pins In UTOPIA mode 5 (UTOPIA pins only): IOH = -8.0mA PA[0-31] PB[4-31] PC[0-31] PD[4-31] Symbol VIH VIL VIHC VILC IIN IOZ IL IH VOH Min 2.0 GND 2.4 GND — — — — 2.4 Max 3.465 0.8 3.465 0.4 10 10 1 1 — Unit V V V V µA µA µA µA V
Table 5 shows DC electrical characteristics.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 8 Freescale Semiconductor
DC Electrical Characteristics
Table 5. DC Electrical Characteristics 1 (continued)
Characteristic In UTOPIA PA[0-31] PB[4-31] PC[0-31] PD[4-31] mode5 (UTOPIA pins only): IOL = 8.0mA Symbol VOL Min — Max 0.5 Unit V
IOL = 6.0mA BR BG ABB/IRQ2 TS A[0-31] TT[0-4] TBST TSIZE[0–3] AACK ARTRY DBG DBB/IRQ3 D[0-63] DP(0)/RSRV/EXT_BR2 DP(1)/IRQ1/EXT_BG2 DP(2)/TLBISYNC/IRQ2/EXT_DBG2 DP(3)/IRQ3/EXT_BR3/CKSTP_OUT DP(4)/IRQ4/EXT_BG3/CORE_SREST DP(5)/TBEN/EXT_DBG3/IRQ5/CINT DP(6)/CSE(0)/IRQ6 DP(7)/CSE(1)/IRQ7 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 WT/BADDR30/IRQ3 L2_HIT/IRQ4 CPU_BG/BADDR31/IRQ5/CINT CPU_DBG CPU_BR IRQ0/NMI_OUT IRQ7/INT_OUT/APE PORESET HRESET SRESET RSTCONF
VOL
—
0.4
V
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 9
DC Electrical Characteristics
Table 5. DC Electrical Characteristics 1 (continued)
Characteristic IOL = 5.3mA CS[0-9] CS(10)/BCTL1 CS(11)/AP(0) BADDR[27–28] ALE BCTL0 PWE[0–7]/PSDDQM[0–7]/PBS[0–7] PSDA10/PGPL0 PSDWE/PGPL1 POE/PSDRAS/PGPL2 PSDCAS/PGPL3 PGTA/PUPMWAIT/PGPL4/PPBS PSDAMUX/PGPL5 LWE[0–3]LSDDQM[0–3]/LBS[0–3]/PCI_CFG[0–3] LSDA10/LGPL0/PCI_MODCKH0 LSDWE/LGPL1/PCI_MODCKH1 LOE/LSDRAS/LGPL2/PCI_MODCKH2 LSDCAS/LGPL3/PCI_MODCKH3 LGTA/LUPMWAIT/LGPL4/LPBS LSDAMUX/LGPL5/PCI_MODCK LWR MODCK[1–3]/AP[1–3]/TC[0–2]/BNKSEL[0–2] IOL = 3.2mA L_A14/PAR L_A15/FRAME/SMI L_A16/TRDY L_A17/IRDY/CKSTP_OUT L_A18/STOP L_A19/DEVSEL L_A20/IDSEL L_A21/PERR L_A22/SERR L_A23/REQ0 L_A24/REQ1/HSEJSW L_A25/GNT0 L_A26/GNT1/HSLED L_A27/GNT2/HSENUM L_A28/RST/CORE_SRESET L_A29/INTA L_A30/REQ2 L_A31 LCL_D[0-31]/AD[0-31] LCL_DP[0-3]/C/BE[0-3] PA[0–31] PB[4–31] PC[0–31] PD[4–31] TDO QREQ
1
Symbol VOL
Min —
Max 0.4
Unit V
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs. 2 TCK, TRST and PORESET have min VIH = 2.5V.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 10 Freescale Semiconductor
Thermal Characteristics
3 4
The leakage current is measured for nominal VDDH,VCCSYN, and VDD. VIL for IIC interface does not match IIC standard, but does meet IIC standard for VOL and should not cause any compatibility issue. 5 MPC8280, MPC8275VR, MPC8275ZQ only.
4
Thermal Characteristics
Table 6 describes thermal characteristics for both the packages. See Table 2 for information about a given device’s package. For the discussions sections 4.1 and 4.5, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
Table 6. Thermal Characteristics
Value Characteristic Symbol 480 TBGA Junction to ambient— single-layer board 1 Junction to ambient— four-layer board Junction to board Junction to case 3 Junction-to-package top 4
1 2 2
Unit 516 PBGA 27 21 19 16 11 8 2 °C/W °C/W °C/W °C/W °C/W
Air Flow
16 RθJA 11 12 RθJA RθJB RθJC ΨJT 9 6 2 2
Natural convection 1 m/s Natural convection 1 m/s — — —
Assumes no thermal vias. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 4 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
4.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in TJ = TA + (RθJA × PD) where: TA = ambient temperature (ºC) RθJA = package junction-to-ambient thermal resistance (ºC/W) PD = power dissipation in package The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible. C can be obtained from the following equation:
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 11
Thermal Characteristics
4.2 Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: RθJA = RθJC + RθCA where: RθJA = junction-to-ambient thermal resistance (ºC/W) RθJC = junction-to-case thermal resistance (ºC/W) RθCA = case-to-ambient thermal resistance (ºC/W) RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the air flow around the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most packages, a better model is required.
4.3 Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two-resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case thermal resistance covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the printed circuit board. It has been observed that the thermal performance of most plastic packages, especially PBGA packages, is strongly dependent on the board temperature. If the board temperature is known, an estimate of the junction temperature in the environment can be made using the following equation: TJ = TB + (RθJB × PD) where: RθJB = junction-to-board thermal resistance (ºC/W) TB = board temperature (ºC) PD = power dissipation in package If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made. For this method to work, the board and board mounting must be similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a power and a ground plane) and by attaching the thermal balls to the ground plane.
4.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor model can be used with the thermal simulation of the application, or a more accurate and complex model of the package can be used in the thermal simulation.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 12 Freescale Semiconductor
Power Dissipation
4.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT + (ΨJT × PD) where: ΨJT = thermal characterization parameter TT = thermocouple temperature on top of package PD = power dissipation in package The thermal characterization parameter is measured per JEDEC JESD51-2 specification using a 40-gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the case to avoid measurement errors caused by cooling effects of the thermocouple wire.
4.6 Layout Practices
Each VDD and VDDH pin should be provided with a low-impedance path to the board’s power supplies. Each ground pin should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct groups of logic on chip. The VDD and VDDH power supplies should be bypassed to ground using by-pass capacitors located as close as possible to the four sides of the package. For filtering high frequency noise, a capacitor of 0.1uF on each VDD and VDDH pin is recommended. Further, for medium frequency noise, a total of 2 capacitors of 47uF for VDD and 2 capacitors of 47uF for VDDH are also recommnded. The capacitor leads and associated printed circuit traces connecting to chip VDD, VDDH and ground should be kept to less than half an inch per capacitor lead. Boards should employ separate inner layers for power and GND planes. All output pins on the MPC8280 have fast rise and fall times. Printed circuit (PC) trace interconnection length should be minimized to minimize overdamped conditions and reflections caused by these fast output switching times. This recommendation particularly applies to the address and data buses. Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher capacitive loads because these loads create higher transient currents in the VDD and GND circuits. Pull up all unused inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
5
Power Dissipation
Table 7 provides preliminary, estimated power dissipation for various configurations. Note that suitable thermal management is required to ensure the junction temperature does not exceed the maximum specified value. Also note that the I/O power should be included when determining whether to use a heat sink. For a complete list of possible clock configurations, refer to Section 7, “Clock Configuration Modes.”
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 13
AC Electrical Characteristics
Table 7. Estimated Power Dissipation for Various Configurations 1
CPM Multiplication Factor 2.5 2.5 3 3.5 3 3 3.5 3 3 CPU Multiplication Factor 3.5 4 4 4.5 4 4.5 5 4 4.5 PINT(W) 2, 3 CPU (MHz) Vddl 1.5 Volts Nominal 66.67 66.67 66.67 66.67 83.33 83.33 83.33 100 100
1 2
Bus (MHz)
CPM (MHz)
Maximum 1.0 1.05 1.1 1.15 1.35 1.4 1.55 1.6 1.65
166 166 200 233 250 250 292 300 300
233 266 266 300 333 375 417 400 450
0.95 1.0 1.05 1.05 1.25 1.3 1.45 1.5 1.55
Test temperature = 105° C PINT = IDD x VDD Watts 3 Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds: 66.7 MHz = 0.45 W (nominal), 0.5 W (maximum) 83.3 MHz = 0.5W (nominal), 0.6 W (maximum) 100 MHz = 0.6 W (nominal), 0.7 W (maximum)
6
AC Electrical Characteristics
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and inputs for 66.67/83.33/100 MHz devices. Note that AC timings are based on a 50-pf load for MAX Delay and 10-pf load for MIN delay. Typical output buffer impedances are shown in Table 8.
Table 8. Output Buffer Impedances 1
Output Buffers 60x bus Local bus Memory controller Parallel I/O PCI
1 2
Typical Impedance (Ω) 45 or 27 2 45 45 or 272 45 27
These are typical values at 65° C. Impedance may vary by ±25% with process and temperature. On silicon revision 0.0 (mask #: 0K49M), selectable impedance is not available. Impedance is set at 45 Ω. On all other revisions, impedance value is selected through the SIUMCR[20,21]. Refer to the MPC8280 PowerQUICC II Family Reference Manual.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 14 Freescale Semiconductor
AC Electrical Characteristics
6.1 CPM AC Characteristics
Table 9 lists CPM output characteristics.
Table 9. AC Characteristics for CPM Outputs 1
Spec Number Max Min Characteristic Maximum Delay 66 MHz sp36a sp37a FCC outputs—internal clock (NMSI) sp36b sp37b FCC outputs—external clock (NMSI) sp38a sp39a SCC/SMC/SPI/I2C outputs—internal clock (NMSI) sp38b sp39b SCC/SMC/SPI/I2C outputs—external clock (NMSI) sp40 sp42 sp41 TDM outputs/SI sp43 TIMER/IDMA outputs 6 8 10 8 11 11 11 Value (ns) Minimum Delay 83 MHz 100 MHz 0.5 2 0 2 2.5 0.5 0.5 0.5 2 0 2 2.5 0.5 0.5
83 MHz 100 MHz 66 MHz 5.5 8 10 8 11 11 11 5.5 8 10 8 11 11 11 0.5 2 0 2 2.5 0.5 0.5
sp42a sp43a PIO outputs
1
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin.
Table 10 lists CPM input characteristics. NOTE: Rise/Fall Time on CPM Input Pins It is recommended that the rise/fall time on CPM input pins should not exceed 5 ns. This should be enforced especially on clock signals. Rise time refers to signal transitions from 10% to 90% of VCC; fall time refers to transitions from 90% to 10% of VCC.
Table 10. AC Characteristics for CPM Inputs 1
Spec Number Setup Hold Characteristic 66 MHz sp16a sp17a FCC inputs—internal clock (NMSI) sp16b sp17b FCC inputs—external clock (NMSI) sp18a sp19a SCC/SMC/SPI/I2C inputs—internal clock (NMSI) sp18b sp19b SCC/SMC/SPI/I2C inputs—external clock (NMSI) sp20 sp22
1
Value (ns) Setup 83 MHz 100 MHz 66 MHz 6 2.5 6 4 5 8 6 2.5 6 4 5 8 0 2 0 2 2.5 0.5 Hold 83 MHz 100 MHz 0 2 0 2 2.5 0.5 0 2 0 2 2.5 0.5
6 2.5 6 4 5 8
sp21 TDM inputs/SI sp23 PIO/TIMER/IDMA inputs
Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are measured at the pin.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 15
AC Electrical Characteristics
NOTE Although the specifications generally reference the rising edge of the clock, the following AC timing diagrams also apply when the falling edge is the active edge. Figure 3 shows the FCC internal clock.
BRG_OUT sp17a sp16a FCC input signals sp36a/sp37a FCC output signals
Note: When GFMR[TCI] = 0
sp36a/sp37a
FCC output signals
Note: When GFMR.[TCI] = 1
Figure 3. FCC Internal Clock Diagram
Figure 4 shows the FCC external clock.
Serial ClKin sp17b sp16b FCC input signals sp36b/sp37b FCC output signals
Note: When GFMR[TCI] = 0
sp36b/sp37b FCC output signals
Note: When GFMR[TCI] = 1
Figure 4. FCC External Clock Diagram
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 16 Freescale Semiconductor
AC Electrical Characteristics
Figure 5 shows the SCC/SMC/SPI/I2C external clock.
Serial CLKin sp18b SCC/SMC/SPI/I2C input signals
(See note)
sp19b
sp38b/sp39b SCC/SMC/SPI/I2C output signals
(See note)
Note: There are four possible timing conditions for SCC and SPI: 1. Input sampled on the rising edge and output driven on the rising edge (shown). 2. Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge.
Figure 5. SCC/SMC/SPI/I2C External Clock Diagram
Figure 6 shows the SCC/SMC/SPI/I2C internal clock.
BRG_OUT sp18a SCC/SMC/SPI/I2C input signals
(See note)
sp19a
sp38a/sp39a SCC/SMC/SPI/I2C output signals
(See note)
Note: There are four possible timing conditions for SCC and SPI: 1. Input sampled on the rising edge and output driven on the rising edge (shown). 2. Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge.
Figure 6. SCC/SMC/SPI/I2C Internal Clock Diagram
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 17
AC Electrical Characteristics
Figure 7 shows TDM input and output signals.
Serial CLKin sp20 TDM input signals sp40/sp41 TDM output signals Note: There are four possible TDM timing conditions: 1. Input sampled on the rising edge and output driven on the rising edge (shown). 2. Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge. sp21
Figure 7. TDM Signal Diagram
Figure 8 shows PIO and timer signals.
Sys clk
sp23 sp22 PIO/IDMA/TIMER[TGATE assertion] input signals
(See note)
sp23 sp22
TIMER input signal [TGATE deassertion]
(See note)
sp42/sp43 IDMA output signals sp42/sp43 sp42a/sp43a TIMER(sp42/43)/ PIO(sp42a/sp43a) output signals Note: TGATE is asserted on the rising edge of the clock; it is deasserted on the falling edge.
Figure 8. PIO and Timer Signal Diagram
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 18 Freescale Semiconductor
AC Electrical Characteristics
6.2 SIU AC Characteristics
NOTE: CLKIN Jitter and Duty Cycle The CLKIN input to the MPC8280 should not exceed +/– 150 psec of jitter (peak-to-peak). This represents total input jitter—the combination of short term (cycle-to-cycle) and long term (cumulative). The duty cycle of CLKIN should not exceed the ratio of 40:60. The rise/file time of CLKIN should adhere to the typical SDRAM device AC clock requirement of 1 V/ns to meet SDRAM AC specs. NOTE: Spread Spectrum Clocking Spread spectrum clocking is allowed with 1% input frequency down-spread at maximum 60 KHz modulation rate regardless of input frequency. NOTE: PCI AC Timing The MPC8280 meets the timing requirements of PCI Specification Revision 2.2. Refer to Sections 7.2 and 7.3 and “Note: Tval (Output Hold)” to determine if a specific clock configuration is compliant. Table 11 lists SIU input characteristics.
