MPC8343ECZQAGDB

Freescale Semiconductor Technical Data Document Number: MPC8343EAEC Rev. 10, 10/2010 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8343EA PowerQUICC II Pro is a next generation PowerQUICC II integrated host processor. The MPC8343EA contains a processor core built on Power Architecture® technology with system logic for networking, storage, and general-purpose embedded applications. For functional characteristics of the processor, refer to the MPC8349EA PowerQUICC II Pro Integrated Host Processor Family Reference Manual. To locate published errata or updates for this document, refer to the MPC8343EA product summary page on our website, as listed on the back cover of this document, or contact your local Freescale sales office. Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10 Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 11 RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 12 DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 14 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Ethernet: Three-Speed Ethernet, MII Management . 21 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 48 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 System Design Information . . . . . . . . . . . . . . . . . . . 72 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 75 Document Revision History . . . . . . . . . . . . . . . . . . . 77 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. © 2006–2010 Freescale Semiconductor, Inc. All rights reserved. Overview NOTE The information in this document is accurate for revision 3.x silicon and later (in other words, for orderable part numbers ending in A or B). For information on revision 1.1 silicon and earlier versions, see the MPC8343E PowerQUICC II Pro Integrated Host Processor Hardware Specifications. See Section 22.1, “Part Numbers Fully Addressed by This Document,” for silicon revision level determination. 1 Overview This section provides a high-level overview of the device features. Figure 1 shows the major functional units within the MPC8343EA. Security DUART Dual I2C Timers GPIO e300 Core Interrupt Controller 32KB D-Cache 32KB I-Cache DDR SDRAM Controller Local Bus High-Speed USB 2.0 Dual Role 10/100/1000 Ethernet 10/100/1000 Ethernet PCI SEQ DMA Figure 1. MPC8343EA Block Diagram Major features of the device are as follows: • Embedded PowerPC e300 processor core; operates at up to 400 MHz — High-performance, superscalar processor core — Floating-point, integer, load/store, system register, and branch processing units — 32-Kbyte instruction cache, 32-Kbyte data cache — Lockable portion of L1 cache — Dynamic power management — Software-compatible with the other Freescale processor families that implement Power Architecture technology • Double data rate, DDR1/DDR2 SDRAM memory controller — Programmable timing supporting DDR1 and DDR2 SDRAM — 32- bit data interface, up to 266 MHz data rate MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 2 Freescale Semiconductor Overview • • — Up to four physical banks (chip selects), each bank up to 1 Gbyte independently addressable — DRAM chip configurations from 64 Mbits to 1 Gbit with ×8/×16 data ports — Full error checking and correction (ECC) support — Support for up to 16 simultaneous open pages (up to 32 pages for DDR2) — Contiguous or discontiguous memory mapping — Read-modify-write support — Sleep-mode support for SDRAM self refresh — Auto refresh — On-the-fly power management using CKE — Registered DIMM support — 2.5-V SSTL2 compatible I/O for DDR1, 1.8-V SSTL2 compatible I/O for DDR2 Dual three-speed (10/100/1000) Ethernet controllers (TSECs) — Dual controllers designed to comply with IEEE 802.3™, 802.3u™, 820.3x™, 802.3z™, 802.3ac™ standards — Ethernet physical interfaces: – 1000 Mbps IEEE Std. 802.3 RGMII, IEEE Std. 802.3z RTBI, full-duplex – 10/100 Mbps IEEE Std. 802.3 MII full- and half-duplex — Buffer descriptors are backward-compatible with MPC8260 and MPC860T 10/100 programming models — 9.6-Kbyte jumbo frame support — RMON statistics support — Internal 2-Kbyte transmit and 2-Kbyte receive FIFOs per TSEC module — MII management interface for control and status — Programmable CRC generation and checking PCI interface — Designed to comply with PCI Specification Revision 2.3 — Data bus width: – 32-bit data PCI interface operating at up to 66 MHz — PCI 3.3-V compatible — PCI host bridge capabilities — PCI agent mode on PCI interface — PCI-to-memory and memory-to-PCI streaming — Memory prefetching of PCI read accesses and support for delayed read transactions — Posting of processor-to-PCI and PCI-to-memory writes — On-chip arbitration supporting five masters on PCI — Accesses to all PCI address spaces — Parity supported — Selectable hardware-enforced coherency MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 3 Overview • • — Address translation units for address mapping between host and peripheral — Dual address cycle for target — Internal configuration registers accessible from PCI Security engine is optimized to handle all the algorithms associated with IPSec, SSL/TLS, SRTP, IEEE Std. 802.11i®, iSCSI, and IKE processing. The security engine contains four crypto-channels, a controller, and a set of crypto execution units (EUs): — Public key execution unit (PKEU) : – RSA and Diffie-Hellman algorithms – Programmable field size up to 2048 bits – Elliptic curve cryptography – F2m and F(p) modes – Programmable field size up to 511 bits — Data encryption standard (DES) execution unit (DEU) – DES and 3DES algorithms – Two key (K1, K2) or three key (K1, K2, K3) for 3DES – ECB and CBC modes for both DES and 3DES — Advanced encryption standard unit (AESU) – Implements the Rijndael symmetric-key cipher – Key lengths of 128, 192, and 256 bits – ECB, CBC, CCM, and counter (CTR) modes — XOR parity generation accelerator for RAID applications — ARC four execution unit (AFEU) – Stream cipher compatible with the RC4 algorithm – 40- to 128-bit programmable key — Message digest execution unit (MDEU) – SHA with 160-, 224-, or 256-bit message digest – MD5 with 128-bit message digest – HMAC with either algorithm — Random number generator (RNG) — Four crypto-channels, each supporting multi-command descriptor chains – Static and/or dynamic assignment of crypto-execution units through an integrated controller – Buffer size of 256 bytes for each execution unit, with flow control for large data sizes Universal serial bus (USB) dual role controller — USB on-the-go mode with both device and host functionality — Complies with USB specification Rev. 2.0 — Can operate as a stand-alone USB device – One upstream facing port – Six programmable USB endpoints MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 4 Freescale Semiconductor Overview • • • • — Can operate as a stand-alone USB host controller – USB root hub with one downstream-facing port – Enhanced host controller interface (EHCI) compatible – High-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operations — External PHY with UTMI, serial and UTMI+ low-pin interface (ULPI) Local bus controller (LBC) — Multiplexed 32-bit address and data operating at up to 133 MHz — Eight chip selects for eight external slaves — Up to eight-beat burst transfers — 32-, 16-, and 8-bit port sizes controlled by an on-chip memory controller — Three protocol engines on a per chip select basis: – General-purpose chip select machine (GPCM) – Three user-programmable machines (UPMs) – Dedicated single data rate SDRAM controller — Parity support — Default boot ROM chip select with configurable bus width (8-, 16-, or 32-bit) Programmable interrupt controller (PIC) — Functional and programming compatibility with the MPC8260 interrupt controller — Support for 8 external and 35 internal discrete interrupt sources — Support for 1 external (optional) and 7 internal machine checkstop interrupt sources — Programmable highest priority request — Four groups of interrupts with programmable priority — External and internal interrupts directed to host processor — Redirects interrupts to external INTA pin in core disable mode. — Unique vector number for each interrupt source Dual industry-standard I2C interfaces — Two-wire interface — Multiple master support — Master or slave I2C mode support — On-chip digital filtering rejects spikes on the bus — System initialization data optionally loaded from I2C-1 EPROM by boot sequencer embedded hardware DMA controller — Four independent virtual channels — Concurrent execution across multiple channels with programmable bandwidth control — Handshaking (external control) signals for all channels: DMA_DREQ[0:3], DMA_DACK[0:3], DMA_DDONE[0:3] — All channels accessible to local core and remote PCI masters MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 5 Electrical Characteristics • • • • • • — Misaligned transfer capability — Data chaining and direct mode — Interrupt on completed segment and chain DUART — Two 4-wire interfaces (RxD, TxD, RTS, CTS) — Programming model compatible with the original 16450 UART and the PC16550D Serial peripheral interface (SPI) for master or slave General-purpose parallel I/O (GPIO) — 39 parallel I/O pins multiplexed on various chip interfaces System timers — Periodic interrupt timer — Real-time clock — Software watchdog timer — Eight general-purpose timers Designed to comply with IEEE Std. 1149.1™, JTAG boundary scan Integrated PCI bus and SDRAM clock generation 2 Electrical Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8343EA. The device is currently targeted to these specifications. Some of these specifications are independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design specifications. 2.1 Overall DC Electrical Characteristics This section covers the ratings, conditions, and other characteristics. 2.1.1 Absolute Maximum Ratings Table 1. Absolute Maximum Ratings1 Parameter Symbol VDD AVDD GVDD LVDD OVDD Max Value –0.3 to 1.32 –0.3 to 1.32 –0.3 to 2.75 –0.3 to 1.98 –0.3 to 3.63 –0.3 to 3.63 Unit V V V V V Notes — — — — — Table 1 provides the absolute maximum ratings. Core supply voltage PLL supply voltage DDR and DDR2 DRAM I/O voltage Three-speed Ethernet I/O, MII management voltage PCI, local bus, DUART, system control and power management, I2C, and JTAG I/O voltage MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 6 Freescale Semiconductor Electrical Characteristics Table 1. Absolute Maximum Ratings1 (continued) Parameter Input voltage DDR DRAM signals DDR DRAM reference Three-speed Ethernet signals Local bus, DUART, CLKIN, system control and power management, I2C, and JTAG signals PCI Storage temperature range Symbol MVIN MVREF LVIN OVIN OVIN TSTG Max Value –0.3 to (GVDD + 0.3) –0.3 to (GVDD + 0.3) –0.3 to (LVDD + 0.3) –0.3 to (OVDD + 0.3) –0.3 to (OVDD + 0.3) –55 to 150 Unit V V V V V °C Notes 2, 5 2, 5 4, 5 3, 5 6 — Notes: 1 Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2 Caution: MV must not exceed GV IN DD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 3 Caution: OV must not exceed OV IN DD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 4 Caution: LV must not exceed LV IN DD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 5 (M,L,O)V and MV IN REF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2. 6 OVIN on the PCI interface can overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as shown in Figure 3. 2.1.2 Power Supply Voltage Specification Table 2 provides the recommended operating conditions for the MPC8343EA. Note that the values in Table 2 are the recommended and tested operating conditions. Proper device operation outside these conditions is not guaranteed. Table 2. Recommended Operating Conditions Parameter Core supply voltage PLL supply voltage DDR and DDR2 DRAM I/O voltage Three-speed Ethernet I/O supply voltage Three-speed Ethernet I/O supply voltage Symbol VDD AVDD GVDD LVDD1 LVDD2 Recommended Value 1.2 V ± 60 mV 1.2 V ± 60 mV 2.5 V ± 125 mV 1.8 V ± 90 mV 3.3 V ± 330 mV 2.5 V ± 125 mV 3.3 V ± 330 mV 2.5 V ± 125 mV Unit V V V V V Notes 1 1 — — — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 7 Electrical Characteristics Table 2. Recommended Operating Conditions (continued) Parameter PCI, local bus, DUART, system control and power management, I2C, and JTAG I/O voltage 1 Symbol OVDD Recommended Value 3.3 V ± 330 mV Unit V Notes — Note: GVDD, LVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or negative direction. Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8343EA. G/L/OVDD + 20% G/L/OVDD + 5% VIH G/L/OVDD GND GND – 0.3 V VIL GND – 0.7 V Not to Exceed 10% of tinterface1 Note: 1. tinterface refers to the clock period associated with the bus clock interface. Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 8 Freescale Semiconductor Electrical Characteristics Figure 3 shows the undershoot and overshoot voltage of the PCI interface of the MPC8343EA for the 3.3-V signals, respectively. 11 ns (Min) +7.1 V Overvoltage Waveform 0V 4 ns (Max) 62.5 ns +3.6 V Undervoltage Waveform –3.5 V 7.1 V p-to-p (Min) 7.1 V p-to-p (Min) 4 ns (Max) Figure 3. Maximum AC Waveforms on PCI Interface for 3.3-V Signaling 2.1.3 Output Driver Characteristics Table 3 provides information on the characteristics of the output driver strengths. The values are preliminary estimates. Table 3. Output Drive Capability Driver Type Local bus interface utilities signals PCI signals (not including PCI output clocks) PCI output clocks (including PCI_SYNC_OUT) DDR signal DDR2 signal TSEC/10/100 signals DUART, system control, C, JTAG, USB GPIO signals I2 Output Impedance (Ω ) 40 25 40 18 18 36 (half strength mode) 40 40 40 GVDD = 2.5 V GVDD = 1.8 V LVDD = 2.5/3.3 V OVDD = 3.3 V OVDD = 3.3 V, LVDD = 2.5/3.3 V Supply Voltage OVDD = 3.3 V 2.2 Power Sequencing The device does not require the core supply voltage and I/O supply voltages to be applied in any particular order. Note that during the power ramp up, before the power supplies are stable, there may be a period of time that I/O pins are actively driven. After the power is stable, as long as PORESET is asserted, most I/O pins are three-stated. To minimize the time that I/O pins are actively driven, it is recommended to apply core voltage before I/O voltage and assert PORESET before the power supplies fully ramp up. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 9 Power Characteristics 3 l Power Characteristics Table 4. MPC8343EA Power Dissipation1 Core Frequency (MHz) PBGA 266 CSB Frequency (MHz) 266 133 400 266 133 400 200 100 Typical at TJ = 65 1.3 1.1 1.5 1.4 1.5 1.3 Typical2,3 Maximum4 Unit The estimated typical power dissipation for the MPC8343EA device is shown in Table 4. 