MPC8313ECVRGDFB

Freescale Semiconductor Technical Data Document Number: MPC8313EEC Rev. 2.1, 12/2008 MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications This document provides an overview of the MPC8313E PowerQUICC™ II Pro processor features, including a block diagram showing the major functional components. The MPC8313E is a cost-effective, low-power, highly integrated host processor that addresses the requirements of several printing and imaging, consumer, and industrial applications, including main CPUs and I/O processors in printing systems, networking switches and line cards, wireless LANs (WLANs), network access servers (NAS), VPN routers, intelligent NIC, and industrial controllers. The MPC8313E extends the PowerQUICC™ family, adding higher CPU performance, additional functionality, and faster interfaces while addressing the requirements related to time-to-market, price, power consumption, and package size. NOTE The information in this document is accurate for revisions 1.0, 2.x, and later. See Section 24.1, “Part Numbers Fully Addressed by this Document.” Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10 Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12 RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13 DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 14 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Ethernet: Three-Speed Ethernet, MII Management . 21 High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 36 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Enhanced Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . 47 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 63 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 System Design Information . . . . . . . . . . . . . . . . . . . 88 Document Revision History . . . . . . . . . . . . . . . . . . . 94 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 97 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. © Freescale Semiconductor, Inc., 2007, 2008. All rights reserved. Overview 1 Overview The MPC8313E incorporates the e300c3 core, which includes 16 Kbytes of L1 instruction and data caches and on-chip memory management units (MMUs). The MPC8313E has interfaces to dual enhanced three-speed 10/100/1000 Mbps Ethernet controllers, a DDR1/DDR2 SDRAM memory controller, an enhanced local bus controller, a 32-bit PCI controller, a dedicated security engine, a USB 2.0 dual-role controller and an on-chip full-speed PHY, a programmable interrupt controller, dual I2C controllers, a 4-channel DMA controller, and a general-purpose I/O port. A block diagram of the MPC8313E is shown in Figure 1. DUART Dual I2C Timers GPIO e300c3 Core w/FPU and Power Management Interrupt Controller 16-KB I-Cache 16-KB D-Cache Local Bus, SPI DDR1/DDR2 Controller I/O Sequencer (IOS) PCI DMA Security Engine 2.2 USB 2.0 Host/Device/OTG ULPI On-Chip FS PHY Gb Ethernet MAC Gb Ethernet MAC Note: The MPC8313 does not include a security engine. Figure 1. MPC8313E Block Diagram The MPC8313E security engine (SEC 2.2) allows CPU-intensive cryptographic operations to be offloaded from the main CPU core. The security-processing accelerator provides hardware acceleration for the DES, 3DES, AES, SHA-1, and MD-5 algorithms. 1.1 MPC8313E Features The following features are supported in the MPC8313E: • Embedded PowerPC™ e300 processor core built on Power Architecture™ technology; operates at up to 333 MHz. • High-performance, low-power, and cost-effective host processor • DDR1/DDR2 memory controller—one 16-/32-bit interface at up to 333 MHz supporting both DDR1 and DDR2 • 16-Kbyte instruction cache and 16-Kbyte data cache, a floating point unit, and two integer units • Peripheral interfaces such as 32-bit PCI interface with up to 66-MHz operation, 16-bit enhanced local bus interface with up to 66-MHz operation, and USB 2.0 (full speed) with an on-chip PHY. • Security engine provides acceleration for control and data plane security protocols • Power management controller for low-power consumption • High degree of software compatibility with previous-generation PowerQUICC processor-based designs for backward compatibility and easier software migration MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 2 Freescale Semiconductor Overview 1.2 Serial Interfaces The following interfaces are supported in the MPC8313E: dual UART, dual I2C, and an SPI interface 1.3 Security Engine The security engine is optimized to handle all the algorithms associated with IPSec, IEEE Std 802.11i®, and iSCSI. The security engine contains one crypto-channel, a controller, and a set of crypto execution units (EUs). The execution units are as follows: • Data encryption standard execution unit (DEU), supporting DES and 3DES • Advanced encryption standard unit (AESU), supporting AES • Message digest execution unit (MDEU), supporting MD5, SHA1, SHA-224, SHA-256, and HMAC with any algorithm • One crypto-channel supporting multi-command descriptor chains 1.4 DDR Memory Controller The MPC8313E DDR1/DDR2 memory controller includes the following features: • Single 16- or 32-bit interface supporting both DDR1 and DDR2 SDRAM • Support for up to 333 MHz • Support for two physical banks (chip selects), each bank independently addressable • 64-Mbit to 1-Gbit devices with x8/x16/x32 data ports (no direct x4 support) • Support for one 16-bit device or two 8-bit devices on a 16-bit bus, or one 32-bit device or two 16-bit devices on a 32-bit bus • Support for up to 16 simultaneous open pages • Supports auto refresh • On-the-fly power management using CKE • 1.8-/2.5-V SSTL2 compatible I/O 1.5 PCI Controller The MPC8313E PCI controller includes the following features: • PCI specification revision 2.3 compatible • Single 32-bit data PCI interface operates at up to 66 MHz • PCI 3.3-V compatible (not 5-V compatible) • Support for host and agent modes • On-chip arbitration, supporting three external masters on PCI • Selectable hardware-enforced coherency MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 3 Overview 1.6 USB Dual-Role Controller The MPC8313E USB controller includes the following features: • Supports USB on-the-go mode, which includes both device and host functionality, when using an external ULPI (UTMI + low-pin interface) PHY • Compatible with Universal Serial Bus Specification, Rev. 2.0 • Supports operation as a stand-alone USB device — Supports one upstream facing port — Supports three programmable USB endpoints • Supports operation as a stand-alone USB host controller — Supports USB root hub with one downstream-facing port — Enhanced host controller interface (EHCI) compatible • Supports full-speed (12 Mbps), and low-speed (1.5 Mbps) operation. Low-speed operation is supported only in host mode. • Supports UTMI + low pin interface (ULPI) or on-chip USB 2.0 full-speed PHY 1.7 Dual Enhanced Three-Speed Ethernet Controllers (eTSECs) The MPC8313E eTSECs include the following features: • Two RGMII/SGMII/MII/RMII/RTBI interfaces • Two controllers designed to comply with IEEE Std 802.3®, 802.3u®, 802.3x®, 802.3z®, 802.3au®, and 802.3ab® • Support for Wake-on-Magic Packet™, a method to bring the device from standby to full operating mode • MII management interface for external PHY control and status • Three-speed support (10/100/1000 Mbps) • On-chip high-speed serial interface to external SGMII PHY interface • Support for IEEE Std 1588™ • Support for two full-duplex FIFO interface modes • Multiple PHY interface configuration • TCP/IP acceleration and QoS features available • IP v4 and IP v6 header recognition on receive • IP v4 header checksum verification and generation • TCP and UDP checksum verification and generation • Per-packet configurable acceleration • Recognition of VLAN, stacked (queue in queue) VLAN, IEEE Std 802.2®, PPPoE session, MPLS stacks, and ESP/AH IP-security headers • Transmission from up to eight physical queues. • Reception to up to eight physical queues MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 4 Freescale Semiconductor Overview • • • • • • Full- and half-duplex Ethernet support (1000 Mbps supports only full-duplex): — IEEE 802.3 full-duplex flow control (automatic PAUSE frame generation or software-programmed PAUSE frame generation and recognition) — Programmable maximum frame length supports jumbo frames (up to 9.6 Kbytes) and IEEE 802.1 virtual local area network (VLAN) tags and priority — VLAN insertion and deletion – Per-frame VLAN control word or default VLAN for each eTSEC – Extracted VLAN control word passed to software separately — Retransmission following a collision — CRC generation and verification of inbound/outbound packets — Programmable Ethernet preamble insertion and extraction of up to 7 bytes MAC address recognition: — Exact match on primary and virtual 48-bit unicast addresses – VRRP and HSRP support for seamless router fail-over — Up to 16 exact-match MAC addresses supported — Broadcast address (accept/reject) — Hash table match on up to 512 multicast addresses — Promiscuous mode Buffer descriptors backward compatible with MPC8260 and MPC860T 10/100 Ethernet programming models RMON statistics support 10-Kbyte internal transmit and 2-Kbyte receive FIFOs MII management interface for control and status 1.8 Programmable Interrupt Controller (PIC) The programmable interrupt controller (PIC) implements the necessary functions to provide a flexible solution for general-purpose interrupt control. The PIC programming model supports 5 external and 34 internal discrete interrupt sources. Interrupts can also be redirected to an external interrupt controller. 1.9 Power Management Controller (PMC) The MPC8313E power management controller includes the following features: • Provides power management when the device is used in both host and agent modes • Supports PCI power management 1.2 D0, D1, D2, D3hot, and D3cold states • On-chip split power supply controlled through external power switch for minimum standby power • Support for PME generation in PCI agent mode, PME detection in PCI host mode • Supports wake-up from Ethernet (Magic Packet), USB, GPIO, and PCI (PME input as host) MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 5 Electrical Characteristics 1.10 Serial Peripheral Interface (SPI) The serial peripheral interface (SPI) allows the MPC8313E to exchange data between other PowerQUICC family chips, Ethernet PHYs for configuration, and peripheral devices such as EEPROMs, real-time clocks, A/D converters, and ISDN devices. The SPI is a full-duplex, synchronous, character-oriented channel that supports a four-wire interface (receive, transmit, clock, and slave select). The SPI block consists of transmitter and receiver sections, an independent baud-rate generator, and a control unit. 1.11 DMA Controller, Dual I2C, DUART, Local Bus Controller, and Timers The MPC8313E provides an integrated four-channel DMA controller with the following features: • Allows chaining (both extended and direct) through local memory-mapped chain descriptors (accessible by local masters) • Supports misaligned transfers There are two I2C controllers. These synchronous, multi-master buses can be connected to additional devices for expansion and system development. The DUART supports full-duplex operation and is compatible with the PC16450 and PC16550 programming models. The 16-byte FIFOs are supported for both the transmitter and the receiver. The MPC8313E local bus controller (LBC) port allows connections with a wide variety of external DSPs and ASICs. Three separate state machines share the same external pins and can be programmed separately to access different types of devices. The general-purpose chip select machine (GPCM) controls accesses to asynchronous devices using a simple handshake protocol. The three user programmable machines (UPMs) can be programmed to interface to synchronous devices or custom ASIC interfaces. Each chip select can be configured so that the associated chip interface can be controlled by the GPCM or UPM controller. The FCM provides a glueless interface to parallel-bus NAND Flash E2PROM devices. The FCM contains three basic configuration register groups—BRn, ORn, and FMR. Both may exist in the same system. The local bus can operate at up to 66 MHz. The MPC8313E system timers include the following features: periodic interrupt timer, real time clock, software watchdog timer, and two general-purpose timer blocks. 2 Electrical Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8313E. The MPC8313E is currently targeted to these specifications. Some of these specifications are independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design specifications. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 6 Freescale Semiconductor Electrical Characteristics 2.1 Overall DC Electrical Characteristics This section covers the ratings, conditions, and other characteristics. 2.1.1 Absolute Maximum Ratings Table 1. Absolute Maximum Ratings1 Characteristic Symbol VDD AVDD XCOREVDD XPADVDD GVDD NVDD/LVDD LVDDA/LVDDB DDR DRAM signals DDR DRAM reference Enhanced three-speed Ethernet signals MVIN MVREF LVIN Max Value –0.3 to 1.26 –0.3 to 1.26 –0.3 to 1.26 –0.3 to 1.26 –0.3 to 2.75 –0.3 to 1.98 –0.3 to 3.6 –0.3 to 3.6 –0.3 to (GV DD + 0.3) –0.3 to (GV DD + 0.3) –0.3 to (LVDDA + 0.3) or –0.3 to (LVDDB + 0.3) –0.3 to (NVDD + 0.3) Unit V V V V V V V V V V Notes — — — — — — — 2, 5 2, 5 4, 5 Table 1 provides the absolute maximum ratings. Core supply voltage PLL supply voltage Core power supply for SerDes transceivers Pad power supply for SerDes transceivers DDR and DDR2 DRAM I/O voltage PCI, local bus, DUART, system control and power management, I2C, and JTAG I/O voltage eTSEC, USB Input voltage Local bus, DUART, SYS_CLK_IN, system control, and power management, I2C, and JTAG signals PCI Storage temperature range OVIN V 3, 5 OVIN TSTG –0.3 to (NVDD + 0.3) –55 to 150 V °C 6 — Notes: 1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 3. Caution: OVIN must not exceed NVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 4. Caution: LV IN must not exceed LV DDA/LVDDB by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 2.1.2 Power Supply Voltage Specification Table 2 provides the recommended operating conditions for the MPC8313E. Note that the values in Table 2 are the recommended and tested operating conditions. If a particular block is given a voltage falling within the range in the Recommended Value column, the MPC8313E is capable of delivering the MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 7 Electrical Characteristics amount of current listed in the Current Requirement column; this is the maximum current possible. Proper device operation outside of these conditions is not guaranteed. Table 2. Recommended Operating Conditions Characteristic Core supply voltage Internal core logic constant power SerDes internal digital power SerDes internal digital ground SerDes I/O digital power SerDes I/O digital ground SerDes analog power for PLL SerDes analog ground for PLL Dedicated 3.3 V analog power for USB PLL Dedicated 1.0 V analog power for USB PLL Dedicated analog ground for USB PLL Dedicated USB power for USB bias circuit Dedicated USB ground for USB bias circuit Dedicated power for USB transceiver Dedicated ground for USB transceiver Analog power for e300 core APLL Analog power for system APLL DDR1 DRAM I/O voltage (333 MHz, 32-bit operation) DDR2 DRAM I/O voltage (333 MHz, 32-bit operation) Differential reference voltage for DDR controller Symbol VDD VDDC XCOREVDD XCOREVSS XPADVDD XPADVSS SDAVDD SDAVSS USB_PLL_PWR3 USB_PLL_PWR1 USB_PLL_GND USB_VDDA_BIAS USB_VSSA_BIAS USB_VDDA USB_VSSA AVDD1 AVDD2 GVDD GVDD MVREF Recommended Value1 1.0 V ± 50 mV 1.0 V ± 50 mV 1.0 0.0 1.0 0.0 1.0 V ± 50 mV 0.0 3.3 V ± 300 mV 1.0 V ± 50 mV 0.0 3.3 V ± 300 mV 0.0 3.3 V ± 300 mV 0.0 1.0 V ± 50 mV 1.0 V ± 50 mV 2.5 V ± 125 mV 1.8 V ± 80 mV 1/2 DDR supply (0.49 × GVDD to 0.51 × GV DD) 3.3 V ± 300 mV2 2.5 V ± 125 mV/ 3.3 V ± 300 mV 2.5 V ± 125 mV/ 3.3 V ± 300 mV 3.3 V ± 300 mV 0.0 0 to 105 Unit V V V V V V V V V V V V V V V V V V V V Current Requirement 469 mA 377 mA 170 mA — 10 mA — 10 mA — 2–3 mA 2–3 mA — 4–5 mA — 75 mA — 2–3 mA 2–3 mA 131 mA 140 mA — Standard I/O voltage eTSEC2 IO supply eTSEC1/USB DR IO supply Supply for eLBC IOs Analog and digital ground Junction temperature 1 NVDD LVDDA LVDDB LVDD VSS TJ V V V V V °C 74 mA 22 mA 44 mA 16 mA — — GVDD, NVDD, AVDD, and V DD must track each other and must vary in the same direction—either in the positive or negative direction. 2 Some GPIO pins may operate from a 2.5-V supply when configured for other functions. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 8 Freescale Semiconductor Electrical Characteristics Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8313E. G/L/NVDD + 20% G/L/NVDD + 5% VIH G/L/NVDD VIL VSS VSS – 0.3 V VSS – 0.7 V Note: 1. Note that tinterface refers to the clock period associated with the bus clock interface. Not to Exceed 10% of tinterface1 Figure 2. Overshoot/Undershoot Voltage for GVDD/NVDD/LVDD 2.1.3 Output Driver Characteristics Table 3. Output Drive Capability Driver Type Local bus interface utilities signals PCI signals DDR signal DDR2 signal DUART, system control, GPIO signals eTSEC signals USB signals I2C, JTAG, SPI Output Impedance (Ω) 42 25 18 18 42 42 42 42 GVDD = 2.5 V GVDD = 1.8 V NVDD = 3.3 V NVDD = 3.3 V LVDDA, LVDDB = 2.5/3.3 V LVDDB = 2.5/3.3 V Supply Voltage NVDD = 3.3 V Table 3 provides information on the characteristics of the output driver strengths. 