Table 11. AC Characteristics for SIU Inputs 1
Spec Number Setup Hold Characteristic 66 MHz sp11 sp12 sp13 sp13a sp14 sp14a sp15
1
Value (ns) Setup 83 MHz 100 MHz 66 MHz 5 4 5 4 5 4 4 3.5 3.5 3.5 2.5 3.5 2.5 3.5 0.5 0.5 0.5 0.5 0.5 — 0.5 Hold 83 MHz 100 MHz 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
sp10 AACK/TA/TS/DBG/BG/BR/ARTRY/ TEA sp10 Data bus in normal mode sp10 Data bus in ECC and PARITY modes sp10 Pipeline mode—Data bus (with or without ECC/PARITY) sp10 DP pins sp10 Pipeline mode—DP pins sp10 All other pins
6 5 7 5 7 — 5
Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are measured at the pin.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 19
AC Electrical Characteristics
Table 12 lists SIU output characteristics.
Table 12. AC Characteristics for SIU Outputs 1
Spec Number Max Min Characteristic Maximum Delay 66 MHz sp31 sp32 sp33a sp33b sp34 sp35 sp35a
1
Value (ns) Minimum Delay 83 MHz 100 MHz 1 1 0.7 1 1 1 1 1 1 0.7 1 1 1 1
83 MHz 100 MHz 66 MHz 6 6.5 6.5 5.5 5.5 5.5 7 5.5 5.5 5.5 5.5 5.5 5.5 7 1 1 0.7 1 1 1 1
sp30 PSDVAL/TEA/TA sp30 ADD/ADD_atr./BADDR/CI/GBL/WT sp30 Data bus 2 sp30 DP sp30 Memory controller signals/ALE sp30 All other signals sp30 AP
7 8 6.5 6 6 6 7
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. 2 To achieve 1 ns of hold time at 66, 83, or 100 MHz, a minimum loading of 20 pF is required.
NOTE Activating data pipelining (setting BRx[DR] in the memory controller) improves the AC timing.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 20 Freescale Semiconductor
AC Electrical Characteristics
Figure 9 shows the interaction of several bus signals.
CLKin sp11 AACK/TA/TS/ DBG/BG/BR input signals sp11a ARTRY/TEA input signals sp12 DATA bus normal mode input signal sp15 All other input signals sp31 PSDVAL/TEA/TA output signals sp32 ADD/ADD_atr/BADDR/CI/ GBL/WT output signals sp33a DATA bus output signals sp30 sp30 sp10 sp10 sp10 sp10
sp30
sp35
sp30
All other output signals (except AP) AP signals
sp35a
sp30
Figure 9. Bus Signals
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 21
AC Electrical Characteristics
Figure 10 shows signal behavior for all parity modes (including ECC, RMW parity, and standard parity).
CLKin sp10 sp13 DATA bus, ECC, and PARITY mode input signals sp10 sp13a Pipeline mode— DATA bus, ECC, and PARITY mode input signals sp14 DP mode input signal sp10 sp14a Pipeline mode— DP mode input signal sp33b DP mode output signal sp30
sp10
Figure 10. Parity Mode Diagram
Figure 11 shows signal behavior in MEMC mode.
CLKin
V_CLK
Memory controller signals
sp34/sp30
Figure 11. MEMC Mode Diagram
NOTE Generally, all MPC8280 bus and system output signals are driven from the rising edge of the input clock (CLKin). Memory controller signals, however, trigger on four points within a CLKin cycle. Each cycle is divided by four internal ticks: T1, T2, T3, and T4. T1 always occurs at the rising edge, and T3 at the falling edge, of CLKin. However, the spacing of T2 and T4 depends on the PLL clock ratio selected, as shown in Table 13.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 22 Freescale Semiconductor
AC Electrical Characteristics
Table 13. Tick Spacing for Memory Controller Signals
Tick Spacing (T1 Occurs at the Rising Edge of CLKin) PLL Clock Ratio T2 1:2, 1:3, 1:4, 1:5, 1:6 1:2.5 1:3.5 1/4 CLKin 3/10 CLKin 4/14 CLKin T3 1/2 CLKin 1/2 CLKin 1/2 CLKin T4 3/4 CLKin 8/10 CLKin 11/14 CLKin
Figure 12 is a representation of the information in Table 13.
CLKin T1 T2 T3 T4 for 1:2, 1:3, 1:4, 1:5, 1:6
CLKin T1 T2 T3 T4
for 1:2.5
CLKin T1 T2 T3 T4
for 1:3.5
Figure 12. Internal Tick Spacing for Memory Controller Signals
NOTE The UPM machine outputs change on the internal tick determined by the memory controller programming; the AC specifications are relative to the internal tick. Note that SDRAM and GPCM machine outputs change on CLKin’s rising edge.
6.3 JTAG Timings
Table 14 lists the JTAG timings.
Table 14. JTAG Timings1
Parameter JTAG external clock frequency of operation JTAG external clock cycle time JTAG external clock pulse width measured at 1.4V JTAG external clock rise and fall times TRST assert time Input setup times Boundary-scan data TMS, TDI tJTDVKH tJTIVKH 4 4 — — ns ns
4, 7 47 ,
Symbol2 fJTG tJTG tJTKHKL tJTGR and tJTGF tTRST
Min 0 30 15 0 25
Max 33.3 — — 5 —
Unit MHz ns ns ns ns
Notes
6
3, 6
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 23
Clock Configuration Modes
Table 14. JTAG Timings1 (continued)
Parameter Input hold times Boundary-scan data TMS, TDI Output valid times Boundary-scan data TDO Output hold times Boundary-scan data TDO JTAG external clock to output high impedance Boundary-scan data TDO
1
Symbol2 tJTDXKH tJTIXKH tJTKLDV tJTKLOV tJTKLDX tJTKLOX tJTKLDZ tJTKLOZ
Min 10 10 — — 1 1 1 1
Max — — 10 10 — — 10 10
Unit ns ns ns ns ns ns ns ns
Notes
47 47
, , , . ,
57 57
57 5, 7
56
,
56 ,
2
3 4 5 6 7
All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load. Time-of-flight delays must be added for trace lengths, vias, and connectors in the system. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t((first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). TRST is an asynchronous level sensitive signal. The setup time is for test purposes only. Non-JTAG signal input timing with respect to tTCLK. Non-JTAG signal output timing with respect to tTCLK. Guaranteed by design. Guaranteed by design and device characterization.
7
Clock Configuration Modes
Table 15. MPC8280 Clocking Modes
Pins PCI_MODE 1 0 0 0 0
1
The MPC8280 has three clocking modes: local, PCI host, and PCI agent. The clocking mode is set according to three input pins—PCI_MODE, PCI_CFG[0], PCI_MODCK—as shown in Table 15.
PCI_CFG[0] PCI_MODCK 1 — 0 0 1 1 — 0 1 0 1
Clocking Mode Local bus PCI host
PCI Clock Frequency Range (MHZ) — 50–66 25–50
Reference Table 16 Table 17 Table 18 Table 19 Table 20
PCI agent
50–66 25–50
Determines PCI clock frequency range. Refer to Sections 7.2 and 7.3.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 24 Freescale Semiconductor
Clock Configuration Modes
In each clocking mode, the configuration of bus, core, PCI, and CPM frequencies is determined by seven bits during the power-up reset—three hardware configuration pins (MODCK[1–3]) and four bits from hardware configuration word[28–31] (MODCK_H). Both the PLLs and the dividers are set according to the selected MPC8280 clock operation mode as described in the following sections.
7.1 Local Bus Mode
Table 16 lists clock configurations for the MPC8280 in local bus mode. The frequencies listed are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not exceed the frequency rating of the user’s device. NOTE Clock configurations change only after PORESET is asserted.
Table 16. Clock Configurations for Local Bus Mode 1
Mode 2 MODCK_H-MODCK[1-3] Bus Clock 3 (MHz) Low High CPM Multiplication Factor 4 CPM Clock (MHz) Low High CPU Multiplication Factor 5 CPU Clock (MHz) Low High
Default Modes (MODCK_H= 0000) 0000_000 0000_001 0000_010 0000_011 0000_100 0000_101 0000_110 0000_111 37.5 33.3 37.5 30.0 60.0 50.0 60.0 50.0 133.3 133.3 100.0 100.0 167.0 167.0 160.0 160.0 3 3 4 4 2 2 2.5 2.5 112.5 100.0 150.0 120.0 120.0 100.0 150.0 125.0 400.0 400.0 400.0 400.0 334.0 334.0 400.0 400.0 4 5 4 5 2.5 3 2.5 3 150.0 166.7 150.0 150.0 150.0 150.0 150.0 150.0 533.3 666.7 400.0 500.0 417.5 501.0 400.0 480.0
Full Configuration Modes 0001_000 0001_001 0001_010 0001_011 0001_100 50.0 50.0 50.0 167.0 167.0 145.8 2 2 2 100.0 100.0 100.0 334.0 334.0 291.7 4 5 6 200.0 250.0 300.0 668.0 835.0 875.0
Reserved Reserved
0001_101 0001_110 1000_111 0001_111 0010_000 0010_001
37.5 33.3 33.3 33.3
133.3 133.3 133.3 133.3
3 3 3 3
112.5 100.0 100.0 100.0
400.0 400.0 400.0 400.0
4 5 5.5 6
150.0 166.7 183.3 200.0
533.3 666.7 733.3 800.0
Reserved Reserved
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 25
Clock Configuration Modes
Table 16. Clock Configurations for Local Bus Mode 1 (continued)
Mode 2 MODCK_H-MODCK[1-3] Bus Clock 3 (MHz) Low High CPM Multiplication Factor 4 CPM Clock (MHz) Low High CPU Multiplication Factor 5 CPU Clock (MHz) Low High
0010_010 0010_011 0010_100 0010_101 0010_110
37.5 30.0 25.0 25.0 25.0
100.0 100.0 100.0 100.0 100.0
4 4 4 4 4
150.0 120.0 100.0 100.0 100.0
400.0 400.0 400.0 400.0 400.0
4 5 6 7 8
150.0 150.0 150.0 175.0 200.0
400.0 500.0 600.0 700.0 800.0
0010_111 0011_000 0011_001 0011_010 0011_011 30.0 25.0 25.0 25.0 80.0 80.0 80.0 80.0 5 5 5 5
Reserved 150.0 125.0 125.0 125.0 400.0 400.0 400.0 400.0 5 6 7 8 150.0 150.0 175.0 200.0 400.0 480.0 560.0 640.0
0011_100 0011_101 0011_110 0011_111 0100_000 25.0 25.0 25.0 66.7 66.7 66.7 6 6 6
Reserved Reserved 150.0 150.0 150.0 400.0 400.0 400.0 6 7 8 150.0 175.0 200.0 400.0 466.7 533.3
0101_101 0101_110 0101_111 0110_000 0110_001 0110_010
75.0 60.0 50.0 50.0 50.0 50.0
167.0 167.0 167.0 167.0 167.0 167.0
2 2 2 2 2 2
150.0 120.0 100.0 100.0 100.0 100.0
334.0 334.0 334.0 334.0 334.0 334.0
2 2.5 3 3.5 4 4.5
166.7 166.7 200.0 250.0 250.0 250.0
334.0 417.5 501.0 584.5 668.0 751.5
0110_011 0110_100 0110_101 0110_110 0110_111 0111_000 60.0 50.0 42.9 40.0 40.0 160.0 160.0 160.0 160.0 160.0 2.5 2.5 2.5 2.5 2.5
Reserved 150.0 125.0 107.1 100.0 100.0 400.0 400.0 400.0 400.0 400.0 2.5 3 3.5 4 4.5 150.0 150.0 150.0 160.0 180.0 400.0 480.0 560.0 640.0 720.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 26 Freescale Semiconductor
Clock Configuration Modes
Table 16. Clock Configurations for Local Bus Mode 1 (continued)
Mode 2 MODCK_H-MODCK[1-3] 0111_001 0111_010 0111_011 0111_100 0111_101 0111_110 0111_111 50.0 42.9 37.5 33.3 133.3 133.3 133.3 133.3 3 3 3 3 Bus Clock 3 (MHz) Low High CPM Multiplication Factor 4 CPM Clock (MHz) Low High CPU Multiplication Factor 5 CPU Clock (MHz) Low High
Reserved Reserved 150.0 128.6 112.5 100.0 400.0 400.0 400.0 400.0 3 3.5 4 4.5 150.0 150.0 150.0 150.0 400.0 466.7 533.3 600.0
Reserved
1000_000 1000_001 1000_010 1000_011 1000_100 1000_101 1000_110 42.9 37.5 33.3 30.0 28.6 114.3 114.3 114.3 114.3 114.3 3.5 3.5 3.5 3.5 3.5
Reserved Reserved 150.0 131.3 116.7 105.0 100.0 400.0 400.0 400.0 400.0 400.0 3.5 4 4.5 5 5.5 150.0 150.0 150.0 150.0 150.0 400.0 457.1 514.3 571.4 628.6
1100_000 1100_001 1100_010
Reserved Reserved Reserved
1101_000
1
Reserved
2 3 4 5
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For modes with a CPU multiplication factor = 3.5: for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices and 175 MHz for extended temperature devices. MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins. 60x and local bus frequency. Identical to CLKIN. CPM multiplication factor = CPM clock/bus clock CPU multiplication factor = Core PLL multiplication factor
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 27
Clock Configuration Modes
7.2 PCI Host Mode
Table 17 and Table 18 show clock configurations for PCI host mode. The frequencies listed are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not exceed the frequency rating of the user’s device. In addition, note the following: NOTE: PCI_MODCK In PCI mode only, PCI_MODCK comes from the LGPL5 pin and MODCK_H[0–3] comes from {LGPL0, LGPL1, LGPL2, LGPL3}. NOTE: Tval (Output Hold) The minimum Tval = 2 ns when PCI_MODCK = 1, and the minimum Tval = 1 ns when PCI_MODCK = 0. Therefore, designers should use clock configurations that fit this condition to achieve PCI-compliant AC timing.