1.6 1.4 1.9 1.7 1.8 1.7 1.8 1.6 2.1 1.9 2.0 1.9 W W W W W W The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 5. Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark application. 3 Thermal solutions may need to design to a value higher than typical power based on the end application, T target, and I/O A power. 4 Maximum power is based on a voltage of V DD = 1.2 V, worst case process, a junction temperature of TJ = 105°C, and an artificial smoke test. 2 1 Table 5 shows the estimated typical I/O power dissipation for MPC8343EA. Table 5. MPC8343EA Typical I/O Power Dissipation Interface Parameter DDR2 GVDD (1.8 V) 0.31 0.35 DDR1 GVDD (2.5 V) 0.42 0.5 OVDD (3.3 V) — — LVDD (3.3 V) — — LVDD (2.5 V) — — Unit Comments DDR I/O 65% utilization 2.5 V Rs = 20 Ω Rt = 50 Ω 2 pair of clocks PCI I/O load = 30 pF Local bus I/O load = 25 pF 200 MHz, 32 bits 266 MHz, 32 bits W W — — 33 MHz, 32 bits 66 MHz, 32 bits 167 MHz, 32 bits 133 MHz, 32 bits 83 MHz, 32 bits 66 MHz, 32 bits 50 MHz, 32 bits — — — — — — — — — — — — — — 0.04 0.07 0.34 0.27 0.17 0.14 0.11 — — — — — — — — — — — — — — W W W W W W W — — — — — — — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 10 Freescale Semiconductor Clock Input Timing Table 5. MPC8343EA Typical I/O Power Dissipation (continued) Interface Parameter DDR2 GVDD (1.8 V) — — — — — — DDR1 GVDD (2.5 V) — — — — — — 0.01 0.2 0.01 OVDD (3.3 V) LVDD (3.3 V) 0.01 0.06 — — — — LVDD (2.5 V) — — 0.04 — — — Unit Comments TSEC I/O load = 25 pF MII GMII or TBI RGMII or RTBI W W W W W W Multiply by number of interfaces used. USB 12 MHz 480 MHz — — — Other I/O 4 4.1 Clock Input Timing DC Electrical Characteristics Table 6. CLKIN DC Timing Specifications Parameter Condition — — 0 V ≤ VIN ≤ OVDD 0 V ≤ VIN ≤ 0.5 V or OVDD – 0.5 V ≤ VIN ≤ OVDD 0.5 V ≤VIN ≤ OVDD – 0.5 V Symbol VIH VIL IIN IIN IIN Min 2.7 –0.3 — — — Max OVDD + 0.3 0.4 ±10 ±10 ±50 Unit V V μA μA μA This section provides the clock input DC and AC electrical characteristics for the device. Table 6 provides the clock input (CLKIN/PCI_SYNC_IN) DC timing specifications for the MPC8343EA. Input high voltage Input low voltage CLKIN input current PCI_SYNC_IN input current PCI_SYNC_IN input current 4.2 AC Electrical Characteristics The primary clock source for the MPC8343EA can be one of two inputs, CLKIN or PCI_CLK, depending on whether the device is configured in PCI host or PCI agent mode. Table 7 provides the clock input (CLKIN/PCI_CLK) AC timing specifications for the device. Table 7. CLKIN AC Timing Specifications Parameter/Condition CLKIN/PCI_CLK frequency CLKIN/PCI_CLK cycle time CLKIN/PCI_CLK rise and fall time Symbol fCLKIN tCLKIN tKH, tKL Min — 15 0.6 Typical — — 1.0 Max 66 — 2.3 Unit MHz ns ns Notes 1, 6 — 2 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 11 RESET Initialization Table 7. CLKIN AC Timing Specifications (continued) CLKIN/PCI_CLK duty cycle CLKIN/PCI_CLK jitter tKHK/tCLKIN — 40 — — — 60 ±150 % ps 3 4, 5 Notes: 1. Caution: The system, core, USB, security, and TSEC must not exceed their respective maximum or minimum operating frequencies. 2. Rise and fall times for CLKIN/PCI_CLK are measured at 0.4 and 2.7 V. 3. Timing is guaranteed by design and characterization. 4. This represents the total input jitter—short term and long term—and is guaranteed by design. 5. The CLKIN/PCI_CLK driver’s closed loop jitter bandwidth should be < 500 kHz at –20 dB. The bandwidth must be set low to allow cascade-connected PLL-based devices to track CLKIN drivers with the specified jitter. 6. Spread spectrum clocking is allowed with 1% input frequency down-spread at maximum 50 KHz modulation rate regardless of input frequency. 4.3 TSEC Gigabit Reference Clock Timing Table 8. EC_GTX_CLK125 AC Timing Specifications Table 8 provides the TSEC gigabit reference clocks (EC_GTX_CLK125) AC timing specifications. At recommended operating conditions with LVDD = 2.5 ± 0.125 mV/ 3.3 V ± 165 mV Parameter EC_GTX_CLK125 frequency EC_GTX_CLK125 cycle time EC_GTX_CLK rise and fall time LVDD = 2.5 V LVDD = 3.3 V EC_GTX_CLK125 duty cycle GMII, TBI 1000Base-T for RGMII, RTBI EC_GTX_CLK125 jitter Symbol tG125 tG125 tG125R/tG125F Min — — — Typical 125 8 — Max — — 0.75 1.0 Unit MHz ns ns Notes — — 1 tG125H/tG125 45 47 — — — 55 53 — ±150 % 2 ps 2 Notes: 1. Rise and fall times for EC_GTX_CLK125 are measured from 0.5 and 2.0 V for LVDD = 2.5 V and from 0.6 and 2.7 V for LVDD = 3.3 V. 2. EC_GTX_CLK125 is used to generate the GTX clock for the eTSEC transmitter with 2% degradation. The EC_GTX_CLK125 duty cycle can be loosened from 47%/53% as long as the PHY device can tolerate the duty cycle generated by the eTSEC GTX_CLK. See Section 8.2.2, “RGMII and RTBI AC Timing Specifications for the duty cycle for 10Base-T and 100Base-T reference clock. 5 RESET Initialization This section describes the DC and AC electrical specifications for the reset initialization timing and electrical requirements of the MPC8343EA. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 12 Freescale Semiconductor RESET Initialization 5.1 RESET DC Electrical Characteristics Table 9. RESET Pins DC Electrical Characteristics1 Parameter Symbol VIH VIL IIN VOH VOL VOL Condition — — — IOH = –8.0 mA IOL = 8.0 mA IOL = 3.2 mA Min 2.0 –0.3 — 2.4 — — Max OVDD + 0.3 0.8 ±5 — 0.5 0.4 Unit V V μA V V V Table 9 provides the DC electrical characteristics for the RESET pins of the MPC8343EA. Input high voltage Input low voltage Input current Output high voltage2 Output low voltage Output low voltage Notes: 1. This table applies for pins PORESET, HRESET, SRESET, and QUIESCE. 2. HRESET and SRESET are open drain pins, thus VOH is not relevant for those pins. 5.2 RESET AC Electrical Characteristics Table 10. RESET Initialization Timing Specifications Parameter Min 32 32 32 512 16 4 Max — — — — — — Unit tPCI_SYNC_IN tCLKIN tPCI_SYNC_IN tPCI_SYNC_IN tPCI_SYNC_IN tCLKIN Notes 1 2 1 1 1 2 Table 10 provides the reset initialization AC timing specifications of the MPC8343EA. Required assertion time of HRESET or SRESET (input) to activate reset flow Required assertion time of PORESET with stable clock applied to CLKIN when the MPC8343EA is in PCI host mode Required assertion time of PORESET with stable clock applied to PCI_SYNC_IN when the MPC8343EA is in PCI agent mode HRESET/SRESET assertion (output) HRESET negation to SRESET negation (output) Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV) with respect to negation of PORESET when the MPC8343EA is in PCI host mode Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV) with respect to negation of PORESET when the MPC8343EA is in PCI agent mode Input hold time for POR configuration signals with respect to negation of HRESET Time for the MPC8343EA to turn off POR configuration signals with respect to the assertion of HRESET 4 — tPCI_SYNC_IN 1 0 — — 4 ns ns — 3 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 13 DDR and DDR2 SDRAM Table 10. RESET Initialization Timing Specifications (continued) Parameter Time for the MPC8343EA to turn on POR configuration signals with respect to the negation of HRESET Min 1 Max — Unit tPCI_SYNC_IN Notes 1, 3 Notes: 1. tPCI_SYNC_IN is the clock period of the input clock applied to PCI_SYNC_IN. In PCI host mode, the primary clock is applied to the CLKIN input, and PCI_SYNC_IN period depends on the value of CFG_CLKIN_DIV. See the MPC8349EA PowerQUICC II Pro Integrated Host Processor Family Reference Manual. 2. tCLKIN is the clock period of the input clock applied to CLKIN. It is valid only in PCI host mode. See the MPC8349EA PowerQUICC II Pro Integrated Host Processor Family Reference Manual. 3. POR configuration signals consist of CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV. Table 11 lists the PLL and DLL lock times. Table 11. PLL and DLL Lock Times Parameter/Condition PLL lock times DLL lock times Min — 7680 Max 100 122,880 Unit μs csb_clk cycles Notes — 1, 2 Notes: 1. DLL lock times are a function of the ratio between the output clock and the coherency system bus clock (csb_clk). A 2:1 ratio results in the minimum and an 8:1 ratio results in the maximum. 2. The csb_clk is determined by the CLKIN and system PLL ratio. See Section 19, “Clocking.” 6 DDR and DDR2 SDRAM This section describes the DC and AC electrical specifications for the DDR SDRAM interface of the MPC8343EA. Note that DDR SDRAM is GVDD(typ) = 2.5 V and DDR2 SDRAM is GVDD(typ) = 1.8 V. The AC electrical specifications are the same for DDR and DRR2 SDRAM. NOTE The information in this document is accurate for revision 3.0 silicon and later. For information on revision 1.1 silicon and earlier versions see the MPC8343E PowerQUICC II Pro Integrated Host Processor Hardware Specifications. See Section 22.1, “Part Numbers Fully Addressed by This Document,” for silicon revision level determination. 6.1 DDR and DDR2 SDRAM DC Electrical Characteristics Table 12 provides the recommended operating conditions for the DDR2 SDRAM component(s) of the MPC8343EA when GVDD(typ) = 1.8 V. Table 12. DDR2 SDRAM DC Electrical Characteristics for GVDD(typ) = 1.8 V Parameter/Condition I/O supply voltage Symbol GVDD Min 1.71 Max 1.89 Unit V Notes 1 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 14 Freescale Semiconductor DDR and DDR2 SDRAM Table 12. DDR2 SDRAM DC Electrical Characteristics for GVDD(typ) = 1.8 V (continued) I/O reference voltage I/O termination voltage Input high voltage Input low voltage Output leakage current Output high current (VOUT = 1.420 V) Output low current (VOUT = 0.280 V) MVREF VTT VIH VIL IOZ IOH IOL 0.49 × GVDD MVREF – 0.04 MVREF + 0.125 –0.3 –9.9 –13.4 13.4 0.51 × GVDD MVREF + 0.04 GVDD + 0.3 MVREF – 0.125 9.9 — — V V V V μA mA mA 2 3 — — 4 — — Notes: 1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times. 2. MVREF is expected to equal 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak noise on MVREF cannot exceed ±2% of the DC value. 3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to equal MVREF. This rail should track variations in the DC level of MVREF. 4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD. Table 13 provides the DDR2 capacitance when GVDD(typ) = 1.8 V. Table 13. DDR2 SDRAM Capacitance for GVDD(typ) = 1.8 V Parameter/Condition Input/output capacitance: DQ, DQS, DQS Delta input/output capacitance: DQ, DQS, DQS Symbol CIO CDIO Min 6 — Max 8 0.5 Unit pF pF Notes 1 1 Note: 1. This parameter is sampled. GVDD = 1.8 V ± 0.090 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V. Table 14 provides the recommended operating conditions for the DDR SDRAM component(s) when GVDD(typ) = 2.5 V. Table 14. DDR SDRAM DC Electrical Characteristics for GVDD(typ) = 2.5 V Parameter/Condition I/O supply voltage I/O reference voltage I/O termination voltage Input high voltage Input low voltage Output leakage current Output high current (VOUT = 1.95 V) Symbol GVDD MVREF VTT VIH VIL IOZ IOH Min 2.375 0.49 × GVDD MVREF – 0.04 MVREF + 0.18 –0.3 –9.9 –15.2 Max 2.625 0.51 × GVDD MVREF + 0.04 GVDD + 0.3 MVREF – 0.18 –9.9 — Unit V V V V V μA mA Notes 1 2 3 — — 4 — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 15 DDR and DDR2 SDRAM Table 14. DDR SDRAM DC Electrical Characteristics for GVDD(typ) = 2.5 V Output low current (VOUT = 0.35 V) IOL 15.2 — mA — Notes: 1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times. 2. MVREF is expected to be equal to 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak noise on MVREF may not exceed ±2% of the DC value. 3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be equal to MVREF. This rail should track variations in the DC level of MVREF. 4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD. Table 15 provides the DDR capacitance when GVDD(typ) = 2.5 V. Table 15. DDR SDRAM Capacitance for GVDD(typ) = 2.5 V Parameter/Condition Input/output capacitance: DQ, DQS Delta input/output capacitance: DQ, DQS Symbol CIO CDIO Min 6 — Max 8 0.5 Unit pF pF Notes 1 1 Note: 1. This parameter is sampled. GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V. Table 16 provides the current draw characteristics for MVREF. Table 16. Current Draw Characteristics for MVREF Parameter/Condition Current draw for MVREF Symbol IMVREF Min — Max 500 Unit μA Note 1 Note: 1. The voltage regulator for MVREF must supply up to 500 μA current. 6.2 DDR and DDR2 SDRAM AC Electrical Characteristics This section provides the AC electrical characteristics for the DDR and DDR2 SDRAM interface. 6.2.1 DDR and DDR2 SDRAM Input AC Timing Specifications Table 17. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface Table 17 provides the input AC timing specifications for the DDR2 SDRAM when GVDD(typ) = 1.8 V. At recommended operating conditions with GVDD of 1.8 ± 5%. Parameter AC input low voltage AC input high voltage Symbol VIL VIH Min — MVREF + 0.25 Max MVREF – 0.25 — Unit V V Notes — — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 16 Freescale Semiconductor DDR and DDR2 SDRAM Table 18 provides the input AC timing specifications for the DDR SDRAM when GVDD(typ) = 2.5 V. Table 18. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface At recommended operating conditions with GVDD of 2.5 ± 5%. Parameter AC input low voltage AC input high voltage Symbol VIL VIH Min — MVREF + 0.31 Max MVREF – 0.31 — Unit V V Notes — — Table 19 provides the input AC timing specifications for the DDR SDRAM interface. Table 19. DDR and DDR2 SDRAM Input AC Timing Specifications At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%. Parameter Controller Skew for MDQS—MDQ/MECC/MDM 400 MHz 333 MHz 266 MHz 200 MHz Symbol tCISKEW Min Max Unit ps Notes 1, 2 3 — — — –600 –750 –750 –750 600 750 750 750 Notes: 1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that will be captured with MDQS[n]. This should be subtracted from the total timing budget. 2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW. This can be determined by the equation: tDISKEW = ± (T/4 – abs (tCISKEW)); where T is the clock period and abs (tCISKEW) is the absolute value of tCISKEW. 