MPC8545VTAQJ

Freescale Semiconductor Technical Data Document Number: MPC8548EEC Rev. 6, 12/2009 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications 1 Overview Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . 10 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14 Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 18 DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 19 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Enhanced Three-Speed Ethernet (eTSEC) . . . . . . . . 26 Ethernet Management Interface Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Programmable Interrupt Controller . . . . . . . . . . . . . 51 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 PCI/PCI-X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 60 PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Serial RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 87 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 System Design Information . . . . . . . . . . . . . . . . . . 128 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 137 Document Revision History . . . . . . . . . . . . . . . . . . 141 This section provides a high-level overview of MPC8548E features. Figure 1 shows the major functional units within the MPC8548E. Although this document is written from the perspective of the MPC8548E, most of the material applies to the other family members—MPC8547E, MPC8545E, and MPC8543E—as well. When specific differences occur, such as pinout differences and processor frequency ranges, they will be identified as such. For specific PVR and SVR numbers, refer to the MPC8548E PowerQUICC™ III Integrated Processor Family Reference Manual. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. © Freescale Semiconductor, Inc., 2009. All rights reserved. Overview DDR SDRAM Flash SDRAM GPIO IRQs Serial I2C I2C MII, GMII, TBI, RTBI, RGMII, RMII MII, GMII, TBI, RTBI, RGMII, RMII MII, GMII, TBI, RTBI, RGMII, RMII RTBI, RGMII, RMII DDR/DDR2/ Memory Controller Security Engine XOR Engine 512-Kbyte L2 Cache/ SRAM Local Bus Controller Programmable Interrupt Controller (PIC) DUART I2C Controller I2C Controller eTSEC 10/100/1Gb eTSEC 10/100/1Gb eTSEC 10/100/1Gb eTSEC 10/100/1Gb e500 Core 32-Kbyte L1 Instruction Cache 32-Kbyte L1 Data Cache e500 Coherency Module Core Complex Bus Serial RapidIO™ or PCI Express OceaN Switch Fabric 32-bit PCI Bus Interface (If 64-bit not used) 32-bit PCI/ 64-bit PCI/PCI-X Bus Interface 4-Channel DMA Controller 4x RapidIO x8 PCI Express PCI 32-bit 66 MHz PCI/PCI-X 133 MHz Figure 1. MPC8548E Block Diagram 1.1 Key Features The following list provides an overview of the MPC8548E feature set: • High-performance 32-bit core built on Power Architecture™ technology. — 32-Kbyte L1 instruction cache and 32-Kbyte L1 data cache with parity protection. Caches can be locked entirely or on a per-line basis, with separate locking for instructions and data. — Signal-processing engine (SPE) APU (auxiliary processing unit). Provides an extensive instruction set for vector (64-bit) integer and fractional operations. These instructions use both the upper and lower words of the 64-bit GPRs as they are defined by the SPE APU. — Double-precision floating-point APU. Provides an instruction set for double-precision (64-bit) floating-point instructions that use the 64-bit GPRs. — 36-bit real addressing — Embedded vector and scalar single-precision floating-point APUs. Provide an instruction set for single-precision (32-bit) floating-point instructions. — Memory management unit (MMU). Especially designed for embedded applications. Supports 4-Kbyte–4-Gbyte page sizes. — Enhanced hardware and software debug support MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 2 Freescale Semiconductor Overview — Performance monitor facility that is similar to, but separate from, the MPC8548E performance monitor The e500 defines features that are not implemented on this device. It also generally defines some features that this device implements more specifically. An understanding of these differences can be critical to ensure proper operations. • 512-Kbyte L2 cache/SRAM — Flexible configuration. — Full ECC support on 64-bit boundary in both cache and SRAM modes — Cache mode supports instruction caching, data caching, or both. — External masters can force data to be allocated into the cache through programmed memory ranges or special transaction types (stashing). — 1, 2, or 4 ways can be configured for stashing only. — Eight-way set-associative cache organization (32-byte cache lines) — Supports locking entire cache or selected lines. Individual line locks are set and cleared through Book E instructions or by externally mastered transactions. — Global locking and Flash clearing done through writes to L2 configuration registers — Instruction and data locks can be Flash cleared separately. — SRAM features include the following: – I/O devices access SRAM regions by marking transactions as snoopable (global). – Regions can reside at any aligned location in the memory map. – Byte-accessible ECC is protected using read-modify-write transaction accesses for smaller-than-cache-line accesses. • Address translation and mapping unit (ATMU) — Eight local access windows define mapping within local 36-bit address space. — Inbound and outbound ATMUs map to larger external address spaces. – Three inbound windows plus a configuration window on PCI/PCI-X and PCI Express – Four inbound windows plus a default window on RapidIO™ – Four outbound windows plus default translation for PCI/PCI-X and PCI Express – Eight outbound windows plus default translation for RapidIO with segmentation and sub-segmentation support • DDR/DDR2 memory controller — Programmable timing supporting DDR and DDR2 SDRAM — 64-bit data interface — Four banks of memory supported, each up to 4 Gbytes, to a maximum of 16 Gbytes — DRAM chip configurations from 64 Mbits to 4 Gbits with ×8/×16 data ports — Full ECC support — Page mode support – Up to 16 simultaneous open pages for DDR MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 3 Overview • • – Up to 32 simultaneous open pages for DDR2 — Contiguous or discontiguous memory mapping — Read-modify-write support for RapidIO atomic increment, decrement, set, and clear transactions — Sleep mode support for self-refresh SDRAM — On-die termination support when using DDR2 — Supports auto refreshing — On-the-fly power management using CKE signal — Registered DIMM support — Fast memory access via JTAG port — 2.5-V SSTL_2 compatible I/O (1.8-V SSTL_1.8 for DDR2) — Support for battery-backed main memory Programmable interrupt controller (PIC) — Programming model is compliant with the OpenPIC architecture. — Supports 16 programmable interrupt and processor task priority levels — Supports 12 discrete external interrupts — Supports 4 message interrupts with 32-bit messages — Supports connection of an external interrupt controller such as the 8259 programmable interrupt controller — Four global high resolution timers/counters that can generate interrupts — Supports a variety of other internal interrupt sources — Supports fully nested interrupt delivery — Interrupts can be routed to external pin for external processing. — Interrupts can be routed to the e500 core’s standard or critical interrupt inputs. — Interrupt summary registers allow fast identification of interrupt source. Integrated security engine (SEC) optimized to process all the algorithms associated with IPSec, IKE, WTLS/WAP, SSL/TLS, and 3GPP — Four crypto-channels, each supporting multi-command descriptor chains – Dynamic assignment of crypto-execution units via an integrated controller – Buffer size of 256 bytes for each execution unit, with flow control for large data sizes — PKEU—public key execution unit – RSA and Diffie-Hellman; programmable field size up to 2048 bits – Elliptic curve cryptography with F2m and F(p) modes and programmable field size up to 511 bits — DEU—Data Encryption Standard execution unit – DES, 3DES – Two key (K1, K2) or three key (K1, K2, K3) – ECB and CBC modes for both DES and 3DES MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 4 Freescale Semiconductor Overview • • • • — AESU—Advanced Encryption Standard unit – Implements the Rijndael symmetric key cipher – ECB, CBC, CTR, and CCM modes – 128-, 192-, and 256-bit key lengths — AFEU—ARC four execution unit – Implements a stream cipher compatible with the RC4 algorithm – 40- to 128-bit programmable key — MDEU—message digest execution unit – SHA with 160- or 256-bit message digest – MD5 with 128-bit message digest – HMAC with either algorithm — KEU—Kasumi execution unit – Implements F8 algorithm for encryption and F9 algorithm for integrity checking – Also supports A5/3 and GEA-3 algorithms — RNG—random number generator — XOR engine for parity checking in RAID storage applications Dual I2C controllers — Two-wire interface — Multiple master support — Master or slave I2C mode support — On-chip digital filtering rejects spikes on the bus Boot sequencer — Optionally loads configuration data from serial ROM at reset via the I2C interface — Can be used to initialize configuration registers and/or memory — Supports extended I2C addressing mode — Data integrity checked with preamble signature and CRC DUART — Two 4-wire interfaces (SIN, SOUT, RTS, CTS) — Programming model compatible with the original 16450 UART and the PC16550D Local bus controller (LBC) — Multiplexed 32-bit address and data bus operating at up to 133 MHz — Eight chip selects support eight external slaves — Up to eight-beat burst transfers — The 32-, 16-, and 8-bit port sizes are controlled by an on-chip memory controller. — Three protocol engines available on a per chip select basis: – General-purpose chip select machine (GPCM) – Three user programmable machines (UPMs) MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 5 Overview • – Dedicated single data rate SDRAM controller — Parity support — Default boot ROM chip select with configurable bus width (8, 16, or 32 bits) Four enhanced three-speed Ethernet controllers (eTSECs) — Three-speed support (10/100/1000 Mbps) — Four controllers designed to comply with IEEE Std. 802.3™, 802.3u™, 802.3x™, 802.3z™, 802.3ac™, and 802.3ab™ — Support for various Ethernet physical interfaces: – 1000 Mbps full-duplex IEEE 802.3 GMII, IEEE 802.3z TBI, RTBI, and RGMII – 10/100 Mbps full and half-duplex IEEE 802.3 MII, IEEE 802.3 RGMII, and RMII — Flexible configuration for multiple PHY interface configurations. See Section 8.1, “Enhanced Three-Speed Ethernet Controller (eTSEC) (10/100/1Gb Mbps)—GMII/MII/TBI/RGMII/RTBI/RMII Electrical Characteristics,” for more information. — TCP/IP acceleration and QoS features available – IP v4 and IP v6 header recognition on receive – IP v4 header checksum verification and generation – TCP and UDP checksum verification and generation – Per-packet configurable acceleration – Recognition of VLAN, stacked (queue in queue) VLAN, IEEE Std 802.2™, PPPoE session, MPLS stacks, and ESP/AH IP-security headers – Supported in all FIFO modes — Quality of service support: – Transmission from up to eight physical queues – Reception to up to eight physical queues — Full- and half-duplex Ethernet support (1000 Mbps supports only full duplex): – IEEE 802.3 full-duplex flow control (automatic PAUSE frame generation or software-programmed PAUSE frame generation and recognition) — Programmable maximum frame length supports jumbo frames (up to 9.6 Kbytes) and IEEE Std. 802.1™ virtual local area network (VLAN) tags and priority — VLAN insertion and deletion – Per-frame VLAN control word or default VLAN for each eTSEC – Extracted VLAN control word passed to software separately — Retransmission following a collision — CRC generation and verification of inbound/outbound frames — Programmable Ethernet preamble insertion and extraction of up to 7 bytes — MAC address recognition: – Exact match on primary and virtual 48-bit unicast addresses MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 6 Freescale Semiconductor Overview • • • – VRRP and HSRP support for seamless router fail-over – Up to 16 exact-match MAC addresses supported – Broadcast address (accept/reject) – Hash table match on up to 512 multicast addresses – Promiscuous mode — Buffer descriptors backward compatible with MPC8260 and MPC860T 10/100 Ethernet programming models — RMON statistics support — 10-Kbyte internal transmit and 2-Kbyte receive FIFOs — MII management interface for control and status — Ability to force allocation of header information and buffer descriptors into L2 cache OCeaN switch fabric — Full crossbar packet switch — Reorders packets from a source based on priorities — Reorders packets to bypass blocked packets — Implements starvation avoidance algorithms — Supports packets with payloads of up to 256 bytes Integrated DMA controller — Four-channel controller — All channels accessible by both the local and remote masters — Extended DMA functions (advanced chaining and striding capability) — Support for scatter and gather transfers — Misaligned transfer capability — Interrupt on completed segment, link, list, and error — Supports transfers to or from any local memory or I/O port — Selectable hardware-enforced coherency (snoop/no snoop) — Ability to start