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0) 1, 2
Mode 3 MODCK_HMODCK[1-3] Bus Clock 4 (MHz) Low High CPM Multiplication Factor 5 CPM Clock (MHz) Low High CPU Multiplication Factor 6 CPU Clock (MHz) Low High PCI Division Factor PCI Clock (MHz) Low High
Default Modes (MODCK_H=0000) 0000_000 0000_001 0000_010 0000_011 0000_100 0000_101 0000_110 0000_111 60.0 50.0 60.0 60.0 60.0 50.0 50.0 50.0 66.7 66.7 80.0 80.0 80.0 66.7 66.7 66.7 2 2 2.5 2.5 2.5 3 3.5 3 120.0 133.3 100.0 133.3 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 2.5 3 3 3.5 4 3 3.5 4 150.0 166.7 150.0 200.0 180.0 240.0 210.0 280.0 240.0 320.0 150.0 200.0 175.0 233.3 200.0 266.6 2 2 3 3 3 3 3 3 60.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
Full Configuration Modes 0001_000 0001_001 0001_010 0001_011 50.0 50.0 50.0 50.0 66.7 66.7 66.7 66.7 3 3 3 3 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 5 6 7 8 250.0 333.3 300.0 400.0 350.0 466.6 400.0 533.3 3 3 3 3 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
0010_000 0010_001 0010_010 0010_011
50.0 50.0 50.0 50.0
66.7 66.7 66.7 66.7
4 4 4 4
200.0 266.6 200.0 266.6 200.0 266.6 200.0 266.6
5 6 7 8
250.0 333.3 300.0 400.0 350.0 466.6 400.0 533.3
4 4 4 4
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 28 Freescale Semiconductor
Clock Configuration Modes
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] 0010_100 0010_101 0010_110 Bus Clock 4 (MHz) Low 75.0 75.0 75.0 High 100.0 100.0 100.0 CPM Multiplication Factor 5 4 4 4 CPM Clock (MHz) Low High 300.0 400.0 300.0 400.0 300.0 400.0 CPU Multiplication Factor 6 5 5.5 6 CPU Clock (MHz) Low High PCI Division Factor 6 6 6 PCI Clock (MHz) Low High 50.0 66.7 50.0 66.7 50.0 66.7
375.0 500.0 412.5 549.9 450.0 599.9
0011_000 0011_001 0011_010 0011_011
50.0 50.0 50.0 50.0
66.7 66.7 66.7 66.7
5 5 5 5
250.0 333.3 250.0 333.3 250.0 333.3 250.0 333.3
5 6 7 8
250.0 333.3 300.0 400.0 350.0 466.6 400.0 533.3
5 5 5 5
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
0100_000 0100_001 0100_010 0100_011 50.0 50.0 50.0 66.7 66.7 66.7 6 6 6 300.0 400.0 300.0 400.0 300.0 400.0
Reserved 6 7 8 300.0 400.0 350.0 466.6 400.0 533.3 6 6 6 50.0 66.7 50.0 66.7 50.0 66.7
0101_000 0101_001 0101_010 0101_011 0101_100
60.0 50.0 50.0 50.0 50.0
66.7 66.7 66.7 66.7 66.7
2 2 2 2 2
120.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3
2.5 3 3.5 4 4.5
150.0 166.7 150.0 200.0 175.0 233.3 200.0 266.6 225.0 300.0
2 2 2 2 2
60.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
0110_000 0110_001 0110_010 0110_011 0110_100 0110_101 0110_110
60.0 60.0 60.0 60.0 60.0 60.0 60.0
80.0 80.0 80.0 80.0 80.0 80.0 80.0
2.5 2.5 2.5 2.5 2.5 2.5 2.5
150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0
2.5 3 3.5 4 4.5 5 6
150.0 200.0 180.0 240.0 210.0 280.0 240.0 320.0 270.0 360.0 300.0 400.0 360.0 480.0
3 3 3 3 3 3 3
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
0111_000 0111_001 0111_010 0111_011 50.0 50.0 50.0 66.7 66.7 66.7 3 3 3 150.0 200.0 150.0 200.0 150.0 200.0
Reserved 3 3.5 4 150.0 200.0 175.0 233.3 200.0 266.6 3 3 3 50.0 66.7 50.0 66.7 50.0 66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 29
Clock Configuration Modes
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] 0111_100 Bus Clock 4 (MHz) Low 50.0 High 66.7 CPM Multiplication Factor 5 3 CPM Clock (MHz) Low High 150.0 200.0 CPU Multiplication Factor 6 4.5 CPU Clock (MHz) Low High PCI Division Factor 3 PCI Clock (MHz) Low High 50.0 66.7
225.0 300.0
1000_000 1000_001 1000_010 1000_011 1000_100 1000_101 1000_110 66.7 66.7 66.7 66.7 66.7 66.7 88.9 88.9 88.9 88.9 88.9 88.9 3 3 3 3 3 3 200.0 266.6 200.0 266.6 200.0 266.6 200.0 266.6 200.0 266.6 200.0 266.6
Reserved 3 3.5 4 4.5 6 6.5 200.0 266.6 233.3 311.1 266.7 355.5 300.0 400.0 400.0 533.3 433.3 577.7 4 4 4 4 4 4 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
1001_000 1001_001 1001_010 1001_011 1001_100 57.1 57.1 57.1 76.2 76.2 76.2 3.5 3.5 3.5 200.0 266.6 200.0 266.6 200.0 266.6
Reserved Reserved 3.5 4 4.5 200.0 266.6 228.6 304.7 257.1 342.8 4 4 4 50.0 66.7 50.0 66.7 50.0 66.7
1001_101 1001_110 1001_111
85.7 85.7 85.7
114.3 114.3 114.3
3.5 3.5 3.5
300.0 400.0 300.0 400.0 300.0 400.0
5 5.5 6
428.6 571.4 471.4 628.5 514.3 685.6
6 6 6
50.0 66.7 50.0 66.7 50.0 66.7
1010_000 1010_001 1010_010 1010_011 1010_100
75.0 75.0 75.0 75.0 75.0
100.0 100.0 100.0 100.0 100.0
2 2 2 2 2
150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0
2 2.5 3 3.5 4
150.0 200.0 187.5 250.0 225.0 300.0 262.5 350.0 300.0 400.0
3 3 3 3 3
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
1011_000 1011_001 1011_010 1011_011 1011_100 1011_101 80.0 80.0 80.0 80.0 80.0 106.7 106.7 106.7 106.7 106.7 2.5 2.5 2.5 2.5 2.5 200.0 266.6 200.0 266.6 200.0 266.6 200.0 266.6 200.0 266.6
Reserved 2.5 3 3.5 4 4.5 200.0 266.6 240.0 320.0 280.0 373.3 320.0 426.6 360.0 480.0 4 4 4 4 4 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 30 Freescale Semiconductor
Clock Configuration Modes
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] Bus Clock 4 (MHz) Low High CPM Multiplication Factor 5 CPM Clock (MHz) Low High CPU Multiplication Factor 6 CPU Clock (MHz) Low High PCI Division Factor PCI Clock (MHz) Low High
1101_000 1101_001 1101_010 1101_011 1101_100
100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3
2.5 2.5 2.5 2.5 2.5
250.0 333.3 250.0 333.3 250.0 333.3 250.0 333.3 250.0 333.3
3 3.5 4 4.5 5
300.0 400.0 350.0 466.6 400.0 533.3 450.0 599.9 500.0 666.6
5 5 5 5 5
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
1101_101 1101_110
125.0 166.7 125.0 166.7
2 2
250.0 333.3 250.0 333.3
3 4
375.0 500.0 500.0 666.6
5 5
50.0 66.7 50.0 66.7
1110_000 1110_001 1110_010 1110_011 1110_100
100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3
3 3 3 3 3
300.0 400.0 300.0 400.0 300.0 400.0 300.0 400.0 300.0 400.0
3.5 4 4.5 5 5.5
350.0 466.6 400.0 533.3 450.0 599.9 500.0 666.6 550.0 733.3
6 6 6 6 6
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
1100_000 1100_001 1100_010
1
Reserved Reserved Reserved
2 3 4 5 6
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For modes with a CPU multiplication factor = 3.5: for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices and 175 MHz for extended temperature devices. As Table 15 shows, PCI_MODCK determines the PCI clock frequency range. Refer to Table 18 for lower configurations. MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins. 60x and local bus frequency. Identical to CLKIN. CPM multiplication factor = CPM clock/bus clock CPU multiplication factor = Core PLL multiplication factor
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 31
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1) 1, 2
Mode 3 MODCK_HMODCK[1-3] Bus Clock 4 (MHz) Low High CPM Multiplication Factor 5 CPM Clock (MHz) Low High CPU Multiplication Factor 6 CPU Clock (MHz) Low High PCI Division Factor PCI Clock (MHz) Low High
Default Modes (MODCK_H=0000) 0000_000 0000_001 0000_010 0000_011 0000_100 0000_101 0000_110 0000_111 60.0 50.0 60.0 60.0 60.0 50.0 50.0 50.0 100.0 100.0 120.0 120.0 120.0 100.0 100.0 100.0 2 2 2.5 2.5 2.5 3 3 3 120.0 200.0 100.0 200.0 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 2.5 3 3 3.5 4 3 3.5 4 150.0 250.0 150.0 300.0 180.0 360.0 210.0 420.0 240.0 480.0 150.0 300.0 175.0 350.0 200.0 400.0 4 4 6 6 6 6 6 6 30.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
Full Configuration Modes 0001_000 0001_001 0001_010 0001_011 50.0 50.0 50.0 50.0 100.0 100.0 100.0 100.0 3 3 3 3 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 5 6 7 8 250.0 500.0 300.0 600.0 350.0 700.0 400.0 800.0 6 6 6 6 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
0010_000 0010_001 0010_010 0010_011
50.0 50.0 50.0 50.0
100.0 100.0 100.0 100.0
4 4 4 4
200.0 400.0 200.0 400.0 200.0 400.0 200.0 400.0
5 6 7 8
250.0 500.0 300.0 600.0 350.0 700.0 400.0 800.0
8 8 8 8
25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
0010_100 0010_101 0010_110
37.5 37.5 37.5
75.0 75.0 75.0
4 4 4
150.0 300.0 150.0 300.0 150.0 300.0
5 5.5 6
187.5 375.0 206.3 412.5 225.0 450.0
6 6 6
25.0 50.0 25.0 50.0 25.0 50.0
0011_000 0011_001 0011_010 0011_011
30.0 25.0 25.0 25.0
50.0 50.0 50.0 50.0
5 5 5 5
150.0 250.0 125.0 250.0 125.0 250.0 125.0 250.0
5 6 7 8
150.0 250.0 150.0 300.0 175.0 350.0 200.0 400.0
5 5 5 5
30.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
0100_000 0100_001 0100_010 25.0 25.0 50.0 50.0 6 6 150.0 300.0 150.0 300.0
Reserved 6 7 150.0 300.0 175.0 350.0 6 6 25.0 50.0 25.0 50.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 32 Freescale Semiconductor
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] 0100_011 Bus Clock 4 (MHz) Low 25.0 High 50.0 CPM Multiplication Factor 5 6 CPM Clock (MHz) Low High 150.0 300.0 CPU Multiplication Factor 6 8 CPU Clock (MHz) Low High PCI Division Factor 6 PCI Clock (MHz) Low High 25.0 50.0
200.0 400.0
0101_000 0101_001 0101_010 0101_011 0101_100
60.0 50.0 50.0 50.0 50.0
100.0 100.0 100.0 100.0 100.0
2 2 2 2 2
120.0 200.0 100.0 200.0 100.0 200.0 100.0 200.0 100.0 200.0
2.5 3 3.5 4 4.5
150.0 250.0 150.0 300.0 175.0 350.0 200.0 400.0 225.0 450.0
4 4 4 4 4
30.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
0110_000 0110_001 0110_010 0110_011 0110_100 0110_101 0110_110
60.0 60.0 60.0 60.0 60.0 60.0 60.0
120.0 120.0 120.0 120.0 120.0 120.0 120.0
2.5 2.5 2.5 2.5 2.5 2.5 2.5
150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0
2.5 3 3.5 4 4.5 5 6
150.0 300.0 180.0 360.0 210.0 420.0 240.0 480.0 270.0 540.0 300.0 600.0 360.0 720.0
6 6 6 6 6 6 6
25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
0111_000 0111_001 0111_010 0111_011 0111_100 50.0 50.0 50.0 50.0 100.0 100.0 100.0 100.0 3 3 3 3 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0
Reserved 3 3.5 4 4.5 150.0 300.0 175.0 350.0 200.0 400.0 225.0 450.0 6 6 6 6 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
1000_000 1000_001 1000_010 1000_011 1000_100 1000_101 1000_110 66.7 66.7 66.7 66.7 66.7 66.7 133.3 133.3 133.3 133.3 133.3 133.3 3 3 3 3 3 3 200.0 400.0 200.0 400.0 200.0 400.0 200.0 400.0 200.0 400.0 200.0 400.0
Reserved 3 3.5 4 4.5 6 6.5 200.0 400.0 233.3 466.7 266.7 533.3 300.0 600.0 400.0 800.0 433.3 866.7 8 8 8 8 8 8 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
1001_000 1001_001
Reserved Reserved
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 33
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] 1001_010 1001_011 1001_100 Bus Clock 4 (MHz) Low 57.1 57.1 57.1 High 114.3 114.3 114.3 CPM Multiplication Factor 5 3.5 3.5 3.5 CPM Clock (MHz) Low High 200.0 400.0 200.0 400.0 200.0 400.0 CPU Multiplication Factor 6 3.5 4 4.5 CPU Clock (MHz) Low High PCI Division Factor 8 8 8 PCI Clock (MHz) Low High 25.0 50.0 25.0 50.0 25.0 50.0
200.0 400.0 228.6 457.1 257.1 514.3
1001_101 1001_110 1001_111
42.9 42.9 42.9
85.7 85.7 85.7
3.5 3.5 3.5
150.0 300.0 150.0 300.0 150.0 300.0
5 5.5 6
214.3 428.6 235.7 471.4 257.1 514.3
6 6 6
25.0 50.0 25.0 50.0 25.0 50.0
1010_000 1010_001 1010_010 1010_011 1010_100
75.0 75.0 75.0 75.0 75.0
150.0 150.0 150.0 150.0 150.0
2 2 2 2 2
150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0
2 2.5 3 3.5 4
150.0 300.0 187.5 375.0 225.0 450.0 262.5 525.0 300.0 600.0
6 6 6 6 6
25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
1011_000 1011_001 1011_010 1011_011 1011_100 1011_101 80.0 80.0 80.0 80.0 80.0 160.0 160.0 160.0 160.0 160.0 2.5 2.5 2.5 2.5 2.5 200.0 400.0 200.0 400.0 200.0 400.0 200.0 400.0 200.0 400.0
Reserved 2.5 3 3.5 4 4.5 200.0 400.0 240.0 480.0 280.0 560.0 320.0 640.0 360.0 720.0 8 8 8 8 8 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
1101_000 1101_001 1101_010 1101_011 1101_100
50.0 50.0 50.0 50.0 50.0
100.0 100.0 100.0 100.0 100.0
2.5 2.5 2.5 2.5 2.5
125.0 250.0 125.0 250.0 125.0 250.0 125.0 250.0 125.0 250.0
3 3.5 4 4.5 5
150.0 300.0 175.0 350.0 200.0 400.0 225.0 450.0 250.0 500.0
5 5 5 5 5
25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0 25.0 50.0
1101_101 1101_110
62.5 62.5
125.0 125.0
2 2
125.0 250.0 125.0 250.0
3 4
187.5 375.0 250.0 500.0
5 5
25.0 50.0 25.0 50.0
1110_000 1110_001
50.0 50.0
100.0 100.0
3 3
150.0 300.0 150.0 300.0
3.5 4
175.0 350.0 200.0 400.0
6 6
25.0 50.0 25.0 50.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 34 Freescale Semiconductor
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] 1110_010 1110_011 1110_100 Bus Clock 4 (MHz) Low 50.0 50.0 50.0 High 100.0 100.0 100.0 CPM Multiplication Factor 5 3 3 3 CPM Clock (MHz) Low High 150.0 300.0 150.0 300.0 150.0 300.0 CPU Multiplication Factor 6 4.5 5 5.5 CPU Clock (MHz) Low High PCI Division Factor 6 6 6 PCI Clock (MHz) Low High 25.0 50.0 25.0 50.0 25.0 50.0
225.0 450.0 250.0 500.0 275.0 550.0
1100_000 1100_001 1100_010
1
Reserved Reserved Reserved
2 3 4 5 6
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For modes with a CPU multiplication factor = 3.5: for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices and 175 MHz for extended temperature devices. As Table 15 shows, PCI_MODCK determines the PCI clock frequency range. Refer to Table 17 for higher configurations. MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins. 60x and local bus frequency. Identical to CLKIN. CPM multiplication factor = CPM clock/bus clock CPU multiplication factor = Core PLL multiplication factor
7.3 PCI Agent Mode