2.2 Power Sequencing The MPC8313E does not require the core supply voltage (V DD and VDDC) and IO supply voltages (GVDD, LVDD, and OVDD) to be applied in any particular order. Note that during power ramp-up, before the power supplies are stable and if the I/O voltages are supplied before the core voltage, there might be a period of time that all input and output pins are actively driven and cause contention and excessive current. In order to avoid actively driving the I/O pins and to eliminate excessive current draw, apply the core voltage (VDD MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 9 Power Characteristics and VDDC) before the I/O voltage (GVDD, LVDD, and OVDD) and assert PORESET before the power supplies fully ramp up. In the case where the core voltage is applied first, the core voltage supply must rise to 90% of its nominal value before the I/O supplies reach 0.7 V; see Figure 3. Once both the power supplies (I/O voltage and core voltage) are stable, wait for a minimum of 32 clock cycles before negating PORESET. Note that there is no specific power down sequence requirement for the MPC8313E. I/O voltage supplies (GVDD, LVDD, and OVDD) do not have any ordering requirements with respect to one another. V I/O Voltage (GV DD, GVDD, and OVDD) Core Voltage (V DD, VDDC) 90% 0.7 V 0 PORESET t tSYS_CLK_IN /tPCI_SYNC_IN >= 32 clocks Figure 3. Power-Up Sequencing Example 3 Power Characteristics Table 4. MPC8313E Power Dissipation1 Core Frequency (MHz) 333 400 1 The estimated typical power dissipation, not including I/O supply power, for this family of MPC8313E devices is shown in Table 4. Table 5 shows the estimated typical I/O power dissipation. CSB Frequency (MHz) 167 133 Typical2 Maximum for Rev. 1.0 Silicon3 1020 1020 Maximum for Rev. 2.x or Later Silicon3 1200 1200 Unit 820 820 mW mW The values do not include I/O supply power or AVDD, but do include core, USB PLL, and a portion of SerDes digital power (not including XCOREV DD, XPADVDD, or SDAVDD, which all have dedicated power supplies for the SerDes PHY). 2 Typical power is based on a voltage of VDD = 1.05 V and an artificial smoker test running at room temperature. 3 Maximum power is based on a voltage of V DD = 1.05 V, a junction temperature of TJ = 105°C, and an artificial smoker test. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 10 Freescale Semiconductor Power Characteristics Table 5 describes a typical scenario where blocks with the stated percentage of utilization and impedances consume the amount of power described. 1 Table 5. MPC8313E Typical I/O Power Dissipation Interface Parameter 333 MHz, 32 bits 266 MHz, 32 bits GVDD (1.8 V) — — GVDD (2.5 V) 0.355 0.323 NVDD (3.3 V) — — LVDDA/ LVDDB (3.3 V) — — LVDDA/ LVDDB (2.5 V) — — LVDD (3.3 V) — — Unit W W Comments — — DDR 1, 60% utilization, 50% read/write Rs = 2 2 Ω Rt = 5 0 Ω single pair of clock capacitive load: data = 8 pF, control address = 8 pF, clock = 8 pF DDR 2, 60% utilization, 50% read/write Rs = 2 2 Ω Rt = 7 5 Ω single pair of clock capacitive load: data = 8 pF, control address = 8 pF, clock = 8 pF PCI I/O load = 50 pF 333 MHz, 32 bits 266 MHz, 32 bits 0.266 0.246 — — — — — — — — — — W W — — 33 MHz 66 MHz — — — — — — — — — — — — — — — — 0.120 0.249 — — — — — 0.015 — — — — 0.008 0.078 0.078 — — — — — — 0.044 — — — — 0.056 0.040 — — — — W W W W W W W W — — — — Multiple by number of interface used — — Local bus I/O load = 20 pF 66 MHz 50 MHz TSEC I/O load = 20 pF MII, 25 MHz RGMII, 125 MHz USBDR controller load = 20 pF Other I/O 60 MHz — Table 6 shows the estimated core power dissipation of the MPC8313E while transitioning into the D3 warm low-power state. Table 6. MPC8313E Low-Power Modes Power Dissipation1 333-MHz Core, 167-MHz CSB2 D3 warm 1 Rev. 1.0 3 400 Rev. 2.x or Later3 425 Unit mW All interfaces are enabled. For further power savings, disable the clocks to unused blocks. 2 The interfaces are run at the following frequencies: DDR: 333 MHz, eLBC 83 MHz, PCI 33 MHz, eTSEC1 and TSEC2: 167 MHz, SEC: 167 MHz, USB: 167 MHz. See the SCCR register for more information. 3 This is maximum power in D3 Warm based on a voltage of 1.05 V and a junction temperature of 105°C. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 11 Clock Input Timing 4 4.1 Clock Input Timing DC Electrical Characteristics This section provides the clock input DC and AC electrical characteristics for the MPC8313E. Table 7 provides the system clock input (SYS_CLK_IN/PCI_SYNC_IN) DC timing specifications for the MPC8313E. Table 7. SYS_CLK_IN DC Electrical Characteristics Parameter Input high voltage Input low voltage SYS_CLK_IN input current PCI_SYNC_IN input current Condition — — 0 V ≤ VIN ≤ NVDD 0 V ≤ VIN ≤ 0.5 V or NVDD – 0.5 V ≤ VIN ≤ NVDD 0.5 V ≤ VIN ≤ NVDD – 0.5 V Symbol VIH VIL IIN IIN Min 2.4 –0.3 — — Max NVDD + 0.3 0.4 ±10 ±10 Unit V V μA μA PCI_SYNC_IN input current IIN — ±50 μA 4.2 AC Electrical Characteristics The primary clock source for the MPC8313E can be one of two inputs, SYS_CLK_IN or PCI_CLK, depending on whether the device is configured in PCI host or PCI agent mode. Table 8 provides the system clock input (SYS_CLK_IN/PCI_CLK) AC timing specifications for the MPC8313E. Table 8. SYS_CLK_IN AC Timing Specifications Parameter/Condition SYS_CLK_IN/PCI_CLK frequency SYS_CLK_IN/PCI_CLK cycle time SYS_CLK_IN/PCI_CLK rise and fall time SYS_CLK_IN/PCI_CLK duty cycle SYS_CLK_IN/PCI_CLK jitter Symbol fSYS_CLK_IN tSYS_CLK_IN tKH, tKL tKHK/tSYS_CLK_IN — Min 24 15 0.6 40 — Typ — — 0.8 — — Max 66.67 — 1.2 60 ±150 Unit MHz ns ns % ps Notes 1 — 2 3 4, 5 Notes: 1. Caution: The system, core, security block must not exceed their respective maximum or minimum operating frequencies. 2. Rise and fall times for SYS_CLK_IN/PCI_CLK are measured at 0.4 and 2.7 V. 3. Timing is guaranteed by design and characterization. 4. This represents the total input jitter—short term and long term—and is guaranteed by design. 5. The SYS_CLK_IN/PCI_CLK driver’s closed loop jitter bandwidth should be 1,000,000 16 Unit baud baud — Notes — 1 2 Table 23 provides the AC timing parameters for the DUART interface. Minimum baud rate Maximum baud rate Oversample rate Notes: 1. Actual attainable baud rate is limited by the latency of interrupt processing. 2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are sampled each 16th sample. 8 Ethernet: Three-Speed Ethernet, MII Management This section provides the AC and DC electrical characteristics for three-speed, 10/100/1000, and MII management. 8.1 Enhanced Three-Speed Ethernet Controller (eTSEC) (10/100/1000 Mbps)—MII/RMII/RGMII/SGMII/RTBI Electrical Characteristics The electrical characteristics specified here apply to all the media independent interface (MII), reduced gigabit media independent interface (RGMII), serial gigabit media independent interface (SGMII), and reduced ten-bit interface (RTBI) signals except management data input/output (MDIO) and management data clock (MDC). The RGMII and RTBI interfaces are defined for 2.5 V, while the MII interface can be operated at 3.3 V. The RMII and SGMII interfaces can be operated at either 3.3 or 2.5 V. The RGMII and RTBI interfaces follow the Hewlett-Packard reduced pin-count interface for Gigabit Ethernet Physical Layer Device Specification Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in Section 8.5, “Ethernet Management Interface Electrical Characteristics.” 8.1.1 TSEC DC Electrical Characteristics All RGMII, RMII, and RTBI drivers and receivers comply with the DC parametric attributes specified in Table 24 and Table 25. The RGMII and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5. Table 24. MII DC Electrical Characteristics Parameter Supply voltage 3.3 V Output high voltage Symbol LVDDA/LVDDB VOH IOH = –4.0 mA Conditions — LV DDA or LVDDB = Min Min 2.97 2.40 Max 3.63 LV DDA + 0.3 or LVDDB + 0.3 Unit V V MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 21 Ethernet: Three-Speed Ethernet, MII Management Table 24. MII DC Electrical Characteristics (continued) Parameter Output low voltage Input high voltage Symbol VOL VIH IOL = 4.0 mA — Conditions LVDDA or LV DDB = M in — Min VSS 2.0 Max 0.50 LV DDA + 0.3 or LVDDB + 0.3 0.90 40 — Unit V V Input low voltage Input high current Input low current VIL IIH IIL — VIN1 = — LVDDA or LVDDB –0.3 — –600 V μA μA VIN1 = VSS Note: 1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. Table 25. RGMII/RTBI DC Electrical Characteristics Parameters Supply voltage 2.5 V Output high voltage Symbol LVDDA/LVDDB VOH IOH = –1.0 mA Conditions — LVDDA or LV DDB = M in Min 2.37 2.00 Max 2.63 LV DDA + 0.3 or LVDDB + 0.3 0.40 LV DDA + 0.3 or LVDDB + 0.3 0.70 10 — Unit V V Output low voltage Input high voltage VOL VIH IOL = 1.0 mA — LVDDA or LV DDB = M in LVDDA or LV DDB = M in VSS – 0.3 1.7 V V Input low voltage Input high current Input low current VIL IIH IIL — VIN1 = LVDDA or LV DDB = Min LVDDA or LVDDB –0.3 — –15 V μA μA VIN1 = V SS Note: 1. Note that the symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. 8.2 MII, RGMII, and RTBI AC Timing Specifications The AC timing specifications for MII, RMII, RGMII, and RTBI are presented in this section. 8.2.1 MII AC Timing Specifications This section describes the MII transmit and receive AC timing specifications. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 22 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management 8.2.1.1 MII Transmit AC Timing Specifications Table 26. MII Transmit AC Timing Specifications Table 26 provides the MII transmit AC timing specifications. At recommended operating conditions with LVDDA/LVDDB/NVDD of 3.3 V ± 0.3 V. Parameter/Condition TX_CLK clock period 10 Mbps TX_CLK clock period 100 Mbps TX_CLK duty cycle TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay TX_CLK data clock rise VIL(min) to VIH(max) TX_CLK data clock fall VIH(max) to VIL(min) Symbol1 tMTX tMTX tMTXH/tMTX tMTKHDX tMTXR tMTXF Min — — 35 1 1.0 1.0 Typ 400 40 — 5 — — Max — — 65 15 4.0 4.0 Unit ns ns % ns ns ns Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 8 shows the MII transmit AC timing diagram. tMTX TX_CLK tMTXH TXD[3:0] TX_EN TX_ER tMTKHDX tMTXF tMTXR Figure 8. MII Transmit AC Timing Diagram 8.2.1.2 MII Receive AC Timing Specifications Table 27. MII Receive AC Timing Specifications Table 27 provides the MII receive AC timing specifications. At recommended operating conditions with LVDDA/LVDDB/NVDD of 3.3 V ± 0.3 V. Parameter/Condition RX_CLK clock period 10 Mbps RX_CLK clock period 100 Mbps RX_CLK duty cycle RXD[3:0], RX_DV, RX_ER setup time to RX_CLK Symbol1 tMRX tMRX tMRXH/tMRX tMRDVKH Min — — 35 10.0 Typ 400 40 — — Max — — 65 — Unit ns ns % ns MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 23 Ethernet: Three-Speed Ethernet, MII Management Table 27. MII Receive AC Timing Specifications (continued) At recommended operating conditions with LVDDA/LVDDB/NVDD of 3.3 V ± 0.3 V. Parameter/Condition RXD[3:0], RX_DV, RX_ER hold time to RX_CLK RX_CLK clock rise VIL(min) to VIH(max) RX_CLK clock fall time VIH(max) to VIL(min) Symbol1 tMRDXKH tMRXR tMRXF Min 10.0 1.0 1.0 Typ — — — Max — 4.0 4.0 Unit ns ns ns Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 9 provides the AC test load for TSEC. Output Z0 = 50 Ω LV DDA/2 or LVDDB/2 RL = 5 0 Ω Figure 9. TSEC AC Test Load Figure 10 shows the MII receive AC timing diagram. tMRX RX_CLK tMRXH RXD[3:0] RX_DV RX_ER tMRDVKH tMRDXKH tMRXF Valid Data tMRXR Figure 10. MII Receive AC Timing Diagram RMII AC Timing Specifications MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 24 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management 8.2.1.3 RMII Transmit AC Timing Specifications Table 28. RMII Transmit AC Timing Specifications Table 28 provides the RMII transmit AC timing specifications. At recommended operating conditions with NVDD of 3.3 V ± 0.3 V. Parameter/Condition REF_CLK clock REF_CLK duty cycle REF_CLK to RMII data TXD[1:0], TX_EN delay REF_CLK data clock rise VIL(min) to VIH(max) REF_CLK data clock fall VIH(max) to VIL(min) Symbol1 tRMX tRMXH/tRMX tRMTKHDX tRMXR tRMXF Min — 35 2 1.0 1.0 Typ 20 — — — — Max — 65 10 4.0 4.0 Unit ns % ns ns ns Note: 1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMTKHDX symbolizes RMII transmit timing (RMT) for the time tRMX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tRMX represents the RMII(RM) reference (X) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 11 shows the RMII transmit AC timing diagram. tRMX REF_CLK tRMXH TXD[1:0] TX_EN tRMTKHDX tRMXF tRMXR Figure 11. RMII Transmit AC Timing Diagram 8.2.1.4 RMII Receive AC Timing Specifications Table 29. RMII Receive AC Timing Specifications Table 29 provides the RMII receive AC timing specifications. At recommended operating conditions with NVDD of 3.3 V ± 0.3 V. Parameter/Condition REF_CLK clock period REF_CLK duty cycle RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK REF_CLK clock rise VIL(min) to VIH(max) Symbol1 tRMX tRMXH/tRMX tRMRDVKH tRMRDXKH tRMXR Min — 35 4.0 2.0 1.0 Typ 20 — — — — Max — 65 — — 4.0 Unit ns % ns ns ns MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 25 Ethernet: Three-Speed Ethernet, MII Management Table 29. RMII Receive AC Timing Specifications (continued) At recommended operating conditions with NVDD of 3.3 V ± 0.3 V. Parameter/Condition REF_CLK clock fall time V IH(max) to VIL(min) Symbol1 tRMXF Min 1.0 Typ — Max 4.0 Unit ns Note: 1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMRDVKH symbolizes RMII receive timing (RMR) with respect to the time data input signals (D) reach the valid state (V) relative to the tRMX clock reference (K) going to the high (H) state or setup time. Also, tRMRDXKL symbolizes RMII receive timing (RMR) with respect to the time data input signals (D) went invalid (X) relative to the tRMX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tRMX represents the RMII (RM) reference (X) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 12 provides the AC test load. Output Z0 = 50 Ω NVDD/2 RL = 5 0 Ω Figure 12. AC Test Load Figure 13 shows the RMII receive AC timing diagram. tRMX REF_CLK tRMXH RXD[1:0] CRS_DV RX_ER tRMRDVKH tRMRDXKH tRMXF Valid Data tRMXR Figure 13. RMII Receive AC Timing Diagram 8.2.2 RGMII and RTBI AC Timing Specifications Table 30. RGMII and RTBI AC Timing Specifications Table 30 presents the RGMII and RTBI AC timing specifications. At recommended operating conditions with LVDDA/LVDDB of 2.5 V ± 5%. Parameter/Condition Data to clock output skew (at transmitter) Data to clock input skew (at receiver) Clock cycle duration 3 4, 5 2 Symbol1 tSKRGT tSKRGT tRGT tRGTH/tRGT Min –0.5 1.0 7.2 45 Typ — — 8.0 50 Max 0.5 2.8 8.8 55 Unit ns ns ns % Duty cycle for 1000Base-T MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 26 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management Table 30. RGMII and RTBI AC Timing Specifications (continued) At recommended operating conditions with LVDDA/LVDDB of 2.5 V ± 5%. Parameter/Condition Duty cycle for 10BASE-T and 100BASE-TX Rise time (20%–80%) Fall time (20%–80%) GTX_CLK125 reference clock period GTX_CLK125 reference clock duty cycle 3, 5 Symbol1 tRGTH/tRGT tRGTR tRGTF tG12 6 Min 40 — — — 47 Typ 50 — — 8.0 — Max 60 0.75 0.75 — 53 Unit % ns ns ns % tG125H/tG125 Notes: 1. Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to represent RGMII and RTBI timing. For example, the subscript of tRGT represents the RTBI (T) receive (RX) clock. Note also that the notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews, the subscript is skew (SK) followed by the clock that is being skewed (RGT). 2. This implies that PC board design requires clocks to be routed such that an additional trace delay of greater than 1.5 ns is added to the associated clock signal. 3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively. 4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned between. 5. Duty cycle reference is LVDDA/2 or LVDDB/2. 6. This symbol is used to represent the external GTX_CLK125 and does not follow the original symbol naming convention. Figure 14 shows the RGMII and RTBI AC timing and multiplexing diagrams. tRGT tRGTH GTX_CLK (At Transmitter) tSKRGT TXD[8:5][3:0] TXD[7:4][3:0] TXD[8:5] TXD[3:0] TXD[7:4] TXD[4] TXEN TXD[9] TXERR tSKRGT TX_CLK (At PHY) TX_CTL RXD[8:5][3:0] RXD[7:4][3:0] RXD[8:5] RXD[3:0] RXD[7:4] tSKRGT RXD[4] RXDV RXD[9] RXERR tSKRGT RX_CTL RX_CLK (At PHY) Figure 14. RGMII and RTBI AC Timing and Multiplexing Diagrams MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 27 Ethernet: Three-Speed Ethernet, MII Management 8.3 SGMII Interface Electrical Characteristics Each SGMII port features a 4-wire AC-coupled serial link from the dedicated SerDes interface of MPC8313E as shown in Figure 15, where CTX is the external (on board) AC-coupled capacitor. Each output pin of the SerDes transmitter differential pair features a 50-Ω output impedance. Each input of the SerDes receiver differential pair features 50-Ω on-die termination to XCOREVSS. The reference circuit of the SerDes transmitter and receiver is shown in Figure 33. When an eTSEC port is configured to operate in SGMII mode, the parallel interface’s output signals of this eTSEC port can be left floating. The input signals should be terminated based on the guidelines described in Section 22.5, “Connection Recommendations,” as long as such termination does not violate the desired POR configuration requirement on these pins, if applicable. When operating in SGMII mode, the TSEC_GTX_CLK125 clock is not required for this port. Instead, the SerDes reference clock is required on SD_REF_CLK and SD_REF_CLK pins. 8.3.1 DC Requirements for SGMII SD_REF_CLK and SD_REF_CLK The characteristics and DC requirements of the separate SerDes reference clock are described in Section 9, “High-Speed Serial Interfaces (HSSI).” 8.3.2 AC Requirements for SGMII SD_REF_CLK and SD_REF_CLK Table 31 lists the SGMII SerDes reference clock AC requirements. Note that SD_REF_CLK and SD_REF_CLK are not intended to be used with, and should not be clocked by, a spread spectrum clock source. Table 31. SD_REF_CLK and SD_REF_CLK AC R equirements Symbol tREF tREFCJ tREFPJ REFCLK cycle time REFCLK cycle-to-cycle jitter. Difference in the period of any two adjacent REFCLK cycles Phase jitter. Deviation in edge location with respect to mean edge location Parameter Description Min — — –50 Typ 8 — — Max — 100 50 Unit ns ps ps 8.3.3 SGMII Transmitter and Receiver DC Electrical Characteristics Table 32 and Table 33 describe the SGMII SerDes transmitter and receiver AC-coupled DC electrical characteristics. Transmitter DC characteristics are measured at the transmitter outputs (SD_TX[n] and SD_TX[n]) as depicted in Figure 16. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 28 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management Table 32. SGMII DC Transmitter Electrical Characteristics Parameter Supply voltage Output high voltage Output low voltage Output ringing Output differential voltage2, 3 Output offset voltage Output impedance (single-ended) Mismatch in a pair Change in VOD between 0 and 1 Change in VOS between 0 and 1 Output current on short to GND Symbol XCOREVDD VOH VOL VRING |VOD| VOS RO ΔRO Δ|VOD| ΔVOS ISA, ISB Min 0.95 — XCOREVDD-Typ/2 – |VOD|-max/2 — 323 425 40 — — — — Typ 1.0 — — — 500 500 — — — — — Max 1.05 XCOREVDD-Typ/2 + |VOD|-max/2 — 10 725 575 60 10 25 25 40 Unit V mV mV % mV mV Ω % mV mV mA Equalization setting: 1.0x 1, 4 1 1 Notes Notes: 1. This will not align to DC-coupled SGMII. XCOREVDD-Typ = 1.0 V. 2. |VOD| = |VTXn – V TXn|. |VOD| is also referred as output differential peak voltage. VTX-DIFFp-p = 2*|VOD|. 3. The |VOD| value shown in the Typ column is based on the condition of XCOREVDD-Typ = 1.0 V, no common mode offset variation (VOS = 500 mV), SerDes transmitter is terminated with 100-Ω differential load between TX[n] and TX[n]. 4. VOS is also referred to as output common mode voltage. 50 Ω Transmitter 50 Ω TXn CTX RXm 50 Ω Receiver TXn MPC8313E SGMII SerDes Interface RXn 50 Ω CTX RXm 50 Ω 50 Ω CTX TXm Receiver Transmitter 50 Ω 50 Ω RXn CTX TXm Figure 15. 4-Wire AC-Coupled SGMII Serial Link Connection Example MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 29 Ethernet: Three-Speed Ethernet, MII Management MPC8313E SGMII SerDes Interface 50 Ω Transmitter 50 Ω TXn 50 Ω TXn 50 Ω Vos VOD Figure 16. SGMII Transmitter DC Measurement Circuit Table 33. SGMII DC Receiver Electrical Characteristics Parameter Supply voltage DC Input voltage range Input differential voltage Loss of signal threshold Input AC common mode voltage Receiver differential input impedance Receiver common mode input impedance Common mode input voltage VRX_DIFFp-p VLOS VCM_ACp-p ZRX_DIFF ZRX_CM VCM 100 30 — 80 20 — Symbol XCOREVDD Min 0.95 Typ 1.0 N/A — — — 100 — Vxcorevss 1200 100 100 120 35 — mV mV mV Ω Ω V 4 3 Max 1.05 Unit V 1 2 Notes Notes: 1. Input must be externally AC-coupled. 2. VRX_DIFFp-p is also referred to as peak to peak input differential voltage 3. VCM_ACp-p is also referred to as peak to peak AC common mode voltage. 4. On-chip termination to XCOREVSS. 8.3.4 SGMII AC Timing Specifications This section describes the SGMII transmit and receive AC timing specifications. Transmitter and receiver characteristics are measured at the transmitter outputs (TX[n] and TX[n]) or at the receiver inputs (RX[n] and RX[n]) as depicted in Figure 18, respectively. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 30 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management 8.3.4.1 SGMII Transmit AC Timing Specifications Table 34. SGMII Transmit AC Timing Specifications Table 34 provides the SGMII transmit AC timing targets. A source synchronous clock is not provided. At recommended operating conditions with XCOREVDD = 1.0 V ± 5%. Parameter Deterministic jitter Total jitter Unit interval VOD fall time (80%–20%) VOD rise time (20%–80%) Note: 1. Each UI is 800 ps ± 100 ppm. Symbol JD JT UI tfall trise Min — — 799.92 50 50 Typ — — 800 — — Max 0.17 0.35 800.08 120 120 Unit UI p-p UI p-p ps ps ps Notes 1 8.3.4.2 SGMII Receive AC Timing Specifications Table 35 provides the SGMII receive AC timing specifications. Source synchronous clocking is not supported. Clock is recovered from the data. Figure 17 shows the SGMII receiver input compliance mask eye diagram. Table 35. SGMII Receive AC Timing Specifications At recommended operating conditions with XCOREVDD = 1.0 V ± 5%. Parameter Deterministic jitter tolerance Combined deterministic and random jitter tolerance Sinusoidal jitter tolerance Total jitter tolerance Bit error ratio Unit interval AC coupling capacitor Symbol JD JDR JSIN JT BER UI CTX Min 0.37 0.55 0.1 0.65 — 799.92 5 Typ — — — — — 800 — Max — — — — 10–12 800.08 200 Unit UI p-p UI p-p UI p-p UI p-p Notes 1 1 1 1 ps nF 2 3 Notes: 1. Measured at receiver. 2. Each UI is 800 ps ± 100 ppm. 3. The external AC coupling capacitor is required. It is recommended to be placed near the device transmitter outputs. 4. Refer to the RapidIO™ 1x/4x LP Serial Physical Layer Specification, for interpretation of jitter specifications. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 31 Ethernet: Three-Speed Ethernet, MII Management VRX_DIFFp-p-max/2 Receiver Differential Input Voltage VRX_DIFFp-p-min/2 0 –VRX_DIFFp-p-min/2 –VRX_DIFFp-p-max/2 0 0.275 0.4 Time (UI) 0.6 0.725 1 Figure 17. SGMII Receiver Input Compliance Mask D+ Package Pin TX Silicon + Package C = TX D– Package Pin R = 50 Ω R = 50 Ω C = TX Figure 18. SGMII AC Test/Measurement Load MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 32 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management 8.4 eTSEC IEEE 1588 AC Specifications tT1588CLKOUT tT1588CLKOUTH TSEC_1588_CLK_OUT tT1588OV TSEC_1588_PULSE_OUT TSEC_1588_TRIG_OUT Note: The output delay is count starting rising edge if tT1588CLKOUT is non-inverting. Otherwise, it is count starting falling edge. Figure 19 provides the data and command output timing diagram. Figure 19. eTSEC IEEE 1588 Output AC Timing Figure 20 provides the data and command input timing diagram. tT1588CLK tT1588CLKH TSEC_1588_CLK TSEC_1588_TRIG_IN tT1588TRIGH Figure 20. eTSEC IEEE 1588 Input AC Timing The IEEE 1588 AC timing specifications are in Table 36. Table 36. eTSEC IEEE 1588 AC Timing Specifications At recommended operating conditions with L/TVDD of 3.3 V ± 5%. Parameter/Condition TSEC_1588_CLK clock period TSEC_1588_CLK duty cycle TSEC_1588_CLK peak-to-peak jitter Rise time eTSEC_1588_CLK (20%–80%) Fall time eTSEC_1588_CLK (80%–20%) TSEC_1588_CLK_OUT clock period TSEC_1588_CLK_OUT duty cycle TSEC_1588_PULSE_OUT Symbol tT1588CLK tT1588CLKH/tT1588CLK tT1588CLKINJ tT1588CLKINR tT1588CLKINF tT1588CLKOUT tT1588CLKOTH /tT1588CLKOUT tT1588OV Min 3.8 40 — 1.0 1.0 2 × tT1588CLK 30 0.5 Typ — 50 — — — — 50 — Max TRX_CLK × 9 60 250 2.0 2.0 — 70 3.0 Unit ns % ps ns ns ns % ns Notes 1, 3 MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 33 Ethernet: Three-Speed Ethernet, MII Management Table 36. eTSEC IEEE 1588 AC Timing Specifications (continued) At recommended operating conditions with L/TVDD of 3.3 V ± 5%. Parameter/Condition TSEC_1588_TRIG_IN pulse width Symbol tT1588TRIGH Min 2 × tT1588CLK_MAX Typ — Max — Unit ns Notes 2 Notes: 1.T RX_CLK is the max clock period of eTSEC receiving clock selected by TMR_CTRL[CKSEL]. See the MPC8313E PowerQUICC™ II Pro Integrated Processor Family Reference Manual, for a description of TMR_CTRL registers. 2. It need to be at least two times of clock period of clock selected by TMR_CTRL[CKSEL]. See the MPC8313E PowerQUICC™ II Pro Integrated Processor Family Reference Manual, for a description of TMR_CTRL registers. 3. The maximum value of tT1588CLK is not only defined by the value of TRX_CLK, but also defined by the recovered clock. For example, for 10/100/1000 Mbps modes, the maximum value of tT1588CLK is 3600, 280, and 56 ns, respectively. 8.5 Ethernet Management Interface Electrical Characteristics The electrical characteristics specified here apply to MII management interface signals MDIO (management data input/output) and MDC (management data clock). The electrical characteristics for MII, RMII, RGMII, SGMII, and RTBI are specified in Section 8.1, “Enhanced Three-Speed Ethernet Controller (eTSEC) (10/100/1000 Mbps)—MII/RMII/RGMII/SGMII/RTBI Electrical Characteristics.” 8.5.1 MII Management DC Electrical Characteristics The MDC and MDIO are defined to operate at a supply voltage of 2.5 V or 3.3 V. Table 37 and Table 38 provide the DC electrical characteristics for MDIO and MDC. Table 37. MII Management DC Electrical Characteristics When Powered at 2.5 V Parameter Supply voltage (2.5 V) Output high voltage Symbol NVDDA/NV DDB VOH IOH = –1.0 mA Conditions — NVDDA or NVDDB = Min Min 2.37 2.00 Max 2.63 NVDDA + 0.3 or NVDDB + 0.3 0.40 — 0.70 10 — Unit V V Output low voltage Input high voltage Input low voltage Input high current Input low current VOL VIH VIL IIH IIL IOL = 1.0 mA — — NVDDA or NVDDB = Min NVDDA or NVDDB = Min NVDDA or NVDDB = Min VSS – 0.3 1.7 –0.3 — –15 V V V μA μA VIN1 = NVDDA or NV DDB VIN = NVDDA or NVDDB Note: 1. Note that the symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 34 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management Table 38. MII Management DC Electrical Characteristics When Powered at 3.3 V Parameter Symbol Conditions — IOH = –1.0 mA NVDDA or NVDDB = Min Min 2.97 2.10 Max 3.63 NVDDA + 0.3 or NVDDB + 0.3 0.50 — 0.80 40 — Unit V V Supply voltage (3.3 V) NVDDA/NV DDB Output high voltage VOH Output low voltage Input high voltage Input low voltage Input high current Input low current VOL VIH VIL IIH IIL IOL = 1.0 mA — — NVDDA or NVDDB = M ax NVDDA or NVDDB = M ax LVDDA or LV DDB = M in VSS 2.0 — V V V μA μA VIN1 = 2.1 V VIN = 0.5 V — –600 Note: 1. Note that the symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. 8.5.2 MII Management AC Electrical Specifications Table 39. MII Management AC Timing Specifications Table 39 provides the MII management AC timing specifications. At recommended operating conditions with LVDDA/LVDDB is 3.3 V ± 0.3V or 2.5 V ± 5% Parameter/Condition MDC frequency MDC period MDC clock pulse width high MDC to MDIO delay MDIO to MDC setup time MDIO to MDC hold time MDC rise time MDC fall time Symbol 1 fMDC tMDC tMDCH tMDKHDX tMDDVKH tMDDXKH tMDCR tMDHF Min — — 32 10 5 0 — — Typ 2.5 400 — — — — — — Max — — — 170 — — 10 10 Unit MHz ns ns ns ns ns ns ns Notes 2 Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. This parameter is dependent on the csb_clk speed. (The MIIMCFG[Mgmt Clock Select] field determines the clock frequency of the Mgmt Clock EC_MDC.) MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 35 High-Speed Serial Interfaces (HSSI) Figure 21 shows the MII management AC timing diagram. tMDC MDC tMDCH MDIO (Input) tMDDVKH tMDDXKH MDIO (Output) tMDKHDX tMDCF tMDCR Figure 21. MII Management Interface Timing Diagram 9 High-Speed Serial Interfaces (HSSI) This section describes the common portion of SerDes DC electrical specifications, which is the DC requirement for SerDes reference clocks. The SerDes data lane’s transmitter and receiver reference circuits are also shown. 9.1 Signal Terms Definition The SerDes utilizes differential signaling to transfer data across the serial link. This section defines terms used in the description and specification of differential signals. Figure 22 shows how the signals are defined. For illustration purpose, only one SerDes lane is used for description. The figure shows waveform for either a transmitter output (TXn and TXn) or a receiver input (RXn and RXn). Each signal swings between A volts and B volts where A > B. Using this waveform, the definitions are as follows. To simplify illustration, the following definitions assume that the SerDes transmitter and receiver operate in a fully symmetrical differential signaling environment. 1. Single-ended swing The transmitter output signals and the receiver input signals TXn, TXn, RXn, and RXn each have a peak-to-peak swing of A – B volts. This is also referred as each signal wire’s single-ended swing. 2. Differential output voltage, VOD (or differential output swing): The differential output voltage (or swing) of the transmitter, VOD, is defined as the difference of the two complimentary output voltages: VTXn – VTXn. The VOD value can be either positive or negative. 3. Differential input voltage, VID (or differential input swing): The differential input voltage (or swing) of the receiver, VID, is defined as the difference of the two complimentary input voltages: VRXn – VRXn. The VID value can be either positive or negative. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 36 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) 4. Differential peak voltage, VDIFFp The peak value of the differential transmitter output signal or the differential receiver input signal is defined as differential peak voltage, VDIFFp = |A – B| volts. 5. Differential peak-to-peak, VDIFFp-p Since the differential output signal of the transmitter and the differential input signal of the receiver each range from A – B to –(A – B) volts, the peak-to-peak value of the differential transmitter output signal or the differential receiver input signal is defined as differential peak-to-peak voltage, VDIFFp-p = 2 × VDIFFp = 2 × |(A – B)| volts, which is twice of differential swing in amplitude, or twice of the differential peak. For example, the output differential peak-peak voltage can also be calculated as VTX-DIFFp-p = 2 × |VOD|. 6. Differential waveform The differential waveform is constructed by subtracting the inverting signal (TXn, for example) from the non-inverting signal (TXn, for example) within a differential pair. There is only one signal trace curve in a differential waveform. The voltage represented in the differential waveform is not referenced to ground. Refer to Figure 31 as an example for differential waveform. 7. Common mode voltage, Vcm The common mode voltage is equal to one half of the sum of the voltages between each conductor of a balanced interchange circuit and ground. In this example, for SerDes output, Vcm_out = (VTXn + VTXn)/2 = (A + B)/2, which is the arithmetic mean of the two complimentary output voltages within a differential pair. In a system, the common mode voltage may often differ from one component’s output to the other’s input. Sometimes, it may be even different between the receiver input and driver output circuits within the same component. It’s also referred as the DC offset in some occasion. TXn or RXn A Volts Vcm = (A + B)/2 TXn or RXn B Volts Differential Swing, V ID or VOD = A – B Differential Peak Voltage, V DIFFp = |A – B| Differential Peak-Peak Voltage, VDIFFpp = 2*VDIFFp (not shown) Figure 22. Differential Voltage Definitions for Transmitter or Receiver To illustrate these definitions using real values, consider the case of a CML (current mode logic) transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing that goes between 2.5 and 2.0 V. Using these values, the peak-to-peak voltage swing of each signal (TD or TD) is 500 mV p-p, which is referred as the single-ended swing for each signal. In this example, since the differential signaling environment is fully symmetrical, the transmitter output’s differential swing (VOD) has the same amplitude as each signal’s single-ended swing. The differential output signal ranges between 500 and –500 mV, in other words, VOD is 500 mV in one phase and –500 mV in the other phase. The peak differential voltage (VDIFFp) is 500 mV. The peak-to-peak differential voltage (VDIFFp-p) is 1000 mV p-p. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 37 High-Speed Serial Interfaces (HSSI) 9.2 SerDes Reference Clocks The SerDes reference clock inputs are applied to an internal PLL whose output creates the clock used by the corresponding SerDes lanes. The SerDes reference clocks input is SD_REF_CLK and SD_REF_CLK for SGMII interface. The following sections describe the SerDes reference clock requirements and some application information. 9.2.1 SerDes Reference Clock Receiver Characteristics Figure 23 shows a receiver reference diagram of the SerDes reference clocks. • The supply voltage requirements for XCOREVDD are specified in Table 1 and Table 2. • SerDes reference clock receiver reference circuit structure: — The SD_REF_CLK and SD_REF_CLK are internally AC-coupled differential inputs as shown in Figure 23. Each differential clock input (SD_REF_CLK or SD_REF_CLK) has a 50-Ω termination to XCOREVSS followed by on-chip AC coupling. — The external reference clock driver must be able to drive this termination. — The SerDes reference clock input can be either differential or single-ended. Refer to the differential mode and single-ended mode description below for further detailed requirements. • The maximum average current requirement that also determines the common mode voltage range: — When the SerDes reference clock differential inputs are DC coupled externally with the clock driver chip, the maximum average current allowed for each input pin is 8 mA. In this case, the exact common mode input voltage is not critical as long as it is within the range allowed by the maximum average current of 8 mA (refer to the following bullet for more detail), since the input is AC-coupled on-chip. — This current limitation sets the maximum common mode input voltage to be less than 0.4 V (0.4 V/50 = 8 mA) while the minimum common mode input level is 0.1 V above XCOREVSS. For example, a clock with a 50/50 duty cycle can be produced by a clock driver with output driven by its current source from 0 to 16 mA (0–0.8 V), such that each phase of the differential input has a single-ended swing from 0 V to 800 mV with the common mode voltage at 400 mV. — If the device driving the SD_REF_CLK and SD_REF_CLK inputs cannot drive 50 Ω to XCOREVSS DC, or it exceeds the maximum input current limitations, then it must be AC-coupled off-chip. • The input amplitude requirement. This requirement is described in detail in the following sections. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 38 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) 50 Ω SDn_REF_CLK Input Amp SDn_REF_CLK 50 Ω Figure 23. Receiver of SerDes Reference Clocks 9.2.2 DC Level Requirement for SerDes Reference Clocks The DC level requirement for the MPC8313E SerDes reference clock inputs is different depending on the signaling mode used to connect the clock driver chip and SerDes reference clock inputs as described below. • Differential mode — The input amplitude of the differential clock must be between 400 and 1600 mV differential peak-to-peak (or between 200 and 800 mV differential peak). In other words, each signal wire of the differential pair must have a single-ended swing less than 800 mV and greater than 200 mV. This requirement is the same for both external DC-coupled or AC-coupled connection. — For external DC-coupled connection, as described in Section 9.2.1, “SerDes Reference Clock Receiver Characteristics,” the maximum average current requirements sets the requirement for average voltage (common mode voltage) to be between 100 and 400 mV. Figure 24 shows the SerDes reference clock input requirement for the DC-coupled connection scheme. — For external AC-coupled connection, there is no common mode voltage requirement for the clock driver. Since the external AC-coupling capacitor blocks the DC level, the clock driver and the SerDes reference clock receiver operate in different command mode voltages. The SerDes reference clock receiver in this connection scheme has its common mode voltage set to XCOREVSS. Each signal wire of the differential inputs is allowed to swing below and above the command mode voltage (XCOREVSS). Figure 25 shows the SerDes reference clock input requirement for AC-coupled connection scheme. • Single-ended mode — The reference clock can also be single-ended. The SD_REF_CLK input amplitude (single-ended swing) must be between 400 and 800 mV peak-to-peak (from Vmin to Vmax) with SD_REF_CLK either left unconnected or tied to ground. — The SD_REF_CLK input average voltage must be between 200 and 400 mV. Figure 26 shows the SerDes reference clock input requirement for the single-ended signaling mode. — To meet the input amplitude requirement, the reference clock inputs might need to be DC or AC coupled externally. For the best noise performance, the reference of the clock could be DC MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 39 High-Speed Serial Interfaces (HSSI) or AC coupled into the unused phase (SD_REF_CLK) through the same source impedance as the clock input (SD_REF_CLK) in use. SD_REF_CLK 200 mV < Input Amplitude or Differential Peak < 800 mV Vmax < 800 mV 100 mV < Vcm < 400 mV SD_REF_CLK Vmin > 0 V Figure 24. Differential Reference Clock Input DC Requirements (External DC-Coupled) 200 mV < Input Amplitude or Differential Peak < 800 mV SD_REF_CLK Vmax < Vcm + 400 mV Vcm SD_REF_CLK Vmin > Vcm – 400 mV Figure 25. Differential Reference Clock Input DC Requirements (External AC-Coupled) 400 mV < SD_REF_CLK Input Amplitude < 800 mV SD_REF_CLK 0V SD_REF_CLK Figure 26. Single-Ended Reference Clock Input DC Requirements 9.2.3 • • Interfacing With Other Differential Signaling Levels With on-chip termination to XCOREVSS, the differential reference clocks inputs are HCSL (high-speed current steering logic) compatible DC coupled. Many other low voltage differential type outputs like LVDS (low voltage differential signaling) can be used but may need to be AC coupled due to the limited common mode input range allowed (100 to 400 mV) for DC-coupled connection. LVPECL outputs can produce a signal with too large of an amplitude and may need to be DC-biased at the clock driver output first, then followed with series attenuation resistor to reduce the amplitude, in addition to AC coupling. • MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 40 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) NOTE Figure 27 to Figure 30 are for conceptual reference only. Due to the fact that the clock driver chip's internal structure, output impedance, and termination requirements are different between various clock driver chip manufacturers, it is possible that the clock circuit reference designs provided by clock driver chip vendors are different from what is shown in the figures. They might also vary from one vendor to the other. Therefore, Freescale can neither provide the optimal clock driver reference circuits, nor guarantee the correctness of the following clock driver connection reference circuits. It is recommended that the system designer contact the selected clock driver chip vendor for the optimal reference circuits for the MPC8313E SerDes reference clock receiver requirement provided in this document. Figure 27 shows the SerDes reference clock connection reference circuits for HCSL type clock driver. It assumes that the DC levels of the clock driver chip is compatible with MPC8313E SerDes reference clock input’s DC requirement. HCSL CLK Driver Chip CLK_Out 33 Ω SDn_REF_CLK 50 Ω MPC8313E Clock Driver 33 Ω CLK_Out 100 Ω Differential PWB Trace SerDes Refer. CLK Receiver SDn_REF_CLK SDn_REF_CLK 50 Ω Total 50 Ω. Assume clock driver’s output impedance is about 16 Ω. Clock driver vendor dependent source termination resistor Figure 27. DC-Coupled Differential Connection with HCSL Clock Driver (Reference Only) Figure 28 shows the SerDes reference clock connection reference circuits for LVDS type clock driver. Since LVDS clock driver’s common mode voltage is higher than the MPC8313E SerDes reference clock input’s allowed range (100 to 400 mV), the AC-coupled connection scheme must be used. It assumes the LVDS output driver features a 50-Ω termination resistor. It also assumes that the LVDS transmitter establishes its own common mode level without relying on the receiver or other external component. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 41 High-Speed Serial Interfaces (HSSI) LVDS CLK Driver Chip CLK_Out 10 nF SDn_REF_CLK 50 Ω MPC8313E Clock Driver 100 Ω Differential PWB Trace SerDes Refer. CLK Receiver CLK_Out 10 nF SDn_REF_CLK 50 Ω Figure 28. AC-Coupled Differential Connection with LVDS Clock Driver (Reference Only) Figure 29 shows the SerDes reference clock connection reference circuits for LVPECL type clock driver. Since LVPECL driver’s DC levels (both common mode voltages and output swing) are incompatible with the MPC8313E SerDes reference clock input’s DC requirement, AC coupling has to be used. Figure 29 assumes that the LVPECL clock driver’s output impedance is 50 Ω. R1 is used to DC-bias the LVPECL outputs prior to AC coupling. Its value could be ranged from 140 to 240 Ω depending on the clock driver vendor’s requirement. R2 is used together with the SerDes reference clock receiver’s 50-Ω termination resistor to attenuate the LVPECL output’s differential peak level such that it meets the MPC8313E SerDes3 reference clock’s differential input amplitude requirement (between 200 and 800 mV differential peak). For example, if the LVPECL output’s differential peak is 900 mV and the desired SerDes reference clock input amplitude is selected as 600 mV, the attenuation factor is 0.67, which requires R2 = 25 Ω. Consult with the clock driver chip manufacturer to verify whether this connection scheme is compatible with a particular clock driver chip. LVPECL CLK Driver Chip SDn_REF_CLK 10 nF 50 Ω MPC8313E CLK_Out R2 Clock Driver R1 100 Ω Differential PWB Trace R2 10 nF SDn_REF_CLK R1 50 Ω SerDes Refer. CLK Receiver CLK_Out Figure 29. AC-Coupled Differential Connection with LVPECL Clock Driver (Reference Only) MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 42 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) Figure 30 shows the SerDes reference clock connection reference circuits for a single-ended clock driver. It assumes the DC levels of the clock driver are compatible with the MPC8313E SerDes reference clock input’s DC requirement. Single-Ended CLK Driver Chip Total 50 Ω. Assume clock driver’s output impedance is about 16 Ω. 33 Ω CLK_Out 100 Ω Differential PWB Trace SerDes Refer. CLK Receiver SDn_REF_CLK 50 Ω MPC8313E Clock Driver 50 Ω SDn_REF_CLK 50 Ω Figure 30. Single-Ended Connection (Reference Only) 9.2.4 AC Requirements for SerDes Reference Clocks The clock driver selected should provide a high quality reference clock with low-phase noise and cycle-to-cycle jitter. Phase noise less than 100 kHz can be tracked by the PLL and data recovery loops and is less of a problem. Phase noise above 15 MHz is filtered by the PLL. The most problematic phase noise occurs in the 1–15 MHz range. The source impedance of the clock driver should be 50 Ω to match the transmission line and reduce reflections which are a source of noise to the system. Table 40 describes some AC parameters for SGMII protocol. Table 40. SerDes Reference Clock Common AC Parameters At recommended operating conditions with XVDD_SRDS1 or XV DD_SRDS2 = 1.0 V ± 5%. Parameter Rising edge rate Falling edge rate Differential input high voltage Differential input low voltage Symbol Rise edge rate Fall edge rate VIH VIL Min 1.0 1.0 +200 — Max 4.0 4.0 — –200 Unit V/ns V/ns mV mV Notes 2, 3 2, 3 2 2 MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 43 High-Speed Serial Interfaces (HSSI) Table 40. SerDes Reference Clock Common AC Parameters (continued) At recommended operating conditions with XVDD_SRDS1 or XV DD_SRDS2 = 1.0 V ± 5%. Parameter Rising edge rate (SDn_REF_CLK) to falling edge rate (SDn_REF_CLK) matching Symbol Rise-fall matching Min — Max 20 Unit % Notes 1, 4 Notes: 1. Measurement taken from single-ended waveform. 2. Measurement taken from differential waveform. 3. Measured from –200 to +200 mV on the differential waveform (derived from SDn_REF_CLK minus SDn_REF_CLK). The signal must be monotonic through the measurement region for rise and fall time. The 400 mV measurement window is centered on the differential zero crossing. See Figure 31. 4. Matching applies to rising edge rate for SD n_REF_CLK and falling edge rate for SDn_REF_CLK . It is measured using a 200 mV window centered on the median cross point, where SD n_REF_CLK rising meets SDn_REF_CLK falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. The rise edge rate of SDn_REF_CLK should be compared to the fall edge rate of SDn_REF_CLK, the maximum allowed difference should not exceed 20% of the slowest edge rate. See Figure 32. Rise Edge Rage Fall Edge Rate VIH = +200 mV 0.0 V VIL = –200 mV SDn_REF_CLK Minus SDn_REF_CLK Figure 31. Differential Measurement Points for Rise and Fall Time TFALL TRISE SDn_REF_CLK SDn_REF_CLK VCROSS MEDIAN + 100 mV VCROSS MEDIAN VCROSS MEDIAN VCROSS MEDIAN – 100 mV SDn_REF_CLK SDn_REF_CLK Figure 32. Single-Ended Measurement Points for Rise and Fall Time Matching The other detailed AC requirements of the SerDes reference clocks is defined by each interface protocol based on application usage. Refer to the following section for detailed information: • Section 8.3.2, “AC Requirements for SGMII SD_REF_CLK and SD_REF_CLK 9.2.4.1 Spread Spectrum Clock SD_REF_CLK/SD_REF_CLK are not intended to be used with, and should not be clocked by, a spread spectrum clock source. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 44 Freescale Semiconductor USB 9.3 SerDes Transmitter and Receiver Reference Circuits TXn RXn 50 Ω Transmitter 50 Ω TXn RXn 50 Ω Receiver Figure 33 shows the reference circuits for the SerDes data lane’s transmitter and receiver. 50 Ω Figure 33. SerDes Transmitter and Receiver Reference Circuits The SerDes data lane’s DC and AC specifications are defined in the interface protocol section listed below (SGMII) based on the application usage: • Section 8.3, “SGMII Interface Electrical Characteristics Please note that a external AC-coupling capacitor is required for the above serial transmission protocol with the capacitor value defined in the specifications of the protocol section. 10 USB 10.1 USB Dual-Role Controllers This section provides the AC and DC electrical specifications for the USB interface. 10.1.1 USB DC Electrical Characteristics Table 41. USB DC Electrical Characteristics Parameter Symbol VIH VIL IIN VOH VOL Min 2.0 –0.3 — LVDDB – 0.2 — Max LVDDB + 0.3 0.8 ±5 — 0.2 Unit V V μA V V Table 41 provides the DC electrical characteristics for the USB interface. High-level input voltage Low-level input voltage Input current High-level output voltage, IOH = –100 μA Low-level output voltage, IOL = 100 μA MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 45 USB 10.1.2 USB AC Electrical Specifications Table 42. USB General Timing Parameters (ULPI Mode Only) Parameter Symbol1 tUSCK tUSIVKH tUSIXKH tUSKHOV tUSKHOX Min 15 4 1 — 2 Max — — — 7 — Unit ns ns ns ns ns Notes Table 42 describes the general timing parameters of the USB interface. USB clock cycle time Input setup to USB clock—all inputs input hold to USB clock—all inputs USB clock to output valid—all outputs Output hold from USB clock—all outputs Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUSIXKH symbolizes USB timing (USB) for the input (I) to go invalid (X) with respect to the time the USB clock reference (K) goes high (H). Also, tUSKHOX symbolizes us timing (USB) for the USB clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. Figure 34 and Figure 35 provide the AC test load and signals for the USB, respectively. Output Z0 = 50 Ω NVDD/2 RL = 5 0 Ω Figure 34. USB AC Test Load USBDR_CLK tUSIVKH Input Signals tUSIXKH tUSKHOV Output Signals tUSKHOX Figure 35. USB Signals 10.2 On-Chip USB PHY This section describes the DC and AC electrical specifications for the on-chip USB PHY of the MPC8313E. See Chapter 7 in the USB Specifications Rev. 2, for more information. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 46 Freescale Semiconductor Enhanced Local Bus Table 43 provides the USB clock input (USB_CLK_IN) DC timing specifications. Table 43. USB_CLK_IN DC Electrical Characteristics Parameter Input high voltage Input low voltage Symbol VIH VIL Min 2.7 –0.3 Max NVDD + 0.3 0.4 Unit V V Table 44 provides the USB clock input (USB_CLK_IN) AC timing specifications. Table 44. USB_CLK_IN AC Timing Specifications Parameter/Condition Frequency range Clock frequency tolerance Reference clock duty cycle Total input jitter/time interval error Measured at 1.6 V Peak-to-peak value measured with a second order high-pass filter of 500 kHz bandwidth Conditions — — Symbol fUSB_CLK_IN tCLK_TOL tCLK_DUTY tCLK_PJ Min — –0.05 40 — Typ 24 0 50 — Max 48 0.05 60 200 Unit MHz % % ps 11 Enhanced Local Bus This section describes the DC and AC electrical specifications for the local bus interface. 11.1 Local Bus DC Electrical Characteristics Table 45 provides the DC electrical characteristics for the local bus interface. Table 45. Local Bus DC Electrical Characteristics at 3.3 V Parameter High-level input voltage for Rev 1.0 High-level input voltage for Rev 2.x or later Low-level input voltage Input current, (VIN1 = 0 V or VIN = LVDD) High-level output voltage, (LVDD = min, IOH = –2 mA) Low-level output voltage, (LVDD = min, IOH = 2 mA) Symbol VIH VIH VIL IIN VOH VOL Min 2.0 2.1 –0.3 — LVDD – 0.2 — Max LVDD + 0.3 LVDD + 0.3 0.8 ±5 — 0.2 Unit V V V μA V V Note: The parameters stated in above table are valid for all revisions unless explicitly mentioned. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 47 Enhanced Local Bus 11.2 Local Bus AC Electrical Specifications Table 46. Local Bus General Timing Parameters Parameter Symbol1 tLBK tLBIVKH tLBIXKH tLBOTOT1 tLBOTOT2 tLBOTOT3 tLALEHOV tLALETOT1 tLALETOT2 tLALETOT3 tLBKHOV tLBKHOZ Min 15 7 1.0 1.5 3 2.5 — –1.5 –5.0 –4.5 — — Max — — — — — — 3.0 — — — 3 4 Unit ns ns ns ns ns ns ns ns ns ns ns ns 5 6 7 3 8 Notes 2 3, 4 3, 4 5 6 7 Table 46 describes the general timing parameters of the local bus interface. Local bus cycle time Input setup to local bus clock Input hold from local bus clock LALE output fall to LAD output transition (LATCH hold time) LALE output fall to LAD output transition (LATCH hold time) LALE output fall to LAD output transition (LATCH hold time) LALE output rise to LCLK negative edge LALE output fall to LCLK negative edge LALE output fall to LCLK negative edge LALE output fall to LCLK negative edge Local bus clock to output valid Local bus clock to output high impedance for LAD Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the t LBK clock reference (K) goes high (H), in this case for clock one (1). 2. All timings are in reference to falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or rising edge of LCLK0 (for all other inputs). 3. All signals are measured from NVDD/2 of the rising/falling edge of LCLK0 to 0.4 × NVDD of the signal in question for 3.3-V signaling levels. 4. Input timings are measured at the pin. 5.tLBOTOT1 and tLALETOT1 should be used when RCWH[LALE] is not set and the load on LALE output pin is at least 10 pF less than the load on LAD output pins. 6.tLBOTOT2 and tLALETOT2 should be used when RCWH[LALE] is set and the load on LALE output pin is at least 10 pF less than the load on LAD output pins. 7.tLBOTOT3 and tLALETOT3 should be used when RCWH[LALE] is set and the load on LALE output pin equals to the load on LAD output pins. 8. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. Figure 36 provides the AC test load for the local bus. Output Z0 = 50 Ω NVDD/2 RL = 5 0 Ω Figure 36. Local Bus AC Test Load MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 48 Freescale Semiconductor Enhanced Local Bus Figure 37 through Figure 40 show the local bus signals. LCLK[ n] tLBIVKH Input Signals: LAD[0:15] tLBIVKH Input Signal: LGTA tLBIXKH tLBKHOV Output Signals: LBCTL/LBCKE/LOE tLBKHOV Output Signals: LAD[0:15] tLBOTOT LALE tLBKHOZ tLBIXKH tLBIXKH Figure 37. Local Bus Signals, Non-Special Signals Only LCLK T1 T3 tLBKHOV GPCM Mode Output Signals: LCS[0:3]/LWE tLBIVKH UPM Mode Input Signal: LUPWAIT tLBIVKH Input Signals: LAD[0:15] tLBKHOV UPM Mode Output Signals: LCS[0:3]/LBS[0:1]/LGPL[0:5] tLBKHOZ tLBIXKH tLBIXKH tLBKHOZ Figure 38. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 49 Enhanced Local Bus LCLK T1 T2 T3 T4 tLBKHOV GPCM Mode Output Signals: LCS[0:3]/LWE tLBIVKH UPM Mode Input Signal: LUPWAIT tLBIVKH Input Signals: LAD[0:15] tLBKHOV UPM Mode Output Signals: LCS[0:3]/LBS[0:1]/LGPL[0:5] tLBKHOZ tLBIXKH tLBIXKH tLBKHOZ Figure 39. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 LCLK[n] t LBIXKH t LBIVKH Input Signals: LAD[0:15] tLBIXKH Input Signal: LGTA t LBKHOV tLBKHOZ t LBKHOV Output Signals: LAD[0:15] t LBOTOT t LALEHOV LALE t LALETOT t LBIVKH tLBIXKH Output Signals: LBCTL/LBCKE/LOE Figure 40. Local Bus Signals, LALE with Respect to LCLK MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 50 Freescale Semiconductor JTAG 12 JTAG This section describes the DC and AC electrical specifications for the IEEE Std 1149.1™ (JTAG) interface. 