3. This specification applies only to the DDR interface. Figure 4 illustrates the DDR input timing diagram showing the tDISKEW timing parameter. MCK[n] MCK[n] tMCK MDQS[n] MDQ[x] tDISKEW D0 D1 tDISKEW Figure 4. DDR Input Timing Diagram MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 17 DDR and DDR2 SDRAM 6.2.2 DDR and DDR2 SDRAM Output AC Timing Specifications Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications Table 20 shows the DDR and DDR2 output AC timing specifications. At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%. Parameter MCK[n] cycle time, (MCK[n]/MCK[n] crossing) ADDR/CMD/MODT output setup with respect to MCK 400 MHz 333 MHz 266 MHz 200 MHz ADDR/CMD/MODT output hold with respect to MCK 400 MHz 333 MHz 266 MHz 200 MHz MCS(n) output setup with respect to MCK 400 MHz 333 MHz 266 MHz 200 MHz MCS(n) output hold with respect to MCK 400 MHz 333 MHz 266 MHz 200 MHz MCK to MDQS Skew MDQ/MECC/MDM output setup with respect to MDQS 400 MHz 333 MHz 266 MHz 200 MHz MDQ/MECC/MDM output hold with respect to MDQS 400 MHz 333 MHz 266 MHz 200 MHz Symbol 1 tMCK tDDKHAS Min 7.5 Max 10 Unit ns ns Notes 2 3 1.95 2.40 3.15 4.20 tDDKHAX 1.95 2.40 3.15 4.20 tDDKHCS 1.95 2.40 3.15 4.20 tDDKHCX 1.95 2.40 3.15 4.20 tDDKHMH tDDKHDS, tDDKLDS 700 775 1100 1200 tDDKHDX, tDDKLDX 700 900 1100 1200 –0.6 — — — — ns — — — — ns — — — — ns — — — — 0.6 ns ps — — — — ps — — — — 5 4 5 3 3 3 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 18 Freescale Semiconductor DDR and DDR2 SDRAM Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications (continued) At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%. Parameter MDQS preamble start MDQS epilogue end Symbol 1 tDDKHMP tDDKHME Min –0.5 × tMCK – 0.6 –0.6 Max –0.5 × tMCK + 0.6 0.6 Unit ns ns Notes 6 6 Notes: 1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output goes invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs (A) are set up (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data output hold time. 2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V. 3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. For the ADDR/CMD setup and hold specifications, it is assumed that the clock control register is set to adjust the memory clocks by 1/2 applied cycle. 4. tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD) from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control of the DQSS override bits in the TIMING_CFG_2 register and is typically set to the same delay as the clock adjust in the CLK_CNTL register. The timing parameters listed in the table assume that these two parameters are set to the same adjustment value. See the MPC8349EA PowerQUICC II Pro Integrated Host Processor Family Reference Manual for the timing modifications enabled by use of these bits. 5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC (MECC), or data mask (MDM). The data strobe should be centered inside the data eye at the pins of the microprocessor. 6. All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that tDDKHMP follows the symbol conventions described in note 1. Figure 5 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH). MCK[n] MCK[n] tMCK tDDKHMHmax) = 0.6 ns MDQS tDDKHMH(min) = –0.6 ns MDQS Figure 5. Timing Diagram for tDDKHMH MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 19 DUART Figure 6 shows the DDR SDRAM output timing diagram. MCK[n] MCK[n] tMCK tDDKHAS,tDDKHCS tDDKHAX,tDDKHCX ADDR/CMD/MODT Write A0 tDDKHMP tDDKHMH MDQS[n] tDDKHDS tDDKLDS MDQ[x] tDDKHDX D0 D1 tDDKLDX tDDKHME NOOP Figure 6. DDR SDRAM Output Timing Diagram Figure 7 provides the AC test load for the DDR bus. Output Z0 = 50 Ω RL = 50 Ω GVDD/2 Figure 7. DDR AC Test Load 7 DUART This section describes the DC and AC electrical specifications for the DUART interface of the MPC8343EA. 7.1 DUART DC Electrical Characteristics Table 21. DUART DC Electrical Characteristics Parameter Symbol VIH VIL IIN Min 2 –0.3 — Max OVDD + 0.3 0.8 ±5 Unit V V μA Table 21 provides the DC electrical characteristics for the DUART interface of the MPC8343EA. High-level input voltage Low-level input voltage Input current (0.8 V ≤ VIN ≤ 2 V) MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 20 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management Table 21. DUART DC Electrical Characteristics (continued) Parameter High-level output voltage, IOH = –100 μA Low-level output voltage, IOL = 100 μA Symbol VOH VOL Min OVDD – 0.2 — Max — 0.2 Unit V V 7.2 DUART AC Electrical Specifications Table 22. DUART AC Timing Specifications Parameter Value 256 > 1,000,000 16 Unit baud baud — Notes — 1 2 Table 22 provides the AC timing parameters for the DUART interface of the MPC8343EA. Minimum baud rate Maximum baud rate Oversample rate Notes: 1. Actual attainable baud rate will be limited by the latency of interrupt processing. 2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are sampled each 16th sample. 8 Ethernet: Three-Speed Ethernet, MII Management This section provides the AC and DC electrical characteristics for three-speeds (10/100/1000 Mbps) and MII management. 8.1 Three-Speed Ethernet Controller (TSEC)—MII/RGMII/RTBI Electrical Characteristics The electrical characteristics specified here apply to the media independent interface (MII), reduced gigabit media independent interface (RGMII), and reduced ten-bit interface (RTBI) signals except management data input/output (MDIO) and management data clock (MDC). The MII interface is defined for 3.3 V, and the RGMII and RTBI interfaces are defined for 2.5 V. The RGMII and RTBI interfaces follow the Hewlett-Packard Reduced Pin-Count Interface for Gigabit Ethernet Physical Layer Device Specification, Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in Section 8.3, “Ethernet Management Interface Electrical Characteristics.” MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 21 Ethernet: Three-Speed Ethernet, MII Management 8.1.1 TSEC DC Electrical Characteristics MII, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes specified in Table 23 and Table 24. The RGMII and RTBI signals in Table 24 are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5. Table 23. MII DC Electrical Characteristics Parameter Supply voltage 3.3 V Output high voltage Output low voltage Input high voltage Input low voltage Input high current Input low current Symbol LVDD2 VOH VOL VIH VIL IIH IIL IOH = –4.0 mA IOL = 4.0 mA — — VIN1 = LVDD VIN 1= Conditions — LVDD = Min LVDD = Min — — Min 2.97 2.40 GND 2.0 –0.3 — –600 Max 3.63 LVDD + 0.3 0.50 LVDD + 0.3 0.90 40 — Unit V V V V V μA μA GND Notes: 1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. 2. MII pins not needed for RGMII or RTBI operation are powered by the OVDD supply. Table 24. RGMII/RTBI (When Operating at 2.5 V) DC Electrical Characteristics Parameters Supply voltage 2.5 V Output high voltage Output low voltage Input high voltage Input low voltage Input high current Input low current Symbol LVDD VOH VOL VIH VIL IIH IIL IOH = –1.0 mA IOL = 1.0 mA — — VIN 1= 1= Conditions — LVDD = Min LVDD = Min LVDD = Min LVDD = Min LVDD GND Min 2.37 2.00 GND – 0.3 1.7 –0.3 — –15 Max 2.63 LVDD + 0.3 0.40 LVDD + 0.3 0.70 10 — Unit V V V V V μA μA VIN Note: 1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 22 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management 8.2 MII, RGMII, and RTBI AC Timing Specifications The AC timing specifications for MII, RGMII, and RTBI are presented in this section. 8.2.1 MII AC Timing Specifications This section describes the MII transmit and receive AC timing specifications. 8.2.1.1 MII Transmit AC Timing Specifications Table 25. MII Transmit AC Timing Specifications Table 25 provides the MII transmit AC timing specifications. At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%. Parameter/Condition TX_CLK clock period 10 Mbps TX_CLK clock period 100 Mbps TX_CLK duty cycle TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay TX_CLK data clock rise (20%–80%) TX_CLK data clock fall (80%–20%) Symbol1 tMTX tMTX tMTXH/tMTX tMTKHDX tMTXR tMTXF Min — — 35 1 1.0 1.0 Typ 400 40 — 5 — — Max — — 65 15 4.0 4.0 Unit ns ns % ns ns ns Note: 1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). In general, the clock reference symbol is based on two to three letters representing the clock of a particular function. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 8 shows the MII transmit AC timing diagram. tMTX TX_CLK tMTXH TXD[3:0] TX_EN TX_ER tMTKHDX tMTXF tMTXR Figure 8. MII Transmit AC Timing Diagram MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 23 Ethernet: Three-Speed Ethernet, MII Management 8.2.1.2 MII Receive AC Timing Specifications Table 26. MII Receive AC Timing Specifications Table 26 provides the MII receive AC timing specifications. At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%. Parameter/Condition RX_CLK clock period 10 Mbps RX_CLK clock period 100 Mbps RX_CLK duty cycle RXD[3:0], RX_DV, RX_ER setup time to RX_CLK RXD[3:0], RX_DV, RX_ER hold time to RX_CLK RX_CLK clock rise (20%–80%) RX_CLK clock fall time (80%–20%) Symbol1 tMRX tMRX tMRXH/tMRX tMRDVKH tMRDXKH tMRXR tMRXF Min — — 35 10.0 10.0 1.0 1.0 Typ 400 40 — — — — — Max — — 65 — — 4.0 4.0 Unit ns ns % ns ns ns ns Note: 1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. In general, the clock reference symbol is based on three letters representing the clock of a particular function. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 9 provides the AC test load for TSEC. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 9. TSEC AC Test Load Figure 10 shows the MII receive AC timing diagram. tMRX RX_CLK tMRXH RXD[3:0] RX_DV RX_ER tMRXF Valid Data tMRDVKH tMRDXKH tMRXR Figure 10. MII Receive AC Timing Diagram MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 24 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management 8.2.2 RGMII and RTBI AC Timing Specifications Table 27. RGMII and RTBI AC Timing Specifications Table 27 presents the RGMII and RTBI AC timing specifications. At recommended operating conditions with LVDD of 2.5 V ± 5%. Parameter/Condition Data to clock output skew (at transmitter) Data to clock input skew (at receiver) Clock cycle duration3 4, 5 3, 5 2 Symbol1 tSKRGT tSKRGT tRGT tRGTH/tRGT tRGTH/tRGT tRGTR tRGTF tG12 6 Min –0.5 1.0 7.2 45 40 — — — 47 Typ — — 8.0 50 50 — — 8.0 — Max 0.5 2.8 8.8 55 60 0.75 0.75 — 53 Unit ns ns ns % % ns ns ns % Duty cycle for 1000Base-T Duty cycle for 10BASE-T and 100BASE-TX Rise time (20%–80%) Fall time (80%–20%) GTX_CLK125 reference clock period GTX_CLK125 reference clock duty cycle tG125H/tG125 Notes: 1. In general, the clock reference symbol for this section is based on the symbols RGT to represent RGMII and RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Also, the notation for rise (R) and fall (F) times follows the clock symbol. For symbols representing skews, the subscript is SK followed by the clock being skewed (RGT). 2. This implies that PC board design requires clocks to be routed so that an additional trace delay of greater than 1.5 ns is added to the associated clock signal. 3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively. 4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet clock domains as long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned. 5. Duty cycle reference is LVDD/2. 6. This symbol represents the external GTX_CLK125 and does not follow the original symbol naming convention. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 25 Ethernet: Three-Speed Ethernet, MII Management Figure 11 shows the RBMII and RTBI AC timing and multiplexing diagrams. tRGT tRGTH GTX_CLK (At Transmitter) tSKRGT TXD[8:5][3:0] TXD[7:4][3:0] TX_CTL TXD[8:5] TXD[3:0] TXD[7:4] TXD[4] TXEN TXD[9] TXERR tSKRGT TX_CLK (At PHY) RXD[8:5][3:0] RXD[7:4][3:0] RX_CTL RXD[8:5] RXD[3:0] RXD[7:4] tSKRGT RXD[4] RXDV RXD[9] RXERR tSKRGT RX_CLK (At PHY) Figure 11. RGMII and RTBI AC Timing and Multiplexing Diagrams 8.3 Ethernet Management Interface Electrical Characteristics The electrical characteristics specified here apply to the MII management interface signals management data input/output (MDIO) and management data clock (MDC). The electrical characteristics for GMII, RGMII, TBI and RTBI are specified in Section 8.1, “Three-Speed Ethernet Controller (TSEC)—MII/RGMII/RTBI Electrical Characteristics.” 8.3.1 MII Management DC Electrical Characteristics The MDC and MDIO are defined to operate at a supply voltage of 2.5 or 3.3 V. The DC electrical characteristics for MDIO and MDC are provided in Table 28 and Table 29. Table 28. MII Management DC Electrical Characteristics Powered at 2.5 V Parameter Supply voltage (2.5 V) Output high voltage Output low voltage Input high voltage Input low voltage Symbol LVDD VOH VOL VIH VIL Conditions — IOH = –1.0 mA IOL = 1.0 mA — — LVDD = Min LVDD = Min LVDD = Min LVDD = Min Min 2.37 2.00 GND – 0.3 1.7 –0.3 Max 2.63 LVDD + 0.3 0.40 — 0.70 Unit V V V V V MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 26 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management Table 28. MII Management DC Electrical Characteristics Powered at 2.5 V (continued) Parameter Input high current Input low current Symbol IIH IIL Conditions VIN1 = LVDD VIN = LVDD Min — –15 Max 10 — Unit μA μA Note: 1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. Table 29. MII Management DC Electrical Characteristics Powered at 3.3 V Parameter Supply voltage (3.3 V) Output high voltage Output low voltage Input high voltage Input low voltage Input high current Input low current Symbol LVDD VOH VOL VIH VIL IIH IIL LVDD = Max LVDD = Max IOH = –1.0 mA IOL = 1.0 mA — — VIN1 = 2.1 V Conditions — LVDD = Min LVDD = Min Min 2.97 2.10 GND 2.00 — — –600 Max 3.63 LVDD + 0.3 0.50 — 0.80 40 — Unit V V V V V μA μA VIN = 0.5 V Note: 1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. 8.3.2 MII Management AC Electrical Specifications Table 30. MII Management AC Timing Specifications Table 30 provides the MII management AC timing specifications. At recommended operating conditions with LVDD is 3.3 V ± 10% or 2.5 V ± 5%. Parameter/Condition MDC frequency MDC period MDC clock pulse width high MDC to MDIO delay MDIO to MDC setup time MDIO to MDC hold time MDC rise time Symbol1 fMDC tMDC tMDCH tMDKHDX tMDDVKH tMDDXKH tMDCR Min — — 32 10 5 0 — Typ 2.5 400 — — — — — Max — — — 170 — — 10 Unit MHz ns ns ns ns ns ns Notes 2 — — 3 — — — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 27 Ethernet: Three-Speed Ethernet, MII Management Table 30. MII Management AC Timing Specifications (continued) At recommended operating conditions with LVDD is 3.3 V ± 10% or 2.5 V ± 5%. Parameter/Condition MDC fall time Symbol1 tMDHF Min — Typ — Max 10 Unit ns Notes — Notes: 1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. This parameter is dependent on the csb_clk speed (that is, for a csb_clk of 267 MHz, the maximum frequency is 8.3 MHz and the minimum frequency is 1.2 MHz; for a csb_clk of 375 MHz, the maximum frequency is 11.7 MHz and the minimum frequency is 1.7 MHz). 