Table 19 and Table 20 show configurations for PCI agent mode. The frequencies listed are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not exceed the frequency rating of the user’s device. In addition, note the following: NOTE: PCI_MODCK In PCI mode only, PCI_MODCK comes from the LGPL5 pin and MODCK_H[0–3] comes from {LGPL0, LGPL1, LGPL2, LGPL3}. NOTE: Tval (Output Hold) The minimum Tval = 2 ns when PCI_MODCK = 1, and the minimum Tval = 1 ns when PCI_MODCK = 0. Therefore, designers should use clock configurations that fit this condition to achieve PCI-compliant AC timing.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 35
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0) 1, 2
Mode 3 MODCK_HMODCK[1-3] PCI Clock (MHz) Low High CPM Multiplication Factor 4 CPM Clock (MHz) Low High CPU Multiplication Factor 5 CPU Clock (MHz) Low High Bus Division Factor Bus Clock (MHz) Low High
Default Modes (MODCK_H=0000 0000_000 0000_001 0000_010 0000_011 0000_100 0000_101 0000_110 0000_111 60.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 2 2 3 3 3 3 4 4 120.0 133.3 100.0 133.3 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 200.0 266.6 200.0 266.6 2.5 3 3 4 3 3.5 3.5 3 150.0 166.7 150.0 200.0 150.0 200.0 200.0 266.6 180.0 240.0 210.0 280.0 233.3 311.1 240.0 320.0 2 2 3 3 2.5 2.5 3 2.5 60.0 50.0 50.0 50.0 60.0 60.0 66.7 80.0 66.7 66.7 66.7 66.7 80.0 80.0 88.9 106.7
Full Configuration Modes 0001_001 0001_010 0001_011 0001_100 60.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 2 2 2 2 120.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3 5 6 7 8 150.0 166.7 150.0 200.0 175.0 233.3 200.0 266.6 4 4 4 4 30.0 25.0 25.0 25.0 33.3 33.3 33.3 33.3
0010_001 0010_010 0010_011 0010_100
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
3 3 3 3
150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0
3 3.5 4 4.5
180.0 240.0 210.0 280.0 240.0 320.0 270.0 360.0
2.5 2.5 2.5 2.5
60.0 60.0 60.0 60.0
80.0 80.0 80.0 80.0
0011_000 0011_001 0011_010 0011_011 0011_100
Reserved Reserved Reserved Reserved Reserved
0100_000 0100_001 0100_010 0100_011 0100_100 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 3 3 3 3 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0
Reserved 3 3.5 4 4.5 150.0 200.0 175.0 200.0 200.0 266.6 225.0 300.0 3 3 3 3 50.0 50.0 50.0 50.0 66.7 66.7 66.7 66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 36 Freescale Semiconductor
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] 0101_000 0101_001 0101_010 0101_011 0101_100 0101_101 0101_110 PCI Clock (MHz) Low High 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 CPM Multiplication Factor 4 5 5 5 5 5 5 5 CPM Clock (MHz) Low High 250.0 333.3 250.0 333.3 250.0 333.3 250.0 333.3 250.0 333.3 250.0 333.3 250.0 333.3 CPU Multiplication Factor 5 2.5 3 3.5 4 4.5 5 5.5 CPU Clock (MHz) Low High Bus Division Factor 2.5 2.5 2.5 2.5 2.5 2.5 2.5 Bus Clock (MHz) Low High
250.0 333.3 300.0 400.0 350.0 466.6 400.0 533.3 450.0 599.9 500.0 666.6 550.0 733.3
100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3
0110_000 0110_001 0110_010 0110_011 0110_100 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 4 4 4 4 200.0 266.6 200.0 266.6 200.0 266.6 200.0 266.6
Reserved 3 3.5 4 4.5 200.0 266.6 233.3 311.1 266.7 355.5 300.0 400.0 3 3 3 3 66.7 66.7 66.7 66.7 88.9 88.9 88.9 88.9
0111_000 0111_001 0111_010 0111_011
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
3 3 3 3
150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0
2 2.5 3 3.5
150.0 200.0 187.5 250.0 225.0 300.0 262.5 350.0
2 2 2 2
75.0 75.0 75.0 75.0
100.0 100.0 100.0 100.0
1000_000 1000_001 1000_010 1000_011 1000_100 1000_101 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 3 3 3 3 3 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0 150.0 200.0
Reserved 2.5 3 3.5 4 4.5 150.0 166.7 180.0 240.0 210.0 280.0 240.0 320.0 270.0 360.0 2.5 2.5 2.5 2.5 2.5 60.0 60.0 60.0 60.0 60.0 80.0 80.0 80.0 80.0 80.0
1001_000 1001_001 1001_010 1001_011 1001_100 50.0 66.7 50.0 66.7 4 4 200.0 266.6 200.0 266.6
Reserved Reserved Reserved 4 4.5 200.0 266.6 225.0 300.0 4 4 50.0 50.0 66.7 66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 37
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] 1010_000 1010_001 1010_010 1010_011 1010_100 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 4 4 4 4 200.0 266.6 200.0 266.6 200.0 266.6 200.0 266.6 PCI Clock (MHz) Low High CPM Multiplication Factor 4 CPM Clock (MHz) Low High CPU Multiplication Factor 5 Reserved 3 3.5 4 4.5 200.0 266.6 233.3 311.1 266.7 355.5 300.0 400.0 3 3 3 3 66.7 66.7 66.7 66.7 88.9 88.9 88.9 88.9 CPU Clock (MHz) Low High Bus Division Factor Bus Clock (MHz) Low High
1011_000 1011_001 1011_010 1011_011 1011_100 50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7 4 4 4 4 200.0 266.6 200.0 266.6 200.0 266.6 200.0 266.6
Reserved 2.5 3 3.5 4 200.0 266.6 240.0 320.0 280.0 373.3 320.0 426.6 2.5 2.5 2.5 2.5 80.0 80.0 80.0 80.0 106.7 106.7 106.7 106.7
1100_101 1100_110 1100_111 1101_000
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
6 6 6 6
300.0 400.0 300.0 400.0 300.0 400.0 300.0 400.0
4 4.5 5 5.5
400.0 533.3 450.0 599.9 500.0 666.6 550.0 733.3
3 3 3 3
100.0 133.3 100.0 133.3 100.0 133.3 100.0 133.3
1101_001 1101_010 1101_011 1101_100
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
6 6 6 6
300.0 400.0 300.0 400.0 300.0 400.0 300.0 400.0
3.5 4 4.5 5
420.0 559.9 480.0 639.9 540.0 719.9 600.0 799.9
2.5 2.5 2.5 2.5
120.0 160.0 120.0 160.0 120.0 160.0 120.0 160.0
1110_000 1110_001 1110_010 1110_011
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
5 5 5 5
250.0 333.3 250.0 333.3 250.0 333.3 250.0 333.3
2.5 3 3.5 4
312.5 416.6 375.0 500.0 437.5 583.3 500.0 666.6
2 2 2 2
125.0 166.7 125.0 166.7 125.0 166.7 125.0 166.7
1110_100 1110_101 1110_110 1110_111
50.0 66.7 50.0 66.7 50.0 66.7 50.0 66.7
5 5 5 5
250.0 333.3 250.0 333.3 250.0 333.3 250.0 333.3
4 4.5 5 5.5
333.3 444.4 375.0 500.0 416.7 555.5 458.3 611.1
3 3 3 3
83.3 83.3 83.3 83.3
111.1 111.1 111.1 111.1
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 38 Freescale Semiconductor
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] PCI Clock (MHz) Low High CPM Multiplication Factor 4 CPM Clock (MHz) Low High CPU Multiplication Factor 5 CPU Clock (MHz) Low High Bus Division Factor Bus Clock (MHz) Low High
1100_000 1100_001 1100_010
1
Reserved Reserved Reserved
2 3 4 5
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For modes with a CPU multiplication factor = 3.5: for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices and 175 MHz for extended temperature devices. As shown in Table 15, PCI_MODCK determines the PCI clock frequency range. Refer to Table 20 for lower configurations. MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins. CPM multiplication factor = CPM clock/PCI clock CPU multiplication factor = Core PLL multiplication factor
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1) 1, 2
Mode 3 MODCK_HMODCK[1-3] PCI Clock (MHz) Low High CPM Multiplication Factor 4 CPM Clock (MHz) Low High CPU Multiplication Factor 5 CPU Clock (MHz) Low High Bus Division Factor Bus Clock (MHz) Low High
Default Modes (MODCK_H=0000) 0000_000 0000_001 0000_010 0000_011 0000_100 0000_101 0000_110 0000_111 30.0 25.0 25.0 25.0 25.0 25.0 25.0 25.0 50.0 50.0 50.0 50.0 50.0 50.0 50.0 50.0 4 4 6 6 6 6 8 8 120.0 200.0 100.0 200.0 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 200.0 400.0 200.0 400.0 2.5 3 3 4 3 3.5 3.5 3 150.0 250.0 150.0 300.0 150.0 300.0 200.0 400.0 180.0 360.0 210.0 420.0 233.3 466.7 240.0 480.0 2 2 3 3 2.5 2.5 3 2.5 60.0 50.0 50.0 50.0 60.0 60.0 66.7 80.0 100.0 100.0 100.0 100.0 120.0 120.0 133.3 160.0
Full Configuration Modes 0001_001 0001_010 0001_011 30.0 25.0 25.0 50.0 50.0 50.0 4 4 4 120.0 200.0 100.0 200.0 100.0 200.0 5 6 7 150.0 250.0 150.0 300.0 175.0 350.0 4 4 4 30.0 25.0 25.0 50.0 50.0 50.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 39
Clock Configuration Modes
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] 0001_100 PCI Clock (MHz) Low High 25.0 50.0 CPM Multiplication Factor 4 4 CPM Clock (MHz) Low High 100.0 200.0 CPU Multiplication Factor 5 8 CPU Clock (MHz) Low High Bus Division Factor 4 Bus Clock (MHz) Low 25.0 High 50.0
200.0 400.0
0010_001 0010_010 0010_011 0010_100
25.0 25.0 25.0 25.0
50.0 50.0 50.0 50.0
6 6 6 6
150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0
3 3.5 4 4.5
180.0 360.0 210.0 420.0 240.0 480.0 270.0 540.0
2.5 2.5 2.5 2.5
60.0 60.0 60.0 60.0
120.0 120.0 120.0 120.0
0011_000 0011_001 0011_010 0011_011 0011_100 37.5 32.1 28.1 25.0 50.0 50.0 50.0 50.0 4 4 4 4 150.0 200.0 128.6 200.0 112.5 200.0 100.0 200.0
Reserved 3 3.5 4 4.5 150.0 200.0 150.0 233.3 150.0 266.7 150.0 300.0 3 3 3 3 50.0 42.9 37.5 33.3 66.7 66.7 66.7 66.7
0100_000 0100_001 0100_010 0100_011 0100_100 25.0 25.0 25.0 25.0 50.0 50.0 50.0 50.0 6 6 6 6 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0
Reserved 3 3.5 4 4.5 150.0 300.0 175.0 350.0 200.0 400.0 225.0 450.0 3 3 3 3 50.0 50.0 50.0 50.0 100.0 100.0 100.0 100.0
0101_000 0101_001 0101_010 0101_011 0101_100 0101_101 0101_110
30.0 25.0 25.0 25.0 25.0 25.0 25.0
50.0 50.0 50.0 50.0 50.0 50.0 50.0
5 5 5 5 5 5 5
150.0 250.0 125.0 250.0 125.0 250.0 125.0 250.0 125.0 250.0 125.0 250.0 125.0 250.0
2.5 3 3.5 4 4.5 5 5.5
150.0 250.0 150.0 300.0 175.0 350.0 200.0 400.0 225.0 450.0 250.0 500.0 275.0 550.0
2.5 2.5 2.5 2.5 2.5 2.5 2.5
60.0 50.0 50.0 50.0 50.0 50.0 50.0
100.0 100.0 100.0 100.0 100.0 100.0 100.0
0110_000 0110_001 0110_010 0110_011 0110_100 25.0 25.0 25.0 25.0 50.0 50.0 50.0 50.0 8 8 8 8 200.0 400.0 200.0 400.0 200.0 400.0 200.0 400.0
Reserved 3 3.5 4 4.5 200.0 400.0 233.3 466.7 266.7 533.3 300.0 600.0 3 3 3 3 66.7 66.7 66.7 66.7 133.3 133.3 133.3 133.3
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 40 Freescale Semiconductor
Clock Configuration Modes
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] PCI Clock (MHz) Low High CPM Multiplication Factor 4 CPM Clock (MHz) Low High CPU Multiplication Factor 5 CPU Clock (MHz) Low High Bus Division Factor Bus Clock (MHz) Low High
0111_000 0111_001 0111_010 0111_011
25.0 25.0 25.0 25.0
50.0 50.0 50.0 50.0
6 6 6 6
150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0
2 2.5 3 3.5
150.0 300.0 187.5 375.0 225.0 450.0 262.5 525.0
2 2 2 2
75.0 75.0 75.0 75.0
150.0 150.0 150.0 150.0
1000_000 1000_001 1000_010 1000_011 1000_100 1000_101 25.0 25.0 25.0 25.0 25.0 50.0 50.0 50.0 50.0 50.0 6 6 6 6 6 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0
Reserved 2.5 3 3.5 4 4.5 150.0 300.0 180.0 360.0 210.0 420.0 240.0 480.0 270.0 540.0 2.5 2.5 2.5 2.5 2.5 60.0 60.0 60.0 60.0 60.0 120.0 120.0 120.0 120.0 120.0
1001_000 1001_001 1001_010 1001_011 1001_100 25.0 25.0 50.0 50.0 8 8 200.0 400.0 200.0 400.0
Reserved Reserved Reserved 4 4.5 200.0 400.0 225.0 450.0 4 4 50.0 50.0 100.0 100.0
1010_000 1010_001 1010_010 1010_011 1010_100 25.0 25.0 25.0 25.0 50.0 50.0 50.0 50.0 8 8 8 8 200.0 400.0 200.0 400.0 200.0 400.0 200.0 400.0
Reserved 3 3.5 4 4.5 200.0 400.0 233.3 466.7 266.7 533.3 300.0 600.0 3 3 3 3 66.7 66.7 66.7 66.7 133.3 133.3 133.3 133.3
1011_000 1011_001 1011_010 1011_011 1011_100 25.0 25.0 25.0 25.0 50.0 50.0 50.0 50.0 8 8 8 8 200.0 400.0 200.0 400.0 200.0 400.0 200.0 400.0
Reserved 2.5 3 3.5 4 200.0 400.0 240.0 480.0 280.0 560.0 320.0 640.0 2.5 2.5 2.5 2.5 80.0 80.0 80.0 80.0 160.0 160.0 160.0 160.0
1100_101
25.0
50.0
6
150.0 300.0
4
200.0 400.0
3
50.0
100.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 41
Clock Configuration Modes
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3 MODCK_HMODCK[1-3] 1100_110 1100_111 1101_000 PCI Clock (MHz) Low High 25.0 25.0 25.0 50.0 50.0 50.0 CPM Multiplication Factor 4 6 6 6 CPM Clock (MHz) Low High 150.0 300.0 150.0 300.0 150.0 300.0 CPU Multiplication Factor 5 4.5 5 5.5 CPU Clock (MHz) Low High Bus Division Factor 3 3 3 Bus Clock (MHz) Low 50.0 50.0 50.0 High 100.0 100.0 100.0
225.0 450.0 250.0 500.0 275.0 550.0
1101_001 1101_010 1101_011 1101_100
25.0 25.0 25.0 25.0
50.0 50.0 50.0 50.0
6 6 6 6
150.0 300.0 150.0 300.0 150.0 300.0 150.0 300.0
3.5 4 4.5 5
210.0 420.0 240.0 480.0 270.0 540.0 300.0 600.0
2.5 2.5 2.5 2.5
60.0 60.0 60.0 60.0
120.0 120.0 120.0 120.0
1110_000 1110_001 1110_010 1110_011
25.0 25.0 25.0 25.0
50.0 50.0 50.0 50.0
5 5 5 5
125.0 250.0 125.0 250.0 125.0 250.0 125.0 250.0
2.5 3 3.5 4
156.3 312.5 187.5 375.0 218.8 437.5 250.0 500.0
2 2 2 2
62.5 62.5 62.5 62.5
125.0 125.0 125.0 125.0
1110_100 1110_101 1110_110 1110_111
25.0 25.0 25.0 25.0
50.0 50.0 50.0 50.0
5 5 5 5
125.0 250.0 125.0 250.0 125.0 250.0 125.0 250.0
4 4.5 5 5.5
166.7 333.3 187.5 375.0 208.3 416.7 229.2 458.3
3 3 3 3
41.7 41.7 41.7 41.7
83.3 83.3 83.3 83.3
1100_000 1100_001 1100_010
1
Reserved Reserved Reserved
2 3 4 5
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For modes with a CPU multiplication factor = 3.5: for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices and 175 MHz for extended temperature devices. As shown in Table 15, PCI_MODCK determines the PCI clock range. Refer to Table 19 for higher range configurations. MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins. CPM multiplication factor = CPM clock/PCI clock CPU multiplication factor = Core PLL multiplication factor
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 42 Freescale Semiconductor
Pinout
8
Pinout
This section provides the pin assignments and pinout lists for both HiP7 PowerQUICC II packages.