12.1 JTAG DC Electrical Characteristics Table 47. JTAG Interface DC Electrical Characteristics Characteristic Symbol VIH VIL IIN VOH VOL VOL Condition — — — IOH = –8.0 mA IOL = 8.0 mA IOL = 3.2 mA Min 2.1 –0.3 — 2.4 — — Max NVDD + 0.3 0.8 ±5 — 0.5 0.4 Unit V V μA V V V Table 47 provides the DC electrical characteristics for the IEEE Std 1149.1 (JTAG) interface. Input high voltage Input low voltage Input current Output high voltage Output low voltage Output low voltage 12.2 JTAG AC Timing Specifications This section describes the AC electrical specifications for the IEEE Std 1149.1 (JTAG) interface. Table 48 provides the JTAG AC timing specifications as defined in Figure 42 through Figure 45. Table 48. JTAG AC Timing Specifications (Independent of SYS_CLK_IN) 1 At recommended operating conditions (see Table 2). Parameter JTAG external clock frequency of operation JTAG external clock cycle time JTAG external clock pulse width measured at 1.4 V JTAG external clock rise and fall times TRST assert time Input setup times: Boundary-scan data TMS, TDI Input hold times: Boundary-scan data TMS, TDI Valid times: Boundary-scan data TDO Symbol2 fJTG t JTG tJTKHKL tJTGR & tJTGF tTRST tJTDVKH tJTIVKH tJTDXKH tJTIXKH tJTKLDV tJTKLOV Min 0 30 15 0 25 4 4 10 10 2 2 Max 33.3 — — 2 — — — Unit MHz ns ns ns ns ns Notes 3 4 ns — — ns 11 11 5 4 MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 51 JTAG Table 48. JTAG AC Timing Specifications (Independent of SYS_CLK_IN)1 (continued) At recommended operating conditions (see Table 2). Parameter Output hold times: Boundary-scan data TDO JTAG external clock to output high impedance: Boundary-scan data TDO Symbol2 Min Max Unit Notes tJTKLDX tJTKLOX tJTKLDZ tJTKLOZ 2 2 2 2 — — 19 9 ns 5 ns 5, 6 Notes: 1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load (see Figure 34). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only. 4. Non-JTAG signal input timing with respect to tTCLK. 5. Non-JTAG signal output timing with respect to tTCLK. 6. Guaranteed by design and characterization. Figure 41 provides the AC test load for TDO and the boundary-scan outputs. Output Z0 = 50 Ω NVDD/2 RL = 5 0 Ω Figure 41. AC Test Load for the JTAG Interface Figure 42 provides the JTAG clock input timing diagram. JTAG External Clock VM tJTKHKL tJTG VM = Midpoint Voltage (NVDD /2) VM VM tJTGR tJTGF Figure 42. JTAG Clock Input Timing Diagram Figure 43 provides the TRST timing diagram. TRST VM tTRST VM = Midpoint Voltage (NVDD /2) VM Figure 43. TRST Timing Diagram MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 52 Freescale Semiconductor JTAG Figure 44 provides the boundary-scan timing diagram. JTAG External Clock VM tJTDVKH tJTDXKH Boundary Data Inputs tJTKLDV tJTKLDX Boundary Data Outputs tJTKLDZ Boundary Data Outputs Output Data Valid VM = Midpoint Voltage (NVDD /2) Output Data Valid Input Data Valid VM Figure 44. Boundary-Scan Timing Diagram Figure 45 provides the test access port timing diagram. JTAG External Clock VM tJTIVKH tJTIXKH TDI, TMS tJTKLOV tJTKLOX TDO tJTKLOZ TDO Output Data Valid VM = Midpoint Voltage (NVDD/2) Output Data Valid Input Data Valid VM Figure 45. Test Access Port Timing Diagram MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 53 I2C 13 I2C This section describes the DC and AC electrical characteristics for the I2C interface. 13.1 I2C DC Electrical Characteristics Table 49. I2C DC Electrical Characteristics Table 49 provides the DC electrical characteristics for the I2C interface. At recommended operating conditions with NVDD of 3.3 V ± 0.3 V. Parameter Input high voltage level Input low voltage level Low level output voltage Output fall time from VIH(min) to VIL(max) with a bus capacitance from 10 to 400 pF Pulse width of spikes which must be suppressed by the input filter Capacitance for each I/O pin Input current, (0 V ≤ VIN ≤ NVDD) Symbol VIH VIL VOL tI2KLKV tI2KHKL CI IIN Min 0.7 × NVDD –0.3 0 20 + 0.1 × CB 0 — — Max NVDD + 0.3 0.3 × NVDD 0.2 × NVDD 250 50 10 ±5 Unit V V V ns ns pF μA Notes 1 2 3 4 Notes: 1. Output voltage (open drain or open collector) condition = 3 mA sink current. 2. CB = capacitance of one bus line in pF. 3. Refer to the MPC8313E PowerQUICC™ II Pro Integrated Processor Family Reference Manual, for information on the digital filter used. 4. I/O pins obstruct the SDA and SCL lines if NVDD is switched off. 13.2 I2C AC Electrical Specifications Table 50. I2C AC Electrical Specifications Table 50 provides the AC timing parameters for the I2C interface. All values refer to VIH (min) and VIL (max) levels (see Table 49). Parameter SCL clock frequency Low period of the SCL clock High period of the SCL clock Setup time for a repeated START condition Hold time (repeated) START condition (after this period, the first clock pulse is generated) Data setup time Symbol1 fI2C tI2CL tI2CH tI2SVKH tI2SXKL tI2DVKH Min 0 1.3 0.6 0.6 0.6 100 Max 400 — — — — — Unit kHz μs μs μs μs ns MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 54 Freescale Semiconductor I2C Table 50. I2C AC Electrical Specifications (continued) All values refer to VIH (min) and VIL (max) levels (see Table 49). Parameter Data hold time: CBUS compatible masters I2C bus devices Fall time of both SDA and SCL signals5 Setup time for STOP condition Bus free time between a STOP and START condition Noise margin at the LOW level for each connected device (including hysteresis) Noise margin at the HIGH level for each connected device (including hysteresis) Symbol1 tI2DXKL Min Max Unit μs — 02 — 0.93 300 — — — — ns μs μs V V tI2CF tI2PVKH tI2KHDX VNL VNH — 0.6 1.3 0.1 × NVDD 0.2 × NVDD Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2) with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition (S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C timing (I2) for the time that the data with respect to the stop condition (P) reaching the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. The MPC8313E provides a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL. 3. The maximum tI2DVKH has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal. 4. CB = capacitance of one bus line in pF. 5. The MPC8313E does not follow the I2C-BUS Specifications, Version 2.1, regarding the tI2CF AC parameter. Figure 46 provides the AC test load for the I2C. Output Z0 = 50 Ω NVDD/2 RL = 5 0 Ω Figure 46. I2C AC Test Load Figure 47 shows the AC timing diagram for the I2C bus. SDA tI2CF tI2CL SCL tI2SXKL S tI2DXKL tI2CH Sr tI2SVKH tI2PVKH P S tI2DVKH tI2SXKL tI2KHKL tI2CR tI2CF Figure 47. I2C Bus AC Timing Diagram MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 55 PCI 14 PCI This section describes the DC and AC electrical specifications for the PCI bus. 14.1 PCI DC Electrical Characteristics Table 51. PCI DC Electrical Characteristics1 Parameter Symbol VIH VIL VOH VOL IIN Test Condition VOUT ≥ VOH (min) or VOUT ≤ VOL (max) NVDD = min, IOH = –100 μA NVDD = min, IOL = 100 μA 0 V ≤ VIN ≤ NVDD Min 0.5 × NVDD –0.5 0.9 × NVDD — — Max NVDD + 0.3 0.3 × NVDD — 0.1 × NVDD ±5 Unit V V V V μA Table 51 provides the DC electrical characteristics for the PCI interface. High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Input current Note: 1. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2. 14.2 PCI AC Electrical Specifications This section describes the general AC timing parameters of the PCI bus. Note that the PCI_CLK or PCI_SYNC_IN signal is used as the PCI input clock depending on whether the MPC8313E is configured as a host or agent device. Table 52 shows the PCI AC timing specifications at 66 MHz. . Table 52. PCI AC Timing Specifications at 66 MHz Parameter Symbol1 tPCKHOV Min — 1 — 3.0 0 Max 6.0 — 14 — — Unit ns ns ns ns ns Notes 2 2 2, 3 2, 4 2, 4 Clock to output valid Output hold from clock Clock to output high impedance Input setup to clock Input hold from clock tPCKHOX tPCKHOZ tPCIVKH tPCIXKH Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state. 2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications. 3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 4. Input timings are measured at the pin. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 56 Freescale Semiconductor PCI Table 53 shows the PCI AC timing specifications at 33 MHz. Table 53. PCI AC Timing Specifications at 33 MHz Parameter Clock to output valid Output hold from clock Clock to output high impedance Input setup to clock Input hold from clock Symbol1 tPCKHOV Min — 2 — 3.0 0 Max 11 — 14 — — Unit ns ns ns ns ns Notes 2 2 2, 3 2, 4 2, 4 tPCKHOX tPCKHOZ tPCIVKH tPCIXKH Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state. 2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications. 3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 4. Input timings are measured at the pin. Figure 48 provides the AC test load for PCI. Output Z0 = 50 Ω NVDD/2 RL = 5 0 Ω Figure 48. PCI AC Test Load Figure 49 shows the PCI input AC timing conditions. CLK tPCIVKH tPCIXKH Input Figure 49. PCI Input AC Timing Measurement Conditions MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 57 Timers Figure 50 shows the PCI output AC timing conditions. CLK tPCKHOV Output Delay tPCKHOZ High-Impedance Output tPCKHOX Figure 50. PCI Output AC Timing Measurement Condition 15 Timers This section describes the DC and AC electrical specifications for the timers. 15.1 Timers DC Electrical Characteristics Table 54 provides the DC electrical characteristics for the MPC8313E timers pins, including TIN, TOUT, TGATE, and RTC_CLK. Table 54. Timers DC Electrical Characteristics Characteristic Output high voltage Output low voltage Output low voltage Input high voltage Input low voltage Input current Symbol VOH VOL VOL VIH VIL IIN Condition IOH = –8.0 mA IOL = 8.0 mA IOL = 3.2 mA — — 0 V ≤ VIN ≤ NVDD Min 2.4 — — 2.1 –0.3 — Max — 0.5 0.4 NVDD + 0.3 0.8 ±5 Unit V V V V V μA 15.2 Timers AC Timing Specifications Table 55. Timers Input AC Timing Specifications1 Characteristic Symbol2 tTIWID Min 20 Unit ns Table 55 provides the Timers input and output AC timing specifications. Timers inputs—minimum pulse width Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of SYS_CLK_IN. Timings are measured at the pin. 2. Timers inputs and outputs are asynchronous to any visible clock. Timers outputs should be synchronized before use by any external synchronous logic. Timers inputs are required to be valid for at least tTIWID ns to ensure proper operation MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 58 Freescale Semiconductor GPIO Figure 51 provides the AC test load for the Timers. Output Z0 = 50 Ω NVDD/2 RL = 5 0 Ω Figure 51. Timers AC Test Load 16 GPIO This section describes the DC and AC electrical specifications for the GPIO. 16.1 GPIO DC Electrical Characteristics Table 56 provides the DC electrical characteristics for the GPIO when the GPIO pins are operating from a 3.3-V supply. Table 56. GPIO (When Operating at 3.3 V) DC Electrical Characteristics 1 Characteristic Output high voltage Output low voltage Output low voltage Input high voltage Input low voltage Input current 1 Symbol VOH VOL VOL VIH VIL IIN Condition IOH = –8.0 mA IOL = 8.0 mA IOL = 3.2 mA — — 0 V ≤ VIN ≤ NVDD Min 2.4 — — 2.0 –0.3 — Max — 0.5 0.4 NVDD + 0.3 0.8 ±5 Unit V V V V V μA This specification only applies to GPIO pins that are operating from a 3.3-V supply. See Table 63 for the power supply listed for the individual GPIO signal. Table 57 provides the DC electrical characteristics for the GPIO when the GPIO pins are operating from a 2.5-V supply. Table 57. GPIO (When Operating at 2.5 V) DC Electrical Characteristics 1 Parameters Supply voltage 2.5 V Output high voltage Output low voltage Input high voltage Input low voltage Input high current Symbol NVDD VOH VOL VIH VIL IIH IOH = –1.0 mA IOL = 1.0 mA — — Conditions — NVDD = min NVDD = min NVDD = min NVDD = min VIN = NVDD Min 2.37 2.00 VSS – 0.3 1.7 –0.3 — Max 2.63 NVDD + 0.3 0.40 NVDD + 0.3 0.70 10 Unit V V V V V μA MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 59 IPIC Table 57. GPIO (When Operating at 2.5 V) DC Electrical Characteristics 1 (continued) Parameters Input low current 1 Symbol IIL Conditions VIN = VSS Min –15 Max — Unit μA This specification only applies to GPIO pins that are operating from a 2.5-V supply. See Table 63 for the power supply listed for the individual GPIO signal. 16.2 GPIO AC Timing Specifications Table 58. GPIO Input AC Timing Specifications1 Characteristic Symbol2 tPIWID Min 20 Unit ns Table 58 provides the GPIO input and output AC timing specifications. GPIO inputs—minimum pulse width Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of SYS_CLKIN. Timings are measured at the pin. 2. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by any external synchronous logic. GPIO inputs are required to be valid for at least tPIWID ns to ensure proper operation. Figure 52 provides the AC test load for the GPIO. Output Z0 = 50 Ω NVDD/2 RL = 5 0 Ω Figure 52. GPIO AC Test Load 17 IPIC This section describes the DC and AC electrical specifications for the external interrupt pins. 17.1 IPIC DC Electrical Characteristics Table 59. IPIC DC Electrical Characteristics Characteristic Symbol VIH VIL IIN VOL VOL Condition — — — IOL = 8.0 mA IOL = 3.2 mA Min 2.1 –0.3 — — — Max NVDD + 0.3 0.8 ±5 0.5 0.4 Unit V V μA V V Table 59 provides the DC electrical characteristics for the external interrupt pins. Input high voltage Input low voltage Input current Output low voltage Output low voltage MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 60 Freescale Semiconductor SPI 17.2 IPIC AC Timing Specifications Table 60. IPIC Input AC Timing Specifications1 Characteristic Symbol2 tPIWID Min 20 Unit ns Table 60 provides the IPIC input and output AC timing specifications. IPIC inputs—minimum pulse width Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of SYS_CLK_IN. Timings are measured at the pin. 2. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by any external synchronous logic. IPIC inputs are required to be valid for at least tPIWID ns to ensure proper operation when working in edge triggered mode. 18 SPI This section describes the DC and AC electrical specifications for the SPI of the MPC8313E. 18.1 SPI DC Electrical Characteristics Table 61. SPI DC Electrical Characteristics Characteristic Symbol VOH VOL VOL VIH VIL IIN Condition IOH = –6.0 mA IOL = 6.0 mA IOL = 3.2 mA — — 0 V ≤ VIN ≤ NVDD Min 2.4 — — 2.1 –0.3 — Max — 0.5 0.4 NVDD + 0.3 0.8 ±5 Unit V V V V V μA Table 61 provides the DC electrical characteristics for the MPC8313E SPI. Output high voltage Output low voltage Output low voltage Input high voltage Input low voltage Input current 18.2 SPI AC Timing Specifications Table 62 and provide the SPI input and output AC timing specifications. Table 62. SPI AC Timing Specifications1 Characteristic SPI outputs—master mode (internal clock) delay SPI outputs—slave mode (external clock) delay SPI inputs—master mode (internal clock) input setup time SPI inputs—master mode (internal clock) input hold time SPI inputs—slave mode (external clock) input setup time Symbol2 tNIKHOV tNEKHOV tNIIVKH tNIIXKH tNEIVKH Min 0.5 2 6 0 4 Max 6 8 — — — Unit ns ns ns ns ns MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 61 SPI Table 62. SPI AC Timing Specifications1 Characteristic SPI inputs—slave mode (external clock) input hold time Symbol2 tNEIXKH Min 2 Max — Unit ns Notes: 1. Output specifications are measured from the 50% level of the rising edge of SYS_CLK_IN to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOV symbolizes the NMSI outputs internal timing (NI) for the time tSPI m emory clock reference (K) goes from the high state (H) until outputs (O) are valid (V). Figure 53 provides the AC test load for the SPI. Output Z0 = 50 Ω NVDD/2 RL = 5 0 Ω Figure 53. SPI AC Test Load Figure 54 through Figure 55 represent the AC timing from Table 62. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. Figure 54 shows the SPI timing in slave mode (external clock). SPICLK (Input) tNEIVKH tNEIXKH Input Signals: SPIMOSI (See Note) Output Signals: SPIMISO (See Note) tNEKHOV Note: The clock edge is selectable on SPI. Figure 54. SPI AC Timing in Slave Mode (External Clock) Diagram MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 62 Freescale Semiconductor Package and Pin Listings Figure 55 shows the SPI timing in master mode (internal clock). SPICLK (Output) tNIIVKH tNIIXKH Input Signals: SPIMISO (See Note) Output Signals: SPIMOSI (See Note) tNIKHOV Note: The clock edge is selectable on SPI. Figure 55. SPI AC Timing in Master Mode (Internal Clock) Diagram 19 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8313E is available in a thermally enhanced plastic ball grid array (TEPBGAII), see Section 19.1, “Package Parameters for the MPC8313E TEPBGAII,” and Section 19.2, “Mechanical Dimensions of the MPC8313E TEPBGAII,” for information on the TEPBGAII. 19.1 Package Parameters for the MPC8313E TEPBGAII The package parameters are as provided in the following list. The package type is 27 mm × 27 mm, 516 TEPBGAII. Package outline 27 mm × 27 mm Interconnects 516 Pitch 1.00 mm Module height (typical) 2.25 mm Solder Balls 95.5 Sn/0.5 Cu/4 Ag (VR package), 62 Sn/36 Pb/2 Ag (ZQ package) Ball diameter (typical) 0.6 mm MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 63 Package and Pin Listings 19.2 Mechanical Dimensions of the MPC8313E TEPBGAII Figure 56 shows the mechanical dimensions and bottom surface nomenclature of the 516-TEPBGAII package. Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Package code 5368 is to account for PGE and the built-in heat spreader. Figure 56. Mechanical Dimension and Bottom Surface Nomenclature of the MPC8313E TEPBGAII MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 64 Freescale Semiconductor Package and Pin Listings 19.3 Pinout Listings Table 63. MPC8313E TEPBGAII Pinout Listing Signal Package Pin Number DDR Memory Controller Interface Pin Type Power Supply Notes Table 63 provides the pin-out listing for the MPC8313E, TEPBGAII package. MEMC_MDQ0 MEMC_MDQ1 MEMC_MDQ2 MEMC_MDQ3 MEMC_MDQ4 MEMC_MDQ5 MEMC_MDQ6 MEMC_MDQ7 MEMC_MDQ8 MEMC_MDQ9 MEMC_MDQ10 MEMC_MDQ11 MEMC_MDQ12 MEMC_MDQ13 MEMC_MDQ14 MEMC_MDQ15 MEMC_MDQ16 MEMC_MDQ17 MEMC_MDQ18 MEMC_MDQ19 MEMC_MDQ20 MEMC_MDQ21 MEMC_MDQ22 MEMC_MDQ23 MEMC_MDQ24 MEMC_MDQ25 MEMC_MDQ26 MEMC_MDQ27 MEMC_MDQ28 A8 A9 C10 C9 E9 E11 E10 C8 E8 A6 B6 C6 C7 D7 D6 A5 A19 D18 A17 E17 E16 C18 D19 C19 E19 A22 C21 C20 A21 IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 65 Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal MEMC_MDQ29 MEMC_MDQ30 MEMC_MDQ31 MEMC_MDM0 MEMC_MDM1 MEMC_MDM2 MEMC_MDM3 MEMC_MDQS0 MEMC_MDQS1 MEMC_MDQS2 MEMC_MDQS3 MEMC_MBA0 MEMC_MBA1 MEMC_MBA2 MEMC_MA0 MEMC_MA1 MEMC_MA2 MEMC_MA3 MEMC_MA4 MEMC_MA5 MEMC_MA6 MEMC_MA7 MEMC_MA8 MEMC_MA9 MEMC_MA10 MEMC_MA11 MEMC_MA12 MEMC_MA13 MEMC_MA14 MEMC_MWE MEMC_MRAS MEMC_MCAS Package Pin Number A20 C22 B22 B7 E6 E18 E20 A7 E7 B19 A23 D15 A18 A15 E12 D11 B11 A11 A12 E13 C12 E14 B15 C17 C13 A16 C15 C16 E15 B18 C 11 B10 Pin Type IO IO IO O O O O IO IO IO IO O O O O O O O O O O O O O O O O O O O O O Power Supply GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD Notes MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 66 Freescale Semiconductor Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal MEMC_MCS0 MEMC_MCS1 MEMC_MCKE MEMC_MCK MEMC_MCK MEMC_MODT0 MEMC_MODT1 Package Pin Number D10 A10 B14 A13 A14 B23 C23 Local Bus Controller Interface LAD0 LAD1 LAD2 LAD3 LAD4 LAD5 LAD6 LAD7 LAD8 LAD9 LAD10 LAD11 LAD12 LAD13 LAD14 LAD15 LA16 LA17 LA18 LA19 LA20 LA21 LA22 LA23 K25 K24 K23 K22 J25 J24 J23 J22 H24 F26 G24 F25 E25 F24 G22 F23 AC25 AC26 AB22 AB23 AB24 AB25 AB26 E22 IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO O O O O O O O O LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD Pin Type O O O O O O O Power Supply GVDD GVDD GVDD GVDD GVDD GVDD GVDD 3 Notes MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 67 Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal LA24 LA25 LCS0 LCS1 LCS2 LCS3 LWE0/LFWE LWE1 LBCTL LALE/M1LALE/M2LALE LGPL0/LFCLE LGPL1/LFALE LGPL2/LOE/LFRE LGPL3/LFWP LGPL4/LGTA/LUPWAIT/LFRB LGPL5 LCLK0 LCLK1 LA0/GPIO0/MSRCID0 LA1/GPIO1//MSRCID1 LA2/GPIO2//MSRCID2 LA3/GPIO3//MSRCID3 LA4/GPIO4//MSRCID4 LA5/GPIO5/MDVAL LA6/GPIO6 LA7/GPIO7/TSEC_1588_TRIG2 LA8/GPIO13/TSEC_1588_ALARM1 LA9/GPIO14/TSEC_1588_PP3 LA10/TSEC_1588_CLK LA11/TSEC_1588_GCLK LA12/TSEC_1588_PP1 LA13/TSEC_1588_PP2 Package Pin Number E23 D22 D23 J26 F22 D26 E24 H26 L22 E26 AA23 AA24 AA25 AA26 Y22 E21 H22 G26 AC24 Y24 Y26 W22 W24 W26 V22 V23 V24 V25 V26 U22 AD24 L25 Pin Type O O O O O O O O O O O O O O IO O O O IO IO IO IO IO IO IO IO IO IO O O O O Power Supply LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD 8 8 8 8 8 8 8 Notes MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 68 Freescale Semiconductor Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal LA14/TSEC_1588_TRIG1 LA15/TSEC_1588_ALARM2 DUART UART_SOUT1/MSRCID0 UART_SIN1/MSRCID1 UART_CTS1/GPIO8/MSRCID2 UART_RTS1/GPIO9/MSRCID3 UART_SOUT2/MSRCID4/TSEC_1588_CLK UART_SIN2/MDVAL/TSEC_1588_GCLK UART_CTS2/TSEC_1588_PP1 UART_RTS2/TSEC_1588_PP2 I2C interface IIC1_SDA/CKSTOP_OUT/TSEC_1588_TRIG1 IIC1_SCL/CKSTOP_IN/TSEC_1588_ALARM2 IIC2_SDA/PMC_PWR_OK/GPIO10 IIC2_SCL/GPIO11 Interrupts MCP_OUT IRQ0/MCP_IN IRQ1 IRQ2 IRQ3/CKSTOP_OUT IRQ4/CKSTOP_IN/GPIO12 Configuration CFG_CLKIN_DIV EXT_PWR_CTRL CFG_LBIU_MUX_EN JTAG TCK TDI TDO E1 E2 E3 I I O NVDD NVDD NVDD 4 3 D5 J5 R24 I O I NVDD NVDD NVDD G5 K5 K4 K2 K3 J1 O I I I IO IO NVDD NVDD NVDD NVDD NVDD NVDD 2 J4 J2 J3 H5 IO IO IO IO NVDD NVDD NVDD NVDD 2, 8 2, 8 2 2 N2 M5 M1 K1 M3 L1 L5 L3 O IO IO IO O IO IO IO NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD 8 8 8 8 Package Pin Number L24 K26 Pin Type O O Power Supply LVDD LVDD Notes 8 8 MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 69 Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal TMS TRST TEST TEST_MODE DEBUG QUIESCE System Control HRESET PORESET SRESET Clocks SYS_CR_CLK_IN SYS_CR_CLK_OUT SYS_CLK_IN USB_CR_CLK_IN USB_CR_CLK_OUT USB_CLK_IN PCI_SYNC_OUT RTC_PIT_CLOCK PCI_SYNC_IN MISC THERM0 THERM1 PCI PCI_INTA PCI_RESET_OUT PCI_AD0 PCI_AD1 PCI_AD2 PCI_AD3 PCI_AD4 PCI_AD5 AF7 AB11 AB20 AF23 AF22 AB19 AE22 AF21 O O IO IO IO IO IO IO NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD N1 N3 I I NVDD NVDD 7 7 U26 U25 U23 T26 R26 T22 U24 R22 T24 I O I I O I O I I NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD 3 F2 F3 F1 IO I I NVDD NVDD NVDD 1 F5 O NVDD F4 I NVDD 6 Package Pin Number E4 E5 Pin Type I I Power Supply NVDD NVDD Notes 4 4 MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 70 Freescale Semiconductor Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal PCI_AD6 PCI_AD7 PCI_AD8 PCI_AD9 PCI_AD10 PCI_AD11 PCI_AD12 PCI_AD13 PCI_AD14 PCI_AD15 PCI_AD16 PCI_AD17 PCI_AD18 PCI_AD19 PCI_AD20 PCI_AD21 PCI_AD22 PCI_AD23 PCI_AD24 PCI_AD25 PCI_AD26 PCI_AD27 PCI_AD28 PCI_AD29 PCI_AD30 PCI_AD31 PCI_C/BE0 PCI_C/BE1 PCI_C/BE2 PCI_C/BE3 PCI_PAR PCI_FRAME Package Pin Number AD19 AD20 AC18 AD18 AB18 AE19 AB17 AE18 AD17 AF19 AB14 AF15 AD14 AE14 AF12 AE11 AD12 AB13 AF9 AD11 AE10 AB12 AD10 AC10 AF10 AF8 AC19 AB15 AF14 AF11 AD16 AF16 Pin Type IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO Power Supply NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD 5 Notes MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 71 Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal PCI_TRDY PCI_IRDY PCI_STOP PCI_DEVSEL PCI_IDSEL PCI_SERR PCI_PERR PCI_REQ0 PCI_REQ1/CPCI_HS_ES PCI_REQ2 PCI_GNT0 PCI_GNT1/CPCI_HS_LED PCI_GNT2/CPCI_HS_ENUM M66EN PCI_CLK0 PCI_CLK1 PCI_CLK2 PCI_PME Package Pin Number AD13 AC15 AF13 AC14 AF20 AE15 AD15 AB10 AD9 AD8 AC11 AE7 AD7 AD21 AF17 AB16 AF18 AD22 ETSEC1/_USBULPI TSEC1_COL/USBDR_TXDRXD0 TSEC1_CRS/USBDR_TXDRXD1 TSEC1_GTX_CLK/USBDR_TXDRXD2 TSEC1_RX_CLK/USBDR_TXDRXD3 TSEC1_RX_DV/USBDR_TXDRXD4 TSEC1_RXD3/USBDR_TXDRXD5 TSEC1_RXD2/USBDR_TXDRXD6 TSEC1_RXD1/USBDR_TXDRXD7 TSEC1_RXD0/USBDR_NXT/TSEC_1588_TRIG1 TSEC1_RX_ER/USBDR_DIR/TSEC_1588_TRIG2 TSEC1_TX_CLK/USBDR_CLK/TSEC_1588_CLK TSEC1_TXD3/TSEC_1588_GCLK TSEC1_TXD2/TSEC_1588_PP1 AD2 AC3 AF3 AE3 AD3 AC6 AF4 AB6 AB5 AD4 AF5 AE6 AC7 IO IO IO IO IO IO IO IO I I I O O LVDDB LVDDB LVDDB LVDDB LVDDB LVDDB LVDDB LVDDB LVDDB LVDDB LVDDB LVDDB LVDDB 3 Pin Type IO IO IO IO I IO IO IO I I IO O O I O O O IO Power Supply NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD NVDD 5 5 Notes 5 5 5 5 MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 72 Freescale Semiconductor Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal TSEC1_TXD1/TSEC_1588_PP2 TSEC1_TXD0/USBDR_STP/TSEC_1588_PP3 TSEC1_TX_EN/TSEC_1588_ALARM1 TSEC1_TX_ER/TSEC_1588_ALARM2 TSEC1_GTX_CLK125 TSEC1_MDC/LB_POR_CFG_BOOT_ECC_DIS TSEC1_MDIO ETSEC2 TSEC2_COL/GTM1_TIN4/GTM2_TIN3/GPIO15 TSEC2_CRS/GTM1_TGATE4/GTM2_TGATE3/GPIO16 TSEC2_GTX_CLK/GTM1_TOUT4/GTM2_TOUT3/GPIO17 TSEC2_RX_CLK/GTM1_TIN2/GTM2_TIN1/GPIO18 TSCE2_RX_DV/GTM1_TGATE2/GTM2_TGATE1/GPIO19 TSEC2_RXD3/GPIO20 TSEC2_RXD2/GPIO21 TSEC2_RXD1/GPIO22 TSEC2_RXD0/GPIO23 TSEC2_RX_ER/GTM1_TOUT2/GTM2_TOUT1/GPIO24 TSEC2_TX_CLK/GPIO25 TSEC2_TXD3/CFG_RESET_SOURCE0 TSEC2_TXD2/CFG_RESET_SOURCE1 TSEC2_TXD1/CFG_RESET_SOURCE2 TSEC2_TXD0/CFG_RESET_SOURCE3 TSEC2_TX_EN/GPIO26 TSEC2_TX_ER/GPIO27 SGMII PHY TXA TXA RXA RXA TXB TXB U3 V3 U1 V1 P4 N4 O O I I O O AB4 AB3 AC1 AC2 AA3 Y5 AA4 AB2 AA5 AA2 AB1 W3 Y1 W5 Y3 AA1 W1 IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA LVDDA Package Pin Number AD6 AD5 AB7 AB8 AE1 AF6 AB9 Pin Type O O O O I O IO Power Supply LVDDB LVDDB LVDDB LVDDB LVDDB NVDD NVDD 9 2 Notes MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 73 Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal RXB RXB SD_IMP_CAL_RX SD_REF_CLK SD_REF_CLK SD_PLL_TPD SD_IMP_CAL_TX SDAVDD SD_PLL_TPA_ANA SDAVSS USB PHY USB_DP USB_DM USB_VBUS USB_TPA USB_RBIAS USB_PLL_PWR3 USB_PLL_GND USB_PLL_PWR1 USB_VSSA_BIAS USB_VDDA_BIAS USB_VSSA USB_VDDA GTM/USB USBDR_DRIVE_VBUS/GTM1_TIN1/GTM2_TIN2/LSRCID0 USBDR_PWRFAULT/GTM1_TGATE1/GTM2_TGATE2/ LSRCID1 USBDR_PCTL0/GTM1_TOUT1/LSRCID2 USBDR_PCTL1/LBC_PM_REF_10/LSRCID3 SPI SPIMOSI/GTM1_TIN3/GTM2_TIN4/GPIO28/LSRCID4 H1 IO NVDD AD23 AE23 AC22 AB21 IO IO O O NVDD NVDD NVDD NVDD P26 N26 P24 L26 M24 M26 N24 N25 M25 M22 N22 P22 IO IO IO IO IO IO IO IO IO IO IO IO Package Pin Number R1 P1 V5 T5 T4 T2 N5 R5 R4 R3 Pin Type I I I I I O I IO O IO 100 Ω to GND 200 Ω to GND Power Supply Notes MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 74 Freescale Semiconductor Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal SPIMISO/GTM1_TGATE3/GTM2_TGATE4/GPIO29/ LDVAL SPICLK/GTM1_TOUT3/GPIO30 SPISEL/GPIO31 Package Pin Number H3 G1 G3 Power and Ground Supplies AVDD1 F14 Power for e300 core APLL (1.0 V) Power for system APLL (1.0 V) Power for DDR1 and DDR2 DRAM I/O voltage (1.8/2.5 V) — Pin Type IO IO IO Power Supply NVDD NVDD NVDD Notes AVDD2 P21 — GV DD A2,A3,A4,A24,A25,B3, B4,B5,B12,B13,B20,B21, B24,B25,B26,D1,D2,D8, D9,D16,D17 — LVDD LVDDA D24,D25,G23,H23,R23, Power for local T23,W25,Y25,AA22,AC23 bus (3.3 V) W2,Y2 Power for eTSEC2 (2.5 V, 3.3 V) Power for eTSEC1/ USB DR (2.5 V, 3.3 V) Reference voltage signal for DDR — — LVDDB AC8,AC9,AE4,AE5 — MV REF C14,D14 — NVDD G4,H4,L2,M2,AC16,AC17, Standard I/O AD25,AD26,AE12,AE13, voltage (3.3 V) AE20,AE21,AE24,AE25, AE26,AF24,AF25 K11,K12,K13,K14,K15, K16,L10,L17,M10,M17, N10,N17,U12,U13, F6,F10,F19,K6,K10,K17, K21,P6,P10,P17,R10,R17, T10,T17,U10,U11,U14, U15,U16,U17,W6,W21, AA6,AA10,AA14,AA19 Power for core (1.0 V) Internal core logic constant power (1.0 V) — VDD — VDDC — MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 75 Package and Pin Listings Table 63. MPC8313E TEPBGAII Pinout Listing (continued) Signal VSS Package Pin Number B1,B2,B8,B9,B16,B17,C1, C2,C3,C4,C5,C24,C25, C26,D3,D4,D12,D13,D20, D21,F8,F11,F13,F16,F17, F21,G2,G25,H2,H6,H21, H25,L4,L6,L11,L12,L13, L14,L15,L16,L21,L23,M4, M11,M12,M13,M14,M15, M16,M23,N6,N11,N12, N13,N14,N15,N16, N21,N23,P11,P12,P13, P14,P15,P16,P23,P25, R11,R12,R13,R14,R15, R16,R25,T6,T11,T12,T13, T14,T15,T16,T21,T25,U5, U6,U21,W4,W23,Y4,Y23, AA8,AA11,AA13,AA16, AA17,AA21,AC4,AC5, AC12,AC13,AC20,AC21, AD1,AE2,AE8,AE9,AE16, AE17,AF2 T1,U2,V2 Pin Type — Power Supply — Notes XCOREV DD Core power for SerDes transceivers (1.0 V) — Pad power for SerDes transceivers (1.0 V) — — XCOREV SS XPADVDD P2,R2,T3 P5,U4 — — XPADVSS P3,V4 — Notes: 1. This pin is an open drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to NVDD. 2. This pin is an open drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to NVDD. 3. This output is actively driven during reset rather than being three-stated during reset. 4. These JTAG pins have weak internal pull-up P-FETs that are always enabled. 5. This pin should have a weak pull up if the chip is in PCI host mode. Follow PCI specifications recommendation. 6. This pin must always be tied to VSS. 7. Internal thermally sensitive resistor, resistor value varies linearly with temperature. Useful for determining the junction temperature. 8. 1588 signals are available on these pins only in MPC8313 Rev 2.x or later. 9. LB_POR_CFG_BOOT_ECC_DIS is available only in MPC8313 Rev 2.x or later. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 76 Freescale Semiconductor Clocking 20 Clocking Figure 57 shows the internal distribution of clocks within the MPC8313E. MPC8313E e300c3 Core Core PLL USB Mac USB PHY PLL To DDR Memory Controller DDR Clock Divider /2 MEMC_MCK MEMC_MCK DDR Memory Device x M1 core_clk mux csb_clk USB_CLK_IN USB_CR_CLK_IN Crystal USB_CR_CLK_OUT /1,/2 xL 2 ddr_clk Clock Unit System PLL lbc_clk /n To Local Bus LBC Clock Divider LCLK[0:1] Local Bus Memory Device CFG_CLKIN_DIV SYS_CLK_IN SYS_CR_CLK_IN Crystal SYS_CR_CLK_OUT GTX_CLK125 125-MHz Source csb_clk to Rest of the Device PCI_CLK/ PCI_SYNC_IN 1 0 PCI Clock Divider (÷2) 3 PCI_SYNC_OUT PCI_CLK_OUT[0:2] eTSEC Protocol Converter Sys Ref RTC RTC_CLK (32 kHz) 1 2 Multiplication factor M = 1, 1.5, 2, 2.5, and 3. Value is decided by RCWLR[COREPLL]. Multiplication factor L = 2, 3, 4, 5, and 6. Value is decided by RCWLR[SPMF]. Figure 57. MPC8313E Clock Subsystem MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 77 Clocking The primary clock source for the MPC8313E can be one of two inputs, SYS_CLK_IN or PCI_CLK, depending on whether the device is configured in PCI host or PCI agent mode. When the device is configured as a PCI host device, SYS_CLK_IN is its primary input clock. SYS_CLK_IN feeds the PCI clock divider (÷2) and the multiplexors for PCI_SYNC_OUT and PCI_CLK_OUT. The CFG_CLKIN_DIV configuration input selects whether SYS_CLK_IN or SYS_CLK_IN/2 is driven out on the PCI_SYNC_OUT signal. The OCCR[PCICOEn] parameters select whether the PCI_SYNC_OUT is driven out on the PCI_CLK_OUTn signals. PCI_SYNC_OUT is connected externally to PCI_SYNC_IN to allow the internal clock subsystem to synchronize to the system PCI clocks. PCI_SYNC_OUT must be connected properly to PCI_SYNC_IN, with equal delay to all PCI agent devices in the system, to allow the device to function. When the device is configured as a PCI agent device, PCI_CLK is the primary input clock. When the device is configured as a PCI agent device the SYS_CLK_IN signal should be tied to VSS. As shown in Figure 57, the primary clock input (frequency) is multiplied up by the system phase-locked loop (PLL) and the clock unit to create the coherent system bus clock (csb_clk), the internal clock for the DDR controller (ddr_clk), and the internal clock for the local bus interface unit (lbc_clk). The csb_clk frequency is derived from a complex set of factors that can be simplified into the following equation: csb_clk = {PCI_SYNC_IN × (1 + ~CFG_CLKIN_DIV)} × SPMF In PCI host mode, PCI_SYNC_IN × (1 + ~CFG_CLKIN_DIV) is the SYS_CLK_IN frequency. The csb_clk serves as the clock input to the e300 core. A second PLL inside the e300 core multiplies up the csb_clk frequency to create the internal clock for the e300 core (core_clk). The system and core PLL multipliers are selected by the SPMF and COREPLL fields in the reset configuration word low (RCWL) which is loaded at power-on reset or by one of the hard-coded reset options. See Chapter 4, “Reset, Clocking, and Initialization,” in the MPC8313E PowerQUICC II Pro Integrated Processor Family Reference Manual, for more information on the clock subsystem. The internal ddr_clk frequency is determined by the following equation: ddr_clk = csb_clk × (1 + RCWL[DDRCM]) Note that ddr_clk is not the external memory bus frequency; ddr_clk passes through the DDR clock divider (÷2) to create the differential DDR memory bus clock outputs (MCK and MCK). However, the data rate is the same frequency as ddr_clk. The internal lbc_clk frequency is determined by the following equation: lbc_clk = csb_clk × (1 + RCWL[LBCM]) Note that lbc_clk is not the external local bus frequency; lbc_clk passes through the a LBC clock divider to create the external local bus clock outputs (LCLK[0:1]). The LBC clock divider ratio is controlled by LCCR[CLKDIV]. In addition, some of the internal units may be required to be shut off or operate at lower frequency than the csb_clk frequency. Those units have a default clock ratio that can be configured by a memory mapped register after the device comes out of reset. Table 64 specifies which units have a configurable clock frequency. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 78 Freescale Semiconductor Clocking Table 64. Configurable Clock Units Unit TSEC1 TSEC2 Security Core, I2C, SAP, TPR USB DR PCI and DMA complex Default Frequency Options Off, csb_clk, csb_clk/2, csb_clk/3 Off, csb_clk, csb_clk/2, csb_clk/3 Off, csb_clk, csb_clk/2, csb_clk/3 Off, csb_clk, csb_clk/2, csb_clk/3 Off, csb_clk csb_clk csb_clk csb_clk csb_clk csb_clk Table 65 provides the operating frequencies for the MPC8313E TEPBGAII under recommended operating conditions (see Table 2). Table 65. Operating Frequencies for TEPBGAII Characteristic1 e300 core frequency (core_clk) Coherent system bus frequency (csb_clk) DDR1/2 memory bus frequency (MCK)2 Local bus frequency (LCLKn)3 Maximum Operating Frequency 333 167 167 66 66 Unit MHz MHz MHz MHz MHz PCI input frequency (SYS_CLK_IN or PCI_CLK) Notes: 1. The SYS_CLK_IN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen such that the resulting csb_clk, MCK, LCLK[0:1], and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies. The value of SCCR[ENCCM] and SCCR[USBDRCM] must be programmed such that the maximum internal operating frequency of the security core and USB modules do not exceed their respective value listed in this table. 2. The DDR data rate is 2x the DDR memory bus frequency. 3. The local bus frequency is 1/2, 1/4, or 1/8 of the lbc_clk frequency (depending on LCCR[CLKDIV]), which is in turn, 1x or 2x the csb_clk frequency (depending on RCWL[LBCM]). 20.1 System PLL Configuration The system PLL is controlled by the RCWL[SPMF] parameter. Table 66 shows the multiplication factor encodings for the system PLL. Table 66. System PLL Multiplication Factors RCWL[SPMF] 0000 0001 0010 System PLL Multiplication Factor Reserved Reserved ×2 MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 79 Clocking Table 66. System PLL Multiplication Factors (continued) RCWL[SPMF] 0011 0100 0101 0110 0111–1111 System PLL Multiplication Factor ×3 ×4 ×5 ×6 Reserved As described in Section 20, “Clocking,” the LBCM, DDRCM, and SPMF parameters in the reset configuration word low and the CFG_CLKIN_DIV configuration input signal select the ratio between the primary clock input (SYS_CLK_IN or PCI_SYNC_IN) and the internal coherent system bus clock (csb_clk). Table 67 shows the expected frequency values for the CSB frequency for select csb_clk to SYS_CLK_IN/PCI_SYNC_IN ratios. Table 67. CSB Frequency Options Input Clock Frequency (MHz)2 CFG_CLKIN_DIV at Reset1 SPMF csb_clk :Input Clock Ratio2 24 25 33.33 66.67 csb_clk Frequency (MHz) High High High High High Low Low Low Low Low 1 2 0010 0011 0100 0101 0110 0010 0011 0100 0101 0110 2:1 3:1 4:1 5:1 6:1 2:1 3:1 4:11 5:1 6:1 120 144 100 125 150 100 133 167 120 144 100 125 150 100 133 167 133 133 CFG_CLKIN_DIV select the ratio between SYS_CLK_IN and PCI_SYNC_OUT. SYS_CLK_IN is the input clock in host mode; PCI_CLK is the input clock in agent mode. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 80 Freescale Semiconductor Clocking 20.2 Core PLL Configuration RCWL[COREPLL] selects the ratio between the internal coherent system bus clock (csb_clk) and the e300 core clock (core_clk). Table 68 shows the encodings for RCWL[COREPLL]. COREPLL values that are not listed in Table 68 should be considered as reserved. NOTE Core VCO frequency = core frequency × VCO divider. The VCO divider, which is determined by RCWLR[COREPLL], must be set properly so that the core VCO frequency is in the range of 400–800 MHz. Table 68. e300 Core PLL Configuration RCWL[COREPLL] core_clk : csb_clk Ratio1 0–1 2–5 0000 6 0 n 0 0 0 1 1 1 0 0 0 1 1 1 0 0 0 PLL bypassed (PLL off, csb_clk clocks core directly) n/a 1:1 1:1 1:1 1.5:1 1.5:1 1.5:1 2:1 2:1 2:1 2.5:1 2.5:1 2.5:1 3:1 3:1 3:1 VCO Divider (VCOD)2 nn 11 00 01 10 00 01 10 00 01 10 00 01 10 00 01 10 1 PLL bypassed (PLL off, csb_clk clocks core directly) n/a 2 4 8 2 4 8 2 4 8 2 4 8 2 4 8 nnnn 0001 0001 0001 0001 0001 0001 0010 0010 0010 0010 0010 0010 0011 0011 0011 For core_clk:csb_clk ratios of 2.5:1 and 3:1, the core_clk must not exceed its maximum operating frequency of 333 MHz. 2 Core VCO frequency = core frequency × VCO divider. Note that VCO divider has to be set properly so that the core VCO frequency is in the range of 400–800 MHz. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 81 Thermal 20.3 Example Clock Frequency Combinations Table 69 shows several possible frequency combinations that can be selected based on the indicated input reference frequencies, with RCWLR[LBCM] = 0 and RCWLR[DDRCM] =1, such that the LBC operates with a frequency equal to the frequency of csb_clk and the DDR controller operates at twice the frequency of csb_clk. Table 69. System Clock Frequencies LBC(lbc_clk) SYS_ CSB DDR CLK_IN/ SPMF 1 VCOD 2 VCO3 (csb_clk)4 (ddr_clk) PCI_CLK 25.0 25.0 33.3 33.3 48.0 66.7 1 2 3 4 5 6 e300 Core(core_clk) USB ref5 /2 /4 /8 ×1 150.0 125.0 166.5 133.2 144.0 133.3 × 1.5 225 188 250 200 216 200 ×2 300 250 333 266 288 267 × 2.5 375 313 — 333 360 333 ×3 — 375 — 400 — 400 6 5 5 4 3 2 2 2 2 2 2 2 600.0 500.0 666.0 532.8 576.0 533.4 150.0 125.0 166.5 133.2 144.0 133.3 300.0 250.0 333.0 266.4 288.0 266.7 — 37.5 18.8 Note 6 Note 6 Note 6 Note 6 48.0 Note 6 62.5 31.25 15.6 — 66.6 — 41.63 20.8 33.3 36 16.7 18.0 66.7 33.34 16.7 System PLL multiplication factor. System PLL VCO divider. When considering operating frequencies, the valid core VCO operating range of 400–800 MHz must not be violated. Due to erratum eTSEC40, csb_clk frequencies of less than 133 MHz do not support gigabit Ethernet data rates. The core frequency must be 333 MHz for gigabit Ethernet operation. This erratum will be fixed in revision 2 silicon. Frequency of USB PLL input reference. USB reference clock must be supplied from a separate source as it must be 24 or 48 MHz, the USB reference must be supplied from a separate external source using USB_CLK_IN. 21 Thermal This section describes the thermal specifications of the MPC8313E. 21.1 Thermal Characteristics Table 70. Package Thermal Characteristics for TEPBGAII Characteristic Board Type Single layer board (1s) Four layer board (2s2p) Single layer board (1s) Four layer board (2s2p) — Symbol TEPBGA II 25 18 20 15 10 Unit °C/W °C/W °C/W °C/W °C/W Notes 1, 2 1, 2, 3 1, 3 1, 3 4 Table 70 provides the package thermal characteristics for the 516, 27 × 27 mm TEPBGAII. Junction-to-ambient natural convection Junction-to-ambient natural convection Junction-to-ambient (@200 ft/min) Junction-to-ambient (@200 ft/min) Junction-to-board RθJA RθJA RθJMA RθJMA RθJB MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 82 Freescale Semiconductor Thermal Table 70. Package Thermal Characteristics for TEPBGAII (continued) Characteristic Junction-to-case Junction-to-package top Board Type — Natural convection Symbol TEPBGA II 8 7 Unit °C/W °C/W Notes 5 6 RθJC ΨJT Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. 2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification. 3. Per JEDEC JESD51-6 with the board horizontal. 4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 21.2 Thermal Management Information For the following sections, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers. 21.2.1 Estimation of Junction Temperature with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, can be obtained from the equation: TJ = TA + (RθJA × PD) where: TJ = junction temperature (°C) TA = ambient temperature for the package (°C) RθJA = junction-to-ambient thermal resistance (°C/W) PD = power dissipation in the package (W) The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal performance. As a general statement, the value obtained on a single layer board is appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually appropriate if the board has low power dissipation and the components are well separated. Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible. 21.2.2 Estimation of Junction Temperature with Junction-to-Board Thermal Resistance The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal resistance. The thermal performance of any component is strongly dependent on the power dissipation of surrounding components. In addition, the ambient temperature varies widely within the application. For many natural convection and especially closed box applications, the board temperature at the perimeter MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 83 Thermal (edge) of the package is approximately the same as the local air temperature near the device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the local ambient conditions that determine the temperature of the device. At a known board temperature, the junction temperature is estimated using the following equation: TJ = TB + (RθJB × PD) where: TJ = junction temperature (°C) TB = board temperature at the package perimeter (°C) RθJB = junction-to-board thermal resistance (°C/W) per JESD51–8 PD = power dissipation in the package (W) When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made. The application board should be similar to the thermal test condition: the component is soldered to a board with internal planes. 21.2.3 Experimental Determination of Junction Temperature To determine the junction temperature of the device in the application after prototypes are available, the thermal characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT + (ΨJT × PD) where: TJ = junction temperature (°C) TT = thermocouple temperature on top of package (°C) ΨJT = thermal characterization parameter (°C/W) PD = power dissipation in the package (W) The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. 21.2.4 Heat Sinks and Junction-to-Case Thermal Resistance In some application environments, a heat sink is required to provide the necessary thermal management of the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction to case thermal resistance and a case to ambient thermal resistance: RθJA = RθJC + RθCA where: RθJA = junction-to-ambient thermal resistance (°C/W) RθJC = junction-to-case thermal resistance (°C/W) RθCA = case-to- ambient thermal resistance (°C/W) MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 84 Freescale Semiconductor Thermal RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the airflow around the device, the interface material, the mounting arrangement on the printed-circuit board, or change the thermal dissipation on the printed-circuit board surrounding the device. To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been simulated with a few commercially available heat sinks. The heat sink choice is determined by the application environment (temperature, airflow, adjacent component power dissipation) and the physical space available. Because there is not a standard application environment, a standard heat sink is not required. Table 71. Thermal Resistance for TEPBGAII with Heat Sink in Open Flow Heat Sink Assuming Thermal Grease Wakefield 53 × 53 × 2.5 mm pin fin Airflow Natural convection 0.5 m/s 1 m/s 2 m/s 4 m/s Aavid 35 × 31 × 23 mm pin fin Natural convection 0.5 m/s 1 m/s 2 m/s 4 m/s Aavid 30 × 30 × 9.4 mm pin fin Natural convection 0.5 m/s 1 m/s 2 m/s 4 m/s Aavid 43 × 41 × 16.5 mm pin fin Natural convection 0.5 m/s 1 m/s 2 m/s 4 m/s Thermal Resistance (°C/W) 13.0 10.6 9.7 9.2 8.9 14.4 11.3 10.5 9.9 9.4 16.5 13.5 12.1 10.9 10.0 14.5 11.7 10.5 9.7 9.2 Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics software which can model both the conduction cooling and the convection cooling of the air moving through the application. Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in Table 71. More detailed thermal models can be made available on request. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 85 Thermal Heat sink Vendors include the following list: Aavid Thermalloy 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 473 Sapena Ct. #12 Santa Clara, CA 95054 Internet: www.alphanovatech.com International Electronic Research Corporation (IERC) 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Millennium Electronics (MEI) Loroco Sites 671 East Brokaw Road San Jose, CA 95112 Internet: www.mei-thermal.com Tyco Electronics Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105 Internet: www.chipcoolers.com Wakefield Engineering 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com Interface material vendors include the following: Chomerics, Inc. 77 Dragon Ct. Woburn, MA 01801 Internet: www.chomerics.com Dow-Corning Corporation Corporate Center PO BOX 994 Midland, MI 48686-0994 Internet: www.dowcorning.com Shin-Etsu MicroSi, Inc. 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com 603-224-9988 408-749-7601 818-842-7277 408-436-8770 800-522-6752 603-635-2800 781-935-4850 800-248-2481 888-642-7674 MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 86 Freescale Semiconductor Thermal The Bergquist Company 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com 800-347-4572 21.3 Heat Sink Attachment When attaching heat sinks to these devices, an interface material is required. The best method is to use thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force. If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic surfaces and its performance verified under the application requirements. 21.3.1 Experimental Determination of the Junction Temperature with a Heat Sink When heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case temperature, the junction temperature is determined from the junction to case thermal resistance. TJ = TC + (RθJC x PD) where: TJ = junction temperature (°C) TC = case temperature of the package RθJC = junction-to-case thermal resistance PD = power dissipation MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 87 System Design Information 22 System Design Information This section provides electrical and thermal design recommendations for successful application of the MPC8313E SYS_CLK_IN 22.1 System Clocking The MPC8313E includes three PLLs. 1. The platform PLL (AVDD2) generates the platform clock from the externally supplied SYS_CLK_IN input in PCI host mode or SYS_CLK_IN/PCI_SYNC_IN in PCI agent mode. The frequency ratio between the platform and SYS_CLK_IN is selected using the platform PLL ratio configuration bits as described in Section 20.1, “System PLL Configuration.” 2. The e300 core PLL (AVDD1) generates the core clock as a slave to the platform clock. The frequency ratio between the e300 core clock and the platform clock is selected using the e300 PLL ratio configuration bits as described in Section 20.2, “Core PLL Configuration.” 3. There is a PLL for the SerDes block. 22.2 PLL Power Supply Filtering Each of the PLLs listed above is provided with power through independent power supply pins (AVDD1, AVDD2, and SDAVDD, respectively). The AVDD level should always be equivalent to VDD, and preferably these voltages are derived directly from VDD through a low frequency filter scheme such as the following. There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to provide independent filter circuits as illustrated in Figure 58, one to each of the five AVDD pins. By providing independent filters to each PLL the opportunity to cause noise injection from one PLL to the other is reduced. This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz range. It should be built with surface mount capacitors with minimum effective series inductance (ESL). Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value capacitor. Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AV DD pin, which is on the periphery of package, without the inductance of vias. Figure 58 shows the PLL power supply filter circuits. V DD 1.0 Ω 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors AV DD1 and AVDD2 Figure 58. PLL Power Supply Filter Circuit MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 88 Freescale Semiconductor System Design Information The SDAVDD signal provides power for the analog portions of the SerDes PLL. To ensure stability of the internal clock, the power supplied to the PLL is filtered using a circuit like the one shown in Figure 59. For maximum effectiveness, the filter circuit should be placed as closely as possible to the SDAVDD ball to ensure it filters out as much noise as possible. The ground connection should be near the SDAVDD ball. The 0.003-µF capacitor is closest to the ball, followed by the two 2.2-µF capacitors, and finally the 1-Ω resistor to the board supply plane. The capacitors are connected from traces from SDAVDD to the ground plane. Use ceramic chip capacitors with the highest possible self-resonant frequency. All traces should be kept short, wide, and direct. 1.0 Ω XCOREV DD SDAVDD 2.2 µF 1 2.2 µF 1 0.003 µF SDAVSS Note: 1. An 0805 sized capacitor is recommended for system initial bring-up. Figure 59. SerDes PLL Power Supply Filter Circuit Note the following: • SDAVDD should be a filtered version of XCOREVDD. • Output signals on the SerDes interface are fed from the XPADVDD power plane. Input signals and sensitive transceiver analog circuits are on the XCOREVDD supply. • Power: XPADVDD consumes less than 300 mW; XCOREVDD + SDAVDD consumes less than 750 mW. 22.3 Decoupling Recommendations Due to large address and data buses, and high operating frequencies, the device can generate transient power surges and high frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from reaching other components in the MPC8313E system, and the MPC8313E itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer place at least one decoupling capacitor at each VDD, NVDD, GVDD, LVDD, LVDDA, and LVDDB pin of the device. These decoupling capacitors should receive their power from separate VDD, NVDD, GVDD, LVDD, LVDDA, LVDDB, and VSS power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be placed directly under the device using a standard escape pattern. Others may surround the part. These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology) capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes. In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the VDD, NVDD, GVDD, LVDD, LVDDA, and LVDDB planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick response time necessary. They should also be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk capacitors—100 to 330 µF (AVX TPS tantalum or Sanyo OSCON). However, customers should work directly with their power regulator vendor for best values and types of bulk capacitors. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 89 System Design Information 22.4 SerDes Block Power Supply Decoupling Recommendations The SerDes block requires a clean, tightly regulated source of power (XCOREVDD and XPADVDD) to ensure low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is outlined below. Only SMT capacitors should be used to minimize inductance. Connections from all capacitors to power and ground should be done with multiple vias to further reduce inductance. • First, the board should have at least 10 × 10-nF SMT ceramic chip capacitors as close as possible to the supply balls of the device. Where the board has blind vias, these capacitors should be placed directly below the chip supply and ground connections. Where the board does not have blind vias, these capacitors should be placed in a ring around the device as close to the supply and ground connections as possible. • Second, there should be a 1-µF ceramic chip capacitor from each SerDes supply (XCOREVDD and XPADVDD) to the board ground plane on each side of the device. This should be done for all SerDes supplies. • Third, between the device and any SerDes voltage regulator there should be a 10-µF, low equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-µF, low ESR SMT tantalum chip capacitor. This should be done for all SerDes supplies. 22.5 Connection Recommendations To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal level. Unused active low inputs should be tied to NVDD, GVDD, LVDD, LVDDA, or LVDDB as required. Unused active high inputs should be connected to VSS. All NC (no-connect) signals must remain unconnected. Power and ground connections must be made to all external VDD, NVDD, GVDD, LVDD, LVDDA, LVDDB, and VSS pins of the device. 22.6 Output Buffer DC Impedance The MPC8313E drivers are characterized over process, voltage, and temperature. For all buses, the driver is a push-pull single-ended driver type (open drain for I2C). To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to NVDD or VSS. Then, the value of each resistor is varied until the pad voltage is NVDD/2 (see Figure 60). The output impedance is the average of two components, the resistances of the pull-up and pull-down devices. When data is held high, SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals NVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in value. Then, Z0 = (RP + RN)/2. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 90 Freescale Semiconductor System Design Information NVDD RN SW2 Data Pad SW1 RP VSS Figure 60. Driver Impedance Measurement The value of this resistance and the strength of the driver’s current source can be found by making two measurements. First, the output voltage is measured while driving logic 1 without an external differential termination resistor. The measured voltage is V1 = Rsource × Isource. Second, the output voltage is measured while driving logic 1 with an external precision differential termination resistor of value R term. The measured voltage is V2 = (1/(1/R1 + 1/R2)) × Isource. Solving for the output impedance gives Rsource = Rterm × (V1/V2 – 1). The drive current is then Isource = V1/Rsource. Table 72 summarizes the signal impedance targets. The driver impedance are targeted at minimum VDD, nominal NVDD, 105°C. Table 72. Impedance Characteristics Local Bus, Ethernet, DUART, Control, Configuration, Power Management 42 Target 42 Target NA PCI Signals (Not Including PCI Output Clocks) 25 Target 25 Target NA PCI Output Clocks (Including PCI_SYNC_OUT) 42 Target 42 Target NA Impedance DDR DRAM Symbol Unit RN RP Differential 20 Target 20 Target NA Z0 Z0 ZDIFF Ω Ω Ω Note: Nominal supply voltages. See Table 1, TJ = 105° C. 22.7 Configuration Pin Muxing The MPC8313E provides the user with power-on configuration options which can be set through the use of external pull-up or pull-down resistors of 4.7 kΩ on certain output pins (see customer visible configuration pins). These pins are generally used as output only pins in normal operation. While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins while HRESET is asserted, is latched when PORESET deasserts, at which time the input receiver is disabled and the I/O circuit takes on its normal function. Careful board layout with stubless connections to these pull-up/pull-down resistors coupled with the large value of the pull-up/pull-down resistor should minimize the disruption of signal quality or speed for output pins thus configured. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 91 System Design Information 22.8 Pull-Up Resistor Requirements The MPC8313E requires high resistance pull-up resistors (10 kΩ is recommended) on open drain type pins including I2C, Ethernet management MDIO, and IPIC (integrated programmable interrupt controller). Correct operation of the JTAG interface requires configuration of a group of system control pins as demonstrated in Figure 61. Care must be taken to ensure that these pins are maintained at a valid deasserted state under normal operating conditions because most have asynchronous behavior and spurious assertion, which give unpredictable results. Refer to the PCI 2.2 Specification, for all pull-ups required for PCI. 22.9 JTAG Configuration Signals Boundary scan testing is enabled through the JTAG interface signals. The TRST signal is optional in IEEE 1149.1, but is provided on any Freescale devices that are built on Power Architecture technology. The device requires TRST to be asserted during reset conditions to ensure the JTAG boundary logic does not interfere with normal chip operation. While it is possible to force the TAP controller to the reset state using only the TCK and TMS signals, systems generally assert TRST during power-on reset. Because the JTAG interface is also used for accessing the common on-chip processor (COP) function, simply tying TRST to PORESET is not practical. The COP function of these processors allows a remote computer system (typically, a PC with dedicated hardware and debugging software) to access and control the internal operations of the processor. The COP interface connects primarily through the JTAG port of the processor, with some additional status monitoring signals. The COP port requires the ability to independently assert TRST without causing PORESET. If the target system has independent reset sources, such as voltage monitors, watchdog timers, power supply failures, or push-button switches, then the COP reset signals must be merged into these signals with logic. The arrangement shown in Figure 61 allows the COP to independently assert HRESET or TRST, while ensuring that the target can drive HRESET as well. If the JTAG interface and COP header are not used, TRST should be tied to PORESET so that it is asserted when the system reset signal (PORESET) is asserted. The COP header shown in Figure 61 adds many benefits—breakpoints, watchpoints, register and memory examination/modification, and other standard debugger features are possible through this interface—and can be as inexpensive as an unpopulated footprint for a header to be added when needed. The COP interface has a standard header for connection to the target system, based on the 0.025" square-post, 0.100" centered header assembly (often called a Berg header). There is no standardized way to number the COP header shown in Figure 61; consequently, many different pin numbers have been observed from emulator vendors. Some are numbered top-to-bottom then left-to-right, while others use left-to-right then top-to-bottom, while still others number the pins counter clockwise from pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended in Figure 61 is common to all known emulators. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 92 Freescale Semiconductor System Design Information PORESET From Target Board Sources (if any) SRESET HRESET 10 kΩ PORESET SRESET HRESET 13 11 HRESET SRESET NVDD NVDD 10 kΩ 10 kΩ NVDD NVDD 1 3 5 7 9 11 2 4 6 8 10 12 4 TRST 2 kΩ 10 kΩ TRST VDD_SENSE 61 5 15 NC CHKSTP_OUT NVDD CHKSTP_OUT 10 kΩ 10 kΩ NVDD NVDD CHKSTP_IN 14 2 CHKSTP_IN COP Header 8 TMS 9 1 3 7 2 10 12 16 NC NC NC TDO TDI TCK KEY 13 No pin 15 16 TMS TDO TDI TCK COP Connector Physical Pin Out Notes: 1. Some systems require power to be fed from the application board into the debugger repeater card via the COP header. In this case the resistor value for VDD_SENSE should be around 20 Ω. 2. Key location; pin 14 is not physically present on the COP header. Figure 61. JTAG Interface Connection MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 93 Document Revision History 23 Document Revision History Table 73 provides a revision history for this hardware specification. Table 73. Document Revision History Rev. Number 2.1 2 Date 12/2008 10/2008 Substantive Change(s) • Added Figure 2, after Table 2 and renumbered the following figures. • Added Note “The information in this document is accurate for revision 1.0, and 2.x and later. See Section 24.1, “Part Numbers Fully Addressed by this Document,” before Section 1, “Overview.” • Added part numbering details for all the silicon revisions in Table 74. • Changed VIH from 2.7 V to 2.4 V in Table 7. • Added a row for V IH level for Rev 2.x or later in Table 45. • Added a column for maximum power dissipation in low power mode for Rev 2.x or later silicon in Table 6. • Added a column for Power Nos for Rev 2.x or later silicon and added a row for 400 MHz in Table 4. • Removed footnote, “These are preliminary estimates.” from Table 4. • Added Table 21 for DDR AC Specs on Rev 2.x or later silicon. • Added Section 9, “High-Speed Serial Interfaces (HSSI).” • Added LFWE, LFCLE, LFALE, LOE, LFRE, LFWP, LGTA, LUPWAIT, and LFRB in Table 63. • In Table 39, added note 2: “This parameter is dependent on the csb_clk speed. (The MIIMCFG[Mgmt Clock Select] field determines the clock frequency of the Mgmt Clock EC_MDC.)” • Removed mentions of SGMII (SGMII has separate specs) from Section 8.1, “Enhanced Three-Speed Ethernet Controller (eTSEC) (10/100/1000 Mbps)—MII/RMII/RGMII/SGMII/RTBI Electrical Characteristics.” • Corrected Section 8.1, “Enhanced Three-Speed Ethernet Controller (eTSEC) (10/100/1000 Mbps)—MII/RMII/RGMII/SGMII/RTBI Electrical Characteristics,” to state that RGMII/RTBI interfaces only operate at 2.5 V, not 3.3 V. • Added ZQ package to ordering information In Table 74 and Section 19.1, “Package Parameters for the MPC8313E TEPBGAII” (applicable to both silicon rev. 1.0 and 2.1) • Removed footnotes 5 and 6 from Table 1 (left over when the PCI undershoot/overshoot voltages and maximum AC waveforms were removed from Section 2.1.2, “Power Supply Voltage Specification”). • Removed SD_PLL_TPD (T2) and SD_PLL_TPA_ANA (R4) from Table 63. • Added Section 8.3, “SGMII Interface Electrical Characteristics.” Removed Section 8.5.3 SGMII DC Electrical Characteristics. • Removed “HRESET negation to SRESET negation (output)” spec and changed “HRESET/SRESET assertion (output)” spec to “HRESET assertion (output)” in Table 10. • Clarified POR configuration signal specs to “Time for the device to turn off POR configuration signal drivers with respect to the assertion of HRESET” and “Time for the device to turn on POR configuration signal drivers with respect to the negation of HRESET” in Table 10. • Added Section 24.2, “Part Marking,” and Figure 62. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 94 Freescale Semiconductor Document Revision History Table 73. Document Revision History (continued) Rev. Number 1 Date 3/2008 • • • • • • Substantive Change(s) Replaced OVDD with NVDD everywhere Added XCOREVDD and XPADVDD to Table 1 Moved VDD and VDDC to the top of the table before SerDes supplies in Table 2 In Table 2 split DDR row into two from total current requirement of 425 mA. One for DDR1 (131 mA) and other for DDR2 (140 mA). In Table 2 corrected current requirement numbers for NV DD from 27 mA to 74 mA, LV DD from 60 mA to 16 mA, LVDDA from 85 mA to 22 mA and LVDDB from 85 mA to 44 mA. In Table 2 corrected Vdd and Vddc current requirements from 560 mA and 454 mA to 469 and 377 mA, respectively. Corrected Avdd1 and Avdd2 current requirements from 10 mA to 2–3 mA, and XCOREVDD from 100 mA to 170 mA. In Table 2, added row stating junction temperature range of 0 to 105•C. Added footnote 2 stating C. GPIO pins may operate from 2.5-V supply as well when configured for different functionality. In Section 2.1.2, “Power Supply Voltage Specification,” added a note describing the purpose of Table 2. In Section 3, “Power Characteristics,” added a note describing the purpose of Table 5. Rewrote Section 2.2, “Power Sequencing,” and added Figure 3. In Table 4, added “but do include core, USB PLL, and a portion of SerDes digital power...” to Note 1. In Table 4 corrected “Typical power” to “Maximum power” in note 2 and added a note for Typical Power. In Table 4 removed 266-MHz row as 266-MHz core parts are not offered. In Table 5, moved Local bus typical power dissipation under LVdd. Added Table 6 to show the low power mode power dissipation for D3warm mode. In Table 8 corrected SYS_CLK_IN frequency range from 25–66 MHz to 24–66.67 MHz. Added Section 8.4, “eTSEC IEEE 1588 AC Specifications” In Table 42 changed minimum value of USB input hold tUSIXKH from 0 to 1ns Added Table 43 and Table 44 showing USB clock in specifications In Table 46, added rows for tLALEHOV, tLALETOT1, tLALETOT2, and tLALETOT3 parameters. Added Figure 40. In Table 50, removed row for rise time (tI2CR). Removed minimum value of tI2CF. Added note 5 stating that the device does not follow the I2C-BUS Specifications version 2.1 regarding the tI2CF AC parameter. In Table 56, added a note stating: “This specification only applies to GPIO pins that are operating from a 3.3-V supply. See Table 63 for the power supply listed for the individual GPIO signal.” [ Added Table 57 to show DC characteristics for GPIO pins supplied by a 2.5-V supply. Same as eTSEC DC characteristics when operating at 2.5 V. In Section 20, “Clocking,” corrected the sentence “When the device is configured as a PCI agent device, PCI_SYNC_IN is the primary input clock.” to state “When the device is configured as a PCI agent device, PCI_CLK is the primary input clock.” Added “Value is decided by RCWLR[COREPLL]” to note 1 of Figure 57 Added paragraph and Figure 59 to Section 22.2, “PLL Power Supply Filtering.” Added Section 22.4, “SerDes Block Power Supply Decoupling Recommendations Removed the two figures on PCI undershoot/overshoot voltages and maximum AC waveforms from Section 2.1.2, “Power Supply Voltage Specification,” • • • • • • • • • • • • • • • • • • • • • • MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 95 Document Revision History Table 73. Document Revision History (continued) Rev. Number 1 Date 3/2008 • • • • • • • • • • • • • • Substantive Change(s) In Table 63, added LBC_PM_REF_10 & LSRCID3 as muxed with USBDR_PCTL1 In Table 63, added LSRCID2 as muxed with USBDR_PCTL0 In Table 63, added LSRCID1 as muxed with USBDR_PWRFAULT In Table 63, added LSRCID0 as muxed with USBDR_DRIVE_VBUS In Table 63, moved T1, U2,& V2 from VDD to XCOREVDD. In Table 63, moved P2, R2, & T3 from VSS to XCOREVSS. In Table 63, moved P5, & U4 from VDD to XPADVDD. In Table 63, moved P3, & V4 from VSS to XPADVSS. In Table 63, removed “Double with pad” for AVDD1 and AVDD2 and moved AVDD1 and AVDD2 to Power and Ground Supplies section In Table 63, added impedance control requirements for SD_IMP_CAL_TX (100 ohms to GND) and SD_IMP_CAL_RX (200 ohms to GND). In Table 63, updated muxing in pinout to show new options for selecting IEEE 1588 functionality. Added footnote 8 In Table 63, updated muxing in pinout to show new LBC ECC boot enable control muxed with eTSEC1_MDC Added pin type information for power supplies. Removed N1 and N3 from Vss section of Table 63. Added Therm0 and Therm1 (N1 and N3, respectively). Added note 7 to state: “Internal thermally sensitive resistor, resistor value varies linearly with temperature. Useful for determining the junction temperature.” In Table 65 corrected maximum frequency of Local Bus Frequency from “33–66” to 66 MHz In Table 65 corrected maximum frequency of PCI from “24–66” to 66 MHz Added “which is determined by RCWLR[COREPLL],” to the note in Section 20.2, “Core PLL Configuration” about the VCO divider. • • • • Added “(VCOD)” next to VCO divider column in Table 68. Added footnote stating that core_clk frequency must not exceed its maximum, so 2.5:1 and 3:1 core_clk:csb_clk ratios are invalid for certain csb_clk values. • In Table 69, notes were confusing. Added note 3 for VCO column, note 4 for CSB (csb_clk) column, note 5 for USB ref column, and note 6 to replace “Note 1”. Clarified note 4 to explain erratum eTSEC40. • In Table 69, updated note 6 to specify USB reference clock frequencies limited to 24 and 48 for rev. 2 silicon. • Replaced Table 71 “Thermal Resistance for TEPBGAII with Heat Sink in Open Flow”. • Removed last row of Table 19. • Removed 200 MHz rows from Table 21 and Table 5. • Changed VIH minimum spec from 2.0 to 2.1 for clock, PIC, JTAG, SPI, and reset pins in Table 9, Table 47, Table 54, Table 59, and Table 61. • Added Figure 4 showing the DDR input timing diagram. • In Table 19, removed “MDM” from the “MDQS-MDQ/MECC/MDM” text under the Parameter column for the tCISKEW parameter. MDM is an output signal and should be removed from the input AC timing spec table (tCISKEW). • Added “and power” to rows 2 and 3 in Table 10 • Added the sentence “Once both the power supplies...” and PORESET to Section 2.2, “Power Sequencing,” and Figure 3. • In Figure 35, corrected “USB0_CLK/USB1_CLK/DR_CLK” with “USBDR_CLK” • In Table 42, clarified that AC specs are for ULPI only. 0 6/2007 Initial release. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 96 Freescale Semiconductor Ordering Information 24 Ordering Information Ordering information for the parts fully covered by this specification document is provided in Section 24.1, “Part Numbers Fully Addressed by this Document.” 24.1 Part Numbers Fully Addressed by this Document Table 74 provides the Freescale part numbering nomenclature for the MPC8313E. Note that the individual part numbers correspond to a maximum processor core frequency. For available frequencies, contact your local Freescale sales office. In addition to the processor frequency, the part numbering scheme also includes an application modifier which may specify special application conditions. Each part number also contains a revision code which refers to the die mask revision number. Table 74. Part Numbering Nomenclature MPC Product Code MPC nnnn Part Identifier 8313 e Encryption Acceleration Blank = Not included E = included t Temperature Range 3 pp Package 1 aa e300 core Frequency 2 AF = 333 MHz GD = 400 MHz a DDR Frequency F = 333 MHz D = 266 MHz x Revision Level Blank = 1.0 A = 2.0 B = 2.1 Blank = 0° to 105° C ZQ = PB C= –40° to 105 °C TEPBGAII VR = PB free TEPBGAII Notes: 1. See Section 19, “Package and Pin Listings,” for more information on available package types. 2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification support all core frequencies. Additionally, parts addressed by Part Number Specifications may support other maximum core frequencies. 3. Contact local Freescale office on availability of parts with ° C temperature range. MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 97 Ordering Information 24.2 Part Marking Parts are marked as shown in Figure 62. MPCnnnnetppaaar core/ddr MHz ATWLYYWW CCCCC MMMMM YWWLAZ TePBGA Notes: MPCnnnnetppaar is the orderable part number. ATWLYYWW is the standard assembly, test, year, and work week codes. CCCCC is the country code. MMMMM is the mask number. Figure 62. Part Marking for TEPBGAII Device MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 98 Freescale Semiconductor Ordering Information THIS PAGE INTENTIONALLY LEFT BLANK MPC8313E PowerQUICC ™ II Pro Processor Hardware Specifications, Rev. 2.1 Freescale Semiconductor 99 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 10 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800 441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor @hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. The PowerPC name is a trademark of IBM Corp. and is used under license. RapidIO is a registered trademark of the RapidIO Trade Association. IEEE Std 802.1, 802.2, 802.3, 802.3u, 802.3x, 802.3z, 802.3ab, 802.3au, 802.11i, 1149.1, and 1588 are registered trademarks or trademarks of the Institute of Electrical and Electronics Engineers, Inc., (IEEE). This product is not endosed or approved by the IEEE. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2007, 2008. All rights reserved. Document Number: MPC8313EEC Rev. 2.1 12/2008