and flow control each DMA channel from external 3-pin interface — Ability to launch DMA from single write transaction Two PCI/PCI-X controllers — PCI 2.2 and PCI-X 1.0 compatible — One 32-/64-bit PCI/PCI-X port with support for speeds of up to 133 MHz (maximum PCI-X frequency in synchronous mode is 110 MHz) — One 32-bit PCI port with support for speeds from 16 to 66 MHz (available when the other port is in 32-bit mode) — Host and agent mode support — 64-bit dual address cycle (DAC) support — PCI-X supports multiple split transactions — Supports PCI-to-memory and memory-to-PCI streaming MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 7 Overview • • — Memory prefetching of PCI read accesses — Supports posting of processor-to-PCI and PCI-to-memory writes — PCI 3.3-V compatible — Selectable hardware-enforced coherency Serial RapidIO™ interface unit — Supports RapidIO™ Interconnect Specification, Revision 1.2 — Both 1× and 4× LP-serial link interfaces — Long- and short-haul electricals with selectable pre-compensation — Transmission rates of 1.25, 2.5, and 3.125 Gbaud (data rates of 1.0, 2.0, and 2.5 Gbps) per lane — Auto detection of 1×- and 4×-mode operation during port initialization — Link initialization and synchronization — Large and small size transport information field support selectable at initialization time — 34-bit addressing — Up to 256 bytes data payload — All transaction flows and priorities — Atomic set/clr/inc/dec for read-modify-write operations — Generation of IO_READ_HOME and FLUSH with data for accessing cache-coherent data at a remote memory system — Receiver-controlled flow control — Error detection, recovery, and time-out for packets and control symbols as required by the RapidIO specification — Register and register bit extensions as described in part VIII (Error Management) of the RapidIO specification — Hardware recovery only — Register support is not required for software-mediated error recovery. — Accept-all mode of operation for fail-over support — Support for RapidIO error injection — Internal LP-serial and application interface-level loopback modes — Memory and PHY BIST for at-speed production test RapidIO-compatible message unit — 4 Kbytes of payload per message — Up to sixteen 256-byte segments per message — Two inbound data message structures within the inbox — Capable of receiving three letters at any mailbox — Two outbound data message structures within the outbox — Capable of sending three letters simultaneously — Single segment multicast to up to 32 devIDs — Chaining and direct modes in the outbox MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 8 Freescale Semiconductor Overview • • • • • • — Single inbound doorbell message structure — Facility to accept port-write messages PCI Express interface — PCI Express 1.0a compatible — Supports ×8, ×4, ×2, and ×1 link widths — Auto-detection of number of connected lanes — Selectable operation as root complex or endpoint — Both 32- and 64-bit addressing — 256-byte maximum payload size — Virtual channel 0 only — Traffic class 0 only — Full 64-bit decode with 32-bit wide windows Pin multiplexing for the high speed I/O interfaces supports one of the following configurations: — ×8 PCI Express — ×4 PCI Express and 4× serial RapidIO Power management — Supports power saving modes: doze, nap, and sleep — Employs dynamic power management, which automatically minimizes power consumption of blocks when they are idle System performance monitor — Supports eight 32-bit counters that count the occurrence of selected events — Ability to count up to 512 counter-specific events — Supports 64 reference events that can be counted on any of the eight counters — Supports duration and quantity threshold counting — Burstiness feature that permits counting of burst events with a programmable time between bursts — Triggering and chaining capability — Ability to generate an interrupt on overflow System access port — Uses JTAG interface and a TAP controller to access entire system memory map — Supports 32-bit accesses to configuration registers — Supports cache-line burst accesses to main memory — Supports large block (4-Kbyte) uploads and downloads — Supports continuous bit streaming of entire block for fast upload and download JTAG boundary scan, designed to comply with IEEE Std. 1149.1™ MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 9 Electrical Characteristics 2 Electrical Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8548E. This device is currently targeted to these specifications. Some of these specifications are independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design specifications. 2.1 Overall DC Electrical Characteristics This section covers the ratings, conditions, and other characteristics. 2.1.1 Absolute Maximum Ratings Table 1. Absolute Maximum Ratings 1 Characteristic Symbol VDD AVDD SVDD XVDD GVDD LVDD (for eTSEC1 and eTSEC2) TVDD (for eTSEC3 and eTSEC4) Max Value –0.3 to 1.21 –0.3 to 1.21 –0.3 to 1.21 –0.3 to 1.21 –0.3 to 2.75 –0.3 to 1.98 –0.3 to 3.63 –0.3 to 2.75 –0.3 to 3.63 –0.3 to 2.75 –0.3 to 3.63 –0.3 to 3.63 –0.3 to 2.75 –0.3 to (GVDD + 0.3) –0.3 to (GVDD/2 + 0.3) –0.3 to (LVDD + 0.3) –0.3 to (TVDD + 0.3) –0.3 to (BVDD + 0.3) –0.3 to (OVDD + 0.3) V V V V V — V Unit V V V V V V Notes — — — — — 3 3 Table 1 provides the absolute maximum ratings. Core supply voltage PLL supply voltage Core power supply for SerDes transceivers Pad power supply for SerDes transceivers DDR and DDR2 DRAM I/O voltage Three-speed Ethernet I/O voltage PCI/PCI-X, DUART, system control and power management, I2C, Ethernet MII management, and JTAG I/O voltage Local bus I/O voltage Input voltage DDR/DDR2 DRAM signals DDR/DDR2 DRAM reference Three-speed Ethernet I/O signals Local bus signals DUART, SYSCLK, system control and power management, I2C, Ethernet MII management, and JTAG signals PCI/PCI-X OVDD BVDD MVIN MVREF LVIN TVIN BVIN OVIN — — 4 — 4 — 4 OVIN –0.3 to (OVDD + 0.3) V 4 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 10 Freescale Semiconductor Electrical Characteristics Table 1. Absolute Maximum Ratings 1 (continued) Characteristic Storage temperature range Symbol TSTG Max Value –55 to 150 Unit °C Notes — Notes: 1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2. The –0.3 to 2.75 V range is for DDR and –0.3 to 1.98 V range is for DDR2. 3. The 3.63 V maximum is only supported when the port is configured in GMII, MII, RMII, or TBI modes; otherwise the 2.75 V maximum applies. See Section 8.2, “FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing Specifications,” for details on the recommended operating conditions per protocol. 4. (M,L,O)VIN may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2. 2.1.2 Recommended Operating Conditions Table 2 provides the recommended operating conditions for this device. Note that the values in Table 2 are the recommended and tested operating conditions. Proper device operation outside these conditions is not guaranteed. Table 2. Recommended Operating Conditions Characteristic Core supply voltage PLL supply voltage Core power supply for SerDes transceivers Pad power supply for SerDes transceivers DDR and DDR2 DRAM I/O voltage Three-speed Ethernet I/O voltage Symbol VDD AVDD SVDD XVDD GVDD LVDD TVDD PCI/PCI-X, DUART, system control and power management, I2C, Ethernet MII management, and JTAG I/O voltage Local bus I/O voltage Input voltage DDR and DDR2 DRAM signals DDR and DDR2 DRAM reference Three-speed Ethernet signals Local bus signals PCI, DUART, SYSCLK, system control and power management, I2C, Ethernet MII management, and JTAG signals OV DD BVDD MVIN MVREF LVIN TVIN BVIN OVIN Recommended Value 1.1 V ± 55 mV 1.1 V ± 55 mV 1.1 V ± 55 mV 1.1 V ± 55 mV 2.5 V ± 125 mV 1.8 V ± 90 mV 3.3 V ± 165 mV 2.5 V ± 125 mV 3.3 V ± 165 mV 2.5 V ± 125 mV 3.3 V ± 165 mV 3.3 V ± 165 mV 2.5 V ± 125 mV GND to GVDD GND to GVDD/2 GND to LVDD GND to TVDD GND to BVDD GND to OVDD Unit V V V V V V — V V V V V V V Notes — 1 — — — 4 4 3 — 2 2 4 — 3 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 11 Electrical Characteristics Table 2. Recommended Operating Conditions (continued) Characteristic Junction temperature range Symbol Tj Recommended Value 0 to 105 Unit °C Notes — Notes: 1. This voltage is the input to the filter discussed in Section 21.2, “PLL Power Supply Filtering,” and not necessarily the voltage at the AVDD pin, which may be reduced from V DD by the filter. 2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 3. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 4. Caution: L/TVIN must not exceed L/TVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. Figure 2 shows the undershoot and overshoot voltages at the interfaces of this device. B/G/L/O/TVDD + 20% B/G/L/O/TVDD + 5% VIH B/G/L/O/TVDD GND GND – 0.3 V VIL GND – 0.7 V Not to Exceed 10% of tCLOCK1 Notes: 1. tCLOCK refers to the clock period associated with the respective interface: For I2C and JTAG, tCLOCK references SYSCLK. For DDR, tCLOCK references MCLK. For eTSEC, tCLOCK references EC_GTX_CLK125. For LBIU, tCLOCK references LCLK. For PCI, tCLOCK references PCIn_CLK or SYSCLK. For SerDes, tCLOCK references SD_REF_CLK. 2. Please note that with the PCI overshoot allowed (as specified above), the device does not fully comply with the maximum AC ratings and device protection guideline outlined in the PCI rev. 2.2 standard (section 4.2.2.3). Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD/BVDD/TVDD The core voltage must always be provided at nominal 1.1 V. Voltage to the processor interface I/Os are provided through separate sets of supply pins and must be provided at the voltages shown in Table 2. The input voltage threshold scales with respect to the associated I/O supply voltage. OVDD and LVDD based receivers are simple CMOS I/O circuits and satisfy appropriate LVCMOS type specifications. The DDR SDRAM interface uses a single-ended differential receiver referenced the externally supplied MVREF signal (nominally set to GVDD/2) as is appropriate for the SSTL2 electrical signaling standard. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 12 Freescale Semiconductor Electrical Characteristics 2.1.3 Output Driver Characteristics Table 3 provides information on the characteristics of the output driver strengths. The values are preliminary estimates. Table 3. Output Drive Capability Driver Type Local bus interface utilities signals Programmable Output Impedance (Ω ) 25 25 45(default) 45(default) PCI signals 25 45(default) DDR signal DDR2 signal TSEC/10/100 signals DUART, system control, JTAG I2C 18 36 (half strength mode) 18 36 (half strength mode) 45 45 150 GVDD = 2.5 V GVDD = 1.8 V L/TVDD = 2.5/3.3 V OVDD = 3.3 V OVDD = 3.3 V 3 3 — — — Supply Voltage BVDD = 3.3 V BVDD = 2.5 V BVDD = 3.3 V BVDD = 2.5 V OVDD = 3.3 V 2 Notes 1 Notes: 1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in PORIMPSCR. 2. The drive strength of the PCI interface is determined by the setting of the PCI_GNT1 signal at reset. 3. The drive strength of the DDR interface in half-strength mode is at Tj = 105°C and at GVDD (min). 2.2 Power Sequencing The device requires its power rails to be applied in a specific sequence in order to ensure proper device operation. These requirements are as follows for power-up: 1. VDD, AVDD_n, BVDD, LVDD, OVDD, SVDD, TVDD, XVDD 2. GVDD All supplies must be at their stable values within 50 ms. NOTE Items on the same line have no ordering requirement with respect to one another. Items on separate lines must be ordered sequentially such that voltage rails on a previous step must reach 90% of their value before the voltage rails on the current step reach 10% of theirs. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 13 Power Characteristics NOTE In order to guarantee MCKE low during power-up, the above sequencing for GVDD is required. If there is no concern about any of the DDR signals being in an indeterminate state during power-up, then the sequencing for GVDD is not required. NOTE From a system standpoint, if any of the I/O power supplies ramp prior to the VDD core supply, the I/Os associated with that I/O supply may drive a logic one or zero during power-up, and extra current may be drawn by the device. 3 Power Characteristics Table 4. MPC8548E Power Dissipation CCB Frequency1 400 Core Frequency 800 1000 1200 500 533 1500 1333 SLEEP 2 2.7 2.7 2.7 11.5 6.2 Typical-653 4.6 5.0 5.4 13.6 7.9 Typical-1054 7.5 7.9 8.3 16.5 10.8 Maximum5 8.1 8.5 8.9 18.6 12.8 W W Unit W W The estimated typical power dissipation for the core complex bus (CCB) versus the core frequency for this family of PowerQUICC III devices is shown in Table 4. Notes: 1. CCB frequency is the SoC platform frequency, which corresponds to the DDR data rate. 2. SLEEP is based on VDD = 1.1 V, Tj = 65°C. 3. Typical-65 is based on VDD = 1.1 V, Tj = 65°C, running Dhrystone. 4. Typical-105 is based on VDD = 1.1 V, Tj = 105°C, running Dhrystone. 5. Maximum is based on V DD = 1.1 V, Tj = 105°C, running a smoke test. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 14 Freescale Semiconductor Input Clocks 4 4.1 Input Clocks System Clock Timing Table 5. SYSCLK AC Timing Specifications This section discusses the timing for the input clocks. Table 5 provides the system clock (SYSCLK) AC timing specifications for the MPC8548E. At recommended operating conditions (see Table 2) with OVDD = 3.3 V ± 165 mV. Parameter/Condition SYSCLK frequency SYSCLK cycle time SYSCLK rise and fall time SYSCLK duty cycle SYSCLK jitter Symbol fSYSCLK tSYSCLK tKH, tKL tKHK/tSYSCLK — Min 16 7.5 0.6 40 — Typ — — 1.0 — — Max 133 60 1.2 60 ± 150 Unit MHz ns ns % ps Notes 1, 6, 7, 8 6, 7, 8 2 3 4, 5 Notes: 1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum operating frequencies.Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2. Rise and fall times for SYSCLK are measured at 0.6 and 2.7 V. 3. Timing is guaranteed by design and characterization. 4. This represents the total input jitter—short term and long term—and is guaranteed by design. 5. The SYSCLK driver’s closed loop jitter bandwidth should be = VTX-DIFFp-p-MIN >= 505 mV (4 dB) 0.07 UI = UI – 0.3 UI (JTX-TOTAL-MAX) [Transition Bit] VTX-DIFFp-p-MIN = 800 mV Figure 48. Minimum Transmitter Timing and Voltage Output Compliance Specifications 16.4.3 Differential Receiver (RX) Input Specifications Table 53 defines the specifications for the differential input at all receivers (RXs). The parameters are specified at the component pins. Table 53. Differential Receiver (RX) Input Specifications Symbol UI Parameter Unit interval Min 399.88 Nom 400 Max 400.12 Unit ps Comments Each UI is 400 ps ± 300 ppm. UI does not account for spread spectrum clock dictated variations. See Note 1. VRX-DIFFp-p = 2 × |VRX-D+ – VRX-D–|. See Note 2. VRX-DIFFp-p Differential peak-to-peak input voltage Minimum receiver eye width Maximum time between the jitter median and maximum deviation from the median 0.175 — 1.200 V TRX-EYE 0.4 — — UI The maximum interconnect media and transmitter jitter that can be tolerated by the receiver can be derived as TRX-MAX-JITTER = 1 – TRX-EYE = 0.6 UI. See Notes 2 and 3. Jitter is defined as the measurement variation of the crossing points (VRX-DIFFp-p = 0 V) in relation to a recovered TX UI. A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. Jitter is measured using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX UI. See Notes 2, 3, and 7. TRX-EYE-MEDIAN-toMAX-JITTER — — 0.3 UI MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 73 PCI Express Table 53. Differential Receiver (RX) Input Specifications (continued) Symbol VRX-CM-ACp Parameter AC peak common mode input voltage Differential return loss Common mode return loss DC differential input impedance DC input impedance Powered down DC input impedance Electrical idle detect threshold Unexpected electrical idle enter detect threshold integration time Min — Nom — Max 150 Unit mV Comments VRX-CM-ACp = |VRXD+ – V RXD-|/2 + VRX-CM-DC VRX-CM-DC = DC (avg) of |VRX-D+ + VRX-D–| ÷ 2. See Note 2. Measured over 50 MHz to 1.25 GHz with the D+ and D– lines biased at +300 mV and –300 mV, respectively. See Note 4. Measured over 50 MHz to 1.25 GHz with the D+ and D– lines biased at 0 V. See Note 4. RX DC differential mode impedance. See Note 5. Required RX D+ as well as D– DC impedance (50 ± 20% tolerance). See Notes 2 and 5. Required RX D+ as well as D– DC impedance when the receiver terminations do not have power. See Note 6. VRX-IDLE-DET-DIFFp-p = 2 × |VRX-D+ –VRX-D–|. Measured at the package pins of the receiver An unexpected electrical idle (VRX-DIFFp-p < VRX-IDLE-DET-DIFFp-p) must be recognized no longer than TRX-IDLE-DET-DIFF-ENTERING to signal an unexpected idle condition. RLRX-DIFF 15 — — dB RLRX-CM ZRX-DIFF-DC ZRX-DC ZRX-HIGH-IMP-DC 6 80 40 200 k — 100 50 — — 120 60 — dB Ω Ω Ω VRX-IDLE-DET-DIFFp-p TRX-IDLE-DET-DIFFENTERTIME 65 — — — 175 10 mV ms MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 74 Freescale Semiconductor PCI Express Table 53. Differential Receiver (RX) Input Specifications (continued) Symbol LTX-SKEW Parameter Total Skew Min — Nom — Max 20 Unit ns Comments Skew across all lanes on a Link. This includes variation in the length of SKP ordered set (for example, COM and one to five symbols) at the RX as well as any delay differences arising from the interconnect itself. Notes: 1. No test load is necessarily associated with this value. 2. Specified at the measurement point and measured over any 250 consecutive UIs. The test load in Figure 50 should be used as the RX device when taking measurements (also refer to the receiver compliance eye diagram shown in Figure 49). If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must be used as a reference for the eye diagram. 3. A TRX-EYE = 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the transmitter and interconnect collected any 250 consecutive UIs. The TRX-EYE-MEDIAN-to-MAX-JITTER specification ensures a jitter distribution in which the median and the maximum deviation from the median is less than half of the total. UI jitter budget collected over any 250 consecutive TX UIs. It should be noted that the median is not the same as the mean. The jitter median describes the point in time where the number of jitter points on either side is approximately equal as opposed to the averaged time value. If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must be used as the reference for the eye diagram. 4. The receiver input impedance shall result in a differential return loss greater than or equal to 15 dB with the D+ line biased to 300 mV and the D– line biased to –{300 mV and a common mode return loss greater than or equal to 6 dB (no bias required) over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The reference impedance for return loss measurements for is 50 Ω to ground for both the D+ and D– line (that is, as measured by a vector network analyzer with 50-Ω probes—see Figure 50). Note: that the series capacitors CTX is optional for the return loss measurement. 5. Impedance during all LTSSM states. When transitioning from a fundamental reset to detect (the initial state of the LTSSM) there is a 5 ms transition time before receiver termination values must be met on all unconfigured lanes of a port. 6. The RX DC common mode Impedance that exists when no power is present or fundamental reset is asserted. This helps ensure that the receiver detect circuit will not falsely assume a receiver is powered on when it is not. This term must be measured at 300 mV above the RX ground. 7. It is recommended that the recovered TX UI is calculated using all edges in the 3500 consecutive UI interval with a fit algorithm using a minimization merit function. Least squares and median deviation fits have worked well with experimental and simulated data. 16.5 Receiver Compliance Eye Diagrams The RX eye diagram in Figure 49 is specified using the passive compliance/test measurement load (see Figure 50) in place of any real PCI Express RX component. Note: In general, the minimum receiver eye diagram measured with the compliance/test measurement load (see Figure 50) will be larger than the minimum receiver eye diagram measured over a range of systems at the input receiver of any real PCI Express component. The degraded eye diagram at the input receiver is due to traces internal to the package as well as silicon parasitic characteristics which cause the real PCI Express component to vary in impedance from the compliance/test measurement load. The input receiver eye diagram is implementation specific and is not specified. RX component designer should provide additional margin to adequately compensate for the degraded minimum receiver eye diagram (shown in Figure 49) expected at the input receiver based on some adequate combination of system simulations and the return loss measured looking into the RX package and silicon. The RX eye diagram must be aligned in time using the jitter median to locate the center of the eye diagram. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 75 PCI Express The eye diagram must be valid for any 250 consecutive UIs. A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX UI. NOTE The reference impedance for return loss measurements is 50. to ground for both the D+ and D– line (that is, as measured by a vector network analyzer with 50-Ω probes—see Figure 50). Note that the series capacitors, CTX, are optional for the return loss measurement. VRX-DIFF = 0 mV (D+ D– Crossing Point) VRX-DIFF = 0 mV (D+ D– Crossing Point) VRX-DIFFp-p-MIN > 175 mV 0.4 UI = TRX-EYE-MIN Figure 49. Minimum Receiver Eye Timing and Voltage Compliance Specification 16.5.1 Compliance Test and Measurement Load The AC timing and voltage parameters must be verified at the measurement point, as specified within 0.2 inches of the package pins, into a test/measurement load shown in Figure 50. NOTE The allowance of the measurement point to be within 0.2 inches of the package pins is meant to acknowledge that package/board routing may benefit from D+ and D– not being exactly matched in length at the package pin boundary. D+ Package Pin TX Silicon + Package D– Package Pin C = C TX R = 50 Ω R = 50 Ω C = C TX Figure 50. Compliance Test/Measurement Load MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 76 Freescale Semiconductor Serial RapidIO 17 Serial RapidIO This section describes the DC and AC electrical specifications for the RapidIO interface of the MPC8548E, for the LP-Serial physical layer. The electrical specifications cover both single- and multiple-lane links. Two transmitters (short and long run) and a single receiver are specified for each of three baud rates, 1.25, 2.50, and 3.125 GBaud. Two transmitter specifications allow for solutions ranging from simple board-to-board interconnect to driving two connectors across a backplane. A single receiver specification is given that will accept signals from both the short- and long-run transmitter specifications. The short-run transmitter should be used mainly for chip-to-chip connections on either the same printed-circuit board or across a single connector. This covers the case where connections are made to a mezzanine (daughter) card. The minimum swings of the short-run specification reduce the overall power used by the transceivers. The long-run transmitter specifications use larger voltage swings that are capable of driving signals across backplanes. This allows a user to drive signals across two connectors and a backplane. The specifications allow a distance of at least 50 cm at all baud rates. All unit intervals are specified with a tolerance of ±100 ppm. The worst case frequency difference between any transmit and receive clock will be 200 ppm. To ensure interoperability between drivers and receivers of different vendors and technologies, AC coupling at the receiver input must be used. 17.1 DC Requirements for Serial RapidIO SD_REF_CLK and SD_REF_CLK For more information, see Section 15.2, “SerDes Reference Clocks.” 17.2 AC Requirements for Serial RapidIO SD_REF_CLK and SD_REF_CLK Table 54. SD_REF_CLK and SD_REF_CLK AC Requirements Table 54 lists the Serial RapidIO SD_REF_CLK and SD_REF_CLK AC requirements. Symbol tREF Parameter Description REFCLK cycle time Min — Typ 10(8) Max — Unit ns Comments 8 ns applies only to serial RapidIO with 125-MHz reference clock — — tREFCJ tREFPJ REFCLK cycle-to-cycle jitter. Difference in the period of any two adjacent REFCLK cycles. Phase jitter. Deviation in edge location with respect to mean edge location. — –40 — — 80 40 ps ps MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 77 Serial RapidIO 17.3 Signal Definitions LP-serial links use differential signaling. This section defines terms used in the description and specification of differential signals. Figure 51 shows how the signals are defined. The figures show waveforms for either a transmitter output (TD and TD) or a receiver input (RD and RD). Each signal swings between A volts and B volts where A > B. Using these waveforms, the definitions are as follows: 1. The transmitter output signals and the receiver input signals TD, TD, RD, and RD each have a peak-to-peak swing of A – B volts. 2. The differential output signal of the transmitter, VOD, is defined as VTD – VTD. 3. The differential input signal of the receiver, VID, is defined as VRD – VRD. 4. The differential output signal of the transmitter and the differential input signal of the receiver each range from A – B to –(A – B) volts. 5. The peak value of the differential transmitter output signal and the differential receiver input signal is A – B volts. 6. The peak-to-peak value of the differential transmitter output signal and the differential receiver input signal is 2 × (A – B) volts. A Volts TD or RD B Volts TD or RD Differential Peak-to-Peak = 2 × (A – B) Figure 51. Differential Peak–Peak Voltage of Transmitter or Receiver To illustrate these definitions using real values, consider the case of a CML (current mode logic) transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing that goes between 2.5 and 2.0 V. Using these values, the peak-to-peak voltage swing of the signals TD and TD is 500 mVp-p. The differential output signal ranges between 500 and –500 mV. The peak differential voltage is 500 mV. The peak-to-peak differential voltage is 1000 mVp-p. 17.4 Equalization With the use of high speed serial links, the interconnect media will cause degradation of the signal at the receiver. Effects such as Inter-Symbol Interference (ISI) or data dependent jitter are produced. This loss can be large enough to degrade the eye opening at the receiver beyond what is allowed in the specification. To negate a portion of these effects, equalization can be used. The most common equalization techniques that can be used are: • A passive high pass filter network placed at the receiver. This is often referred to as passive equalization. • The use of active circuits in the receiver. This is often referred to as adaptive equalization. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 78 Freescale Semiconductor Serial RapidIO 17.5 Explanatory Note on Transmitter and Receiver Specifications AC electrical specifications are given for transmitter and receiver. Long- and short-run interfaces at three baud rates (a total of six cases) are described. The parameters for the AC electrical specifications are guided by the XAUI electrical interface specified in Clause 47 of IEEE 802.3ae-2002. XAUI has similar application goals to Serial RapidIO, as described in Section 8.1. The goal of this standard is that electrical designs for Serial RapidIO can reuse electrical designs for XAUI, suitably modified for applications at the baud intervals and reaches described herein. 17.6 Transmitter Specifications LP-serial transmitter electrical and timing specifications are stated in the text and tables of this section. The differential return loss, S11, of the transmitter in each case shall be better than: • –10 dB for (baud frequency)/10 < Freq(f) < 625 MHz, and • –10 dB + 10log(f/625 MHz) dB for 625 MHz ≤ Freq(f) ≤ baud frequency The reference impedance for the differential return loss measurements is 100-Ω resistive. Differential return loss includes contributions from on-chip circuitry, chip packaging, and any off-chip components related to the driver. The output impedance requirement applies to all valid output levels. It is recommended that the 20%–80% rise/fall time of the transmitter, as measured at the transmitter output, in each case have a minimum value 60 ps. It is recommended that the timing skew at the output of an LP-serial transmitter between the two signals that comprise a differential pair not exceed 25 ps at 1.25 GB, 20 ps at 2.50 GB, and 15 ps at 3.125 GB. Table 55. Short Run Transmitter AC Timing Specifications—1.25 GBaud Range Characteristic Symbol Min Output voltage Differential output voltage Deterministic jitter Total jitter Multiple output skew Unit Interval VO VDIFFPP JD JT SMO UI –0.40 500 — — — 800 Max 2.30 1000 0.17 0.35 1000 800 V mV p-p UI p-p UI p-p ps ps Voltage relative to COMMON of either signal comprising a differential pair — — — Skew at the transmitter output between lanes of a multilane link ±100 ppm Unit Notes MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 79 Serial RapidIO Table 56. Short Run Transmitter AC Timing Specifications—2.5 GBaud Range Characteristic Symbol Min Output voltage Differential output voltage Deterministic jitter Total jitter Multiple output skew Unit interval VO VDIFFPP JD JT SMO UI –0.40 500 — — — 400 Max 2.30 1000 0.17 0.35 1000 400 V mV p-p UI p-p UI p-p ps ps Voltage relative to COMMON of either signal comprising a differential pair — — — Skew at the transmitter output between lanes of a multilane link ±100 ppm Unit Notes Table 57. Short Run Transmitter AC Timing Specifications—3.125 GBaud Range Characteristic Symbol Min Output voltage Differential output voltage Deterministic jitter Total jitter Multiple output skew Unit interval VO VDIFFPP JD JT SMO UI –0.40 500 — — — 320 Max 2.30 1000 0.17 0.35 1000 320 V mVp-p UI p-p UI p-p ps ps Voltage relative to COMMON of either signal comprising a differential pair — — — Skew at the transmitter output between lanes of a multilane link ±100 ppm Unit Notes Table 58. Long Run Transmitter AC Timing Specifications—1.25 GBaud Range Characteristic Symbol Min Output voltage Differential output voltage Deterministic jitter Total jitter Multiple output skew Unit interval VO VDIFFPP JD JT SMO UI –0.40 800 — — — 800 Max 2.30 1600 0.17 0.35 1000 800 V mVp-p UI p-p UI p-p ps ps Voltage relative to COMMON of either signal comprising a differential pair — — — Skew at the transmitter output between lanes of a multilane link ±100 ppm Unit Notes MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 80 Freescale Semiconductor Serial RapidIO Table 59. Long Run Transmitter AC Timing Specifications—2.5 GBaud Range Characteristic Symbol Min Output voltage Differential output voltage Deterministic jitter Total jitter Multiple output skew Unit interval VO VDIFFPP JD JT SMO UI –0.40 800 — — — 400 Max 2.30 1600 0.17 0.35 1000 400 V mVp-p UI p-p UI p-p ps ps Voltage relative to COMMON of either signal comprising a differential pair — — — Skew at the transmitter output between lanes of a multilane link ±100 ppm Unit Notes Table 60. Long Run Transmitter AC Timing Specifications—3.125 GBaud Range Characteristic Symbol Min Output voltage Differential output voltage Deterministic jitter Total jitter Multiple output skew Unit interval VO VDIFFPP JD JT SMO UI –0.40 800 — — — 320 Max 2.30 1600 0.17 0.35 1000 320 V mVp-p UI p-p UI p-p ps ps Voltage relative to COMMON of either signal comprising a differential pair — — — Skew at the transmitter output between lanes of a multilane link ±100 ppm Unit Notes For each baud rate at which an LP-serial transmitter is specified to operate, the output eye pattern of the transmitter shall fall entirely within the unshaded portion of the transmitter output compliance mask shown in Figure 52 with the parameters specified in Table 61 when measured at the output pins of the device and the device is driving a 100-Ω ± 5% differential resistive load. The output eye pattern of an LP-serial MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 81 Serial RapidIO transmitter that implements pre-emphasis (to equalize the link and reduce inter-symbol interference) need only comply with the transmitter output compliance mask when pre-emphasis is disabled or minimized. Transmitter Differential Output Voltage VDIFF max VDIFF min 0 –V DIFF min –VDIFF max 0 A B Time in UI 1-B 1-A 1 Figure 52. Transmitter Output Compliance Mask Table 61. Transmitter Differential Output Eye Diagram Parameters Transmitter Type 1.25 GBaud short range 1.25 GBaud long range 2.5 GBaud short range 2.5 GBaud long range 3.125 GBaud short range 3.125 GBaud long range VDIFFmin (mV) 250 400 250 400 250 400 VDIFFmax (mV) 500 800 500 800 500 800 A (UI) 0.175 0.175 0.175 0.175 0.175 0.175 B (UI) 0.39 0.39 0.39 0.39 0.39 0.39 17.7 Receiver Specifications LP-serial receiver electrical and timing specifications are stated in the text and tables of this section. Receiver input impedance shall result in a differential return loss better that 10 dB and a common mode return loss better than 6 dB from 100 MHz to (0.8) × (baud frequency). This includes contributions from on-chip circuitry, the chip package, and any off-chip components related to the receiver. AC coupling MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 82 Freescale Semiconductor Serial RapidIO components are included in this requirement. The reference impedance for return loss measurements is 100-Ω resistive for differential return loss and 25-Ω resistive for common mode. Table 62. Receiver AC Timing Specifications—1.25 GBaud Range Characteristic Symbol Min Differential input voltage Deterministic jitter tolerance Combined deterministic and random jitter tolerance Total jitter tolerance1 Multiple input skew Bit error rate Unit interval VIN JD JDR JT SMI BER UI 200 0.37 0.55 0.65 — — 800 Max 1600 — — — 24 10–12 800 mVp-p UI p-p UI p-p UI p-p ns — ps ±100 ppm Measured at receiver Measured at receiver Measured at receiver Measured at receiver Skew at the receiver input between lanes of a multilane link — Unit Notes Note: 1. Total jitter is composed of three components, deterministic jitter, random jitter, and single frequency sinusoidal jitter. The sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 53. The sinusoidal jitter component is included to ensure margin for low frequency jitter, wander, noise, crosstalk, and other variable system effects. Table 63. Receiver AC Timing Specifications—2.5 GBaud Range Characteristic Symbol Min Differential input voltage Deterministic jitter tolerance Combined deterministic and random jitter tolerance Total jitter tolerance1 Multiple input skew Bit error rate Unit interval VIN JD JDR JT SMI BER UI 200 0.37 0.55 0.65 — — 400 Max 1600 — — — 24 10–12 400 ps ±100 ppm mVp-p UI p-p UI p-p UI p-p ns Measured at receiver Measured at receiver Measured at receiver Measured at receiver Skew at the receiver input between lanes of a multilane link — Unit Notes Note: 1. Total jitter is composed of three components, deterministic jitter, random jitter, and single frequency sinusoidal jitter. The sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 53. The sinusoidal jitter component is included to ensure margin for low frequency jitter, wander, noise, crosstalk, and other variable system effects. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 83 Serial RapidIO Table 64. Receiver AC Timing Specifications—3.125 GBaud Range Characteristic Differential input voltage Deterministic jitter tolerance Combined deterministic and random jitter tolerance Total jitter tolerance1 Multiple input skew Bit error rate Unit interval Symbol Min VIN JD JDR JT SMI BER UI 200 0.37 0.55 0.65 — — 320 Max 1600 — — — 22 10-12 320 ps ±100 ppm mVp-p UI p-p UI p-p UI p-p ns Measured at receiver Measured at receiver Measured at receiver Measured at receiver Skew at the receiver input between lanes of a multilane link — Unit Notes Note: 1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 53. The sinusoidal jitter component is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects. 8.5 UI p-p Sinusoidal Jitter Amplitude 0.10 UI p-p 22.1 kHz Frequency 1.875 MHz 20 MHz Figure 53. Single Frequency Sinusoidal Jitter Limits MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 84 Freescale Semiconductor Serial RapidIO 17.8 Receiver Eye Diagrams For each baud rate at which an LP-serial receiver is specified to operate, the receiver shall meet the corresponding bit error rate specification (Table 62, Table 63, Table 64) when the eye pattern of the receiver test signal (exclusive of sinusoidal jitter) falls entirely within the unshaded portion of the receiver input compliance mask shown in Figure 54 with the parameters specified in Table 65. The eye pattern of the receiver test signal is measured at the input pins of the receiving device with the device replaced with a 100-Ω ± 5% differential resistive load. VDIFF max Receiver Differential Input Voltage VDIFF min 0 –VDIFF min –VDIFF max 0 A B Time (UI) 1-B 1-A 1 Figure 54. Receiver Input Compliance Mask Table 65. Receiver Input Compliance Mask Parameters Exclusive of Sinusoidal Jitter Receiver Type 1.25 GBaud 2.5 GBaud 3.125 GBaud VDIFFmin (mV) 100 100 100 VDIFFmax (mV) 800 800 800 A (UI) 0.275 0.275 0.275 B (UI) 0.400 0.400 0.400 17.9 Measurement and Test Requirements Since the LP-serial electrical specification are guided by the XAUI electrical interface specified in Clause 47 of IEEE Std. 802.3ae-2002, the measurement and test requirements defined here are similarly guided by Clause 47. In addition, the CJPAT test pattern defined in Annex 48A of IEEE Std. 802.3ae-2002 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 85 Serial RapidIO is specified as the test pattern for use in eye pattern and jitter measurements. Annex 48B of IEEE Std. 802.3ae-2002 is recommended as a reference for additional information on jitter test methods. 17.9.1 Eye Template Measurements For the purpose of eye template measurements, the effects of a single-pole high pass filter with a 3 dB point at (baud frequency)/1667 is applied to the jitter. The data pattern for template measurements is the continuous jitter test pattern (CJPAT) defined in Annex 48A of IEEE 802.3ae. All lanes of the LP-serial link shall be active in both the transmit and receive directions, and opposite ends of the links shall use asynchronous clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. The amount of data represented in the eye shall be adequate to ensure that the bit error ratio is less than 10–12. The eye pattern shall be measured with AC coupling and the compliance template centered at 0 V differential. The left and right edges of the template shall be aligned with the mean zero crossing points of the measured data eye. The load for this test shall be 100-Ω resistive ± 5% differential to 2.5 GHz. 17.9.2 Jitter Test Measurements For the purpose of jitter measurement, the effects of a single-pole high pass filter with a 3 dB point at (baud frequency)/1667 is applied to the jitter. The data pattern for jitter measurements is the Continuous Jitter test pattern (CJPAT) pattern defined in Annex 48A of IEEE 802.3ae. All lanes of the LP-serial link shall be active in both the transmit and receive directions, and opposite ends of the links shall use asynchronous clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. Jitter shall be measured with AC coupling and at 0 V differential. Jitter measurement for the transmitter (or for calibration of a jitter tolerance setup) shall be performed with a test procedure resulting in a BER curve such as that described in Annex 48B of IEEE 802.3ae. 17.9.3 Transmit Jitter Transmit jitter is measured at the driver output when terminated into a load of 100 Ω resistive ± 5% differential to 2.5 GHz. 17.9.4 Jitter Tolerance Jitter tolerance is measured at the receiver using a jitter tolerance test signal. This signal is obtained by first producing the sum of deterministic and random jitter defined in Section 17.7, “Receiver Specifications,” and then adjusting the signal amplitude until the data eye contacts the 6 points of the minimum eye opening of the receive template shown in Figure 54 and Table 65. Note that for this to occur, the test signal must have vertical waveform symmetry about the average value and have horizontal symmetry (including jitter) about the mean zero crossing. Eye template measurement requirements are as defined above. Random jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20 dB/decade roll-off below this. The required sinusoidal jitter specified in Section 17.7, “Receiver Specifications,” is then added to the signal and the test load is replaced by the receiver being tested. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 86 Freescale Semiconductor Package Description 18 Package Description This section details package parameters, pin assignments, and dimensions. 18.1 Package Parameters The package parameters for both the HiCTE FC-CBGA and FC-PBGA are as provided in Table 66. Table 66. Package Parameters Parameter Package outline Interconnects Ball pitch Ball diameter (typical) Solder ball CBGA 1 29 mm × 29 mm 783 1 mm 0.6 mm 62% Sn 36% Pb 2% Ag 95% Sn 4.5% Ag 0.5% Cu PBGA2 29 mm × 29 mm 783 1 mm 0.6 mm 62% Sn 36% Pb 2% Ag 96.5% Sn 3.5% Ag Solder ball (lead-free) Notes: 1. The HiCTE FC-CBGA package is available on only Version 2.0 of the device. 2. The FC-PBGA package is available on only Version 2.1.1 and 2.1.2 of the device. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 87 Package Description 18.2 Mechanical Dimensions of the HiCTE FC-CBGA and FC-PBGA with Full Lid Figure 55 shows the mechanical dimensions and bottom surface nomenclature for both the MPC8548E HiCTE FC-CBGA and FC-PBGA package with full lid. Notes: 1. All dimensions are in millimeters. 2. Dimensioning and tolerancing per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. 6. All dimensions are symmetric across the package center lines unless dimensioned otherwise. 7. Package code summary: •PBGA 8423 •CBGA 5112 Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature of the HiCTE FC-CBGA and FC-PBGA with Full Lid MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 88 Freescale Semiconductor Package Description 18.3 Pinout Listings NOTE The DMA_DACK[0:1] and TEST_SEL/TEST_SEL pins must be set to a proper state during POR configuration. Please refer to the pinlist table of the individual device for more details. For MPC8548/47/45, GPIOs are still available on PCI1_AD[63:32]/PC2_AD[31:0] pins if they are not used for PCI functionality. For MPC8545/43, eTSEC does not support 16 bit FIFO mode. Table 67 provides the pinout listing for the MPC8548E 783 FC-PBGA package. Table 67. MPC8548E Pinout Listing Signal Package Pin Number PCI1 and PCI2 (One 64-Bit or Two 32-Bit) PCI1_AD[63:32]/PCI2_AD[31:0] AB14, AC15, AA15, Y16, W16, AB16, AC16, AA16, AE17, AA18, W18, AC17, AD16, AE16, Y17, AC18, AB18, AA19, AB19, AB21, AA20, AC20, AB20, AB22, AC22, AD21, AB23, AF23, AD23, AE23, AC23, AC24 AH6, AE7, AF7, AG7, AH7, AF8, AH8, AE9, AH9, AC10, AB10, AD10, AG10, AA10, AH10, AA11, AB12, AE12, AG12, AH12, AB13, AA12, AC13, AE13, Y14, W13, AG13, V14, AH13, AC14, Y15, AB15 AF15, AD14, AE15, AD15 AF9, AD11, Y12, Y13 W15 AG6, AE6, AF5, AH5 AG5 AF11 AD12 AC12 V13 W12 AG11 I/O OV DD 17 Pin Type Power Supply Notes PCI1_AD[31:0] I/O OV DD 17 PCI1_C_BE[7:4]/PCI2_C_BE[3:0] PCI1_C_BE[3:0] PCI1_PAR64/PCI2_PAR PCI1_GNT[4:1] PCI1_GNT0 PCI1_IRDY PCI1_PAR PCI1_PERR PCI1_SERR PCI1_STOP PCI1_TRDY I/O I/O I/O O I/O I/O I/O I/O I/O I/O I/O OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD 17 17 5, 9, 35 — 2 — 2 2, 4 2 2 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 89 Package Description Table 67. MPC8548E Pinout Listing (continued) Signal PCI1_REQ[4:1] Package Pin Number AH2, AG4, AG3, AH4 Pin Type I Power Supply OV DD Notes — — — — — PCI1_REQ0 PCI1_CLK PCI1_DEVSEL PCI1_FRAME PCI1_IDSEL PCI1_REQ64/PCI2_FRAME PCI1_ACK64/PCI2_DEVSEL PCI2_CLK PCI2_IRDY PCI2_PERR PCI2_GNT[4:1] PCI2_GNT0 PCI2_SERR PCI2_STOP PCI2_TRDY PCI2_REQ[4:1] PCI2_REQ0 AH3 AH26 AH11 AE11 AG9 AF14 V15 AE28 AD26 AD25 AE26, AG24, AF25, AE25 AG25 AD24 AF24 AD27 AD28, AE27, W17, AF26 AH25 DDR SDRAM Memory Interface MDQ[0:63] L18, J18, K14, L13, L19, M18, L15, L14, A17, B17, A13, B12, C18, B18, B13, A12, H18, F18, J14, F15, K19, J19, H16, K15, D17, G16, K13, D14, D18, F17, F14, E14, A7, A6, D5, A4, C8, D7, B5, B4, A2, B1, D1, E4, A3, B2, D2, E3, F3, G4, J5, K5, F6, G5, J6, K4, J1, K2, M5, M3, J3, J2, L1, M6 H13, F13, F11, C11, J13, G13, D12, M12 M17, C16, K17, E16, B6, C4, H4, K1, E13 M15, A16, G17, G14, A5, D3, H1, L2, C13 L17, B16, J16, H14, C6, C2, H3, L4, D13 A8, F9, D9, B9, A9, L10, M10, H10, K10, G10, B8, E10, B10, G6, A10, L11 F7, J7, M11 I/O GVDD — I/O I I/O I/O I I/O I/O I I/O I/O O I/O I/O I/O I/O I I/O OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD — 39 2 2 — 2, 5, 10 2 39 2 2 5, 9, 35 — 2, 4 2 2 — — MECC[0:7] MDM[0:8] MDQS[0:8] MDQS[0:8] MA[0:15] MBA[0:2] I/O O I/O I/O O O GVDD GVDD GVDD GVDD GVDD GVDD — — — — — — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 90 Freescale Semiconductor Package Description Table 67. MPC8548E Pinout Listing (continued) Signal MWE MCAS MRAS MCKE[0:3] MCS[0:3] MCK[0:5] MCK[0:5] MODT[0:3] MDIC[0:1] Package Pin Number E7 H7 L8 F10, C10, J11, H11 K8, J8, G8, F8 H9, B15, G2, M9, A14, F1 J9, A15, G1, L9, B14, F2 E6, K6, L7, M7 A19, B19 Local Bus Controller Interface LAD[0:31] E27, B20, H19, F25, A20, C19, E28, J23, A25, K22, B28, D27, D19, J22, K20, D28, D25, B25, E22, F22, F21, C25, C22, B23, F20, A23, A22, E19, A21, D21, F19, B21 K21, C28, B26, B22 H21 H20, A27, D26, A28 J25, C20, J24, G26, A26 D23 G20 E21 G25 C23 J21 A24 H24 G27 F23 G22 B27 F24 H23 E26 E24 E23, D24, H22 I/O BVDD — Pin Type O O O O O O O O I/O Power Supply GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD Notes — — — 11 — — — — 36 LDP[0:3] LA[27] LA[28:31] LCS[0:4] LCS5/DMA_DREQ2 LCS6/DMA_DACK2 LCS7/DMA_DDONE2 LWE0 /LBS0/LSDDQM[0] LWE1 /LBS1/LSDDQM[1] LWE2 /LBS2/LSDDQM[2] LWE3 /LBS3/LSDDQM[3] LALE LBCTL LGPL0/LSDA10 LGPL1/LSDWE LGPL2/LOE/LSDRAS LGPL3/LSDCAS LGPL4/LGTA/LUPWAIT/LPBSE LGPL5 LCKE LCLK[0:2] I/O O O O I/O O O O O O O O O O O O O I/O O O O BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD — 5, 9 5, 7, 9 1 1 1 5, 9 5, 9 5, 9 5, 9 5, 8, 9 5, 8, 9 5, 9 5, 9 5, 8, 9 5, 9 — 5, 9 — — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 91 Package Description Table 67. MPC8548E Pinout Listing (continued) Signal LSYNC_IN LSYNC_OUT Package Pin Number F27 F28 DMA DMA_DACK[0:1] DMA_DREQ [0:1] DMA_DDONE[0:1] AD3, AE1 AD4, AE2 AD2, AD1 Programmable Interrupt Controller UDE MCP IRQ[0:7] IRQ[8] IRQ[9]/DMA_DREQ3 IRQ[10]/DMA_DACK3 IRQ[11]/DMA_DDONE3 IRQ_OUT AH16 AG19 AG23, AF18, AE18, AF20, AG18, AF17, AH24, AE20 AF19 AF21 AE19 AD20 AD18 Ethernet Management Interface EC_MDC EC_MDIO AB9 AC8 Gigabit Reference Clock EC_GTX_CLK125 V11 Three-Speed Ethernet Controller (Gigabit Ethernet 1) TSEC1_RXD[7:0] TSEC1_TXD[7:0] TSEC1_COL TSEC1_CRS TSEC1_GTX_CLK TSEC1_RX_CLK TSEC1_RX_DV TSEC1_RX_ER TSEC1_TX_CLK TSEC1_TX_EN TSEC1_TX_ER R5, U1, R3, U2, V3, V1, T3, T2 T10, V7, U10, U5, U4, V6, T5, T8 R4 V5 U7 U3 V2 T1 T6 U9 T7 I O I I/O O I I I I O O LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD — 5, 9 — 20 — — — — — 30 — I LVDD — O I/O OV DD OV DD 5, 9 — I I I I I I/O I/O O OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD — — — — 1 1 1 2, 4 O I O OV DD OV DD OV DD 5, 9, 102 — — Pin Type I O Power Supply BVDD BVDD Notes — — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 92 Freescale Semiconductor Package Description Table 67. MPC8548E Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes Three-Speed Ethernet Controller (Gigabit Ethernet 2) TSEC2_RXD[7:0] TSEC2_TXD[7:0] TSEC2_COL TSEC2_CRS TSEC2_GTX_CLK TSEC2_RX_CLK TSEC2_RX_DV TSEC2_RX_ER TSEC2_TX_CLK TSEC2_TX_EN TSEC2_TX_ER P2, R2, N1, N2, P3, M2, M1, N3 N9, N10, P8, N7, R9, N5, R8, N6 P1 R6 P6 N4 P5 R1 P10 P7 R10 Three-Speed Ethernet Controller (Gigabit Ethernet 3) TSEC3_TXD[3:0] TSEC3_RXD[3:0] TSEC3_GTX_CLK TSEC3_RX_CLK TSEC3_RX_DV TSEC3_RX_ER TSEC3_TX_CLK TSEC3_TX_EN V8, W10, Y10, W7 Y1, W3, W5, W4 W8 W2 W1 Y2 V10 V9 Three-Speed Ethernet Controller (Gigabit Ethernet 4) TSEC4_TXD[3:0]/TSEC3_TXD[7:4] TSEC4_RXD[3:0]/TSEC3_RXD[7:4] TSEC4_GTX_CLK TSEC4_RX_CLK/TSEC3_COL TSEC4_RX_DV/TSEC3_CRS TSEC4_TX_EN/TSEC3_TX_ER AB8, Y7, AA7, Y8 AA1, Y3, AA2, AA4 AA5 Y5 AA3 AB6 DUART UART_CTS[0:1] UART_RTS[0:1] UART_SIN[0:1] UART_SOUT[0:1] AB3, AC5 AC6, AD7 AB5, AC7 AB7, AD8 I O I O OV DD OV DD OV DD OV DD — — — — O I O I I/O O TVDD TVDD TVDD TVDD TVDD TVDD 1, 5, 9, 29 1 — 1 1, 31 1, 30 O I O I I I I O TVDD TVDD TVDD TVDD TVDD TVDD TVDD TVDD 5, 9, 29 — — — — — — 30 I O I I/O O I I I I O O LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD — — — — 30 5, 9, 33 — 5, 9, 33 — 20 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 93 Package Description Table 67. MPC8548E Pinout Listing (continued) Signal Package Pin Number I2C interface IIC1_SCL IIC1_SDA IIC2_SCL IIC2_SDA AG22 AG21 AG15 AG14 SerDes SD_RX[0:7] SD_RX[0:7] SD_TX[0:7] SD_TX[0:7] SD_PLL_TPD SD_REF_CLK SD_REF_CLK Reserved Reserved Reserved Reserved M28, N26, P28, R26, W26, Y28, AA26, AB28 M27, N25, P27, R25, W25, Y27, AA25, AB27 M22, N20, P22, R20, U20, V22, W20, Y22 M23, N21, P23, R21, U21, V23, W21, Y23 U28 T28 T27 AC1, AC3 M26, V28 M25, V27 M20, M21, T22, T23 General-Purpose Output GPOUT[24:31] K26, K25, H27, G28, H25, J26, K24, K23 System Control HRESET HRESET_REQ SRESET CKSTP_IN CKSTP_OUT AG17 AG16 AG20 AA9 AA8 Debug TRIG_IN TRIG_OUT/READY/QUIESCE MSRCID[0:1] MSRCID[2:4] MDVAL CLK_OUT AB2 AB1 AE4, AG2 AF3, AF1, AF2 AE5 AE21 I O O O O O OV DD OV DD OV DD OV DD OV DD OV DD — 6, 9, 19, 29 5, 6, 9 6, 19, 29 6 11 I O I I O OV DD OV DD OV DD OV DD OV DD — 29 — — 2, 4 O BVDD — I I O O O I I — — — — XVDD XVDD XVDD XVDD XVDD XVDD XVDD — — — — — — — — 24 3 3 2 32 34 38 I/O I/O I/O I/O OV DD OV DD OV DD OV DD 4, 27 4, 27 4, 27 4, 27 Pin Type Power Supply Notes MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 94 Freescale Semiconductor Package Description Table 67. MPC8548E Pinout Listing (continued) Signal Package Pin Number Clock RTC SYSCLK AF16 AH17 JTAG TCK TDI TDO TMS TRST AG28 AH28 AF28 AH27 AH23 DFT L1_TSTCLK L2_TSTCLK LSSD_MODE TEST_SEL AC25 AE22 AH20 AH14 Thermal Management THERM0 THERM1 AG1 AH1 Power Management ASLEEP AH18 Power and Ground Signals GND A11, B7, B24, C1, C3, C5, C12, C15, C26, D8, D11, D16, D20, D22, E1, E5, E9, E12, E15, E17, F4, F26, G12, G15, G18, G21, G24, H2, H6, H8, H28, J4, J12, J15, J17, J27, K7, K9, K11, K27, L3, L5, L12, L16, N11, N13, N15, N17, N19, P4, P9, P12, P14, P16, P18, R11, R13, R15, R17, R19, T4, T12, T14, T16, T18, U8, U11, U13, U15, U17, U19, V4, V12, V18, W6, W19, Y4, Y9, Y11, Y19, AA6, AA14, AA17, AA22, AA23, AB4, AC2, AC11, AC19, AC26, AD5, AD9, AD22, AE3, AE14, AF6, AF10, AF13, AG8, AG27, K28, L24, L26, N24, N27, P25, R28, T24, T26, U24, V25, W28, Y24, Y26, AA24, AA27, AB25, AC28, L21, L23, N22, P20, R23, T21, U22, V20, W23, Y21, U27 V16, W11, W14, Y18, AA13, AA21, AB11, AB17, AB24, AC4, AC9, AC21, AD6, AD13, AD17, AD19, AE10, AE8, AE24, AF4, AF12, AF22, AF27, AG26 — — — O OV DD 9, 19, 29 — — — — 14 14 I I I I OV DD OV DD OV DD OV DD 25 25 25 25 I I O I I OV DD OV DD OV DD OV DD OV DD — 12 11 12 12 I I OV DD OV DD — — Pin Type Power Supply Notes OVDD Power for PCI and other standards (3.3 V) OV DD — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 95 Package Description Table 67. MPC8548E Pinout Listing (continued) Signal LVDD Package Pin Number N8, R7, T9, U6 Pin Type Power for TSEC1 and TSEC2 (2.5 V, 3.3 V) Power for TSEC3 and TSEC4 (2,5 V, 3.3 V) Power for DDR1 and DDR2 DRAM I/O voltage (1.8 V, 2.5) Power Supply LVDD Notes — TVDD W9, Y6 TVDD — GVDD B3, B11, C7, C9, C14, C17, D4, D6, D10, D15, E2, E8, E11, E18, F5, F12, F16, G3, G7, G9, G11, H5, H12, H15, H17, J10, K3, K12, K16, K18, L6, M4, M8, M13 GVDD — BVDD C21, C24, C27, E20, E25, G19, G23, H26, J20 Power for local bus (1.8 V, 2.5 V, 3.3 V) M19, N12, N14, N16, N18, P11, P13, P15, P17, Power for core P19, R12, R14, R16, R18, T11, T13, T15, T17, (1.1 V) T19, U12, U14, U16, U18, V17, V19 L25, L27, M24, N28, P24, P26, R24, R27, T25, Core Power for V24, V26, W24, W27, Y25, AA28, AC27 SerDes transceivers (1.1 V) L20, L22, N23, P21, R22, T20, U23, V21, W22, Y20 Pad Power for SerDes transceivers (1.1 V) Power for local bus PLL (1.1 V) Power for PCI1 PLL (1.1 V) Power for PCI2 PLL (1.1 V) Power for e500 PLL (1.1 V) Power for CCB PLL (1.1 V) Power for SRDSPLL (1.1 V) O — BVDD — VDD VDD — SVDD SVDD — XVDD XVDD — AVDD_LBIU J28 — 26 AVDD_PCI1 AH21 — 26 AVDD_PCI2 AH22 — 26 AVDD_CORE AVDD_PLAT AVDD_SRDS AH15 AH19 U25 — — — 26 26 26 SENSEVDD SENSEVSS M14 M16 VDD — 13 13 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 96 Freescale Semiconductor Package Description Table 67. MPC8548E Pinout Listing (continued) Signal Package Pin Number Analog Signals MVREF A18 I Reference voltage signal for DDR I I O MVREF — Pin Type Power Supply Notes SD_IMP_CAL_RX SD_IMP_CAL_TX SD_PLL_TPA L28 AB26 U26 200Ω to GND 100Ω to GND — — — 24 Notes: 1. All multiplexed signals are listed only once and do not re-occur. For example, LCS5/DMA_REQ2 is listed only once in the local bus controller section, and is not mentioned in the DMA section even though the pin also functions as DMA_REQ2. 