8.1 ZU Package—MPC8280 and MPC8270
The following figures and table represent the standard 480 TBGA package. For information on the alternate package, refer to Section 8.2, “VR and ZQ Packages—MPC8275 and MPC8270,” on page -58. Figure 13 shows the pinout of the ZU package as viewed from the top surface.
1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ 1 2 3 456 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
Not to Scale
2
3
456
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ
Figure 13. Pinout of the 480 TBGA Package (View from Top)
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 43
Pinout
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
View
Copper Heat Spreader (Oxidized for Insulation) Polymide Tape Die Soldermask Glob-Top Filled Area Glob-Top Dam Wire Bonds Copper Traces Die Attach Etched Cavity Pressure Sensitive Adhesive
1.27 mm Pitch
Figure 14. Side View of the TBGA Package
Table 21 shows the pinout list of the MPC8280 and MPC8270. Table 22 defines conventions and acronyms used in Table 21.
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List
Pin Name Ball MPC8280/MPC8270 BR BG ABB/IRQ2 TS A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 MPC8280 only W5 F4 E2 E3 G1 H5 H2 H1 J5 J4 J3 J2 J1 K4 K3 K2 K1 L5 L4 L3 L2
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 44 Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 TT0 TT1 TT2 TT3 TT4 TBST TSIZ0 TSIZ1 TSIZ2 TSIZ3 AACK ARTRY DBG DBB/IRQ3 D0 D1 D2 D3 MPC8280 only L1 M5 N5 N4 N3 N2 N1 P4 P3 P2 P1 R1 R3 R5 R4 F1 G4 G3 G2 F2 D3 C1 E4 D2 F5 F3 E1 V1 V2 B20 A18 A16 A13
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 45
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 D32 D33 D34 D35 D36 MPC8280 only E12 D9 A6 B5 A20 E17 B15 B13 A11 E9 B7 B4 D19 D17 D15 C13 B11 A8 A5 C5 C19 C17 C15 D13 C11 B8 A4 E6 E18 B17 A15 A12 D11
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 46 Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 D37 D38 D39 D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 DP0/RSRV/EXT_BR2 IRQ1/DP1/EXT_BG2 IRQ2/DP2/TLBISYNC/EXT_DBG2 IRQ3/DP3/CKSTP_OUT/EXT_BR3 IRQ4/DP4/CORE_SRESET/EXT_BG3 IRQ5/CINT/DP5/TBEN/EXT_DBG3 MPC8280 only C8 E7 A3 D18 A17 A14 B12 A10 D8 B6 C4 C18 E16 B14 C12 B10 A7 C6 D5 B18 B16 E14 D12 C10 E8 D6 C2 B22 A22 E21 D21 C21 B21
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 47
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 IRQ6/DP6/CSE0 IRQ7/DP7/CSE1 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 WT/BADDR30/IRQ3 L2_HIT/IRQ4 CPU_BG/BADDR31/IRQ5/CINT CPU_DBG CPU_BR CS0 CS1 CS2 CS3 CS4 CS5 CS6 CS7 CS8 CS9 CS10/BCTL1 CS11/AP0 BADDR27 BADDR28 ALE BCTL0 PWE0/PSDDQM0/PBS0 PWE1/PSDDQM1/PBS1 PWE2/PSDDQM2/PBS2 PWE3/PSDDQM3/PBS3 PWE4/PSDDQM4/PBS4 MPC8280 only A21 E20 V3 C22 V5 W1 U2 U3 Y4 U4 R2 Y3 F25 C29 E27 E28 F26 F27 F28 G25 D29 E29 F29 G28 T5 U1 T2 A27 C25 E24 D24 C24 B26
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 48 Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 PWE5/PSDDQM5/PBS5 PWE6/PSDDQM6/PBS6 PWE7/PSDDQM7/PBS7 PSDA10/PGPL0 PSDWE/PGPL1 POE/PSDRAS/PGPL2 PSDCAS/PGPL3 PGTA/PUPMWAIT/PGPL4/PPBS PSDAMUX/PGPL5 LWE0/LSDDQM0/LBS0/PCI_CFG0 LWE1/LSDDQM1/LBS1/PCI_CFG1 LWE2/LSDDQM2/LBS2/PCI_CFG2 LWE3/LSDDQM3/LBS3/PCI_CFG3 LSDA10/LGPL0/PCI_MODCKH0 LSDWE/LGPL1/PCI_MODCKH1 LOE/LSDRAS/LGPL2/PCI_MODCKH2 LSDCAS/LGPL3/PCI_MODCKH3 LGTA/LUPMWAIT/LGPL4/LPBS LGPL5/LSDAMUX/PCI_MODCK LWR L_A14/PAR L_A15/FRAME/SMI L_A16/TRDY L_A17/IRDY/CKSTP_OUT L_A18/STOP L_A19/DEVSEL L_A20/IDSEL L_A21/PERR L_A22/SERR L_A23/REQ0 L_A24/REQ1/HSEJSW L_A25/GNT0 L_A26/GNT1/HSLED MPC8280 only A26 B25 A25 E23 B24 A24 B23 A23 D22 H28 H27 H26 G29 D27 C28 E26 D25 C26 B27 D28 N27 T29 R27 R26 R29 R28 W29 P28 N26 AA27 P29 AA26 N25
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 49
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 L_A27/GNT2/HSENUM L_A28/RST/CORE_SRESET L_A29/INTA L_A30/REQ2 L_A31/DLLOUT LCL_D0/AD0 LCL_D1/AD1 LCL_D2/AD2 LCL_D3/AD3 LCL_D4/AD4 LCL_D5/AD5 LCL_D6/AD6 LCL_D7/AD7 LCL_D8/AD8 LCL_D9/AD9 LCL_D10/AD10 LCL_D11/AD11 LCL_D12/AD12 LCL_D13/AD13 LCL_D14/AD14 LCL_D15/AD15 LCL_D16/AD16 LCL_D17/AD17 LCL_D18/AD18 LCL_D19/AD19 LCL_D20/AD20 LCL_D21/AD21 LCL_D22/AD22 LCL_D23/AD23 LCL_D24/AD24 LCL_D25/AD25 LCL_D26/AD26 LCL_D27/AD27 MPC8280 only AA25 AB29 AB28 P25 AB27 H29 J29 J28 J27 J26 J25 K25 L29 L27 L26 L25 M29 M28 M27 M26 N29 T25 U27 U26 U25 V29 V28 V27 V26 W27 W26 W25 Y29
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 50 Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 LCL_D28/AD28 LCL_D29/AD29 LCL_D30/AD30 LCL_D31/AD31 LCL_DP0/C0/BE0 LCL_DP1/C1/BE1 LCL_DP2/C2/BE2 LCL_DP3/C3/BE3 IRQ0/NMI_OUT IRQ7/INT_OUT/APE TRST 1 TCK TMS TDI TDO TRIS PORESET1 HRESET SRESET QREQ RSTCONF MODCK1/AP1/TC0/BNKSEL0 MODCK2/AP2/TC1/BNKSEL1 MODCK3/AP3/TC2/BNKSEL2 CLKIN1 PA0/RESTART1/DREQ3 PA1/REJECT1/DONE3 PA2/CLK20/DACK3 PA3/CLK19/DACK4/L1RXD1A2 PA4/REJECT2/DONE4 PA5/RESTART2/DREQ4 PA6/FCC2_RXADDR3 PA7/SMSYN2/FCC2_TXADDR3 FCC2_UTM_TXADDR2 FCC2_UTM_TXADDR1 FCC2_UTM_TXADDR0 FCC2_UTM_RXADDR0 FCC2_UTM_RXADDR1 FCC2_UTM_RXADDR2/FCC1_UT_RX PRTY L1RSYNCA1 L1TSYNCA1/L1GNTA1 MPC8280 only Y28 Y25 AA29 AA28 L28 N28 T28 W28 T1 D1 AH3 AG5 AJ3 AE6 AF5 AB4 AG6 AH5 AF6 AA3 AJ4 W2 W3 W4 AH4 AC29 2 AC252 AE282 AG292 AG282 AG262 AE242 AH252
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 51
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 PA8/SMRXD2/FCC2_TXADDR4 PA9/SMTXD2 PA10/MSNUM5 PA11/MSNUM4 PA12/MSNUM3 PA13/MSNUM2 PA14/FCC1_MII_HDLC_RXD3 PA15/FCC1_MII_HDLC_RXD2 PA16/FCC1_MII_HDLC_RXD1/ FCCI_RMII_RXD1 PA17/FCC1_MII_HDLC_RXD0/ FCC1_MII_TRAN_RXD/ FCCI_RMII_RXD0 PA18/FCC1_MII_HDLC_TXD0/ FCC1_MII_TRAN_TXD/ FCC1_RMII_TXD0 PA19/FCC1_MII_HDLC_TXD1/ FCC1_RMII_TXD1 PA20/FCC1_MII_HDLC_TXD2 PA21/FCC1_MII_HDLC_TXD3 PA22 PA23 PA24/MSNUM1 PA25/MSNUM0 PA26/FCC1_RMII_RX_ER PA27/FCC1_MII_RX_DV/ FCC1_RMII_CRS_DV PA28/FCC1_MII_TX_EN/ FCC1_RMII_TX_EN PA29/FCC1_MII_TX_ER PA30/FCC1_MII_CRS/FCC1_RTS PA31/FCC1_MII_COL MPC8280 only L1RXD0A1/L1RXDA1 L1TXD0A1 FCC1_UT8_RXD0/FCC1_UT16_RXD8 FCC1_UT8_RXD1/FCC1_UT16_RXD9 FCC1_UT8_RXD2/ FCC1_UT16_RXD10 FCC1_UT8_RXD3/ FCC1_UT16_RXD11 FCC1_UT8_RXD4/ FCC1_UT16_RXD12 FCC1_UT8_RXD5/ FCC1_UT16_RXD13 FCC1_UT8_RXD6/ FCC1_UT16_RXD14 FCC1_UT8_RXD7/ FCC1_UT16_RXD15 FCC1_UT8_TXD7/FCC1_UT16_TXD15 AF232 AH232 AE222 AH222 AJ212 AH202 AG192 AF182 AF172 AE162
AJ162
FCC1_UT8_TXD6/FCC1_UT16_TXD14 FCC1_UT8_TXD5/FCC1_UT16_TXD13 FCC1_UT8_TXD4/FCC1_UT16_TXD12 FCC1_UT8_TXD3/FCC1_UT16_TXD11 FCC1_UT8_TXD2/FCC1_UT16_TXD10 FCC1_UT8_TXD1/FCC1_UT16_TXD9 FCC1_UT8_TXD0/FCC1_UT16_TXD8 FCC1_UTM_RXCLAV/ FCC1_UTS_RXCLAV FCC1_UT_RXSOC FCC1_UTM_RXENB/ FCC1_UTS_RXENB FCC1_UT_TXSOC FCC1_UTM_TXCLAV/ FCC1_UTS_TXCLAV FCC1_UTM_TXENB/ FCC1_UTS_TXENB
AG152 AJ132 AE132 AF122 AG112 AH92 AJ82 AH72 AF72 AD52 AF12 AD32 AB52
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 52 Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 PB4/FCC3_MII_HDLC_TXD3/ L1RSYNCA2/FCC3_RTS PB5/FCC3_MII_HDLC_TXD2/ L1TSYNCA2/L1GNTA2 PB6/FCC3_MII_HDLC_TXD1/ FCC3_RMII_TXD1/ L1RXDA2/L1RXD0A2 PB7/FCC3_MII_HDLC_TXD0/ FCC3_RMII_TXD0/ FCC3_TXD/L1TXDA2/L1TXD0A2 PB8/FCC3_MII_HDLC_RXD0/ FCC3_RMII_RXD0/ FCC3_RXD/TXD3 PB9/FCC3_MII_HDLC_RXD1/ FCC3_RMII_RXD1/L1TXD2A2 PB10/FCC3_MII_HDLC_RXD2 PB11/FCC3_MII_HDLC_RXD3 PB12/FCC3_MII_CRS/TXD2 PB13/FCC3_MII_COL/L1TXD1A2 PB14/FCC3_MII_RMII_TX_EN//RXD3 PB15/FCC3_MII_TX_ER/RXD2 PB16/FCC3_MII_RMII_RX_ER/CLK18 PB17/FCC3_MII_RX_DV/CLK17/ FCC3_RMII_CRS_DV PB18/FCC2_MII_HDLC_RXD3/ L1CLKOD2/L1RXD2A2 PB19FCC2_MII_HDLC_RXD2/ L1RQD2/L1RXD3A2 PB20/FCC2_MII_HDLC_RMII_RXD1/ L1RSYNCD2 PB21//FCC2_MII_HDLC_RMII_RXD0/ FCC2_TRAN_RXD/L1TSYNCD2/ L1GNTD2 PB22/FCC2_MII_HDLC_TXD0/ FCC2_TXD/FCC2_RMII_TXD0/ L1RXDD2 PB23/FCC2_MII_HDLC_TXD1/ L1RXD2A1/L1TXDD2/ FCC2_RMII_TXD1 PB24/FCC2_MII_HDLC_TXD2/ L1RSYNCC2 MPC8280 only FCC2_UT8_RXD0 FCC2_UT8_RXD1 FCC2_UT8_RXD2 AD282 AD262 AD252
FCC2_UT8_RXD3
AE262
FCC2_UT8_TXD3/L1RSYNCD1
AH272