3. This parameter is dependent on the csb_clk speed (that is, for a csb_clk of 267 MHz, the delay is 70 ns and for a csb_clk of 333 MHz, the delay is 58 ns). Figure 12 shows the MII management AC timing diagram. tMDC MDC tMDCH MDIO (Input) tMDDVKH tMDDXKH MDIO (Output) tMDKHDX tMDCF tMDCR Figure 12. MII Management Interface Timing Diagram MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 28 Freescale Semiconductor USB 9 9.1 USB USB DC Electrical Characteristics Table 31. USB DC Electrical Characteristics Parameter Symbol VIH VIL IIN VOH VOL Min 2 –0.3 — OVDD – 0.2 — Max OVDD + 0.3 0.8 ±5 — 0.2 Unit V V μA V V This section provides the AC and DC electrical specifications for the USB interface of the MPC8343EA. Table 31 provides the DC electrical characteristics for the USB interface. High-level input voltage Low-level input voltage Input current High-level output voltage, IOH = –100 μA Low-level output voltage, IOL = 100 μA 9.2 USB AC Electrical Specifications Table 32. USB General Timing Parameters (ULPI Mode Only) Parameter Symbol1 tUSCK tUSIVKH tUSIXKH tUSKHOV tUSKHOX Min 15 4 1 — 2 Max — — — 7 — Unit ns ns ns ns ns Notes 2–5 2–5 2–5 2–5 2–5 Table 32 describes the general timing parameters of the USB interface of the MPC8343EA. USB clock cycle time Input setup to USB clock—all inputs Input hold to USB clock—all inputs USB clock to output valid—all outputs Output hold from USB clock—all outputs Notes: 1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUSIXKH symbolizes USB timing (US) for the input (I) to go invalid (X) with respect to the time the USB clock reference (K) goes high (H). Also, tUSKHOX symbolizes USB timing (US) for the USB clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. 2. All timings are in reference to USB clock. 3. All signals are measured from OVDD/2 of the rising edge of the USB clock to 0.4 × OVDD of the signal in question for 3.3 V signaling levels. 4. Input timings are measured at the pin. 5. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the component pin is less than or equal to that of the leakage current specification. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 29 Local Bus Figure 13 and Figure 14 provide the AC test load and signals for the USB, respectively. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 13. USB AC Test Load USB0_CLK/USB1_CLK/DR_CLK tUSIVKH Input Signals tUSIXKH tUSKHOV Output Signals: tUSKHOX Figure 14. USB Signals 10 Local Bus This section describes the DC and AC electrical specifications for the local bus interface of the MPC8343EA. 10.1 Local Bus DC Electrical Characteristics Table 33. Local Bus DC Electrical Characteristics Parameter Symbol VIH VIL IIN VOH VOL Min 2 –0.3 — OVDD – 0.2 — Max OVDD + 0.3 0.8 ±5 — 0.2 Unit V V μA V V Table 33 provides the DC electrical characteristics for the local bus interface. High-level input voltage Low-level input voltage Input current High-level output voltage, IOH = –100 μA Low-level output voltage, IOL = 100 μA MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 30 Freescale Semiconductor Local Bus 10.2 Local Bus AC Electrical Specification Table 34 and Table 35 describe the general timing parameters of the local bus interface of the MPC8343EA. Table 34. Local Bus General Timing Parameters—DLL On Parameter Local bus cycle time Input setup to local bus clock (except LUPWAIT) LUPWAIT input setup to local bus clock Input hold from local bus clock (except LUPWAIT) LUPWAIT Input hold from local bus clock LALE output fall to LAD output transition (LATCH hold time) LALE output fall to LAD output transition (LATCH hold time) LALE output fall to LAD output transition (LATCH hold time) Local bus clock to LALE rise Local bus clock to output valid (except LAD/LDP and LALE) Local bus clock to data valid for LAD/LDP Local bus clock to address valid for LAD Output hold from local bus clock (except LAD/LDP and LALE) Output hold from local bus clock for LAD/LDP Local bus clock to output high impedance for LAD/LDP Symbol1 tLBK tLBIVKH1 tLBIVKH2 tLBIXKH1 tLBIXKH2 tLBOTOT1 tLBOTOT2 tLBOTOT3 tLBKHLR tLBKHOV1 tLBKHOV2 tLBKHOV3 tLBKHOX1 tLBKHOX2 tLBKHOZ Min 7.5 1.5 2.2 1.0 1.0 1.5 3 2.5 — — — — 1 1 — Max — — — — — — — — 4.5 4.5 4.5 4.5 — — 3.8 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Notes 2 3, 4 3, 4 3, 4 3, 4 5 6 7 — — 3 3 3 3 8 Notes: 1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one (1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. 2. All timings are in reference to the rising edge of LSYNC_IN. 3. All signals are measured from OVDD/2 of the rising edge of LSYNC_IN to 0.4 × OVDD of the signal in question for 3.3 V signaling levels. 4. Input timings are measured at the pin. 5. tLBOTOT1 should be used when RCWH[LALE] is not set and when the load on the LALE output pin is at least 10 pF less than the load on the LAD output pins. 6. tLBOTOT2 should be used when RCWH[LALE] is set and when the load on the LALE output pin is at least 10 pF less than the load on the LAD output pins. 7. tLBOTOT3 should be used when RCWH[LALE] is set and when the load on the LALE output pin equals the load on the LAD output pins. 8. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the component pin is less than or equal to that of the leakage current specification. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 31 Local Bus Table 35. Local Bus General Timing Parameters—DLL Bypass9 Parameter Local bus cycle time Input setup to local bus clock Input hold from local bus clock LALE output fall to LAD output transition (LATCH hold time) LALE output fall to LAD output transition (LATCH hold time) LALE output fall to LAD output transition (LATCH hold time) Local bus clock to output valid Local bus clock to output high impedance for LAD/LDP Symbol1 tLBK tLBIVKH tLBIXKH tLBOTOT1 tLBOTOT2 tLBOTOT3 tLBKLOV tLBKHOZ Min 15 7 1.0 1.5 3 2.5 — — Max — — — — — — 3 4 Unit ns ns ns ns ns ns ns ns Notes 2 3, 4 3, 4 5 6 7 3 8 Notes: 1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one (1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. 2. All timings are in reference to the falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or the rising edge of LCLK0 (for all other inputs). 3. All signals are measured from OVDD/2 of the rising/falling edge of LCLK0 to 0.4 × OVDD of the signal in question for 3.3 V signaling levels. 4. Input timings are measured at the pin. 5. tLBOTOT1 should be used when RCWH[LALE] is set and when the load on the LALE output pin is at least 10 pF less than the load on the LAD output pins. 6. tLBOTOT2 should be used when RCWH[LALE] is not set and when the load on the LALE output pin is at least 10 pF less than the load on the LAD output pins.the 7. tLBOTOT3 should be used when RCWH[LALE] is not set and when the load on the LALE output pin equals to the load on the LAD output pins. 8. For purposes of active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 9. DLL bypass mode is not recommended for use at frequencies above 66 MHz. Figure 15 provides the AC test load for the local bus. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 15. Local Bus C Test Load MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 32 Freescale Semiconductor Local Bus Figure 16 through Figure 21 show the local bus signals. LSYNC_IN tLBIVKH Input Signals: LAD[0:31]/LDP[0:3] tLBIXKH Output Signals: LSDA10/LSDWE/LSDRAS/ LSDCAS/LSDDQM[0:3] LA[27:31]/LBCTL/LBCKE/LOE Output (Data) Signals: LAD[0:31]/LDP[0:3] tLBKHOV Output (Address) Signal: LAD[0:31] tLBKHLR LALE tLBOTOT tLBKHOZ tLBKHOX tLBKHOV tLBIXKH tLBKHOV tLBKHOZ tLBKHOX Figure 16. Local Bus Signals, Nonspecial Signals Only (DLL Enabled) LCLK[n] tLBIVKH tLBIXKH tLBIVKH tLBKLOV tLBIXKH Input Signals: LAD[0:31]/LDP[0:3] Input Signal: LGTA Output Signals: LSDA10/LSDWE/LSDRAS/ LSDCAS/LSDDQM[0:3] LA[27:31]/LBCTL/LBCKE/LOE Output Signals: LAD[0:31]/LDP[0:3] LALE tLBKLOV tLBKHOZ tLBKLOV tLBOTOT Figure 17. Local Bus Signals, Nonspecial Signals Only (DLL Bypass Mode) MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 33 Local Bus LSYNC_IN T1 T3 tLBKHOV1 GPCM Mode Output Signals: LCS[0:7]/LWE tLBIVKH2 UPM Mode Input Signal: LUPWAIT tLBIVKH1 Input Signals: LAD[0:31]/LDP[0:3] tLBKHOV1 UPM Mode Output Signals: LCS[0:7]/LBS[0:3]/LGPL[0:5] tLBKHOZ1 tLBIXKH1 tLBIXKH2 tLBKHOZ1 Figure 18. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 (DLL Enabled) LCLK T1 T3 tLBKLOV GPCM Mode Output Signals: LCS[0:7]/LWE tLBIVKH UPM Mode Input Signal: LUPWAIT Input Signals: LAD[0:31]/LDP[0:3] (DLL Bypass Mode) tLBKLOV UPM Mode Output Signals: LCS[0:7]/LBS[0:3]/LGPL[0:5] tLBIVKH tLBIXKH tLBIXKH tLBKHOZ tLBKHOZ Figure 19. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 (DLL Bypass Mode) MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 34 Freescale Semiconductor Local Bus LCLK T1 T2 T3 T4 tLBKLOV GPCM Mode Output Signals: LCS[0:7]/LWE tLBIVKH UPM Mode Input Signal: LUPWAIT Input Signals: LAD[0:31]/LDP[0:3] (DLL Bypass Mode) tLBKLOV UPM Mode Output Signals: LCS[0:7]/LBS[0:3]/LGPL[0:5] tLBIVKH tLBIXKH tLBIXKH tLBKHOZ tLBKHOZ Figure 20. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (DLL Bypass Mode) MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 35 JTAG LSYNC_IN T1 T2 T3 T4 tLBKHOV1 GPCM Mode Output Signals: LCS[0:3]/LWE tLBIVKH2 UPM Mode Input Signal: LUPWAIT tLBIVKH1 Input Signals: LAD[0:31]/LDP[0:3] tLBKHOV1 UPM Mode Output Signals: LCS[0:3]/LBS[0:3]/LGPL[0:5] tLBKHOZ1 tLBIXKH1 tLBIXKH2 tLBKHOZ1 Figure 21. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (DLL Enabled) 11 JTAG This section describes the DC and AC electrical specifications for the IEEE Std. 1149.1 (JTAG) interface of the MPC8343EA. 11.1 JTAG DC Electrical Characteristics Table 36 provides the DC electrical characteristics for the IEEE Std. 1149.1 (JTAG) interface of the MPC8343EA. Table 36. JTAG Interface DC Electrical Characteristics Parameter Input high voltage Input low voltage Input current Output high voltage Symbol VIH VIL IIN VOH Condition — — — IOH = –8.0 mA Min OVDD – 0.3 –0.3 — 2.4 Max OVDD + 0.3 0.8 ±5 — Unit V V μA V MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 36 Freescale Semiconductor JTAG Table 36. JTAG Interface DC Electrical Characteristics (continued) Parameter Output low voltage Output low voltage Symbol VOL VOL Condition IOL = 8.0 mA IOL = 3.2 mA Min — — Max 0.5 0.4 Unit V V 11.2 JTAG AC Timing Specifications This section describes the AC electrical specifications for the IEEE Std. 1149.1 (JTAG) interface of the MPC8343EA. Table 37 provides the JTAG AC timing specifications as defined in Figure 23 through Figure 26. Table 37. JTAG AC Timing Specifications (Independent of CLKIN)1 At recommended operating conditions (see Table 2). Parameter JTAG external clock frequency of operation JTAG external clock cycle time JTAG external clock pulse width measured at 1.4 V JTAG external clock rise and fall times TRST assert time Input setup times: Boundary-scan data TMS, TDI Input hold times: Boundary-scan data TMS, TDI Valid times: Boundary-scan data TDO Output hold times: Boundary-scan data TDO Symbol2 fJTG t JTG tJTKHKL tJTGR, tJTGF tTRST tJTDVKH tJTIVKH tJTDXKH tJTIXKH tJTKLDV tJTKLOV tJTKLDX tJTKLOX Min 0 30 15 0 25 4 4 10 10 2 2 2 2 Max 33.3 — — 2 — — — Unit MHz ns ns ns ns ns Notes — — — — 3 4 ns — — ns 11 11 ns — — 5 5 4 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 37 JTAG Table 37. JTAG AC Timing Specifications (Independent of CLKIN)1 (continued) At recommended operating conditions (see Table 2). Parameter JTAG external clock to output high impedance: Boundary-scan data TDO Symbol2 Min Max Unit ns Notes tJTKLDZ tJTKLOZ 2 2 19 9 5, 6 Notes: 1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50 Ω load (see Figure 13). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system. 2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. In general, the clock reference symbol is based on three letters representing the clock of a particular function. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only. 4. Non-JTAG signal input timing with respect to tTCLK. 5. Non-JTAG signal output timing with respect to tTCLK. 6. Guaranteed by design and characterization. Figure 22 provides the AC test load for TDO and the boundary-scan outputs of the MPC8343EA. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 22. AC Test Load for the JTAG Interface Figure 23 provides the JTAG clock input timing diagram. JTAG External Clock VM tJTKHKL tJTG VM = Midpoint Voltage (OVDD/2) VM VM tJTGR tJTGF Figure 23. JTAG Clock Input Timing Diagram Figure 24 provides the TRST timing diagram. TRST VM tTRST VM = Midpoint Voltage (OVDD/2) VM Figure 24. TRST Timing Diagram MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 38 Freescale Semiconductor JTAG Figure 25 provides the boundary-scan timing diagram. JTAG External Clock VM tJTDVKH tJTDXKH Boundary Data Inputs tJTKLDV tJTKLDX Boundary Data Outputs tJTKLDZ Boundary Data Outputs Output Data Valid VM = Midpoint Voltage (OVDD/2) Output Data Valid Input Data Valid VM Figure 25. Boundary-Scan Timing Diagram Figure 26 provides the test access port timing diagram. JTAG External Clock VM tJTIVKH tJTIXKH TDI, TMS tJTKLOV tJTKLOX TDO tJTKLOZ TDO Output Data Valid VM = Midpoint Voltage (OVDD/2) Output Data Valid Input Data Valid VM Figure 26. Test Access Port Timing Diagram MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 39 I2 C 12 I2C This section describes the DC and AC electrical characteristics for the I2C interface of the MPC8343EA. 12.1 I2C DC Electrical Characteristics Table 38. I2C DC Electrical Characteristics Table 38 provides the DC electrical characteristics for the I2C interface of the MPC8343EA. At recommended operating conditions with OVDD of 3.3 V ± 10%. Parameter Input high voltage level Input low voltage level Low level output voltage Output fall time from VIH(min) to VIL(max) with a bus capacitance from 10 to 400 pF Pulse width of spikes which must be suppressed by the input filter Input current each I/O pin (input voltage is between 0.1 × OVDD and 0.9 × OVDD(max) Capacitance for each I/O pin Symbol VIH VIL VOL tI2KLKV tI2KHKL II CI Min 0.7 × OVDD –0.3 0 20 + 0.1 × CB 0 –10 — Max OVDD + 0.3 0.3 × OVDD 0.2 × OVDD 250 50 10 10 Unit V V V ns ns μA pF Notes 1 2 3 4 Notes: 1. Output voltage (open drain or open collector) condition = 3 mA sink current. 