2. Recommend a weak pull-up resistor (2–10 kΩ) be placed on this pin to OVDD. 3. A valid clock must be provided at POR if TSEC4_TXD[2] is set = 1. 4. This pin is an open drain signal. 5. This pin is a reset configuration pin. It has a weak internal pull-up P-FET which is enabled only when the processor is in the reset state. This pull-up is designed such that it can be overpowered by an external 4.7-kΩ pull-down resistor. However, if the signal is intended to be high after reset, and if there is any device on the net which might pull down the value of the net at reset, then a pullup or active driver is needed. 6. Treat these pins as no connects (NC) unless using debug address functionality. 7. The value of LA[28:31] during reset sets the CCB clock to SYSCLK PLL ratio. These pins require 4.7-kΩ pull-up or pull-down resistors. See Section 19.2, “CCB/SYSCLK PLL Ratio.” 8. The value of LALE, LGPL2, and LBCTL at reset set the e500 core clock to CCB clock PLL ratio. These pins require 4.7-kΩ pull-up or pull-down resistors. See the Section 19.3, “e500 Core PLL Ratio.” 9. Functionally, this pin is an output, but structurally it is an I/O because it either samples configuration input during reset or because it has other manufacturing test functions. This pin will therefore be described as an I/O for boundary scan. 10.This pin functionally requires a pull-up resistor, but during reset it is a configuration input that controls 32- vs. 64-bit PCI operation. Therefore, it must be actively driven low during reset by reset logic if the device is to be configured to be a 64-bit PCI device. Refer to the PCI Specification. 11.This output is actively driven during reset rather than being three-stated during reset. 12.These JTAG pins have weak internal pull-up P-FETs that are always enabled. 13.These pins are connected to the VDD/GND planes internally and may be used by the core power supply to improve tracking and regulation. 14.Internal thermally sensitive resistor. 15.No connections should be made to these pins if they are not used. 16.These pins are not connected for any use. 17.PCI specifications recommend that a weak pull-up resistor (2–10 kΩ) be placed on the higher order pins to OVDD when using 64-bit buffer mode (pins PCI_AD[63:32] and PCI1_C_BE[7:4]). 19.If this pin is connected to a device that pulls down during reset, an external pull-up is required to drive this pin to a safe state during reset. 20.This pin is only an output in FIFO mode when used as Rx flow control. 24.Do not connect. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 97 Package Description Table 67. MPC8548E Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes 25.These are test signals for factory use only and must be pulled up (100 Ω–1 kΩ) to OVDD for normal machine operation. 26.Independent supplies derived from board VDD. 27.Recommend a pull-up resistor (~1 kΩ) be placed on this pin to OVDD. 29. The following pins must NOT be pulled down during power-on reset: TSEC3_TXD[3], TSEC4_TXD3/TSEC3_TXD7, HRESET_REQ, TRIG_OUT/READY/QUIESCE, MSRCID[2:4], ASLEEP. 30.This pin requires an external 4.7-kΩ pull-down resistor to prevent PHY from seeing a valid transmit enable before it is actively driven. 31.This pin is only an output in eTSEC3 FIFO mode when used as Rx flow control. 32.These pins should be connected to XVDD. 33.TSEC2_TXD1, TSEC2_TX_ER are multiplexed as cfg_dram_type[0:1]. They must be valid at power-up, even before HRESET assertion. 34.These pins should be pulled to ground through a 300-Ω (±10%) resistor. 35.When a PCI block is disabled, either the POR config pin that selects between internal and external arbiter must be pulled down to select external arbiter if there is any other PCI device connected on the PCI bus, or leave the PCIn_AD pins as ‘no connect’ or terminated through 2–10 kΩ pull-up resistors with the default of internal arbiter if the PCIn_AD pins are not connected to any other PCI device. The PCI block will drive the PCIn_AD pins if it is configured to be the PCI arbiter—through POR config pins—irrespective of whether it is disabled via the DEVDISR register or not. It may cause contention if there is any other PCI device connected on the bus. 36.MDIC0 is grounded through an 18.2-Ω precision 1% resistor and MDIC1 is connected to GVDD through an 18.2-Ω precision 1% resistor. These pins are used for automatic calibration of the DDR IOs. 38.These pins should be left floating. 39. If PCI1 or PCI2 is configured as PCI asynchronous mode, a valid clock must be provided on pin PCI1_CLK or PCI2_CLK. Otherwise the processor will not boot up. 40.These pins should be connected to GND. 101.This pin requires an external 4.7-kΩ resistor to GND. 102.For Rev. 2.x silicon, DMA_DACK[0:1] must be 0b11 during POR configuration; for rev. 1.x silicon, the pin values during POR configuration are don’t care. 103.If these pins are not used as GPINn (general-purpose input), they should be pulled low (to GND) or high (to LVDD) through 2–10 kΩ resistors. 104.These should be pulled low to GND through 2–10 kΩ resistors if they are not used. 105.These should be pulled low or high to LVDD through 2–10 kΩ resistors if they are not used. 106.For rev. 2.x silicon, DMA_DACK [0:1] must be 0b10 during POR configuration; for rev. 1.x silicon, the pin values during POR configuration are don’t care. 107.For rev. 2.x silicon, DMA_DACK [0:1] must be 0b01 during POR configuration; for rev. 1.x silicon, the pin values during POR configuration are don’t care. 108.For rev. 2.x silicon, DMA_DACK [0:1] must be 0b11 during POR configuration; for rev. 1.x silicon, the pin values during POR configuration are don’t care. 109.This is a test signal for factory use only and must be pulled down (100 Ω – 1 kΩ) to GND for normal machine operation. 110.These pins should be pulled high to OVDD through 2–10 kΩ resistors. 111.If these pins are not used as GPINn (general-purpose input), they should be pulled low (to GND) or high (to OVDD) through 2–10 kΩ resistors. 112.This pin must not be pulled down during POR configuration. 113.These should be pulled low or high to OVDD through 2–10 kΩ resistors. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 98 Freescale Semiconductor Package Description Table 68 provides the pin-out listing for the MPC8547E 783 FC-PBGA package. NOTE All note references in the following table use the same numbers as those for Table 67. The reader should refer to Table 67 for the meanings of these notes. Table 68. MPC8547E Pinout Listing Signal Package Pin Number PCI1 (One 64-Bit or One 32-Bit) PCI1_AD[63:32] AB14, AC15, AA15, Y16, W16, AB16, AC16, AA16, AE17, AA18, W18, AC17, AD16, AE16, Y17, AC18, AB18, AA19, AB19, AB21, AA20, AC20, AB20, AB22, AC22, AD21, AB23, AF23, AD23, AE23, AC23, AC24 AH6, AE7, AF7, AG7, AH7, AF8, AH8, AE9, AH9, AC10, AB10, AD10, AG10, AA10, AH10, AA11, AB12, AE12, AG12, AH12, AB13, AA12, AC13, AE13, Y14, W13, AG13, V14, AH13, AC14, Y15, AB15 AF15, AD14, AE15, AD15 AF9, AD11, Y12, Y13 W15 AG6, AE6, AF5, AH5 AG5 AF11 AD12 AC12 V13 W12 AG11 AH2, AG4, AG3, AH4 AH3 AH26 AH11 AE11 AG9 AF14 V15 AE28 AD26 I/O OV DD 17 Pin Type Power Supply Notes PCI1_AD[31:0] I/O OV DD 17 PCI1_C_BE[7:4] PCI1_C_BE[3:0] PCI1_PAR64 PCI1_GNT[4:1] PCI1_GNT0 PCI1_IRDY PCI1_PAR PCI1_PERR PCI1_SERR PCI1_STOP PCI1_TRDY PCI1_REQ[4:1] PCI1_REQ0 PCI1_CLK PCI1_DEVSEL PCI1_FRAME PCI1_IDSEL PCI1_REQ64 PCI1_ACK64 Reserved Reserved I/O I/O I/O O I/O I/O I/O I/O I/O I/O I/O I I/O I I/O I/O I I/O I/O — — OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD — — 17 17 — 5, 9, 35 — 2 — 2 2, 4 2 2 — — 39 2 2 — 2, 5,10 2 2 2 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 99 Package Description Table 68. MPC8547E Pinout Listing (continued) Signal Reserved Reserved cfg_pci1_clk Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Package Pin Number AD25 AE26 AG24 AF25 AE25 AG25 AD24 AF24 AD27 AD28, AE27, W17, AF26 AH25 DDR SDRAM Memory Interface MDQ[0:63] L18, J18, K14, L13, L19, M18, L15, L14, A17, B17, A13, B12, C18, B18, B13, A12, H18, F18, J14, F15, K19, J19, H16, K15, D17, G16, K13, D14, D18, F17, F14, E14, A7, A6, D5, A4, C8, D7, B5, B4, A2, B1, D1, E4, A3, B2, D2, E3, F3, G4, J5, K5, F6, G5, J6, K4, J1, K2, M5, M3, J3, J2, L1, M6 H13, F13, F11, C11, J13, G13, D12, M12 M17, C16, K17, E16, B6, C4, H4, K1, E13 M15, A16, G17, G14, A5, D3, H1, L2, C13 L17, B16, J16, H14, C6, C2, H3, L4, D13 A8, F9, D9, B9, A9, L10, M10, H10, K10, G10, B8, E10, B10, G6, A10, L11 F7, J7, M11 E7 H7 L8 F10, C10, J11, H11 K8, J8, G8, F8 H9, B15, G2, M9, A14, F1 J9, A15, G1, L9, B14, F2 E6, K6, L7, M7 A19, B19 I/O GVDD — Pin Type — — I — — — — — — — — Power Supply — — OV DD — — — — — — — — Notes 2 2 5 101 2 2 2 2 2 2 2 MECC[0:7] MDM[0:8] MDQS[0:8] MDQS[0:8] MA[0:15] MBA[0:2] MWE MCAS MRAS MCKE[0:3] MCS[0:3] MCK[0:5] MCK[0:5] MODT[0:3] MDIC[0:1] I/O O I/O I/O O O O O O O O O O O I/O GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD — — — — — — — — — 11 — — — — 36 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 100 Freescale Semiconductor Package Description Table 68. MPC8547E Pinout Listing (continued) Signal Package Pin Number Local Bus Controller Interface LAD[0:31] E27, B20, H19, F25, A20, C19, E28, J23, A25, K22, B28, D27, D19, J22, K20, D28, D25, B25, E22, F22, F21, C25, C22, B23, F20, A23, A22, E19, A21, D21, F19, B21 K21, C28, B26, B22 H21 H20, A27, D26, A28 J25, C20, J24, G26, A26 D23 G20 E21 G25 C23 J21 A24 H24 G27 F23 G22 B27 F24 H23 E26 E24 E23, D24, H22 F27 F28 DMA DMA_DACK[0:1] DMA_DREQ [0:1] DMA_DDONE[0:1] AD3, AE1 AD4, AE2 AD2, AD1 Programmable Interrupt Controller UDE MCP AH16 AG19 I I OV DD OV DD — — O I O OV DD OV DD OV DD 5, 9, 107 — — I/O BVDD — Pin Type Power Supply Notes LDP[0:3] LA[27] LA[28:31] LCS[0:4] LCS5/DMA_DREQ2 LCS6/DMA_DACK2 LCS7/DMA_DDONE2 LWE0 /LBS0/LSDDQM[0] LWE1 /LBS1/LSDDQM[1] LWE2 /LBS2/LSDDQM[2] LWE3 /LBS3/LSDDQM[3] LALE LBCTL LGPL0/LSDA10 LGPL1/LSDWE LGPL2/LOE/LSDRAS LGPL3/LSDCAS LGPL4/LGTA/LUPWAIT/LPBSE LGPL5 LCKE LCLK[0:2] LSYNC_IN LSYNC_OUT I/O O O O I/O O O O O O O O O O O O O I/O O O O I O BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD — 5, 9 5, 7, 9 — 1 1 1 5, 9 5, 9 5, 9 5, 9 5, 8, 9 5, 8, 9 5, 9 5, 9 5, 8, 9 5, 9 — 5, 9 — — — — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 101 Package Description Table 68. MPC8547E Pinout Listing (continued) Signal IRQ[0:7] IRQ[8] IRQ[9]/DMA_DREQ3 IRQ[10]/DMA_DACK3 IRQ[11]/DMA_DDONE3 IRQ_OUT Package Pin Number AG23, AF18, AE18, AF20, AG18, AF17, AH24, AE20 AF19 AF21 AE19 AD20 AD18 Ethernet Management Interface EC_MDC EC_MDIO AB9 AC8 Gigabit Reference Clock EC_GTX_CLK125 V11 Three-Speed Ethernet Controller (Gigabit Ethernet 1) TSEC1_RXD[7:0] TSEC1_TXD[7:0] TSEC1_COL TSEC1_CRS TSEC1_GTX_CLK TSEC1_RX_CLK TSEC1_RX_DV TSEC1_RX_ER TSEC1_TX_CLK TSEC1_TX_EN TSEC1_TX_ER R5, U1, R3, U2, V3, V1, T3, T2 T10, V7, U10, U5, U4, V6, T5, T8 R4 V5 U7 U3 V2 T1 T6 U9 T7 Three-Speed Ethernet Controller (Gigabit Ethernet 2) TSEC2_RXD[7:0] TSEC2_TXD[7:0] TSEC2_COL TSEC2_CRS TSEC2_GTX_CLK TSEC2_RX_CLK TSEC2_RX_DV TSEC2_RX_ER TSEC2_TX_CLK TSEC2_TX_EN P2, R2, N1, N2, P3, M2, M1, N3 N9, N10, P8, N7, R9, N5, R8, N6 P1 R6 P6 N4 P5 R1 P10 P7 I O I I/O O I I I I O LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD — 5, 9, 33 — 20 — — — — — 30 I O I I/O O I I I I O O LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD — 5, 9 — 20 — — — — — 30 — I LVDD — O I/O OV DD OV DD 5, 9 — Pin Type I I I I/O I/O O Power Supply OV DD OV DD OV DD OV DD OV DD OV DD Notes — — 1 1 1 2, 4 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 102 Freescale Semiconductor Package Description Table 68. MPC8547E Pinout Listing (continued) Signal TSEC2_TX_ER Package Pin Number R10 Three-Speed Ethernet Controller (Gigabit Ethernet 3) TSEC3_TXD[3:0] TSEC3_RXD[3:0] TSEC3_GTX_CLK TSEC3_RX_CLK TSEC3_RX_DV TSEC3_RX_ER TSEC3_TX_CLK TSEC3_TX_EN V8, W10, Y10, W7 Y1, W3, W5, W4 W8 W2 W1 Y2 V10 V9 Three-Speed Ethernet Controller (Gigabit Ethernet 4) TSEC4_TXD[3:0]/TSEC3_TXD[7:4] TSEC4_RXD[3:0]/TSEC3_RXD[7:4] TSEC4_GTX_CLK TSEC4_RX_CLK/TSEC3_COL TSEC4_RX_DV/TSEC3_CRS TSEC4_TX_EN/TSEC3_TX_ER AB8, Y7, AA7, Y8 AA1, Y3, AA2, AA4 AA5 Y5 AA3 AB6 DUART UART_CTS[0:1] UART_RTS[0:1] UART_SIN[0:1] UART_SOUT[0:1] I IIC1_SCL IIC1_SDA IIC2_SCL IIC2_SDA AB3, AC5 AC6, AD7 AB5, AC7 AB7, AD8 2C Pin Type O Power Supply LVDD Notes 5, 9, 33 O I O I I I I O TVDD TVDD TVDD TVDD TVDD TVDD TVDD TVDD 5, 9, 29 — — — — — — 30 O I O I I/O O TVDD TVDD TVDD TVDD TVDD TVDD 1, 5, 9, 29 1 1 1, 31 1, 30 I O I O OV DD OV DD OV DD OV DD — — — — Interface I/O I/O I/O I/O OV DD OV DD OV DD OV DD 4, 27 4, 27 4, 27 4, 27 AG22 AG21 AG15 AG14 SerDes SD_RX[0:3] SD_RX[0:3] SD_TX[0:3] SD_TX[0:3] Reserved Reserved M28, N26, P28, R26 M27, N25, P27, R25 M22, N20, P22, R20 M23, N21, P23, R21 W26, Y28, AA26, AB28 W25, Y27, AA25, AB27 I I O O — — XVDD XVDD XVDD XVDD — — — — — — 40 40 