FCC2_UT8_TXD2/L1TSYNCD1/ L1GNTD1 FCC2_UT8_TXD1/L1RXDD1 FCC2_UT8_TXD0/L1TXDD1 L1CLKOB1/L1RSYNCC1 L1RQB1/L1TSYNCC1/L1GNTC1 L1RXDC1 L1TXDC1 L1CLKOA1 L1RQA1 FCC2_UT8_RXD4 FCC2_UT8_RXD5 FCC2_UT8_RXD6/L1TXD1A1 FCC2_UT8_RXD7/L1TXD2A1
AG242 AH242 AJ242 AG222 AH212 AG202 AF192 AJ182 AJ172 AE142 AF132 AG122 AH112
FCC2_UT8_TXD7/L1RXD1A1
AH162
FCC2_UT8_TXD6/L1RXD2A1
AE152
FCC2_UT8_TXD5/L1RXD3A1
AJ92
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 53
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 PB25/FCC2_MII_HDLC_TXD3/ L1TSYNCC2/L1GNTC2 PB26/FCC2_MII_CRS/L1RXDC2 PB27/FCC2_MII_COL/L1TXDC2 PB28/FCC2_MII_RX_ER/ FCC2_RMII_RX_ER/FCC2_RTS/ L1TSYNCB2/L1GNTB2/TXD1 PB29/L1RSYNCB2/FCC2_MII_TX_EN/ FCC2_UTM_RXCLAV/ FCC2_RMII_TX_EN FCC2_UTS_RXCLAV PB30/FCC2_MII_RX_DV/ FCC2_RMII_CRS_DV/L1RXDB2 PB31/FCC2_MII_TX_ER/L1TXDB2 PC0/DREQ1/BRGO7/SMSYN2/ L1CLKOA2 PC1/DREQ2/BRGO6/L1RQA2/ SPISEL PC2/FCC3_CD/DONE2 PC3/FCC3_CTS/DACK2/CTS4/ USB_RP PC4/SI2_L1ST4/FCC2_CD PC5/SI2_L1ST3/FCC2_CTS PC6/FCC1_CD FCC2_UT8_TXD3 FCC2_UT8_TXD2 FCC2_UTM_RXENB/ FCC2_UTS_RXENB FCC2_UTM_TXCLAV/ FCC2_UTS_TXCLAV L1CLKOC1/FCC1_UTM_RXADDR2/ FCC1_UTS_RXADDR2/ FCC1_UTM_RXCLAV1 L1RQC1/FCC1_UTM_TXADDR2/ FCC1_UTS_TXADDR2/ FCC1_UTM_TXCLAV1 FCC1_UT16_TXD0 FCC1_UT16_TXD1 FCC1_UT16_TXD2/SI1_L1ST4/ FCC2_UT8_RXD3 L1CLKOD1/FCC2_UT8_RXD2 SI1_L1ST3/FCC1_UTM_RXADDR1/ FCC1_UTS_RXADDR1 L1RQD1/FCC1_UTM_TXADDR1/ FCC1_UTS_TXADDR1 FCC2_UT_TXSOC FCC2_UT_RXSOC MPC8280 only FCC2_UT8_TXD4/L1TXD3A1 FCC2_UT8_TXD1 FCC2_UT8_TXD0 AE92 AJ72 AH62 AE32
AE22 AC52 AC42 AB262 AD292 AE292 AE272 AF272 AF242 AJ262
PC7/FCC1_CTS
AJ252
PC8/CD4/RENA4/SI2_L1ST2/CTS3/ USBRN PC9/CTS4/CLSN4/SI2_L1ST1/ L1TSYNCA2/L1GNTA2/USB_RP PC10/CD3/RENA3 PC11/CTS3/CLSN3/L1TXD3A2 PC12/CD2/RENA2 PC13/CTS2/CLSN2
AF222 AE212 AF202 AE192 AE182 AH182
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 54 Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 PC14/CD1/RENA1 PC15/CTS1/CLSN1/SMTXD2 PC16/CLK16/TIN4 PC17/CLK15/TIN3/BRGO8 PC18/CLK14/TGATE2 PC19/CLK13/BRGO7/SPICLK PC20/CLK12/TGATE1/USB_OE PC21/CLK11/BRGO6 PC22/CLK10/DONE1/FCC1_UT_TXPRTY PC23/CLK9/BRGO5/DACK1 PC24/CLK8/TOUT4 PC25/CLK7/BRGO4 PC26/CLK6/TOUT3/TMCLK PC27/FCC3_TXD/FCC3_MII_TXD0/ FCC3_RMII_TXD0/CLK5/BRGO3 PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2/ FCC2_RXADDR4 PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1 PC30/CLK2/TOUT1 PC31/CLK1/BRGO1 PD4/BRGO8/FCC3_RTS/SMRXD2 PD5/DONE1 PD6/DACK1 PD7/SMSYN1/FCC1_TXCLAV2 L1TSYNCD1/L1GNTD1 FCC1_UT16_TXD3 FCC1_UT16_TXD4 FCC1_UTM_TXADDR3/ FCC1_UTS_TXADDR3/ FCC2_UTM_TXADDR4 FCC2_UTS_TXADDR1 FCC2_UT_TXPRTY FCC2_UT_RXPRTY FCC2_UT8_RXD1/L1RSYNCB1 FCC2_UT8_RXD0/L1TSYNCB1/ L1GNTB1 SI1_L1ST2/L1RXDB1 SI1_L1ST1/L1TXDB1 FCC2_UT8_TXD3 FCC2_UT8_TXD3 FCC2_UT8_TXD2 MPC8280 only FCC1_UTM_RXADDR0/ FCC1_UTS_RXADDR0 FCC1_UTM_TXADDR0/ FCC1_UTS_TXADDR0 AH172 AG162 AF152 AJ152 AH142 AG132 AH122 AJ112 AG102 AE102 AF92 AE82 AJ62 AG22 AF32 AF22 AE12 AD12 AC282 AD272 AF292 AF282
PD8/SMRXD1/BRGO5 PD9/SMTXD1/BRGO3 PD10/L1CLKOB2/BRGO4 PD11/L1RQB2 PD12 PD13
AG252 AH262 AJ272 AJ232 AG232 AJ222
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 55
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 PD14/L1CLKOC2/I2CSCL PD15/L1RQC2/I2CSDA PD16/SPIMISO PD17/BRGO2/SPIMOSI PD18/SPICLK MPC8280 only FCC1_UT16_RXD0 FCC1_UT16_RXD1 FCC1_UT_TXPRTY/L1TSYNCC1/ L1GNTC1 FCC1_UT_RXPRTY FCC1_UTM_RXADDR4/ FCC1_UTS_RXADDR4/ FCC1_UTM_RXCLAV3/ FCC2_UTM_RXADDR3/ FCC2_UTS_RXADDR0 FCC1_UTM_TXADDR4/ FCC1_UTS_TXADDR4/ FCC1_UTM_TXCLAV3/ FCC2_UTM_TXADDR3/ FCC2_UTS_TXADDR0 FCC1_UT16_RXD2 FCC1_UT16_RXD3 FCC1_UT16_TXD5 FCC1_UT16_RXD4/L1RSYNCD1 FCC1_UT16_RXD5/L1RXDD1 FCC1_UT16_TXD6/L1TXDD1 FCC1_UT16_RXD6/L1RSYNCC1 FCC1_UT16_RXD7/L1RXDC1 FCC1_UT16_TXD7/L1TXDC1 FCC1_UTM_RXADDR3/ FCC1_UTS_RXADDR3/ FCC1_UTM_RXCLAV2/ FCC2_UTM_RXADDR4/ FCC2_UTS_RXADDR1 FCC2_UTM_TXENB/ FCC2_UTS_TXENB AE202 AJ202 AG182 AG172 AF162
PD19/SPISEL/BRGO1
AH152
PD20/RTS4/TENA4/L1RSYNCA2/ USB_TP PD21/TXD4/L1RXD0A2/L1RXDA2/ USB_TN PD22/RXD4L1TXD0A2/L1TXDA2/ USB_RXD PD23/RTS3/TENA3 PD24/TXD3 PD25/RXD3 PD26/RTS2/TENA2 PD27/TXD2 PD28/RXD2 PD29/RTS1/TENA1
AJ142 AH132 AJ122 AE122 AF102 AG92 AH82 AG72 AE42 AG12
PD30/TXD1 PD31/RXD1 VCCSYN VCCSYN1 CLKIN2 SPARE4 3
AD42 AD22 AB3 B9 AE11 U5
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 56 Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name Ball MPC8280/MPC8270 PCI_MODE 4 SPARE6
3
MPC8280 only AF25 V4 AA1, AG4 AG21, AG14, AG8, AJ1, AJ2, AH1, AH2, AG3, AF4, AE5, AC27, Y27, T27, P27, K26, G27, AE25, AF26, AG27, AH28, AH29, AJ28, AJ29, C7, C14, C16, C20, C23, E10, A28, A29, B28, B29, C27, D26, E25, H3, M4, T3, AA4, A1, A2, B1, B2, C3, D4, E5 U28, U29, K28, K29, A9, A19, B19, M1, M2, Y1, Y2, AC1, AC2, AH19, AJ19, AH10, AJ10, AJ5 AA5, AB1 6, AB2 7, AF21, AF14, AF8, AE7, AF11, AE17, AE23, AC26, AB25, Y26, V25, T26, R25, P26, M25, K27, H25, G26, D7, D10, D14, D16, D20, D23, C9, E11, E13, E15, E19, E22, B3, G5, H4, K5, M3, P5, T4, Y5, AA2, AC3
No connect 5 I/O power
Core power
Ground
1 2 3 4 5 6
7
Should be tied to VDDH via a 2K Ω external pull-up resistor. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs. Must be pulled down or left floating. If PCI is not desired, must be pulled up or left floating. Sphere is not connected to die. GNDSYN (AB1): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate ground signal on the MPC8280. New designs must connect AB1 to GND and follow the suggestions in Section 4.6, “Layout Practices.” Old designs in which the MPC8280 is used as a drop-in replacement can leave the pin connected to GND with the noise filtering capacitors. XFC (AB2) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8280 because there is no need for external capacitor to operate the PLL. New designs should connect AB2 (XFC) pin to GND. Old designs in which the MPC8280 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Symbols used in Table 21 are described in Table 22.
Table 22. Symbol Legend
Symbol OVERBAR UTM UTS Meaning Signals with overbars, such as TA, are active low. Indicates that a signal is part of the UTOPIA master interface. Indicates that a signal is part of the UTOPIA slave interface.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 57
Pinout
Table 22. Symbol Legend (continued)
Symbol UT8 UT16 MII RMII Meaning Indicates that a signal is part of the 8-bit UTOPIA interface. Indicates that a signal is part of the 16-bit UTOPIA interface. Indicates that a signal is part of the media independent interface. Indicates that a signal is part of the reduced media independent interface.
8.2 VR and ZQ Packages—MPC8275 and MPC8270
The following figures and table represent the alternate 516 PBGA package. For information on the standard package for the MPC8280 and the MPC8270, refer to Section 8.1, “ZU Package—MPC8280 and MPC8270,” on page -43. Figure 15 shows the pinout of the VR and ZQ packages as viewed from the top surface.
1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 1
Not to Scale
2
3
456
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF
2
3
456
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
Figure 15. Pinout of the 516 PBGA Package (View from Top)
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 58 Freescale Semiconductor
Pinout
Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view.
Die attach Wire bonds
Ball bond Screen-printed solder mask Cu substrate traces
Transfer molding compound
Plated substrate via
DIE
1 mm pitch
BT resin glass epoxy
Figure 16. Side View of the PBGA Package Remove
NOTE: Temperature Reflow for the VR Package In the VR package, sphere composition is lead-free (refer to Table 2). This requires higher temperature reflow than what is required for other PowerQUICC II packages. Users should consult “Freescale PowerQUICC II™ Pb-Free Packaging Information” (MPC8250PBFREEPKG) available at www.freescale.com.
Table 23 shows the pinout list of the MPC8275 and MPC8270. Table 22 defines conventions and acronyms used in Table 23.