2. CB = capacitance of one bus line in pF. 3. Refer to the MPC8349EA Integrated Host Processor Family Reference Manual, for information on the digital filter used. 4. I/O pins obstruct the SDA and SCL lines if OVDD is switched off. 12.2 I2C AC Electrical Specifications Table 39 provides the AC timing parameters for the I2C interface of the MPC8343EA. Note that all values refer to VIH(min) and VIL(max) levels (see Table 38). Table 39. I2C AC Electrical Specifications Parameter SCL clock frequency Low period of the SCL clock High period of the SCL clock Setup time for a repeated START condition Hold time (repeated) START condition (after this period, the first clock pulse is generated) Data setup time Data hold time:CBUS compatible masters I2C bus devices Symbol1 fI2C tI2CL tI2CH tI2SVKH tI2SXKL tI2DVKH tI2DXKL Min 0 1.3 0.6 0.6 0.6 100 — 02 Max 400 — — — — — — 0.93 Unit kHz μs μs μs μs ns μs MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 40 Freescale Semiconductor I2 C Table 39. I2C AC Electrical Specifications (continued) Parameter Fall time of both SDA and SCL signals5 Setup time for STOP condition Bus free time between a STOP and START condition Noise margin at the LOW level for each connected device (including hysteresis) Noise margin at the HIGH level for each connected device (including hysteresis) Symbol1 tI2CF tI2PVKH tI2KHDX VNL VNH Min __ Max 300 — — — — Unit ns μs μs V V 0.6 1.3 0.1 × OVDD 0.2 × OVDD Notes: 1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2) with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition (S) goes invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C timing (I2) for the time that the data with respect to the stop condition (P) reaches the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. The device provides a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL. 3. The maximum tI2DVKH must be met only if the device does not stretch the LOW period (tI2CL) of the SCL signal. 4. CB = capacitance of one bus line in pF. 5.)The device does not follow the “I2C-BUS Specifications” version 2.1 regarding the tI2CF AC parameter. Figure 27 provides the AC test load for the I2C. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 27. I2C AC Test Load Figure 28 shows the AC timing diagram for the I2C bus. SDA tI2CF tI2CL SCL tI2SXKL S tI2DXKL 2 tI2DVKH tI2SXKL tI2KHKL tI2CR tI2CF tI2CH Sr tI2SVKH tI2PVKH P S Figure 28. I C Bus AC Timing Diagram MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 41 PCI 13 PCI This section describes the DC and AC electrical specifications for the PCI bus of the MPC8343EA. 13.1 PCI DC Electrical Characteristics Table 40. PCI DC Electrical Characteristics Parameter Symbol VIH VIL IIN VOH VOL Test Condition VOUT ≥ VOH (min) or VOUT ≤ VOL (max) VIN1= 0 V or VIN = OVDD OVDD = min, IOH = –100 μA OVDD = min, IOL = 100 μA Min 2 –0.3 — OVDD – 0.2 — Max OVDD + 0.3 0.8 ±5 — 0.2 Unit V V μA V V Table 40 provides the DC electrical characteristics for the PCI interface of the MPC8343EA. High-level input voltage Low-level input voltage Input current High-level output voltage Low-level output voltage Note: 1. The symbol VIN, in this case, represents the OVIN symbol referenced in Table 1. 13.2 PCI AC Electrical Specifications This section describes the general AC timing parameters of the PCI bus of the MPC8343EA. Note that the PCI_CLK or PCI_SYNC_IN signal is used as the PCI input clock depending on whether the device is configured as a host or agent device. Table 41 provides the PCI AC timing specifications at 66 MHz. Table 41. PCI AC Timing Specifications at 66 MHz1 Parameter Clock to output valid Output hold from clock Clock to output high impedance Input setup to clock Symbol2 tPCKHOV tPCKHOX tPCKHOZ tPCIVKH Min — 1 — 3.0 Max 6.0 — 14 — Unit ns ns ns ns Notes 3 3 3, 4 3, 5 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 42 Freescale Semiconductor PCI Table 41. PCI AC Timing Specifications at 66 MHz1 (continued) Parameter Input hold from clock Symbol2 tPCIXKH Min 0 Max — Unit ns Notes 3, 5 Notes: 1. PCI timing depends on M66EN and the ratio between PCI1/PCI2. Refer to the PCI chapter of the reference manual for a description of M66EN. 2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state. 3. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications. 4. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 5. Input timings are measured at the pin. Table 42 provides the PCI AC timing specifications at 33 MHz. Table 42. PCI AC Timing Specifications at 33 MHz Parameter Clock to output valid Output hold from clock Clock to output high impedance Input setup to clock Input hold from clock Symbol1 tPCKHOV tPCKHOX tPCKHOZ tPCIVKH tPCIXKH Min — 2 — 3.0 0 Max 11 — 14 — — Unit ns ns ns ns ns Notes 2 2 2, 3 2, 4 2, 4 Notes: 1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state. 2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications. 3. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 4. Input timings are measured at the pin. Figure 29 provides the AC test load for PCI. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 29. PCI AC Test Load MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 43 Timers Figure 30 shows the PCI input AC timing diagram. CLK tPCIVKH tPCIXKH Input Figure 30. PCI Input AC Timing Diagram Figure 31 shows the PCI output AC timing diagram. CLK tPCKHOV Output Delay tPCKHOZ High-Impedance Output tPCKHOX Figure 31. PCI Output AC Timing Diagram 14 Timers This section describes the DC and AC electrical specifications for the timers. 14.1 Timer DC Electrical Characteristics Table 43 provides the DC electrical characteristics for the MPC8343EA timer pins, including TIN, TOUT, TGATE, and RTC_CLK. Table 43. Timer DC Electrical Characteristics Parameter Input high voltage Input low voltage Input current Output high voltage Output low voltage Output low voltage Symbol VIH VIL IIN VOH VOL VOL Condition — — — IOH = –8.0 mA IOL = 8.0 mA IOL = 3.2 mA Min 2.0 –0.3 — 2.4 — — Max OVDD + 0.3 0.8 ±5 — 0.5 0.4 Unit V V μA V V V MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 44 Freescale Semiconductor GPIO 14.2 Timer AC Timing Specifications Table 44. Timers Input AC Timing Specifications1 Parameter Symbol2 tTIWID Min 20 Unit ns Table 44 provides the timer input and output AC timing specifications. Timers inputs—minimum pulse width Notes: 1. Input specifications are measured from the 50 percent level of the signal to the 50 percent level of the rising edge of CLKIN. Timings are measured at the pin. 2. Timer inputs and outputs are asynchronous to any visible clock. Timer outputs should be synchronized before use by external synchronous logic. Timer inputs are required to be valid for at least tTIWID ns to ensure proper operation. 15 GPIO This section describes the DC and AC electrical specifications for the GPIO. 15.1 GPIO DC Electrical Characteristics Table 45. GPIO DC Electrical Characteristics PArameter Symbol VIH VIL IIN VOH VOL VOL Condition — — — IOH = –8.0 mA IOL = 8.0 mA IOL = 3.2 mA Min 2.0 –0.3 — 2.4 — — Max OVDD + 0.3 0.8 ±5 — 0.5 0.4 Unit V V μA V V V Table 45 provides the DC electrical characteristics for the MPC8343EA GPIO. Input high voltage Input low voltage Input current Output high voltage Output low voltage Output low voltage 15.2 GPIO AC Timing Specifications Table 46. GPIO Input AC Timing Specifications1 Parameter Symbol2 tPIWID Min 20 Unit ns Table 46 provides the GPIO input and output AC timing specifications. GPIO inputs—minimum pulse width Notes: 1. Input specifications are measured from the 50 percent level of the signal to the 50 percent level of the rising edge of CLKIN. Timings are measured at the pin. 2. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by external synchronous logic. GPIO inputs must be valid for at least tPIWID ns to ensure proper operation. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 45 IPIC 16 IPIC This section describes the DC and AC electrical specifications for the external interrupt pins. 16.1 IPIC DC Electrical Characteristics Table 47. IPIC DC Electrical Characteristics1 Parameter Symbol VIH VIL IIN VOL VOL Condition — — — IOL = 8.0 mA IOL = 3.2 mA Min 2.0 –0.3 — — — Max OVDD + 0.3 0.8 ±5 0.5 0.4 Unit V V μA V V Notes — — — 2 2 Table 47 provides the DC electrical characteristics for the external interrupt pins. Input high voltage Input low voltage Input current Output low voltage Output low voltage Notes: 1. This table applies for pins IRQ[0:7], IRQ_OUT, and MCP_OUT. 2. IRQ_OUT and MCP_OUT are open-drain pins; thus VOH is not relevant for those pins. 16.2 IPIC AC Timing Specifications Table 48. IPIC Input AC Timing Specifications1 Parameter Symbol2 tPICWID Min 20 Unit ns Table 48 provides the IPIC input and output AC timing specifications. IPIC inputs—minimum pulse width Notes: 1. Input specifications are measured at the 50 percent level of the IPIC input signals. Timings are measured at the pin. 2. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by external synchronous logic. IPIC inputs must be valid for at least tPICWID ns to ensure proper operation in edge triggered mode. 17 SPI This section describes the SPI DC and AC electrical specifications. 17.1 SPI DC Electrical Characteristics Table 49. SPI DC Electrical Characteristics Parameter Symbol VIH VIL Condition — — Min 2.0 –0.3 Max OVDD + 0.3 0.8 Unit V V Table 49 provides the SPI DC electrical characteristics. Input high voltage Input low voltage MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 46 Freescale Semiconductor SPI Table 49. SPI DC Electrical Characteristics (continued) Parameter Input current Output high voltage Output low voltage Output low voltage Symbol IIN VOH VOL VOL Condition — IOH = –8.0 mA IOL = 8.0 mA IOL = 3.2 mA Min — 2.4 — — Max ±5 — 0.5 0.4 Unit μA V V V 17.2 SPI AC Timing Specifications Table 50. SPI AC Timing Specifications1 Parameter Symbol2 tNIKHOV tNIKHOX tNEKHOV tNEKHOX tNIIVKH tNIIXKH tNEIVKH tNEIXKH Min — 0.5 — 2 4 0 4 2 Max 6 — 8 — — — — — Unit ns ns ns ns ns ns ns ns Table 50 provides the SPI input and output AC timing specifications. SPI outputs valid—Master mode (internal clock) delay SPI outputs hold—Master mode (internal clock) delay SPI outputs valid—Slave mode (external clock) delay SPI outputs hold—Slave mode (external clock) delay SPI inputs—Master mode (internal clock input setup time SPI inputs—Master mode (internal clock input hold time SPI inputs—Slave mode (external clock) input setup time SPI inputs—Slave mode (external clock) input hold time Notes: 1. Output specifications are measured from the 50 percent level of the rising edge of CLKIN to the 50 percent level of the signal. Timings are measured at the pin. 2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOX symbolizes the internal timing (NI) for the time SPICLK clock reference (K) goes to the high state (H) until outputs (O) are invalid (X). Figure 32 provides the AC test load for the SPI. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 32. SPI AC Test Load MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 47 Package and Pin Listings Figure 33 and Figure 34 represent the AC timings from Table 50. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. Figure 33 shows the SPI timings in slave mode (external clock). SPICLK (Input) tNEIVKH tNEIXKH Input Signals: SPIMOSI (See Note) Output Signals: SPIMISO (See Note) tNEKHOX Note: The clock edge is selectable on SPI. Figure 33. SPI AC Timing in Slave Mode (External Clock) Diagram Figure 34 shows the SPI timings in master mode (internal clock). SPICLK (Output) tNIIVKH tNIIXKH Input Signals: SPIMISO (See Note) Output Signals: SPIMOSI (See Note) tNIKHOX Note: The clock edge is selectable on SPI. Figure 34. SPI AC Timing in Master Mode (Internal Clock) Diagram 18 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8343EA is available in a plastic ball grid array (PBGA). See Section 18.1, “Package Parameters for the MPC8343EA PBGA,” and Section 18.2, “Mechanical Dimensions for the MPC8343EA PBGA.” 18.1 Package Parameters for the MPC8343EA PBGA The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 620 plastic ball grid array (PBGA). Package outline 29 mm × 29 mm Interconnects 620 Pitch 1.00 mm Module height (maximum) 2.46 mm MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 48 Freescale Semiconductor Package and Pin Listings Module height (typical) Module height (minimum) Solder balls Ball diameter (typical) 2.23 mm 2.00 mm 62 Sn/36 Pb/2 Ag (ZQ package) 96.5 Sn/3.5Ag (VR package) 0.60 mm MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 49 Package and Pin Listings 18.2 Mechanical Dimensions for the MPC8343EA PBGA Figure 35 shows the mechanical dimensions and bottom surface nomenclature for the MPC8343EA, 620-PBGA package. Notes: 1. All dimensions are in millimeters. 2. Dimensioning and tolerancing per ASME Y14. 5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. Figure 35. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8343EA PBGA MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 50 Freescale Semiconductor Package and Pin Listings 18.3 Pinout Listings Table 51. MPC8343EA (PBGA) Pinout Listing Signal Package Pin Number PCI Pin Type Power Supply Notes Table 51 provides the pin-out listing for the MPC8343EA, 620-PBGA package. PCI1_INTA/IRQ_OUT PCI1_RESET_OUT PCI1_AD[31:0] D20 B21 E19, D17, A16, A18, B17, B16, D16, B18, E17, E16, A15, C16, D15, D14, C14, A12, D12, B11, C11, E12, A10, C10, A9, E11, E10, B9, B8, D9, A8, C9, D8, C8 A17, A14, A11, B10 D13 B14 A13 E13 C13 B13 C17 C12 B12 A21 C19 C18, A19, E20 B20 C20 B19 A20, E18 L26 DDR SDRAM Memory Interface O O I/O OVDD OVDD OVDD 2 — — PCI1_C/BE[3:0] PCI1_PAR PCI1_FRAME PCI1_TRDY PCI1_IRDY PCI1_STOP PCI1_DEVSEL PCI1_IDSEL PCI1_SERR PCI1_PERR PCI1_REQ[0] PCI1_REQ[1]/CPCI1_HS_ES PCI1_REQ[2:4] PCI1_GNT0 PCI1_GNT1/CPCI1_HS_LED PCI1_GNT2/CPCI1_HS_ENUM PCI1_GNT[3:4] M66EN I/O I/O I/O I/O I/O I/O I/O I I/O I/O I/O I I I/O O O O I OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD — — 5 5 5 5 5 — 5 5 — — — — — — — — MDQ[0:31] AC25, AD27, AD25, AH27, AE28, AD26, AD24, AF27, AF25, AF28, AH24, AG26, AE25, AG25, AH26, AH25, AG22, AH22, AE21, AD19, AE22, AF23, AE19, AG20, AG19, AD17, AE16, AF16, AF18, AG18, AH17, AH16 I/O GVDD — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 51 Package and Pin Listings Table 51. MPC8343EA (PBGA) Pinout Listing (continued) Signal MECC[0:4]/MSRCID[0:4] MECC[5]/MDVAL MECC[6:7] MDM[0:3] MDM[8] MDQS[0:3] MDQS[8] MBA[0:1] MA[0:14] Package Pin Number AG13, AE14, AH12, AH10, AE15 AH14 AE13, AH11 AG28, AG24, AF20, AG17 AG12 AE27, AE26, AE20, AH18 AH13 AF10, AF11 AF13, AF15, AG16, AD16, AF17, AH20, AH19, AH21, AD18, AG21, AD13, AF21, AF22, AE1, AA5 AD10 AF7 AG6 AE7, AH7, AH4, AF2 AG23, AH23 AH15, AE24, AE2, AF14 AG15, AD23, AE3, AG14 AG5, AD4, AH6, AF4 AD22 AG11 AF12 Local Bus Controller Interface LAD[0:31] T4, T5, T1, R2, R3, T2, R1, R4, P1, P2, P3, P4, N1, N4, N2, N3, M1, M2, M3, N5, M4, L1, L2, L3, K1, M5, K2, K3, J1, J2, L5, J3 H1 K5 H2 G1 J4, H3, G2, F1, G3 J5, H4, F2, E1 F3, G4, D1, E2 I/O OVDD — Pin Type I/O I/O I/O O O I/O I/O O O Power Supply GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD Notes — — — — — — — — — MWE MRAS MCAS MCS[0:3] MCKE[0:1] MCK[0:3] MCK[0:3] MODT[0:3] MBA[2] MDIC0 MDIC1 O O O O O O O O O I/O I/O GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD — — — — — — 3 — — — — 9 9 LDP[0]/CKSTOP_OUT LDP[1]/CKSTOP_IN LDP[2]/LCS[4] LDP[3]/LCS[5] LA[27:31] LCS[0:3] LWE[0:3]/LSDDQM[0:3]/LBS[0:3] I/O I/O I/O I/O O O O OVDD OVDD OVDD OVDD OVDD OVDD OVDD — — — — — — — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 52 Freescale Semiconductor Package and Pin Listings Table 51. MPC8343EA (PBGA) Pinout Listing (continued) Signal LBCTL LALE LGPL0/LSDA10/cfg_reset_source0 LGPL1/LSDWE/cfg_reset_source1 LGPL2/LSDRAS/LOE LGPL3/LSDCAS/cfg_reset_source2 LGPL4/LGTA/LUPWAIT/LPBSE LGPL5/cfg_clkin_div LCKE LCLK[0:2] LSYNC_OUT LSYNC_IN Package Pin Number H5 E3 F4 D2 C1 C2 C3 B3 E4 D4, A3, C4 U3 Y2 General Purpose I/O Timers GPIO1[0]/DMA_DREQ0/GTM1_TIN1/ GTM2_TIN2 GPIO1[1]/DMA_DACK0/GTM1_TGATE1/ GTM2_TGATE2 GPIO1[2]/DMA_DDONE0/ GTM1_TOUT1 GPIO1[3]/DMA_DREQ1/GTM1_TIN2/ GTM2_TIN1 GPIO1[4]/DMA_DACK1/ GTM1_TGATE2/GTM2_TGATE1 GPIO1[5]/DMA_DDONE1/ GTM1_TOUT2/GTM2_TOUT1 GPIO1[6]/DMA_DREQ2/GTM1_TIN3/ GTM2_TIN4 GPIO1[7]/DMA_DACK2/GTM1_TGATE3/ GTM2_TGATE4 GPIO1[8]/DMA_DDONE2/ GTM1_TOUT3 GPIO1[9]/DMA_DREQ3/GTM1_TIN4/ GTM2_TIN3 GPIO1[10]/DMA_DACK3/ GTM1_TGATE4/GTM2_TGATE3 GPIO1[11]/DMA_DDONE3/ GTM1_TOUT4/GTM2_TOUT3 D27 E26 D28 G25 J24 F26 E27 E28 H25 F27 K24 G26 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD — — — — — — — — — — — — Pin Type O O I/O I/O O I/O I/O I/O O O O I Power Supply OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD Notes — — — — — — 12 — — — — — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 53 Package and Pin Listings Table 51. MPC8343EA (PBGA) Pinout Listing (continued) Signal Package Pin Number USB DR_D0_ENABLEN DR_D1_SER_TXD DR_D2_VMO_SE0 DR_D3_SPEED DR_D4_DP DR_D5_DM DR_D6_SER_RCV DR_D7_DRVVBUS DR_SESS_VLD_NXT DR_XCVR_SEL_DPPULLUP DR_STP_SUSPEND DR_RX_ERROR_PWRFAULT DR_TX_VALID_PCTL0 DR_TX_VALIDH_PCTL1 DR_CLK C28 F25 B28 C27 D26 E25 C26 D25 B26 E24 A27 C25 A26 B25 A25 Programmable Interrupt Controller MCP_OUT IRQ0/MCP_IN/GPIO2[12] IRQ[1:5]/GPIO2[13:17] IRQ[6]/GPIO2[18]/CKSTOP_OUT IRQ[7]/GPIO2[19]/CKSTOP_IN E8 J28 K25, J25, H26, L24, G27 G28 J26 Ethernet Management Interface EC_MDC EC_MDIO Y24 Y25 Gigabit Reference Clock EC_GTX_CLK125 Y26 Three-Speed Ethernet Controller (Gigabit Ethernet 1) TSEC1_COL/GPIO2[20] TSEC1_CRS/GPIO2[21] TSEC1_GTX_CLK TSEC1_RX_CLK M26 U25 V24 U26 I/O I/O O I OVDD LVDD1 LVDD1 LVDD1 — — 3 — I LVDD1 — O I/O LVDD1 LVDD1 — 11 O I/O I/O I/O I/O OVDD OVDD OVDD OVDD OVDD 2 — — — — I/O I/O I/O I/O I/O I/O I/O I/O I I/O O I O O I OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD — — — — — — — — — — — — — — — Pin Type Power Supply Notes MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 54 Freescale Semiconductor Package and Pin Listings Table 51. MPC8343EA (PBGA) Pinout Listing (continued) Signal TSEC1_RX_DV TSEC1_RX_ER/GPIO2[26] TSEC1_RXD[3:0] TSEC1_TX_CLK TSEC1_TXD[3:0] TSEC1_TX_EN TSEC1_TX_ER/GPIO2[31] Package Pin Number U24 L28 W26, W24, Y28, Y27 N25 V28, V27, V26, W28 W27 N24 Three-Speed Ethernet Controller (Gigabit Ethernet 2) TSEC2_COL/GPIO1[21] TSEC2_CRS/GPIO1[22] TSEC2_GTX_CLK TSEC2_RX_CLK TSEC2_RX_DV/GPIO1[23] TSEC2_RXD[3:0]/GPIO1[13:16] TSEC2_RX_ER/GPIO1[25] TSEC2_TXD[3:0]/GPIO1[17:20] TSEC2_TX_ER/GPIO1[24] TSEC2_TX_EN/GPIO1[12] TSEC2_TX_CLK/GPIO1[30] P28 AC28 AC27 AB25 AC26 AA25, AA26, AA27, AA28 R25 AB26, AB27, AA24, AB28 R27 AD28 R26 DUART UART_SOUT[1:2]/MSRCID[0:1]/ LSRCID[0:1] UART_SIN[1:2]/MSRCID[2:3]/ LSRCID[2:3] UART_CTS[1]/MSRCID4/LSRCID4 UART_CTS[2]/MDVAL/LDVAL UART_RTS[1:2] I2C IIC1_SDA IIC1_SCL IIC2_SDA IIC2_SCL B4, A4 D5, C5 B5 A5 D6, C6 interface E5 A6 B6 E7 I/O I/O I/O I/O OVDD OVDD OVDD OVDD 2 2 2 2 O I/O I/O I/O O OVDD OVDD OVDD OVDD OVDD — — — — — I/O I/O O I I/O I/O I/O I/O I/O I/O I/O OVDD LVDD2 LVDD2 LVDD2 LVDD2 LVDD2 OVDD LVDD2 OVDD LVDD2 OVDD — — — — — — — — — 3 — Pin Type I I/O I I O O I/O Power Supply LVDD1 OVDD LVDD1 OVDD LVDD1 LVDD1 OVDD Notes — — — — 10 — — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 55 Package and Pin Listings Table 51. MPC8343EA (PBGA) Pinout Listing (continued) Signal Package Pin Number SPI SPIMOSI/LCS[6] SPIMISO/LCS[7] SPICLK SPISEL D7 C7 B7 A7 Clocks PCI_CLK_OUT[0:2] PCI_CLK_OUT[3]/LCS[6] PCI_CLK_OUT[4]/LCS[7] PCI_SYNC_IN/PCI_CLOCK PCI_SYNC_OUT RTC/PIT_CLOCK CLKIN Y1, W3, W2 W1 V3 U4 U5 E9 W5 JTAG TCK TDI TDO TMS TRST H27 H28 M24 J27 K26 Test TEST TEST_SEL F28 T3 PMC QUIESCE K27 System Control PORESET HRESET SRESET K28 M25 L27 Thermal Management THERM0 B15 I — 8 I I/O I/O OVDD OVDD OVDD — 1 2 O OVDD — I I OVDD OVDD 6 7 I I O I I OVDD OVDD OVDD OVDD OVDD — 4 3 4 4 O O O I O I I OVDD OVDD OVDD OVDD OVDD OVDD OVDD — — — — 3 — — I/O I/O I/O I OVDD OVDD OVDD OVDD — — — — Pin Type Power Supply Notes MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 56 Freescale Semiconductor Package and Pin Listings Table 51. MPC8343EA (PBGA) Pinout Listing (continued) Signal Package Pin Number Power and Ground Signals AVDD1 AVDD2 C15 U1 Power for e300 PLL (1.2 V) Power for system PLL (1.2 V) Power for DDR DLL (1.2 V) Power for LBIU DLL (1.2 V) — AVDD1 AVDD2 — — Pin Type Power Supply Notes AVDD3 AVDD4 GND AF9 U2 A2, B1, B2, D10, D18, E6, E14, E22, F9, F12, F15, F18, F21, F24, G5, H6, J23, L4, L6, L12, L13, L14, L15, L16, L17, M11, M12, M13, M14, M15, M16, M17, M18, M23, N11, N12, N13, N14, N15, N16, N17, N18, P6, P11, P12, P13, P14, P15, P16, P17, P18, P24, R5, R23, R11, R12, R13, R14, R15, R16, R17, R18, T11, T12, T13, T14, T15, T16, T17, T18, U6, U11, U12, U13, U14, U15, U16, U17, U18, V12, V13, V14, V15, V16, V17, V23, V25, W4, Y6, AA23, AB24, AC5, AC8, AC11, AC14, AC17, AC20, AD9, AD15, AD21, AE12, AE18, AF3, AF26 U9, V9, W10, W19, Y11, Y12, Y14, Y15, Y17, Y18, AA6, AB5, AC9, AC12, AC15, AC18, AC21, AC24, AD6, AD8, AD14, AD20, AE5, AE11, AE17, AG2, AG27 U20, W25 — AVDD4 — — — — GVDD Power for DDR DRAM I/O voltage (2.5 V) Power for three speed Ethernet #1 and for Ethernet management interface I/O (2.5V, 3.3V) Power for three speed Ethernet #2 I/O (2.5 V, 3.3 V) Power for core (1.2 V) GVDD — LVDD1 LVDD1 — LVDD2 V20, Y23 LVDD2 — VDD J11, J12, J15, K10, K11, K12, K13, K14, K15, K16, K17, K18, K19, L10, L11, L18, L19, M10, M19, N10, N19, P9, P10, P19, R10, R19, R20, T10, T19, U10, U19, V10, V11, V18, V19, W11, W12, W13, W14, W15, W16, W17, W18 VDD — MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 57 Package and Pin Listings Table 51. MPC8343EA (PBGA) Pinout Listing (continued) Signal OVDD Package Pin Number B27, D3, D11, D19, E15, E23, F5, F8, F11, F14, F17, F20, G24, H23, H24, J6, J14, J17, J18, K4, L9, L20, L23, L25, M6, M9, M20, P5, P20, P23, R6, R9, R24, U23, V4, V6 AF19 Pin Type PCI, 10/100 Ethernet, and other standard (3.3 V) I Power Supply OVDD Notes — MVREF1 DDR reference voltage DDR reference voltage — MVREF2 AE10 I — No Connection NC A22, A23, A24, B22, B23, B24, C21, C22, C23, C24, D21, D22, D23, D24, E21, M27, M28, N26, N27, N28, P25, P26, P27, R28, T24, T25, T26, T27, T28, U27, U28, Y3, Y4, Y5, AA1, AA2, AA3, AA4, AB1, AB2, AB3, AB4, AC1, AC2, AC3, AC4, AD1, AD2, AD3, AD5, AD7, AD11, AD12, AE4, AE6, AE8, AE9, AE23, AF1, AF5, AF6, AF8, AF24, AG1, AG3, AG4, AG7, AG8, AG9, AG10, AH2, AH3, AH5, AH8, AH9, V5, V2, V1 — — — Notes: 1. This pin is an open-drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to OVDD. 2. This pin is an open-drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OVDD. 3. During reset, this output is actively driven rather than three-stated. 4. These JTAG pins have weak internal pull-up P-FETs that are always enabled. 5. This pin should have a weak pull-up if the chip is in PCI host mode. Follow the PCI specifications. 6. This pin must be always be tied to GND. 7. This pin must always be pulled up to OVDD. 8. Thermal sensitive resistor. 9. It is recommended that MDIC0 be tied to GND using an 18.2 Ω resistor and MDIC1 be tied to DDR power using an 18.2 Ω resistor. 10.TSEC1_TXD[3] is required an external pull-up resistor. For proper functionality of the device, this pin must be pulled up or actively driven high during a hard reset. No external pull-down resistors are allowed to be attached to this net. 11. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to LVDD1. 12. For systems that boot from local bus (GPCM)-controlled NOR flash, a pull up on LGPL4 is required. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 58 Freescale Semiconductor Clocking 19 Clocking Figure 36 shows the internal distribution of the clocks. MPC8343EA e300 Core Core PLL core_clk csb_clk System PLL To DDR Memory Controller DDR Clock ddr_clk Div /2 Clock Unit lbiu_clk /n To Local Bus Memory LBIU Controller DLL csb_clk to Rest of the Device 4 4 MCK[0:3] MCK[0:3] DDR Memory Device LCLK[0:2] LSYNC_OUT LSYNC_IN PCI_CLK/ PCI_SYNC_IN Local Bus Memory Device CFG_CLKIN_DIV CLKIN PCI Clock Divider 5 PCI_SYNC_OUT PCI_CLK_OUT[0:4] Figure 36. MPC8343EA Clock Subsystem The primary clock source can be one of two inputs, CLKIN or PCI_CLK, depending on whether the device is configured in PCI host or PCI agent mode. When the MPC8343EA is configured as a PCI host device, CLKIN is its primary input clock. CLKIN feeds the PCI clock divider (÷2) and the multiplexors for PCI_SYNC_OUT and PCI_CLK_OUT. The CFG_CLKIN_DIV configuration input selects whether CLKIN or CLKIN/2 is driven out on the PCI_SYNC_OUT signal. The OCCR[PCICDn] parameters select whether CLKIN or CLKIN/2 is driven out on the PCI_CLK_OUTn signals. PCI_SYNC_OUT is connected externally to PCI_SYNC_IN to allow the internal clock subsystem to synchronize to the system PCI clocks. PCI_SYNC_OUT must be connected properly to PCI_SYNC_IN, with equal delay to all PCI agent devices in the system, to allow the MPC8343EA to function. When the device is configured as a PCI agent device, PCI_CLK is the primary input clock and the CLKIN signal should be tied to GND. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 59 Clocking As shown in Figure 36, the primary clock input (frequency) is multiplied up by the system phase-locked loop (PLL) and the clock unit to create the coherent system bus clock (csb_clk), the internal clock for the DDR controller (ddr_clk), and the internal clock for the local bus interface unit (lbiu_clk). The csb_clk frequency is derived from a complex set of factors that can be simplified into the following equation: csb_clk = {PCI_SYNC_IN × (1 + CFG_CLKIN_DIV)} × SPMF In PCI host mode, PCI_SYNC_IN × (1 + CFG_CLKIN_DIV) is the CLKIN frequency. The csb_clk serves as the clock input to the e300 core. A second PLL inside the e300 core multiplies the csb_clk frequency to create the internal clock for the e300 core (core_clk). The system and core PLL multipliers are selected by the SPMF and COREPLL fields in the reset configuration word low (RCWL), which is loaded at power-on reset or by one of the hard-coded reset options. See the chapter on reset, clocking, and initialization in the MPC8349EA Reference Manual for more information on the clock subsystem. The internal ddr_clk frequency is determined by the following equation: ddr_clk = csb_clk × (1 + RCWL[DDRCM]) ddr_clk is not the external memory bus frequency; ddr_clk passes through the DDR clock divider (÷2) to create the differential DDR memory bus clock outputs (MCK and MCK). However, the data rate is the same frequency as ddr_clk. The internal lbiu_clk frequency is determined by the following equation: lbiu_clk = csb_clk × (1 + RCWL[LBIUCM]) lbiu_clk is not the external local bus frequency; lbiu_clk passes through the LBIU clock divider to create the external local bus clock outputs (LSYNC_OUT and LCLK[0:2]). The LBIU clock divider ratio is controlled by LCCR[CLKDIV]. In addition, some of the internal units may have to be shut off or operate at lower frequency than the csb_clk frequency. Those units have a default clock ratio that can be configured by a memory-mapped register after the device exits reset. Table 52 specifies which units have a configurable clock frequency. Table 52. Configurable Clock Units Unit TSEC1 TSEC2, I2C1 Security core USB DR, USB MPH PCI and DMA complex Default Frequency csb_clk/3 csb_clk/3 csb_clk/3 csb_clk/3 csb_clk Options Off, csb_clk, csb_clk/2, csb_clk/3 Off, csb_clk, csb_clk/2, csb_clk/3 Off, csb_clk, csb_clk/2, csb_clk/3 Off, csb_clk, csb_clk/2, csb_clk/3 Off, csb_clk All frequency combinations shown in the table below may not be available. Maximum operating frequencies depend on the part ordered, see Section 22.1, “Part Numbers Fully Addressed by This Document,” for part ordering details and contact your Freescale Sales Representative or authorized distributor for more information. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 60 Freescale Semiconductor Clocking Table 53 provides the operating frequencies for the MPC8343EA PBGA under recommended operating conditions. Table 53. Operating Frequencies for PBGA Parameter1 e300 core frequency (core_clk) Coherent system bus frequency (csb_clk) DDR1 memory bus frequency (MCK)2 DDR2 memory bus frequency Local bus frequency (LCLKn)4 PCI input frequency (CLKIN or PCI_CLK) Security core maximum internal operating frequency USB_DR, USB_MPH maximum internal operating frequency 1 266 MHz 200–266 333 MHz 200–333 100–266 100–133 100–133 16.67–133 25–66 133 133 400 MHz 200–400 Unit MHz MHz MHz MHz MHz MHz MHz MHz (MCK)3 The CLKIN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen so that the resulting csb_clk, MCLK, LCLK[0:2], and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies. The value of SCCR[ENCCM], SCCR[USBDRCM], and SCCR[USBMPHCM] must be programmed so that the maximum internal operating frequency of the Security core and USB modules does not exceed the respective values listed in this table. 2 The DDR data rate is 2× the DDR memory bus frequency. 3 The DDR data rate is 2× the DDR memory bus frequency. 4 The local bus frequency is ½, ¼, or 1/8 of the lbiu_clk frequency (depending on LCCR[CLKDIV]) which is in turn 1× or 2× the csb_clk frequency (depending on RCWL[LBIUCM]). 