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List
Pin Name Ball MPC8275/MPC8270 BR BG ABB/IRQ2 TS A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 MPC8275 only C16 D2 C1 D1 D5 E8 C4 B4 A4 D7 D8 C6 B5 B6 C7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 59
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 TT0 TT1 TT2 TT3 TT4 TBST TSIZ0 TSIZ1 TSIZ2 TSIZ3 AACK ARTRY MPC8275 only C8 A6 D9 F11 B7 B8 C9 A7 B9 E11 A8 D11 B10 C11 A9 B11 C12 D12 A10 B12 B13 E7 B3 F8 A3 C3 F5 E3 E2 E1 E4 D3 C2
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 60 Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 DBG DBB/IRQ3 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 MPC8275 only A14 C15 W4 Y1 V1 P4 N3 K5 J4 G1 AB1 U4 U2 N6 N1 L1 J5 G3 AA2 W1 T3 T1 M2 K2 J1 G4 U5 T5 P5 P3 M3 K3 H2
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 61
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 D31 D32 D33 D34 D35 D36 D37 D38 D39 D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 MPC8275 only G5 AA1 V2 U1 P2 M4 K4 H3 F2 Y2 U3 T2 N2 M5 K1 H4 F1 W2 T4 R3 N4 M1 J2 H5 F3 V3 R5 R2 N5 L2 J3 H1 F4
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 62 Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 DP0/RSRV/EXT_BR2 IRQ1/DP1/EXT_BG2 IRQ2/DP2/TLBISYNC/EXT_DBG2 IRQ3/DP3/CKSTP_OUT/EXT_BR3 IRQ4/DP4/CORE_SRESET/EXT_BG3 IRQ5/CINT/DP5/TBEN/EXT_DBG3 IRQ6/DP6/CSE0 IRQ7/DP7/CSE1 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 WT/BADDR30/IRQ3 L2_HIT/IRQ4 CPU_BG/BADDR31/IRQ5/CINT CPU_DBG CPU_BR CS0 CS1 CS2 CS3 CS4 CS5 CS6 CS7 CS8 CS9 CS10/BCTL1 CS11/AP0 BADDR27 BADDR28 ALE MPC8275 only AB3 W5 AC2 AA3 AD1 AC1 AB2 Y3 D15 Y4 D16 E15 D14 E14 A17 B14 F13 B17 AC6 AD6 AE6 AB7 AF7 AC7 AD7 AF8 AE8 AD8 AC8 AB8 C13 A12 D13
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 63
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 BCTL0 PWE0/PSDDQM0/PBS0 PWE1/PSDDQM1/PBS1 PWE2/PSDDQM2/PBS2 PWE3/PSDDQM3/PBS3 PWE4/PSDDQM4/PBS4 PWE5/PSDDQM5/PBS5 PWE6/PSDDQM6/PBS6 PWE7/PSDDQM7/PBS7 PSDA10/PGPL0 PSDWE/PGPL1 POE/PSDRAS/PGPL2 PSDCAS/PGPL3 PGTA/PUPMWAIT/PGPL4/PPBS PSDAMUX/PGPL5 LWE0/LSDDQM0/LBS0/PCI_CFG0 LWE1/LSDDQM1/LBS1/PCI_CFG1 LWE2/LSDDQM2/LBS2/PCI_CFG2 LWE3/LSDDQM3/LBS3/PCI_CFG3 LSDA10/LGPL0/PCI_MODCKH0 LSDWE/LGPL1/PCI_MODCKH1 LOE/LSDRAS/LGPL2/PCI_MODCKH2 LSDCAS/LGPL3/PCI_MODCKH3 LGTA/LUPMWAIT/LGPL4/LPBS LGPL5/LSDAMUX/PCI_MODCK LWR L_A14/PAR L_A15/FRAME/SMI L_A16/TRDY L_A17/IRDY/CKSTP_OUT L_A18/STOP L_A19/DEVSEL L_A20/IDSEL MPC8275 only AF4 AA5 AE4 AD4 AF3 AB4 AE3 AF2 AD3 AE2 AD2 AE1 AC3 W6 AA4 AC9 AD9 AE9 AF9 AB6 AF5 AE5 AD5 AC5 AB5 AF6 AE13 AD15 AF16 AF15 AE15 AE14 AC17
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 64 Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 L_A21/PERR L_A22/SERR L_A23/REQ0 L_A24/REQ1/HSEJSW L_A25/GNT0 L_A26/GNT1/HSLED L_A27/GNT2/HSENUM L_A28/RST/CORE_SRESET L_A29/INTA L_A30/REQ2 L_A31/DLLOUT LCL_D0/AD0 LCL_D1/AD1 LCL_D2/AD2 LCL_D3/AD3 LCL_D4/AD4 LCL_D5/AD5 LCL_D6/AD6 LCL_D7/AD7 LCL_D8/AD8 LCL_D9/AD9 LCL_D10/AD10 LCL_D11/AD11 LCL_D12/AD12 LCL_D13/AD13 LCL_D14/AD14 LCL_D15/AD15 LCL_D16/AD16 LCL_D17/AD17 LCL_D18/AD18 LCL_D19/AD19 LCL_D20/AD20 LCL_D21/AD21 MPC8275 only AD14 AF13 AE20 AC14 AC19 AD13 AF21 AF22 AE21 AB14 AD20 AB9 AB10 AC10 AD10 AE10 AF10 AF11 AB12 AB11 AF12 AE11 AC13 AC12 AB13 AD12 AF14 AF17 AE16 AD16 AC16 AB16 AF18
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 65
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 LCL_D22/AD22 LCL_D23/AD23 LCL_D24/AD24 LCL_D25/AD25 LCL_D26/AD26 LCL_D27/AD27 LCL_D28/AD28 LCL_D29/AD29 LCL_D30/AD30 LCL_D31/AD31 LCL_DP0/C0/BE0 LCL_DP1/C1/BE1 LCL_DP2/C2/BE2 LCL_DP3/C3/BE3 IRQ0/NMI_OUT IRQ7/INT_OUT/APE TRST 1 TCK TMS TDI TDO TRIS PORESET1 HRESET SRESET QREQ RSTCONF MODCK1/AP1/TC0/BNKSEL0 MODCK2/AP2/TC1/BNKSEL1 MODCK3/AP3/TC2/BNKSEL2 CLKIN1 PA0/RESTART1/DREQ3 PA1/REJECT1/DONE3 FCC2_UTM_TXADDR2 FCC2_UTM_TXADDR1 MPC8275 only AE17 AD17 AB17 AE18 AD18 AC18 AE19 AF20 AD19 AB18 AE12 AA13 AC15 AF19 A11 E5 F22 A24 C24 A25 B24 C19 B25 D24 E23 D18 E24 B16 F16 A15 G22 AC20 2 AC212
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 66 Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 PA2/CLK20/DACK3 PA3/CLK19/DACK4/L1RXD1A2 PA4/REJECT2/DONE4 PA5/RESTART2/DREQ4 PA6 PA7/SMSYN2 PA8/SMRXD2 PA9/SMTXD2 PA10/MSNUM5 PA11/MSNUM4 PA12/MSNUM3 PA13/MSNUM2 PA14/FCC1_MII_HDLC_RXD3 PA15/FCC1_MII_HDLC_RXD2 PA16/FCC1_MII_HDLC_RXD1/ FCC1_RMII_RXD1 PA17/FCC_MII_HDLC_RXD0/ FCC1_MII_TRAN_RXD/ FCCI_RMII_RXD0 PA18/FCC1_MII_HDLC_TXD0/ FCC1_MIITRAN_TXD/ FCC1_RMII_TXD0 PA19/FCC1_MII_HDLC_TXD1/ FCC1_RMII_TXD1 PA20/FCC1_MII_HDLC_TXD2 PA21/FCC1_MII_HDLC_TXD3 PA22 PA23 PA24/MSNUM1 PA25/MSNUM0 PA26/FCC1_MII_RMII_RX_ER/ PA27/FCC1_MII_RX_DV/ FCC1_RMII_CRS_DV FCC1_UT8_RXD0/FCC1_UT16_RXD8 FCC1_UT8_RXD1/FCC1_UT16_RXD9 FCC1_UT8_RXD2/ FCC1_UT16_RXD10 FCC1_UT8_RXD3/ FCC1_UT16_RXD11 FCC1_UT8_RXD4/ FCC1_UT16_RXD12 /FCC1_UT8_RXD5/ FCC1_UT16_RXD13 FCC1_UT8_RXD6/ FCC1_UT16_RXD14 FCC1_UT8_RXD7/ FCC1_UT16_RXD15 FCC1_UT8_TXD7/FCC1_UT16_TXD15 MPC8275 only FCC2_UTM_TXADDR0 FCC2_UTM_RXADDR0 FCC2_UTM_RXADDR1 FCC2_UTM_RXADDR2 FCC2_UT_RXADDR3 FCC2_UT_TXADDR3 FCC2_UT_TXADDR4 AF252 AE242 AA212 AD252 AC242 AA222 AA232 Y262 W222 W232 V262 V252 T222 T252 R242 P222
N262
FCC1_UT8_TXD6/FCC1_UT16_TXD14 FCC1_UT8_TXD5/FCC1_UT16_TXD13 FCC1_UT8_TXD4/FCC1_UT16_TXD12 FCC1_UT8_TXD3/FCC1_UT16_TXD11 FCC1_UT8_TXD2/FCC1_UT16_TXD10 FCC1_UT8_TXD1/FCC1_UT16_TXD9 FCC1_UT8_TXD0/FCC1_UT16_TXD8 FCC1_UTM_RXCLAV/ FCC1_UTS_RXCLAV FCC1_UT_RXSOC
N232 K262 L232 K232 H262 F252 D262 D252 C252
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 67
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 PA28/FCC1_MII_TX_EN/ FCC1_RMII_TX_EN PA29/FCC1_MII_TX_ER PA30/FCC1_MII_CRS/FCC1_RTS PA31/FCC1_MII_COL PB4/FCC3_MII_HDLC_TXD3/ L1RSYNCA2/FCC3_RTS PB5/FCC3_MII_HDLC_TXD2/ L1TSYNCA2/L1GNTA2 PB6/FCC3_MII_HDLC_TXD1/ FCC3_RMII_TXD1/ L1RXDA2/L1RXD0A2 PB7/FCC3_MII_HDLC_TXD0/ FCC3_RMII_TXD0/ FCC3_TXD/L1TXDA2/L1TXD0A2 PB8/FCC3_MII_HDLC_RXD0/ FCC3_RMII_RXD0/ FCC3_RXD/TXD3 PB9/FCC3_MII_HDLC_RXD1/ FCC3_RMII_RXD1/L1TXD2A2 PB10/FCC3_MII_HDLC_RXD2 PB11/FCC3_MII_HDLC_RXD3 PB12/FCC3_MII_CRS/TXD2 PB13/FCC3_MII_COL/L1TXD1A2 PB14/FCC3_MII_RMII_TX_EN/RXD3 PB15/FCC3_MII_TX_ER/RXD2 PB16/FCC3_MII_RMII_RX_ER/CLK18 PB17/FCC3_MII_RX_DV/CLK17/ FCC3_RMII_CRS_DV PB18/FCC2_MII_HDLC_RXD3/ L1CLKOD2/L1RXD2A2 PB19FCC2_MII_HDLC_RXD2/ L1RQD2/L1RXD3A2 PB20/FCC2_MII_HDLC_RMII_RXD1/ L1RSYNCD2 PB21//FCC2_MII_HDLC_RMII_RXD0/ FCC2_TRAN_RXD/L1TSYNCD2/ L1GNTD2 FCC2_UT8_RXD4 FCC2_UT8_RXD5 FCC2_UT8_RXD6 FCC2_UT8_RXD7 MPC8275 only FCC1_UTM_RXENB/ FCC1_UTS_RXENB FCC1_UT_TXSOC FCC1_UTM_TXCLAV/ FCC1_UTS_TXCLAV FCC1_UTM_TXENB/ FCC1_UTS_TXENB FCC2_UT8_RXD0 FCC2_UT8_RXD1 FCC2_UT8_RXD2 C222 B212 A202 A192 AD212 AD222 AC222
FCC2_UT8_RXD3
AE262
FCC2_UT8_TXD3
AB232
FCC2_UT8_TXD2 FCC2_UT8_TXD1 FCC2_UT8_TXD0
AC262 AB262 AA252 W262 W252 V242 U242 R222 R232 M232 L242 K242 L212
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 68 Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 PB22/FCC2_MII_HDLC_RMII_TXD0/ FCC2_TXD/FCC2_RMII_TXD0/ L1RXDD2 PB23/FCC2_MII_HDLC_TXD1/ L1RXD2A1/L1TXDD2/ FCC2_RMII_TXD1 PB24/FCC2_MII_HDLC_TXD2/ L1RSYNCC2 PB25/FCC2_MII_HDLC_TXD3/ L1TSYNCC2/L1GNTC2 PB26/FCC2_MII_CRS/L1RXDC2 PB27/FCC2_MII_COL/L1TXDC2 MPC8275 only FCC2_UT8_TXD7 P252
FCC2_UT8_TXD6
N252
FCC2_UT8_TXD5 FCC2_UT8_TXD4 FCC2_UT8_TXD1 FCC2_UT8_TXD0
E262 H232 C262 B262 A222 A212 E202 C202 AE222 AA192
PB28/FCC2_MII_RX_ER/FCC2_RMII_RX_ER/ FCC2_RTS/L1TSYNCB2/L1GNTB2/TXD1 PB29/L1RSYNCB2/ FCC2_UTM_RXCLAV/ FCC2_MII_TX_EN/FCC2_RMII_TX_EN FCC2_UTS_RXCLAV PB30/FCC2_MII_RX_DV/L1RXDB2/ FCC2_RMII_CRS_DV PB31/FCC2_MII_TX_ER/L1TXDB2 PC0/DREQ1/BRGO7/SMSYN2/ L1CLKOA2 PC1/DREQ2/SPISEL/BRGO6/L1RQA2 PC2/FCC3_CD/DONE2 PC3/FCC3_CTS/DACK2/CTS4/ USB_RP PC4/SI2_L1ST4/FCC2_CD PC5/SI2_L1ST3/FCC2_CTS PC6/FCC1_CD FCC2_UT8_TXD3 FCC2_UT8_TXD2 FCC2_UTM_RXENB/ FCC2_UTS_RXENB FCC2_UTM_TXCLAV/ FCC2_UTS_TXCLAV FCC1_UTM_RXADDR2/ FCC1_UTS_RXADDR2/ FCC1_UTM_RXCLAV1 FCC1_UTM_TXADDR2/ FCC1_UTS_TXADDR2/ FCC1_UTM_TXCLAV1 FCC1_UT16_TXD0 FCC1_UT16_TXD1 FCC1_UT16_TXD2/FCC2_UT8_RXD3 FCC2_UT_TXSOC FCC2_UT_RXSOC
AF242 AE252 AB222 AC252 AB252
PC7/FCC1_CTS
AA242
PC8/CD4/RENA4/SI2_L1ST2/CTS3/ USB_RN PC9/CTS4/CLSN4/SI2_L1ST1/ L1TSYNCA2/L1GNTA2/USB_RP PC10/CD3/RENA3
Y242 U222 V232
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 69
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 PC11/CTS3/CLSN3/L1TXD3A2 PC12/CD2/RENA2 PC13/CTS2/CLSN2 PC14/CD1/RENA1 PC15/CTS1/CLSN1/SMTXD2 PC16/CLK16/TIN4 PC17/CLK15/TIN3/BRGO8 PC18/CLK14/TGATE2 PC19/CLK13/BRGO7/SPICLK PC20/CLK12/TGATE1/USB_OE PC21/CLK11/BRGO6 PC22/CLK10/DONE1 PC23/CLK9/BRGO5/DACK1 PC24/CLK8/TOUT4 PC25/CLK7/BRGO4 PC26/CLK6/TOUT3/TMCLK PC27/FCC3_TXD/FCC3_MII_TXD0/ FCC3_RMII_TXD0/CLK5/BRGO3 PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2 FCC2_UT_RXADDR4 PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1 PC30/CLK2/TOUT1 PC31/CLK1/BRGO1 PD4/BRGO8/FCC3_RTS/SMRXD2 PD5/DONE1 PD6/DACK1 PD7/SMSYN1/FCC1_TXCLAV2 FCC1_UT16_TXD3 FCC1_UT16_TXD4 FCC1_UTM_TXADDR3/ FCC1_UTS_TXADDR3/ FCC2_UTM_TXADDR4 FCC2_UTS_TXADDR1 FCC2_UT_TXPRTY FCC2_UT_RXPRTY FCC2_UT8_RXD1 FCC2_UT8_TXD3 FCC2_UT8_TXD3 FCC2_UT8_TXD2 FCC1_UT_TXPRTY MPC8275 only FCC2_UT8_RXD2 FCC1_UTM_RXADDR1/ FCC1_UTS_RXADDR1 FCC1_UTM_TXADDR1/ FCC1_UTS_TXADDR1 FCC1_UTM_RXADDR0/ FCC1_UTS_RXADDR0 FCC1_UTM_TXADDR0/ FCC1_UTS_TXADDR0 U232 T262 R262 P262 P242 M262 L262 M242 L222 K252 J252 G262 F262 G242 E252 G232 B232 E222 E212 D212 B202 AF232 AE232 AB212 AD232
PD8/SMRXD1/BRGO5 PD9/SMTXD1/BRGO3 PD10/L1CLKOB2/BRGO4
AD262 Y222 AB242
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 70 Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 PD11/L1RQB2 PD12 PD13 PD14/L1CLKOC2/I2CSCL PD15/L1RQC2/I2CSDA PD16/SPIMISO PD17/BRGO2/SPIMOSI PD18/SPICLK FCC1_UT16_RXD0 FCC1_UT16_RXD1 FCC1_UT_TXPRTY FCC1_UT_RXPRTY FCC1_UTM_RXADDR4/ FCC1_UTS_RXADDR4/ FCC1_UTM_RXCLAV3/ FCC2_UTM_RXADDR3/ FCC2_UTS_RXADDR0 FCC1_UTM_TXADDR4/ FCC1_UTS_TXADDR4/ FCC1_UTM_TXCLAV3/ FCC2_UTM_TXADDR3/ FCC2_UTS_TXADDR0 FCC1_UT16_RXD2 FCC1_UT16_RXD3 FCC1_UT16_TXD5 FCC1_UT16_RXD4 FCC1_UT16_RXD5 FCC1_UT16_TXD6 FCC1_UT16_RXD6 FCC1_UT16_RXD7 FCC1_UT16_TXD7 FCC1_UTM_RXADDR3/ FCC1_UTS_RXADDR3/ FCC1_UTM_RXCLAV2/ FCC2_UTM_RXADDR4/ FCC2_UTS_RXADDR1 FCC2_UTM_TXENB/ FCC2_UTS_TXENB MPC8275 only FCC2_UT8_RXD0 L1GNTB1 Y232 AA262 W242 V222 U262 T232 R252 P232