19.1 System PLL Configuration The system PLL is controlled by the RCWL[SPMF] parameter. Table 54 shows the multiplication factor encodings for the system PLL. Table 54. System PLL Multiplication Factors RCWL[SPMF] 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 System PLL Multiplication Factor × 16 Reserved ×2 ×3 ×4 ×5 ×6 ×7 ×8 ×9 × 10 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 61 Clocking Table 54. System PLL Multiplication Factors (continued) RCWL[SPMF] 1011 1100 1101 1110 1111 System PLL Multiplication Factor × 11 × 12 × 13 × 14 × 15 As described in Section 19, “Clocking,” the LBIUCM, DDRCM, and SPMF parameters in the reset configuration word low and the CFG_CLKIN_DIV configuration input signal select the ratio between the primary clock input (CLKIN or PCI_CLK) and the internal coherent system bus clock (csb_clk). Table 55 and Table 56 show the expected frequency values for the CSB frequency for select csb_clk to CLKIN/PCI_SYNC_IN ratios. Table 55. CSB Frequency Options for Host Mode Input Clock Frequency (MHz)2 CFG_CLKIN_DIV at Reset1 SPMF csb_clk : Input Clock Ratio2 16.67 25 33.33 66.67 csb_clk Frequency (MHz) Low Low Low Low Low Low Low Low Low Low Low Low Low Low Low 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 0000 2:1 3:1 4:1 5:1 6:1 7:1 8:1 9:1 10 : 1 11 : 1 12 : 1 13 : 1 14 : 1 15 : 1 16 : 1 100 116 133 150 166 183 200 216 233 250 266 100 125 150 175 200 225 250 275 300 325 100 133 166 200 233 266 300 333 133 200 266 333 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 62 Freescale Semiconductor Clocking Table 55. CSB Frequency Options for Host Mode (continued) Input Clock Frequency (MHz)2 CFG_CLKIN_DIV at Reset1 SPMF csb_clk : Input Clock Ratio2 16.67 25 33.33 66.67 csb_clk Frequency (MHz) High High High High High High High 1 2 0010 0011 0100 0101 0110 0111 1000 2:1 3:1 4:1 5:1 6:1 7:1 8:1 100 133 166 200 233 133 200 266 333 CFG_CLKIN_DIV selects the ratio between CLKIN and PCI_SYNC_OUT. CLKIN is the input clock in host mode; PCI_CLK is the input clock in agent mode. DDR2 memory may be used at 133 MHz provided that the memory components are specified for operation at this frequency. Table 56. CSB Frequency Options for Agent Mode Input Clock Frequency (MHz)2 CFG_CLKIN_DIV at Reset1 SPMF csb_clk : Input Clock Ratio2 16.67 25 33.33 66.67 csb_clk Frequency (MHz) Low Low Low Low Low Low Low Low Low Low Low Low Low Low Low High 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 0000 0010 2:1 3:1 4:1 5:1 6:1 7:1 8:1 9:1 10 : 1 11 : 1 12 : 1 13 : 1 14 : 1 15 : 1 16 : 1 4:1 100 116 133 150 166 183 200 216 233 250 266 100 133 266 100 125 150 175 200 225 250 275 300 325 100 133 166 200 233 266 300 333 133 200 266 333 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 63 Clocking Table 56. CSB Frequency Options for Agent Mode (continued) Input Clock Frequency (MHz)2 CFG_CLKIN_DIV at Reset1 SPMF csb_clk : Input Clock Ratio2 16.67 25 33.33 66.67 csb_clk Frequency (MHz) High High High High High High 1 2 0011 0100 0101 0110 0111 1000 6:1 8:1 10 : 1 12 : 1 14 : 1 16 : 1 100 133 166 200 233 266 150 200 250 300 200 266 333 CFG_CLKIN_DIV doubles csb_clk if set high. CLKIN is the input clock in host mode; PCI_CLK is the input clock in agent mode. DDR2 memory may be used at 133 MHz provided that the memory components are specified for operation at this frequency. 19.2 Core PLL Configuration RCWL[COREPLL] selects the ratio between the internal coherent system bus clock (csb_clk) and the e300 core clock (core_clk). Table 57 shows the encodings for RCWL[COREPLL]. COREPLL values that are not listed in Table 57 should be considered as reserved. NOTE Core VCO frequency = core frequency × VCO divider VCO divider must be set properly so that the core VCO frequency is in the range of 800–1800 MHz. Table 57. e300 Core PLL Configuration RCWL[COREPLL] core_clk : csb_clk Ratio 0–1 nn 00 01 10 11 00 01 10 11 2–5 0000 0001 0001 0001 0001 0001 0001 0001 0001 6 n 0 0 0 0 1 1 1 1 PLL bypassed PLL bypassed (PLL off, csb_clk clocks core directly) (PLL off, csb_clk clocks core directly) 1:1 1:1 1:1 1:1 1.5:1 1.5:1 1.5:1 1.5:1 2 4 8 8 2 4 8 8 VCO Divider1 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 64 Freescale Semiconductor Clocking Table 57. e300 Core PLL Configuration (continued) RCWL[COREPLL] core_clk : csb_clk Ratio 0–1 00 01 10 11 00 01 10 11 00 01 10 11 1 VCO Divider1 2–5 0010 0010 0010 0010 0010 0010 0010 0010 0011 0011 0011 0011 6 0 0 0 0 1 1 1 1 0 0 0 0 2:1 2:1 2:1 2:1 2.5:1 2.5:1 2.5:1 2.5:1 3:1 3:1 3:1 3:1 2 4 8 8 2 4 8 8 2 4 8 8 Core VCO frequency = core frequency × VCO divider. The VCO divider must be set properly so that the core VCO frequency is in the range of 800–1800 MHz. 19.3 Suggested PLL Configurations Table 58 shows suggested PLL configurations for 33 and 66 MHz input clocks, when CFG_CLKIN_DIV is low at reset. Table 58. Suggested PLL Configurations RCWL Ref No.1 266 MHz Device Input Clock Freq (MHz)2 CSB Freq (MHz) Core Freq (MHz) 333 MHz Device Input Clock Freq (MHz)2 CSB Freq (MHz) Core Freq (MHz) 400 MHz Device Input Clock Freq (MHz)2 CSB Freq (MHz) Core Freq (MHz) SPMF CORE PLL 33 MHz CLKIN/PCI_CLK Options 343 324 423 622 523 424 822 0011 0011 0100 0110 0101 0100 1000 1000011 0100100 0100011 0100010 0100011 0100100 0100010 33 33 33 33 33 33 33 100 100 133 200 166 133 266 150 200 200 200 250 266 266 33 33 33 33 33 33 33 100 100 133 200 166 133 266 150 200 200 200 250 266 266 33 33 33 33 33 33 33 100 100 133 200 166 133 266 150 200 200 200 250 266 266 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 65 Clocking Table 58. Suggested PLL Configurations (continued) RCWL Ref No.1 266 MHz Device Input Clock Freq (MHz)2 CSB Freq (MHz) — — — — — — — — — — Core Freq (MHz) 333 MHz Device Input Clock Freq (MHz)2 33 33 33 33 33 33 CSB Freq (MHz) 100 200 300 133 166 333 — — — — 66 MHz CLKIN/PCI_CLK Options 242 322 224 422 323 223 522 304 324 403 423 1 400 MHz Device Input Clock Freq (MHz)2 33 33 33 33 33 33 33 33 33 33 CSB Freq (MHz) 100 200 300 133 166 333 233 200 200 266 Core Freq (MHz) 300 300 300 333 333 333 350 400 400 400 SPMF CORE PLL 0100110 0100011 0100010 0100101 0100100 0100010 0100011 0000100 0100100 0100011 Core Freq (MHz) 300 300 300 333 333 333 326 623 922 425 524 A22 723 604 624 823 0011 0110 1001 0100 0101 1010 0111 0110 0110 1000 0010 0011 0010 0100 0011 0010 0101 0011 0011 0100 0100 1000010 0100010 0100100 0100010 0100011 0100101 0100010 0000100 0100100 0000011 0100011 66 66 66 66 133 200 133 266 — — — — — — — 133 200 266 266 66 66 66 66 66 66 66 133 200 133 266 200 133 333 — — — — 133 200 266 266 300 333 333 66 66 66 66 66 66 66 66 66 66 66 133 200 133 266 200 133 333 200 200 266 266 133 200 266 266 300 333 333 400 400 400 400 The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and COREPLL settings given in the table. 2 The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 66 Freescale Semiconductor Thermal 20 Thermal This section describes the thermal specifications of the MPC8343EA. 20.1 Thermal Characteristics Table 59. Package Thermal Characteristics for PBGA Parameter Symbol RθJA RθJMA RθJMA RθJMA RθJB RθJC ψJT Value 21 15 17 12 6 5 5 Unit °C/W °C/W °C/W °C/W °C/W °C/W °C/W Notes 1, 2 1, 3 1, 3 1, 3 4 5 6 .Table 59 provides the package thermal characteristics for the 620 29 × 29 mm PBGA of the MPC8343EA. Junction-to-ambient natural convection on single-layer board (1s) Junction-to-ambient natural convection on four-layer board (2s2p) Junction-to-ambient (at 200 ft/min) on single-layer board (1s) Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p) Junction-to-board thermal Junction-to-case thermal Junction-to-package natural convection on top Notes 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. 3. Per JEDEC JESD51-6 with the board horizontal. 4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 20.2 Thermal Management Information For the following sections, PD = (VDD × IDD) + PI/O where PI/O is the power dissipation of the I/O drivers. See Table 5 for I/O power dissipation values. 20.2.1 Estimation of Junction Temperature with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, can be obtained from the equation: TJ = TA + (RθJA × PD) where: TJ = junction temperature (°C) TA = ambient temperature for the package (°C) RθJA = junction-to-ambient thermal resistance (°C/W) PD = power dissipation in the package (W) MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 67 Thermal The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy estimation of thermal performance. Generally, the value obtained on a single-layer board is appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually appropriate if the board has low power dissipation and the components are well separated. Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible. 20.2.2 Estimation of Junction Temperature with Junction-to-Board Thermal Resistance The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal resistance. The thermal performance of any component is strongly dependent on the power dissipation of surrounding components. In addition, the ambient temperature varies widely within the application. For many natural convection and especially closed box applications, the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the local ambient conditions that determine the temperature of the device. At a known board temperature, the junction temperature is estimated using the following equation: TJ = TA + (RθJA × PD) where: TJ = junction temperature (°C) TA = ambient temperature for the package (°C) RθJA = junction-to-ambient thermal resistance (°C/W) PD = power dissipation in the package (W) When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made. The application board should be similar to the thermal test condition: the component is soldered to a board with internal planes. 20.2.3 Experimental Determination of Junction Temperature To determine the junction temperature of the device in the application after prototypes are available, use the thermal characterization parameter (ΨJT) to determine the junction temperature and a measure of the temperature at the top center of the package case using the following equation: TJ = TT + (ΨJT × PD) where: TJ = junction temperature (°C) TT = thermocouple temperature on top of package (°C) ΨJT = junction-to-ambient thermal resistance (°C/W) PD = power dissipation in the package (W) The thermal characterization parameter is measured per the JESD51-2 specification using a 40 gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 68 Freescale Semiconductor Thermal that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. 20.2.4 Heat Sinks and Junction-to-Case Thermal Resistance Some application environments require a heat sink to provide the necessary thermal management of the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: RθJA = RθJC + RθCA where: RθJA = junction-to-ambient thermal resistance (°C/W) RθJC = junction-to-case thermal resistance (°C/W) RθCA = case-to-ambient thermal resistance (°C/W) RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit board, or change the thermal dissipation on the printed-circuit board surrounding the device. The thermal performance of devices with heat sinks has been simulated with a few commercially available heat sinks. The heat sink choice is determined by the application environment (temperature, air flow, adjacent component power dissipation) and the physical space available. Because there is not a standard application environment, a standard heat sink is not required. Table 60 shows heat sink thermal resistance for PBGA of the MPC8343EA. f Table 60. Heat Sink and Thermal Resistance of MPC8343EA (PBGA) 29 × 29 mm PBGA Heat Sink Assuming Thermal Grease Air Flow Thermal Resistance AAVID 30 × 30 × 9.4 mm pin fin AAVID 30 × 30 × 9.4 mm pin fin AAVID 30 × 30 × 9.4 mm pin fin AAVID 31 × 35 × 23 mm pin fin AAVID 31 × 35 × 23 mm pin fin AAVID 31 × 35 × 23 mm pin fin Wakefield, 53 × 53 × 25 mm pin fin Wakefield, 53 × 53 × 25 mm pin fin Wakefield, 53 × 53 × 25 mm pin fin MEI, 75 × 85 × 12 no adjacent board, extrusion Natural convection 1 m/s 2 m/s Natural convection 1 m/s 2 m/s Natural convection 1 m/s 2 m/s Natural convection 13.5 9.6 8.8 11.3 8.1 7.5 9.1 7.1 6.5 10.1 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 69 Thermal Table 60. Heat Sink and Thermal Resistance of MPC8343EA (PBGA) (continued) 29 × 29 mm PBGA Heat Sink Assuming Thermal Grease MEI, 75 × 85 × 12 no adjacent board, extrusion MEI, 75 × 85 × 12 no adjacent board, extrusion MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass Air Flow Thermal Resistance 1 m/s 2 m/s 1 m/s 7.7 6.6 6.9 Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics software which can model both the conduction cooling and the convection cooling of the air moving through the application. Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More detailed thermal models can be made available on request. Heat sink vendors include the following list: Aavid Thermalloy 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 473 Sapena Ct. #12 Santa Clara, CA 95054 Internet: www.alphanovatech.com International Electronic Research Corporation (IERC) 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Millennium Electronics (MEI) Loroco Sites 671 East Brokaw Road San Jose, CA 95112 Internet: www.mei-thermal.com Tyco Electronics Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.chipcoolers.com Wakefield Engineering 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com 603-224-9988 408-567-8082 818-842-7277 408-436-8770 800-522-2800 603-635-5102 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 70 Freescale Semiconductor Thermal Interface material vendors include the following: Chomerics, Inc. 77 Dragon Ct. Woburn, MA 01801 Internet: www.chomerics.com Dow-Corning Corporation Dow-Corning Electronic Materials P.O. Box 994 Midland, MI 48686-0997 Internet: www.dowcorning.com Shin-Etsu MicroSi, Inc. 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com The Bergquist Company 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com 781-935-4850 800-248-2481 888-642-7674 800-347-4572 20.3 Heat Sink Attachment When heat sinks are attached, an interface material is required, preferably thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces that can lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint lifetime of the package. The recommended maximum force on the top of the package is 10 lb force (4.5 kg force). Any adhesive attachment should attach to painted or plastic surfaces, and its performance should be verified under the application requirements. 20.3.1 Experimental Determination of the Junction Temperature with a Heat Sink When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimize the size of the clearance to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case temperature, the junction temperature is determined from the junction-to-case thermal resistance. TJ = TC + (RθJC × PD) where: TJ = junction temperature (°C) TC = case temperature of the package (°C) MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 71 System Design Information RθJC = junction-to-case thermal resistance (°C/W) PD = power dissipation (W) 21 System Design Information This section provides electrical and thermal design recommendations for successful application of the MPC8343EA. 21.1 System Clocking The MPC8343EA includes two PLLs: 1. The platform PLL generates the platform clock from the externally supplied CLKIN input. The frequency ratio between the platform and CLKIN is selected using the platform PLL ratio configuration bits as described in Section 19.1, “System PLL Configuration.” 2. The e300 core PLL generates the core clock as a slave to the platform clock. The frequency ratio between the e300 core clock and the platform clock is selected using the e300 PLL ratio configuration bits as described in Section 19.2, “Core PLL Configuration.” 21.2 PLL Power Supply Filtering Each PLL gets power through independent power supply pins (AVDD1, AVDD2, respectively). The AVDD level should always equal to VDD, and preferably these voltages are derived directly from VDD through a low frequency filter scheme. There are a number of ways to provide power reliably to the PLLs, but the recommended solution is to provide four independent filter circuits as illustrated in Figure 37, one to each of the four AVDD pins. Independent filters to each PLL reduce the opportunity to cause noise injection from one PLL to the other. The circuit filters noise in the PLL resonant frequency range from 500 kHz to 10 MHz. It should be built with surface mount capacitors with minimum effective series inductance (ESL). Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value capacitor. To minimize noise coupled from nearby circuits, each circuit should be placed as closely as possible to the specific AVDD pin being supplied. It should be possible to route directly from the capacitors to the AVDD pin, which is on the periphery of package, without the inductance of vias. Figure 37 shows the PLL power supply filter circuit. 10 Ω VDD 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors AVDD (or L2AVDD) GND Figure 37. PLL Power Supply Filter Circuit MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 72 Freescale Semiconductor System Design Information 21.3 Decoupling Recommendations Due to large address and data buses and high operating frequencies, the MPC8343EA can generate transient power surges and high frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from reaching other components in the MPC8343EA system, and the device itself requires a clean, tightly regulated source of power. Therefore, the system designer should place at least one decoupling capacitor at each VDD, OVDD, GVDD, and LVDD pin of the device. These capacitors should receive their power from separate VDD, OVDD, GVDD, LVDD, and GND power planes in the PCB, with short traces to minimize inductance. Capacitors can be placed directly under the device using a standard escape pattern. Others can surround the part. These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology) capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes. In addition, distribute several bulk storage capacitors around the PCB, feeding the VDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick response time. They should also be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk capacitors are 100–330 µF (AVX TPS tantalum or Sanyo OSCON). 21.4 Connection Recommendations To ensure reliable operation, connect unused inputs to an appropriate signal level. Unused active low inputs should be tied to OVDD, GVDD, or LVDD as required. Unused active high inputs should be connected to GND. All NC (no-connect) signals must remain unconnected. Power and ground connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins of the MPC8343EA. 21.5 Output Buffer DC Impedance The MPC8343EA drivers are characterized over process, voltage, and temperature. For all buses, the driver is a push-pull single-ended driver type (open drain for I2C). To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD or GND. Then the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 38). The output impedance is the average of two components, the resistances of the pull-up and pull-down devices. When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 73 System Design Information OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in value. Then, Z0 = (RP + RN) ÷ 2. OVDD RN SW2 Data Pad SW1 RP OGND Figure 38. Driver Impedance Measurement Two measurements give the value of this resistance and the strength of the driver current source. First, the output voltage is measured while driving logic 1 without an external differential termination resistor. The measured voltage is V1 = Rsource × Isource. Second, the output voltage is measured while driving logic 1 with an external precision differential termination resistor of value Rterm. The measured voltage is V2 = (1 ÷ (1/R1 + 1/R2)) × Isource. Solving for the output impedance gives Rsource = Rterm × (V1 ÷ V2 – 1). The drive current is then Isource = V1 ÷ Rsource. Table 61 summarizes the signal impedance targets. The driver impedance are targeted at minimum VDD, nominal OVDD, 105°C. Table 61. Impedance Characteristics Local Bus, Ethernet, DUART, Control, Configuration, Power Management 42 Target 42 Target NA PCI Signals (Not Including PCI Output Clocks) 25 Target 25 Target NA PCI Output Clocks (Including PCI_SYNC_OUT) 42 Target 42 Target NA Impedance DDR DRAM Symbol Unit RN RP Differential 20 Target 20 Target NA Z0 Z0 ZDIFF W W W Note: Nominal supply voltages. See Table 1, Tj = 105°C. 21.6 Configuration Pin Multiplexing The MPC8343EA power-on configuration options can be set through external pull-up or pull-down resistors of 4.7 kΩ on certain output pins (see the customer-visible configuration pins). These pins are used as output only pins in normal operation. MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 74 Freescale Semiconductor Ordering Information However, while HRESET is asserted, these pins are treated as inputs, and the value on these pins is latched when PORESET deasserts. Then the input receiver is disabled and the I/O circuit takes on its normal function. Careful board layout with stubless connections to these pull-up/pull-down resistors coupled with the large value of the pull-up/pull-down resistor should minimize the disruption of signal quality or speed for the output pins. 21.7 Pull-Up Resistor Requirements The MPC8343EA requires high resistance pull-up resistors (10 kΩ is recommended) on open-drain pins, including I2C pins, and IPIC interrupt pins. For more information on required pull-up resistors and the connections required for the JTAG interface, refer to application note AN2931, PowerQUICC Design Checklist. 22 Ordering Information This section presents ordering information for the device discussed in this document, and it shows an example of how the parts are marked. NOTE The information in this document is accurate for revision 3.x silicon and later (in other words, for orderable part numbers ending in A or B). For information on revision 1.1 silicon and earlier versions, see the MPC8343E PowerQUICC II Pro Integrated Host Processor Hardware Specifications (Document Order No. MPC8343EEC). 22.1 Part Numbers Fully Addressed by This Document Table 62 shows an analysis of the Freescale part numbering nomenclature for the MPC8343EA. The individual part numbers correspond to a maximum processor core frequency. Each part number also contains a revision code that refers to the die mask revision number. For available frequency configuration MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 75 Ordering Information parts including extended temperatures, refer to the device product summary page on our website listed on the back cover of this document or, contact your local Freescale sales office. Table 62. Part Numbering Nomenclature MPC nnnn e Encryption Acceleration Blank = Not included E = included t Temperature1 Range pp Package2 aa Processor Frequency3 e300 core speed AD = 266 AG = 400 a Platform Frequency D = 266 r Revision Level B = 3.1 Product Part Code Identifier MPC 8343 Blank = 0 to 105°C C = –40 to 105°C ZQ = PBGA VR = PB Free PBGA Notes: 1. For temperature range = C, processor frequency is limited to 400 with a platform frequency of 266 and up to with a platform frequency of 333 2. See Section 18, “Package and Pin Listings,” for more information on available package types. 3. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification support all core frequencies. Additionally, parts addressed by Part Number Specifications may support other maximum core frequencies. Table 63 shows the SVR settings by device and package type. Table 63. SVR Settings Device MPC8343EA MPC8343A Package PBGA PBGA SVR (Rev. 3.0) 8056_0030 8057_0030 22.2 Part Marking Parts are marked as in the example shown in Figure 39. MPCnnnnetppaaar core/platform MHZ ATWLYYWW CCCCC *MMMMM YWWLAZ PBGA Notes: ATWLYYWW is the traceability code. CCCCC is the country code. MMMMM is the mask number. YWWLAZ is the assembly traceability code. Figure 39. Freescale Part Marking for PBGA Devices MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 76 Freescale Semiconductor Document Revision History 23 Document Revision History Table 64 provides a revision history of this document. Table 64. Document Revision History Rev. Number 10 9 8 Date 11/2010 05/2010 5/2009 Substantive Change(s) • In Table 51, added overbar to LCS[4] and LCS[5] signals. In Table 51 added note for pin LGPL4. • In Section 21.7, “Pull-Up Resistor Requirements, updated the list of open drain type pins. • In Table 25 through Table 26, changed VIL(min) to VIH(max) to (20%–80%). • Added Table 8, “EC_GTX_CLK125 AC Timing Specifications.” • In Section 18.1, “Package Parameters for the MPC8343EA PBGA, changed solder ball for TBGA and PBGA from 95.5 Sn/0.5 Cu/4 Ag to 96.5 Sn/3.5 Ag. • In Table 53, added two columns for the DDR1 and DDR2 memory bus frequency. • In Table 62, footnote 1, changed 667(TBGA) to 533(TBGA). footnote 4, added data rate for DDR1 and DDR2. • Added footnote 6 to Table 7. • In Section 9.2, “USB AC Electrical Specifications,” clarified that AC table is for ULPI only. • In Table 35, corrected tLBKHOV parameter to tLBKLOV (output data is driven on falling edge of clock in DLL bypass mode). Similarly, made the same correction to Figure 17, Figure 19, and Figure 20 for output signals. • Added footnote 10 to Table 51. • In Table 51, updated note 11 to say the following: “SEC1_TXD[3] is required an external pull-up resistor. For proper functionality of the device, this pin must be pulled up or actively driven high during a hard reset. No external pull-down resistors are allowed to be attached to this net.” • In Section 21.1, “System Clocking,” removed “(AVDD1)” and “(AVDD2”) from bulleted list. • In Section 21.2, “PLL Power Supply Filtering,” in the second paragraph, changed “provide five independent filter circuits,” and “the five AVDD pins” to provide four independent filter circuits,” and “the four AVDD pins.” • In Table 62, updated note 1 to say the following: “For temperature range = C, processor frequency is limited to 400 with a platform frequency of 266.” • In Table 3, “Output Drive Capability,” changed the values in the Output Impedance column and added USB to the seventh row. • In Section 21.7, “Pull-Up Resistor Requirements,“ deleted last two paragraphs and after first paragraph, added a new paragraph. • Deleted Section 21.8, “JTAG Configuration Signals,” and Figure 43, “JTAG Interface Connection.” • Page 1, updated first paragraph to reflect PowerQUICC II Pro information. • In Table 18, “DDR and DDR2 SDRAM Input AC Timing Specifications,” added note 2 to tCISKEW and deleted original note 3; renumbered the remaining notes. • In Figure 38, “JTAG Interface Connection,” updated with new figure. • In Figure 38, “JTAG Interface Connection,” updated with new figure. • In Section 23, “Ordering Information,” replaced first paragraph and added a note. • In Section 23.1, “Part Numbers Fully Addressed by this Document,” replaced first paragraph. Table 19, “DDR and DDR2 SDRAM Output AC Timing Specifications,” modified Tddkhds for 333 MHz from 900 ps to 775 ps. 7 2/2009 6 4/2007 5 3/2007 4 12/2006 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 77 Document Revision History Table 64. Document Revision History (continued) Rev. Number 3 Date 11/2006 Substantive Change(s) • Updated note in introduction. • In the features list in Section 1, “Overview,” updated DDR data rate to show 266 MHz for PBGA parts for all silicon revisions. • In Table 57, “Suggested PLL Configurations,” added the following row: • Ref No: 823, SPMF: 1000, Core PLL: 0100011, 400-MHz Device Input Clock Freq: 33, CSB Freq: 266, and Core Freq: 400. • In Section 23, “Ordering Information,” replicated note from document introduction. • Changed all references to revision 2.0 silicon to revision 3.0 silicon. • Changed number of general purpose parallel I/O pins to 39 in Section 1, “Overview.” • Changed VIH minimum value in Table 35, “JTAG Interface DC Electrical Characteristics,” to OVDD – 0.3. • In Table 40, “PCI DC Electrical Characteristics,” changed high-level input voltage values to min = 2 and max = OVDD + 0.3; changed low-level input voltage values to min = (–0.3) and max = 0.8. • In Table 44, “PCI DC Electrical Characteristics,” changed high-level input voltage values to min = 2 and max = OVDD + 0.3; changed low-level input voltage values to min = (–0.3) and max = 0.8. • In Table 44, “PCI DC Electrical Characteristics,” changed higl-level input voltage values to min = 2 and max = OVDD + 0.3; changed low-level input voltage values to min = (–0.3) and max = 0.8. • Updated DDR2 I/O power values in Table 5, “MPC8347EA Typical I/O Power Dissipation.” • • Removed Table 20, “Timing Parameters for DDR2-400.” • Changed ADDR/CMD to ADDR/CMD/MODT in Table 9, “DDR and DDR2 SDRAM Output AC Timing Specifications,” rows 2 and 3, and in Figure 2, “DDR SDRAM Output Timing Diagram. • Changed Min and Max values for VIH and VIL in Table 40Table 44,“PCI DC Electrical Characteristics.” • In Table 58, “MPC8343EA (PBGA) Pinout Listing,” and Table 52, “MPC8347EA (PBGA) Pinout Listing,” modified rows for MDICO and MDIC1 signals and added note ‘It is recommended that MDICO be tied to GRD using an 18 Ω resistor and MCIC1 be tied to DDR power using an 18 Ω resistor.’ • Table 58, “MPC8343EA (PBGA) Pinout Listing,” in row AVDD3 changed power supply from “AVDD3” to ‘—.’ Initial public release. 2 8/2006 1 4/2006 0 3/2006 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10 78 Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale, the Freescale logo and PowerQUICC are trademarks of Freescale Semiconductor, Inc. Reg. U.S. Pat. & Tm. Off. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. © 2006–2010 Freescale Semiconductor, Inc. Document Number: MPC8343EAEC Rev. 10 10/2010