PD19/SPISEL/BRGO1
N222
PD20/RTS4/TENA4/L1RSYNCA2/ USB_TP PD21/TXD4/L1RXD0A2/L1RXDA2/ USB_TN PD22/RXD4L1TXD0A2/L1TXDA2/ USB_RXD PD23/RTS3/TENA3 PD24/TXD3 PD25/RXD3 PD26/RTS2/TENA2 PD27/TXD2 PD28/RXD2 PD29/RTS1/TENA1
M252 L252 J262 K222 G252 H242 F242 H222 B222 D222
PD30/TXD1 PD31/RXD1 VCCSYN
C212 E192 D19
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 71
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name Ball MPC8275/MPC8270 VCCSYN1 CLKIN2 SPARE4 3 PCI_MODE 4 SPARE6 No
3
MPC8275 only K6 K21 C14 AD24 B15 E17, C23 E6, F6, H6, L5, L6, P6, T6, U6, V5, Y5, AA6, AA8, AA10, AA11, AA14, AA16, AA17, AB19, AB20, W21, U21, T21, P21, N21, M22, J22, H21, F21, F19, F17, E16, F14, E13, E12, F10, E10, E9 L3, V4, W3, AC11, AD11, AB15, U25, T24, J24, H25, F23, B19, D17, C17, D10, C10 B18 6, A18 7, A2, B1, B2, A5, C5, C18, D4, D6, G2, L4, P1, R1, R4, AC4, AE7, AC23, Y25, N24, J23, A23, D23, D20, E18, A13, A16, K10, K11, K12, K13, K14, K15, K16, K17, L10, L11, L12, L13, L14, L15, L16, L17, M10, M11, M12, M13, M14, M15, M16, M17, N10, N11, N12, N13, N14, N15, N16, N17, P10, P11, P12, P13, P14, P15, P16, P17, R10, R11,R12, R13, R14, R15, R16, R17, T10, T11, T12, T13, T14, T15, T16, T17, U10, U11, U12, U13, U14, U15, U16, U17
connect 5
I/O power
Core Power
Ground
1 2 3 4 5 6
7
Should be tied to VDDH via a 2K Ω external pull-up resistor. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs. Must be pulled down or left floating. If PCI is not desired, must be pulled up or left floating. Sphere is not connected to die. GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate ground signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in Section 4.6, “Layout Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to GND with the noise filtering capacitors. XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no need for external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 72 Freescale Semiconductor
Package Description
9
Package Description
The following sections provide the package parameters and mechanical dimensions.
9.1 Package Parameters
Package parameters are provided in Table 24.
Table 24. Package Parameters
Package ZU VR ZQ Devices MPC8280 MPC8270 MPC8275VR MPC8270VR MPC8275ZQ MPC8270ZQ Outline (mm) 37.5 x 37.5 27 x 27 27 x 27 Type TBGA PBGA PBGA Interconnects 480 516 516 Pitch (mm) 1.27 1 1 Nominal Unmounted Height (mm) 1.55 2.25 2.25
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 73
Package Description
9.2 Mechanical Dimensions
Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU) package. Refer to Table 2.
Notes:
1. Dimensions and Tolerancing per ASME Y14.5M-1994. 2. Dimensions in millimeters. 3. Dimension b is measured at the maximum solder ball diameter, parallel to primary data A. 4. Primary data A and the seating plane are defined by the spherical crowns of the solder balls.
Millimeters Dim Min A A1 A2 A3 b D D1 e E E1 1.45 0.60 0.85 0.25 0.65 Max 1.65 0.70 0.95 — 0.85
37.50 BSC 35.56 REF 1.27 BSC 37.50 BSC 35.56 REF
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 74 Freescale Semiconductor
Package Description
Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the 516 PBGA (VR/ZQ) packages.
Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature—516 PBGA
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 75
Ordering Information
10 Ordering Information
Figure 19 provides an example of the Freescale part numbering nomenclature for the MPC8280. In addition to the processor frequency, the part numbering scheme also consists of a part modifier that indicates any enhancement(s) in the part from the original production design. Each part number also contains a revision code that refers to the die mask revision number and is specified in the part numbering scheme for identification purposes only. For more information, contact your local Freescale sales office.
MPC 82XX C ZU XXX X
Product Code Device Number Temperature Range Blank = 0T to 105Tj
A
Die Revision Level Processor Frequency (CPU/CPM/Bus) Package ZU = 480 TBGA Lead spheres VR = 516 PBGA Lead-free spheres ZQ = 516 PBGA Lead spheres
C = (-40)T – 105Tj
A
Figure 19. Freescale Part Number Key
11 Document Revision History
Table 25. Document Revision History
Revision 1.7 1.6 Date 12/2006 05/2006 Substantive Changes • Section 6, “AC Electrical Characteristics,” removed deratings statement and clarified AC timing descriptions. • • • • Table 11: Added text to clarify that Data Bus Parity is not supported at 66 Mhz. Table 11: Added text to clarify that Data Bus ECC is supported at 66 Mhz Table 11: Added note to DP pins to show it is not supported at 66 MHz Table 12: Added note to support 1 ns hold time
1.5 1.4 1.3
03/2006 11/2005 01/2005
• Added Section 6.3, “JTAG Timings” • In Section 6.2, “SIU AC Characteristics”, modified the note on CLKIN Jitter and Duty Cycle. • Modified Figure 17 to display all text. • Modification for correct display of assertion level (“overbar”) for some signals
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 76 Freescale Semiconductor
Document Revision History
Table 25. Document Revision History (continued)
Revision 1.2 Date 12/2004 Substantive Changes • Section 2: removed voltage tracking note • Table 3: Note 2 updated regarding VDD/VCCSYN relationship to VDDH during power-on reset • Table 5: Note 2 updated to reflect VIH=2.5 for TCK, TRST, PORESET; request for external pullup removed. • Table 5: Note 4 added regarding IIC compatibility • Section 4.2: New information about jumper-to-case thermal resistance • Section 4.3: New information about jumper-to-board thermal resistance • Section 4.4: New information about estimation with simulation • Section 4.6: Updated description of layout practices • Section 6: Added sentence providing derating factor • Section 6.1, “CPM AC Characteristics”: added Note: Rise/Fall Time on CPM Input Pins • Table 9: updated values for following specs: sp42, sp43, sp42a • Table 10: updated values for following specs: sp16b, sp18b, sp20, sp22 • Section 6.2: added spread sprectrum clocking note • Table 11: combined specs sp11 and sp11a • Sections 7.2, 7.3: unit of ns added to Tval notes • Section 7, “Clock Configuration Modes”: Updated all table footnotes reflect updated CPU Fmin of 150 MHz commercial temp devices, 175 MHz extended temp; CPM Fmin of 120 MHz.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 77
Document Revision History
Table 25. Document Revision History (continued)
Revision 1.0 Date 2/2004 • • • • • • • • • • • • • • • • • • • • • • • • • • • • Substantive Changes Removal of “Advance Information” and “Preliminary.” The MPC8280 is fully qualified. Table 1: New Figure 1: Modification to note 2 Section 1.1: Core frequency range is 166–450 MHz Addition of ZQ (516 PBGA with Lead spheres) package references Table 4: VDD and VCCSYN modified to 1.45–1.60 V Note following Table 4: Modified Table 5: Addition of note 2 regarding TRST and PORESET (see VIH row of Table 5) Table 5: Changed IOL for 60x signals to 6.0 mA Table 5: Moved QREQ to VOL: IOL= 3.2 mA Table 5: Addition of critical interrupt (CINT) to IRQ5 for VOL (IOL = 6.0mA) Table 6: Addition of ΨJT and note 4 Sections 4.1–4.5: New Table 7: Modified power values (+ 150mW to each) Table 8: Addition of note 2. Changed PCI impedance to 27 Ω. Table 9: Changes to sp36b, SP38a, sp38b, sp37a, sp39a, sp40 and sp41 Table 10: Changes to sp16a, sp18a, sp20 and sp21 Section 6.2: Addition of Note: CLKIN Jitter and Duty Cycle Table 11: Changes to sp13 @ 66 and 83 MHz, sp14 @ 83 MHz Table 12: Change to sp30 (data bus signals). Changes to sp33b. Removal of note 2. Table 16 through Table 20: Modification of note 1 regarding CPU and CPM Fmin. Modification to corresponding values in tables. Table 21: Addition of note 1 to TRST (AH3) and PORESET (AG6) Table 21: Addition of RXD3 to CPM port pin PB14. Previously omitted. Table 21: Addition of critical interrupt (CINT) to B21 and U4. Previously omitted. Table 21: Addition of note 5 to ‘No connect’ (AA1, AG4) Addition of “Note: Temperature Reflow for the VR Package" on page 59 Table 23: Addition of note 1 to TRST (F22) and PORESET (B25) Table 23: Addition of previously omitted signals that are multiplexed with CPM port pins: PA6—FCC2_UT_RXADDR3 PA7—FCC2_UT_TXADDR3 PA8—FCC2_UT_TXADDR4 PB14—RXD3 PC19—SPICLK PC22—FCC1_UT_TXPRTY PC28—FCC2_UT_RXADDR4 Table 23: Removal of serial interface 1 (SI1) signals from port pins (see note 2 in Figure 1): PA[6–9], PB[8–17, 20–25], PC[6–7, 10–13], PD[4, 10–13, 16, 23–28] Table 23: Addition of critical interrupt (CINT) to AC1 and B14. Previously omitted. Table 23: Addition of note 5 to ‘No connect’ (E17, C23)
• • •
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 78 Freescale Semiconductor
Document Revision History
Table 25. Document Revision History (continued)
Revision 0.3 Date 6/2003 Substantive Changes • Removal of notes stating “no local bus” on VR-package devices. The MPC8270VR and the MPC8275VR have local bus support. • References to “G2 core” changed to “G2_LE core.” Refer to the G2 Core Reference Manual (G2CORERM/D). • Addition of VCCSYN to “Note” below Table 4, and to note 3 of Table 5 • Figure 2: New • Table 5: Addition of note 1 • Table 6: Addition of θJB and θJC. Modifications to ZU package values. • Table 7: Addition of various configurations, Modification of values. Addition of note 3. • Table 9: Addition of 66 MHZ and 100 MHz values. Addition of sp42a/sp43a. • Table 10: Addition of 66 MHZ and 100 MHz values • Table 12: sp30 values. sp33b @100 MHz value. Removal of previous note 2. Modification of current note 2. • Figure 5, Figure 6, Figure 7, and Figure 8: Addition of notes • Section 6.2: Addition of note on PCI timing • Table 16, Table 17, Table 18, Table 19, Table 20: Addition of note 1 concerning minimum operating frequencies • Addition of statement before clock tables about selection of clock configuration and input frequency • Table 21 and Table 23: Addition of note 1 to CPM pins
0.2 0.1
11/2002 Table 23, “VR Pinout”: Addition of C18 to the Ground (GND) pin list (page 63) — Initial public release
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 79
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MPC8280EC Rev. 1.7 12/2006
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