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 103 Package Description Table 68. MPC8547E Pinout Listing (continued) Signal Reserved Reserved SD_PLL_TPD SD_REF_CLK SD_REF_CLK Reserved Reserved Reserved Reserved Package Pin Number U20, V22, W20, Y22 U21, V23, W21, Y23 U28 T28 T27 AC1, AC3 M26, V28 M25, V27 M20, M21, T22, T23 General-Purpose Output GPOUT[24:31] K26, K25, H27, G28, H25, J26, K24, K23 System Control HRESET HRESET_REQ SRESET CKSTP_IN CKSTP_OUT AG17 AG16 AG20 AA9 AA8 Debug TRIG_IN TRIG_OUT/READY/QUIESCE MSRCID[0:1] MSRCID[2:4] MDVAL CLK_OUT AB2 AB1 AE4, AG2 AF3, AF1, AF2 AE5 AE21 Clock RTC SYSCLK AF16 AH17 JTAG TCK TDI TDO TMS TRST AG28 AH28 AF28 AH27 AH23 I I O I I OV DD OV DD OV DD OV DD OV DD — 12 11 12 12 I I OV DD OV DD — — I O O O O O OV DD OV DD OV DD OV DD OV DD OV DD — 6, 9, 19, 29 5, 6, 9 6, 19, 29 6 11 I O I I O OV DD OV DD OV DD OV DD OV DD — 29 — — 2, 4 O BVDD — Pin Type — — O I I — — — — Power Supply — — XVDD XVDD XVDD — — — — Notes 15 15 24 — — 2 32 34 38 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 104 Freescale Semiconductor Package Description Table 68. MPC8547E Pinout Listing (continued) Signal Package Pin Number DFT L1_TSTCLK L2_TSTCLK LSSD_MODE TEST_SEL AC25 AE22 AH20 AH14 Thermal Management THERM0 THERM1 AG1 AH1 Power Management ASLEEP AH18 Power and Ground Signals GND A11, B7, B24, C1, C3, C5, C12, C15, C26, D8, D11, D16, D20, D22, E1, E5, E9, E12, E15, E17, F4, F26, G12, G15, G18, G21, G24, H2, H6, H8, H28, J4, J12, J15, J17, J27, K7, K9, K11, K27, L3, L5, L12, L16, N11, N13, N15, N17, N19, P4, P9, P12, P14, P16, P18, R11, R13, R15, R17, R19, T4, T12, T14, T16, T18, U8, U11, U13, U15, U17, U19, V4, V12, V18, W6, W19, Y4, Y9, Y11, Y19, AA6, AA14, AA17, AA22, AA23, AB4, AC2, AC11, AC19, AC26, AD5, AD9, AD22, AE3, AE14, AF6, AF10, AF13, AG8, AG27, K28, L24, L26, N24, N27, P25, R28, T24, T26, U24, V25, W28, Y24, Y26, AA24, AA27, AB25, AC28, L21, L23, N22, P20, R23, T21, U22, V20, W23, Y21, U27 V16, W11, W14, Y18, AA13, AA21, AB11, AB17, AB24, AC4, AC9, AC21, AD6, AD13, AD17, AD19, AE10, AE8, AE24, AF4, AF12, AF22, AF27, AG26 N8, R7, T9, U6 — — — O OV DD 9, 19, 29 — — — — 14 14 I I I I OV DD OV DD OV DD OV DD 25 25 25 25 Pin Type Power Supply Notes OVDD Power for PCI and other standards (3.3 V) Power for TSEC1 and TSEC2 (2.5 V, 3.3 V) Power for TSEC3 and TSEC4 (2,5 V, 3.3 V) Power for DDR1 and DDR2 DRAM I/O voltage (1.8 V, 2.5 V) OV DD — LVDD LVDD — TVDD W9, Y6 TVDD — GVDD B3, B11, C7, C9, C14, C17, D4, D6, D10, D15, E2, E8, E11, E18, F5, F12, F16, G3, G7, G9, G11, H5, H12, H15, H17, J10, K3, K12, K16, K18, L6, M4, M8, M13 GVDD — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 105 Package Description Table 68. MPC8547E Pinout Listing (continued) Signal BVDD Package Pin Number Pin Type Power Supply BVDD Notes — C21, C24, C27, E20, E25, G19, G23, H26, J20 Power for local bus (1.8 V, 2.5 V, 3.3 V) M19, N12, N14, N16, N18, P11, P13, P15, P17, Power for core P19, R12, R14, R16, R18, T11, T13, T15, T17, (1.1 V) T19, U12, U14, U16, U18, V17, V19 L25, L27, M24, N28, P24, P26, R24, R27, T25, Core power for V24, V26, W24, W27, Y25, AA28, AC27 SerDes transceivers (1.1 V) L20, L22, N23, P21, R22, T20, U23, V21, W22, Y20 Pad Power for SerDes transceivers (1.1 V) Power for local bus PLL (1.1 V) Power for PCI1 PLL (1.1 V) Power for PCI2 PLL (1.1 V) Power for e500 PLL (1.1 V) Power for CCB PLL (1.1 V) Power for SRDSPLL (1.1 V) O — VDD VDD — SVDD SVDD — XVDD XVDD — AVDD_LBIU J28 — 26 AVDD_PCI1 AH21 — 26 AVDD_PCI2 AH22 — 26 AVDD_CORE AVDD_PLAT AVDD_SRDS AH15 AH19 U25 — — — 26 26 26 SENSEVDD SENSEVSS M14 M16 Analog Signals VDD — 13 13 MVREF A18 I Reference voltage signal for DDR I I O MVREF — SD_IMP_CAL_RX SD_IMP_CAL_TX SD_PLL_TPA L28 AB26 U26 200 Ω to GND 100 Ω to GND — — — 24 Note: All note references in this table use the same numbers as those for Table 67. The reader should refer to Table 67 for the meanings of these notes. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 106 Freescale Semiconductor Package Description Table 69 provides the pin-out listing for the MPC8545E 783 FC-PBGA package. NOTE All note references in the following table use the same numbers as those for Table 67. The reader should refer to Table 67 for the meanings of these notes. Table 69. MPC8545E Pinout Listing Signal Package Pin Number PCI1 and PCI2 (One 64-Bit or Two 32-Bit) PCI1_AD[63:32]/PCI2_AD[31:0] AB14, AC15, AA15, Y16, W16, AB16, AC16, AA16, AE17, AA18, W18, AC17, AD16, AE16, Y17, AC18, AB18, AA19, AB19, AB21, AA20, AC20, AB20, AB22, AC22, AD21, AB23, AF23, AD23, AE23, AC23, AC24 AH6, AE7, AF7, AG7, AH7, AF8, AH8, AE9, AH9, AC10, AB10, AD10, AG10, AA10, AH10, AA11, AB12, AE12, AG12, AH12, AB13, AA12, AC13, AE13, Y14, W13, AG13, V14, AH13, AC14, Y15, AB15 AF15, AD14, AE15, AD15 AF9, AD11, Y12, Y13 W15 AG6, AE6, AF5, AH5 AG5 AF11 AD12 AC12 V13 W12 AG11 AH2, AG4, AG3, AH4 AH3 AH26 AH11 AE11 AG9 AF14 V15 AE28 AD26 I/O OV DD 17 Pin Type Power Supply Notes PCI1_AD[31:0] I/O OV DD 17 PCI1_C_BE[7:4]/PCI2_C_BE[3:0] PCI1_C_BE[3:0] PCI1_PAR64/PCI2_PAR PCI1_GNT[4:1] PCI1_GNT0 PCI1_IRDY PCI1_PAR PCI1_PERR PCI1_SERR PCI1_STOP PCI1_TRDY PCI1_REQ[4:1] PCI1_REQ0 PCI1_CLK PCI1_DEVSEL PCI1_FRAME PCI1_IDSEL PCI1_REQ64/PCI2_FRAME PCI1_ACK64/PCI2_DEVSEL PCI2_CLK PCI2_IRDY I/O I/O I/O O I/O I/O I/O I/O I/O I/O I/O I I/O I I/O I/O I I/O I/O I I/O OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD 17 17 — 5, 9, 35 — 2 — 2 2, 4 2 2 — — 39 2 2 — 2, 5, 10 2 39 2 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 107 Package Description Table 69. MPC8545E Pinout Listing (continued) Signal PCI2_PERR PCI2_GNT[4:1] PCI2_GNT0 PCI2_SERR PCI2_STOP PCI2_TRDY PCI2_REQ[4:1] PCI2_REQ0 Package Pin Number AD25 AE26, AG24, AF25, AE25 AG25 AD24 AF24 AD27 AD28, AE27, W17, AF26 AH25 DDR SDRAM Memory Interface MDQ[0:63] L18, J18, K14, L13, L19, M18, L15, L14, A17, B17, A13, B12, C18, B18, B13, A12, H18, F18, J14, F15, K19, J19, H16, K15, D17, G16, K13, D14, D18, F17, F14, E14, A7, A6, D5, A4, C8, D7, B5, B4, A2, B1, D1, E4, A3, B2, D2, E3, F3, G4, J5, K5, F6, G5, J6, K4, J1, K2, M5, M3, J3, J2, L1, M6 H13, F13, F11, C11, J13, G13, D12, M12 M17, C16, K17, E16, B6, C4, H4, K1, E13 M15, A16, G17, G14, A5, D3, H1, L2, C13 L17, B16, J16, H14, C6, C2, H3, L4, D13 A8, F9, D9, B9, A9, L10, M10, H10, K10, G10, B8, E10, B10, G6, A10, L11 F7, J7, M11 E7 H7 L8 F10, C10, J11, H11 K8, J8, G8, F8 H9, B15, G2, M9, A14, F1 J9, A15, G1, L9, B14, F2 E6, K6, L7, M7 A19, B19 Local Bus Controller Interface LAD[0:31] E27, B20, H19, F25, A20, C19, E28, J23, A25, K22, B28, D27, D19, J22, K20, D28, D25, B25, E22, F22, F21, C25, C22, B23, F20, A23, A22, E19, A21, D21, F19, B21 K21, C28, B26, B22 I/O BVDD — I/O GVDD — Pin Type I/O O I/O I/O I/O I/O I I/O Power Supply OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD Notes 2 5, 9, 35 — 2,4 2 2 — — MECC[0:7] MDM[0:8] MDQS[0:8] MDQS[0:8] MA[0:15] MBA[0:2] MWE MCAS MRAS MCKE[0:3] MCS[0:3] MCK[0:5] MCK[0:5] MODT[0:3] MDIC[0:1] I/O O I/O I/O O O O O O O O O O O I/O GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD — — — — — — — — — 11 — — — — 36 LDP[0:3] I/O BVDD — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 108 Freescale Semiconductor Package Description Table 69. MPC8545E Pinout Listing (continued) Signal LA[27] LA[28:31] LCS[0:4] LCS5/DMA_DREQ2 LCS6/DMA_DACK2 LCS7/DMA_DDONE2 LWE0 /LBS0/LSDDQM[0] LWE1 /LBS1/LSDDQM[1] LWE2 /LBS2/LSDDQM[2] LWE3 /LBS3/LSDDQM[3] LALE LBCTL LGPL0/LSDA10 LGPL1/LSDWE LGPL2/LOE/LSDRAS LGPL3/LSDCAS LGPL4/LGTA/LUPWAIT/LPBSE LGPL5 LCKE LCLK[0:2] LSYNC_IN LSYNC_OUT Package Pin Number H21 H20, A27, D26, A28 J25, C20, J24, G26, A26 D23 G20 E21 G25 C23 J21 A24 H24 G27 F23 G22 B27 F24 H23 E26 E24 E23, D24, H22 F27 F28 DMA DMA_DACK[0:1] DMA_DREQ [0:1] DMA_DDONE[0:1] AD3, AE1 AD4, AE2 AD2, AD1 Programmable Interrupt Controller UDE MCP IRQ[0:7] IRQ[8] IRQ[9]/DMA_DREQ3 IRQ[10]/DMA_DACK3 AH16 AG19 AG23, AF18, AE18, AF20, AG18, AF17, AH24, AE20 AF19 AF21 AE19 I I I I I I/O OV DD OV DD OV DD OV DD OV DD OV DD — — — — 1 1 O I O OV DD OV DD OV DD 5, 9, 106 — — Pin Type O O O I/O O O O O O O O O O O O O I/O O O O I O Power Supply BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD Notes 5, 9 5, 7, 9 — 1 1 1 5, 9 5, 9 5, 9 5, 9 5, 8, 9 5, 8, 9 5, 9 5, 9 5, 8, 9 5, 9 — 5, 9 — — — — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 109 Package Description Table 69. MPC8545E Pinout Listing (continued) Signal IRQ[11]/DMA_DDONE3 IRQ_OUT Package Pin Number AD20 AD18 Ethernet Management Interface EC_MDC EC_MDIO AB9 AC8 Gigabit Reference Clock EC_GTX_CLK125 V11 Three-Speed Ethernet Controller (Gigabit Ethernet 1) TSEC1_RXD[7:0] TSEC1_TXD[7:0] TSEC1_COL TSEC1_CRS TSEC1_GTX_CLK TSEC1_RX_CLK TSEC1_RX_DV TSEC1_RX_ER TSEC1_TX_CLK TSEC1_TX_EN TSEC1_TX_ER GPIN[0:7] GPOUT[0:5] cfg_dram_type0/GPOUT6 GPOUT7 Reserved Reserved Reserved Reserved FIFO1_RXC2 Reserved Reserved FIFO1_TXC2 cfg_dram_type1 R5, U1, R3, U2, V3, V1, T3, T2 T10, V7, U10, U5, U4, V6, T5, T8 R4 V5 U7 U3 V2 T1 T6 U9 T7 P2, R2, N1, N2, P3, M2, M1, N3 N9, N10, P8, N7, R9, N5 R8 N6 P1 R6 P6 N4 P5 R1 P10 P7 R10 Three-Speed Ethernet Controller (Gigabit Ethernet 3) TSEC3_TXD[3:0] V8, W10, Y10, W7 O TVDD 5, 9, 29 I O I I/O O I I I I O O I O O O — — — — I — — O I LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD — — — — LVDD — — LVDD LVDD — 5, 9 — 20 — — — — — 30 — 103 — 5, 9 — 104 104 15 105 104 104 105 15 5 I LVDD — O I/O OV DD OV DD 5, 9 — Pin Type I/O O Power Supply OV DD OV DD Notes 1 2, 4 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 110 Freescale Semiconductor Package Description Table 69. MPC8545E Pinout Listing (continued) Signal TSEC3_RXD[3:0] TSEC3_GTX_CLK TSEC3_RX_CLK TSEC3_RX_DV TSEC3_RX_ER TSEC3_TX_CLK TSEC3_TX_EN TSEC3_TXD[7:4] TSEC3_RXD[7:4] Reserved TSEC3_COL TSEC3_CRS TSEC3_TX_ER Package Pin Number Y1, W3, W5, W4 W8 W2 W1 Y2 V10 V9 AB8, Y7, AA7, Y8 AA1, Y3, AA2, AA4 AA5 Y5 AA3 AB6 DUART UART_CTS[0:1] UART_RTS[0:1] UART_SIN[0:1] UART_SOUT[0:1] I IIC1_SCL IIC1_SDA IIC2_SCL IIC2_SDA AB3, AC5 AC6, AD7 AB5, AC7 AB7, AD8 2C Pin Type I O I I I I O O I — I I/O O Power Supply TVDD TVDD TVDD TVDD TVDD TVDD TVDD TVDD TVDD — TVDD TVDD TVDD Notes — — — — — — 30 5, 9, 29 — 15 — 31 — I O I O OV DD OV DD OV DD OV DD — — — — interface I/O I/O I/O I/O OV DD OV DD OV DD OV DD 4, 27 4, 27 4, 27 4, 27 AG22 AG21 AG15 AG14 SerDes SD_RX[0:3] SD_RX[0:3] SD_TX[0:3] SD_TX[0:3] Reserved Reserved Reserved Reserved SD_PLL_TPD SD_REF_CLK M28, N26, P28, R26 M27, N25, P27, R25 M22, N20, P22, R20 M23, N21, P23, R21 W26, Y28, AA26, AB28 W25, Y27, AA25, AB27 U20, V22, W20, Y22 U21, V23, W21, Y23 U28 T28 I I O O — — — — O I XVDD XVDD XVDD XVDD — — — — XVDD XVDD — — — — 40 40 15 15 24 — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 111 Package Description Table 69. MPC8545E Pinout Listing (continued) Signal SD_REF_CLK Reserved Reserved Reserved Reserved Package Pin Number T27 AC1, AC3 M26, V28 M25, V27 M20, M21, T22, T23 General-Purpose Output GPOUT[24:31] K26, K25, H27, G28, H25, J26, K24, K23 System Control HRESET HRESET_REQ SRESET CKSTP_IN CKSTP_OUT AG17 AG16 AG20 AA9 AA8 Debug TRIG_IN TRIG_OUT/READY/QUIESCE MSRCID[0:1] MSRCID[2:4] MDVAL CLK_OUT AB2 AB1 AE4, AG2 AF3, AF1, AF2 AE5 AE21 Clock RTC SYSCLK AF16 AH17 JTAG TCK TDI TDO TMS TRST AG28 AH28 AF28 AH27 AH23 DFT L1_TSTCLK L2_TSTCLK LSSD_MODE AC25 AE22 AH20 I I I OV DD OV DD OV DD 25 25 25 I I O I I OV DD OV DD OV DD OV DD OV DD — 12 11 12 12 I I OV DD OV DD — — I O O O O O OV DD OV DD OV DD OV DD OV DD OV DD — 6, 9, 19, 29 5, 6, 9 6, 19, 29 6 11 I O I I O OV DD OV DD OV DD OV DD OV DD — 29 — — 2, 4 O BVDD — Pin Type I — — — — Power Supply XVDD — — — — Notes — 2 32 34 38 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 112 Freescale Semiconductor Package Description Table 69. MPC8545E Pinout Listing (continued) Signal TEST_SEL Package Pin Number AH14 Thermal Management THERM0 THERM1 AG1 AH1 Power Management ASLEEP AH18 Power and Ground Signals GND A11, B7, B24, C1, C3, C5, C12, C15, C26, D8, D11, D16, D20, D22, E1, E5, E9, E12, E15, E17, F4, F26, G12, G15, G18, G21, G24, H2, H6, H8, H28, J4, J12, J15, J17, J27, K7, K9, K11, K27, L3, L5, L12, L16, N11, N13, N15, N17, N19, P4, P9, P12, P14, P16, P18, R11, R13, R15, R17, R19, T4, T12, T14, T16, T18, U8, U11, U13, U15, U17, U19, V4, V12, V18, W6, W19, Y4, Y9, Y11, Y19, AA6, AA14, AA17, AA22, AA23, AB4, AC2, AC11, AC19, AC26, AD5, AD9, AD22, AE3, AE14, AF6, AF10, AF13, AG8, AG27, K28, L24, L26, N24, N27, P25, R28, T24, T26, U24, V25, W28, Y24, Y26, AA24, AA27, AB25, AC28, L21, L23, N22, P20, R23, T21, U22, V20, W23, Y21, U27 V16, W11, W14, Y18, AA13, AA21, AB11, AB17, AB24, AC4, AC9, AC21, AD6, AD13, AD17, AD19, AE10, AE8, AE24, AF4, AF12, AF22, AF27, AG26 N8, R7, T9, U6 — — — O OV DD 9, 19, 29 — — — — 14 14 Pin Type I Power Supply OV DD Notes 25 OVDD Power for PCI and other standards (3.3 V) Power for TSEC1 and TSEC2 (2.5 V, 3.3 V) Power for TSEC3 and TSEC4 (2,5 V, 3.3 V) Power for DDR1 and DDR2 DRAM I/O voltage (1.8 V, 2.5 V) OV DD — LVDD LVDD — TVDD W9, Y6 TVDD — GVDD B3, B11, C7, C9, C14, C17, D4, D6, D10, D15, E2, E8, E11, E18, F5, F12, F16, G3, G7, G9, G11, H5, H12, H15, H17, J10, K3, K12, K16, K18, L6, M4, M8, M13 GVDD — BVDD C21, C24, C27, E20, E25, G19, G23, H26, J20 Power for local bus (1.8 V, 2.5 V, 3.3 V) BVDD — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 113 Package Description Table 69. MPC8545E Pinout Listing (continued) Signal VDD Package Pin Number Pin Type Power Supply VDD Notes — M19, N12, N14, N16, N18, P11, P13, P15, P17, Power for core (1.1 V) P19, R12, R14, R16, R18, T11, T13, T15, T17, T19, U12, U14, U16, U18, V17, V19 L25, L27, M24, N28, P24, P26, R24, R27, T25, Core power for V24, V26, W24, W27, Y25, AA28, AC27 SerDes transceivers (1.1 V) L20, L22, N23, P21, R22, T20, U23, V21, W22, Y20 Pad power for SerDes transceivers (1.1 V) Power for local bus PLL (1.1 V) Power for PCI1 PLL (1.1 V) Power for PCI2 PLL (1.1 V) Power for e500 PLL (1.1 V) Power for CCB PLL (1.1 V) Power for SRDSPLL (1.1 V) O — SVDD SVDD — XVDD XVDD — AVDD_LBIU J28 — 26 AVDD_PCI1 AH21 — 26 AVDD_PCI2 AH22 — 26 AVDD_CORE AVDD_PLAT AVDD_SRDS AH15 AH19 U25 — — — 26 26 26 SENSEVDD SENSEVSS M14 M16 Analog Signals VDD — 13 13 MVREF A18 I Reference voltage signal for DDR I I O MVREF — SD_IMP_CAL_RX SD_IMP_CAL_TX SD_PLL_TPA L28 AB26 U26 200 Ω to GND 100 Ω to GND — — — 24 Note: All note references in this table use the same numbers as those for Table 67. The reader should refer to Table 67 for the meanings of these notes. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 114 Freescale Semiconductor Package Description Table 70 provides the pin-out listing for the MPC8543E 783 FC-PBGA package. NOTE All note references in the following table use the same numbers as those for Table 67. The reader should refer to Table 67 for the meanings of these notes. Table 70. MPC8543E Pinout Listing Signal Package Pin Number PCI1 (One 32-Bit) Reserved AB14, AC15, AA15, Y16, W16, AB16, AC16, AA16, AE17, AA18, W18, AC17, AD16, AE16, Y17, AC18, AB18, AA19, AB19, AB21, AA20, AC20, AB20, AB22 AC22, AD21, AB23, AF23, AD23, AE23, AC23, AC24 AH6, AE7, AF7, AG7, AH7, AF8, AH8, AE9, AH9, AC10, AB10, AD10, AG10, AA10, AH10, AA11, AB12, AE12, AG12, AH12, AB13, AA12, AC13, AE13, Y14, W13, AG13, V14, AH13, AC14, Y15, AB15 AF15, AD14, AE15, AD15 AF9, AD11, Y12, Y13 W15 AG6, AE6, AF5, AH5 AG5 AF11 AD12 AC12 V13 W12 AG11 AH2, AG4, AG3, AH4 AH3 AH26 AH11 AE11 AG9 AF14 V15 — — 110 Pin Type Power Supply Notes GPOUT[8:15] GPIN[8:15] PCI1_AD[31:0] O I I/O OV DD OV DD OV DD — 111 17 Reserved PCI1_C_BE[3:0] Reserved PCI1_GNT[4:1] PCI1_GNT0 PCI1_IRDY PCI1_PAR PCI1_PERR PCI1_SERR PCI1_STOP PCI1_TRDY PCI1_REQ[4:1] PCI1_REQ0 PCI1_CLK PCI1_DEVSEL PCI1_FRAME PCI1_IDSEL cfg_pci1_width Reserved — I/O — O I/O I/O I/O I/O I/O I/O I/O I I/O I I/O I/O I I/O — — OV DD — OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD OV DD — 110 17 110 5, 9, 35 — 2 — 2 2, 4 2 2 — — 39 2 2 — 112 110 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 115 Package Description Table 70. MPC8543E Pinout Listing (continued) Signal Reserved Reserved Reserved Reserved cfg_pci1_clk Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Package Pin Number AE28 AD26 AD25 AE26 AG24 AF25 AE25 AG25 AD24 AF24 AD27 AD28, AE27, W17, AF26 AH25 DDR SDRAM Memory Interface MDQ[0:63] L18, J18, K14, L13, L19, M18, L15, L14, A17, B17, A13, B12, C18, B18, B13, A12, H18, F18, J14, F15, K19, J19, H16, K15, D17, G16, K13, D14, D18, F17, F14, E14, A7, A6, D5, A4, C8, D7, B5, B4, A2, B1, D1, E4, A3, B2, D2, E3, F3, G4, J5, K5, F6, G5, J6, K4, J1, K2, M5, M3, J3, J2, L1, M6 H13, F13, F11, C11, J13, G13, D12, M12 M17, C16, K17, E16, B6, C4, H4, K1, E13 M15, A16, G17, G14, A5, D3, H1, L2, C13 L17, B16, J16, H14, C6, C2, H3, L4, D13 A8, F9, D9, B9, A9, L10, M10, H10, K10, G10, B8, E10, B10, G6, A10, L11 F7, J7, M11 E7 H7 L8 F10, C10, J11, H11 K8, J8, G8, F8 H9, B15, G2, M9, A14, F1 J9, A15, G1, L9, B14, F2 E6, K6, L7, M7 A19, B19 I/O GVDD — Pin Type — — — — I — — — — — — — — Power Supply — — — — OV DD — — — — — — — — Notes 2 110 110 110 5 101 110 110 110 110 110 110 110 MECC[0:7] MDM[0:8] MDQS[0:8] MDQS[0:8] MA[0:15] MBA[0:2] MWE MCAS MRAS MCKE[0:3] MCS[0:3] MCK[0:5] MCK[0:5] MODT[0:3] MDIC[0:1] I/O O I/O I/O O O O O O O O O O O I/O GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD — — — — — — — — — 11 — — — — 36 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 116 Freescale Semiconductor Package Description Table 70. MPC8543E Pinout Listing (continued) Signal Package Pin Number Local Bus Controller Interface LAD[0:31] E27, B20, H19, F25, A20, C19, E28, J23, A25, K22, B28, D27, D19, J22, K20, D28, D25, B25, E22, F22, F21, C25, C22, B23, F20, A23, A22, E19, A21, D21, F19, B21 K21, C28, B26, B22 H21 H20, A27, D26, A28 J25, C20, J24, G26, A26 D23 G20 E21 G25 C23 J21 A24 H24 G27 F23 G22 B27 F24 H23 E26 E24 E23, D24, H22 F27 F28 DMA DMA_DACK[0:1] DMA_DREQ [0:1] DMA_DDONE[0:1] AD3, AE1 AD4, AE2 AD2, AD1 Programmable Interrupt Controller UDE MCP AH16 AG19 I I OV DD OV DD — — O I O OV DD OV DD OV DD 5, 9, 108 — — I/O BVDD — Pin Type Power Supply Notes LDP[0:3] LA[27] LA[28:31] LCS[0:4] LCS5/DMA_DREQ2 LCS6/DMA_DACK2 LCS7/DMA_DDONE2 LWE0 /LBS0/LSDDQM[0] LWE1 /LBS1/LSDDQM[1] LWE2 /LBS2/LSDDQM[2] LWE3 /LBS3/LSDDQM[3] LALE LBCTL LGPL0/LSDA10 LGPL1/LSDWE LGPL2/LOE/LSDRAS LGPL3/LSDCAS LGPL4/LGTA/LUPWAIT/LPBSE LGPL5 LCKE LCLK[0:2] LSYNC_IN LSYNC_OUT I/O O O O I/O O O O O O O O O O O O O I/O O O O I O BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD — 5, 9 5, 7, 9 — 1 1 1 5, 9 5, 9 5, 9 5, 9 5, 8, 9 5, 8, 9 5, 9 5, 9 5, 8, 9 5, 9 — 5, 9 — — — — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 117 Package Description Table 70. MPC8543E Pinout Listing (continued) Signal IRQ[0:7] IRQ[8] IRQ[9]/DMA_DREQ3 IRQ[10]/DMA_DACK3 IRQ[11]/DMA_DDONE3 IRQ_OUT Package Pin Number AG23, AF18, AE18, AF20, AG18, AF17, AH24, AE20 AF19 AF21 AE19 AD20 AD18 Ethernet Management Interface EC_MDC EC_MDIO AB9 AC8 Gigabit Reference Clock EC_GTX_CLK125 V11 Three-Speed Ethernet Controller (Gigabit Ethernet 1) TSEC1_RXD[7:0] TSEC1_TXD[7:0] TSEC1_COL TSEC1_CRS TSEC1_GTX_CLK TSEC1_RX_CLK TSEC1_RX_DV TSEC1_RX_ER TSEC1_TX_CLK TSEC1_TX_EN TSEC1_TX_ER GPIN[0:7] GPOUT[0:5] cfg_dram_type0/GPOUT6 GPOUT7 Reserved Reserved Reserved Reserved FIFO1_RXC2 Reserved R5, U1, R3, U2, V3, V1, T3, T2 T10, V7, U10, U5, U4, V6, T5, T8 R4 V5 U7 U3 V2 T1 T6 U9 T7 P2, R2, N1, N2, P3, M2, M1, N3 N9, N10, P8, N7, R9, N5 R8 N6 P1 R6 P6 N4 P5 R1 I O I I/O O I I I I O O I O O O — — — — I — LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD LVDD — — — — LVDD — — 5, 9 — 20 — — — — — 30 — 103 — 5, 9 — 104 104 15 105 104 104 I LVDD — O I/O OV DD OV DD 5, 9 — Pin Type I I I I/O I/O O Power Supply OV DD OV DD OV DD OV DD OV DD OV DD Notes — — 1 1 1 2, 4 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 118 Freescale Semiconductor Package Description Table 70. MPC8543E Pinout Listing (continued) Signal Reserved FIFO1_TXC2 cfg_dram_type1 Package Pin Number P10 P7 R10 Pin Type — O O Power Supply — LVDD LVDD Notes 105 15 5, 9 Three-Speed Ethernet Controller (Gigabit Ethernet 3) TSEC3_TXD[3:0] TSEC3_RXD[3:0] TSEC3_GTX_CLK TSEC3_RX_CLK TSEC3_RX_DV TSEC3_RX_ER TSEC3_TX_CLK TSEC3_TX_EN TSEC3_TXD[7:4] TSEC3_RXD[7:4] Reserved TSEC3_COL TSEC3_CRS TSEC3_TX_ER V8, W10, Y10, W7 Y1, W3, W5, W4 W8 W2 W1 Y2 V10 V9 AB8, Y7, AA7, Y8 AA1, Y3, AA2, AA4 AA5 Y5 AA3 AB6 DUART UART_CTS[0:1] UART_RTS[0:1] UART_SIN[0:1] UART_SOUT[0:1] AB3, AC5 AC6, AD7 AB5, AC7 AB7, AD8 I2C interface IIC1_SCL IIC1_SDA IIC2_SCL IIC2_SDA AG22 AG21 AG15 AG14 SerDes SD_RX[0:7] SD_RX[0:7] SD_TX[0:7] SD_TX[0:7] SD_PLL_TPD M28, N26, P28, R26, W26, Y28, AA26, AB28 M27, N25, P27, R25, W25, Y27, AA25, AB27 M22, N20, P22, R20, U20, V22, W20, Y22 M23, N21, P23, R21, U21, V23, W21, Y23 U28 I I O O O XVDD XVDD XVDD XVDD XVDD — — — — 24 I/O I/O I/O I/O OV DD OV DD OV DD OV DD 4, 27 4, 27 4, 27 4, 27 I O I O OV DD OV DD OV DD OV DD — — — — O I O I I I I O O I — I I/O O TVDD TVDD TVDD TVDD TVDD TVDD TVDD TVDD TVDD TVDD — TVDD TVDD TVDD 5, 9, 29 — — — — — — 30 5, 9, 29 — 15 — 31 — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 119 Package Description Table 70. MPC8543E Pinout Listing (continued) Signal SD_REF_CLK SD_REF_CLK Reserved Reserved Reserved Reserved Package Pin Number T28 T27 AC1, AC3 M26, V28 M25, V27 M20, M21, T22, T23 General-Purpose Output GPOUT[24:31] K26, K25, H27, G28, H25, J26, K24, K23 System Control HRESET HRESET_REQ SRESET CKSTP_IN CKSTP_OUT AG17 AG16 AG20 AA9 AA8 Debug TRIG_IN TRIG_OUT/READY/QUIESCE MSRCID[0:1] MSRCID[2:4] MDVAL CLK_OUT AB2 AB1 AE4, AG2 AF3, AF1, AF2 AE5 AE21 Clock RTC SYSCLK AF16 AH17 JTAG TCK TDI TDO TMS TRST AG28 AH28 AF28 AH27 AH23 DFT L1_TSTCLK L2_TSTCLK AC25 AE22 I I OV DD OV DD 25 25 I I O I I OV DD OV DD OV DD OV DD OV DD — 12 11 12 12 I I OV DD OV DD — — I O O O O O OV DD OV DD OV DD OV DD OV DD OV DD — 6, 9, 19, 29 5, 6, 9 6, 19, 29 6 11 I O I I O OV DD OV DD OV DD OV DD OV DD — 29 — — 2, 4 O BVDD — Pin Type I I — — — — Power Supply XVDD XVDD — — — — Notes — — 2 32 34 38 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 120 Freescale Semiconductor Package Description Table 70. MPC8543E Pinout Listing (continued) Signal LSSD_MODE TEST_SEL Package Pin Number AH20 AH14 Thermal Management THERM0 THERM1 AG1 AH1 Power Management ASLEEP AH18 Power and Ground Signals GND A11, B7, B24, C1, C3, C5, C12, C15, C26, D8, D11, D16, D20, D22, E1, E5, E9, E12, E15, E17, F4, F26, G12, G15, G18, G21, G24, H2, H6, H8, H28, J4, J12, J15, J17, J27, K7, K9, K11, K27, L3, L5, L12, L16, N11, N13, N15, N17, N19, P4, P9, P12, P14, P16, P18, R11, R13, R15, R17, R19, T4, T12, T14, T16, T18, U8, U11, U13, U15, U17, U19, V4, V12, V18, W6, W19, Y4, Y9, Y11, Y19, AA6, AA14, AA17, AA22, AA23, AB4, AC2, AC11, AC19, AC26, AD5, AD9, AD22, AE3, AE14, AF6, AF10, AF13, AG8, AG27, K28, L24, L26, N24, N27, P25, R28, T24, T26, U24, V25, W28, Y24, Y26, AA24, AA27, AB25, AC28, L21, L23, N22, P20, R23, T21, U22, V20, W23, Y21, U27 V16, W11, W14, Y18, AA13, AA21, AB11, AB17, AB24, AC4, AC9, AC21, AD6, AD13, AD17, AD19, AE10, AE8, AE24, AF4, AF12, AF22, AF27, AG26 N8, R7, T9, U6 — — — O OV DD 9, 19, 29 — — — — 14 14 Pin Type I I Power Supply OV DD OV DD Notes 25 109 OVDD Power for PCI and other standards (3.3 V) Power for TSEC1 and TSEC2 (2.5 V, 3.3 V) Power for TSEC3 and TSEC4 (2,5 V, 3.3 V) Power for DDR1 and DDR2 DRAM I/O voltage (1.8 V,2.5 V) OV DD — LVDD LVDD — TVDD W9, Y6 TVDD — GVDD B3, B11, C7, C9, C14, C17, D4, D6, D10, D15, E2, E8, E11, E18, F5, F12, F16, G3, G7, G9, G11, H5, H12, H15, H17, J10, K3, K12, K16, K18, L6, M4, M8, M13 GVDD — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 121 Package Description Table 70. MPC8543E Pinout Listing (continued) Signal BVDD Package Pin Number C21, C24, C27, E20, E25, G19, G23, H26, J20 Pin Type Power for local bus (1.8 V, 2.5 V, 3.3 V) Power for core (1.1 V) Core power for SerDes transceivers (1.1 V) Pad power for SerDes transceivers (1.1 V) Power for local bus PLL (1.1 V) Power for PCI1 PLL (1.1 V) Power for PCI2 PLL (1.1 V) Power for e500 PLL (1.1 V) Power for CCB PLL (1.1 V) Power for SRDSPLL (1.1 V) O — Power Supply BVDD Notes — VDD M19, N12, N14, N16, N18, P11, P13, P15, P17, P19, R12, R14, R16, R18, T11, T13, T15, T17, T19, U12, U14, U16, U18, V17, V19 L25, L27, M24, N28, P24, P26, R24, R27, T25, V24, V26, W24, W27, Y25, AA28, AC27 VDD — SVDD SVDD — XVDD L20, L22, N23, P21, R22, T20, U23, V21, W22, Y20 XVDD — AVDD_LBIU J28 — 26 AVDD_PCI1 AH21 — 26 AVDD_PCI2 AH22 — 26 AVDD_CORE AH15 — 26 AVDD_PLAT AH19 — 26 AVDD_SRDS U25 — 26 SENSEVDD SENSEVSS M14 M16 Analog Signals VDD — 13 13 MVREF A18 I Reference voltage signal for DDR I MVREF — SD_IMP_CAL_RX L28 200 Ω (±1%) to GND — MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 122 Freescale Semiconductor Clocking Table 70. MPC8543E Pinout Listing (continued) Signal SD_IMP_CAL_TX SD_PLL_TPA Package Pin Number AB26 U26 Pin Type I O Power Supply 100 Ω (±1%) to GND AVDD_SRDS Notes — 24 Note: All note references in this table use the same numbers as those for Table 67. The reader should refer to Table 67 for the meanings of these notes. 19 Clocking This section describes the PLL configuration of the MPC8548E. Note that the platform clock is identical to the core complex bus (CCB) clock. 19.1 Clock Ranges Table 71 through Table 73 provide the clocking specifications for the processor cores and Table 74, through Table 76 provide the clocking specifications for the memory bus. Table 71. Processor Core Clocking Specifications (MPC8548E and MPC8547E) Maximum Processor Core Frequency Characteristic 1000 MHz Min e500 core processor frequency 800 Max 1000 1200 MHz Min 800 Max 1200 1333 MHz Min 800 Max 1333 MHz 1, 2 Unit Notes Notes: 1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2.)The minimum e500 core frequency is based on the minimum platform frequency of 333 MHz. Table 72. Processor Core Clocking Specifications (MPC8545E) Maximum Processor Core Frequency Characteristic 800 MHz Min e500 core processor frequency 800 Max 800 1000 MHz Min 800 Max 1000 1200 MHz Min 800 Max 1200 MHz 1, 2 Unit Notes Notes: 1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2.)The minimum e500 core frequency is based on the minimum platform frequency of 333 MHz. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 123 Clocking Table 73. Processor Core Clocking Specifications (MPC8543E) Maximum Processor Core Frequency Characteristic Min e500 core processor frequency 800 800 MHz Max 800 1000 MHz Min 800 Max 1000 MHz 1, 2 Unit Notes Notes: 1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2.)The minimum e500 core frequency is based on the minimum platform frequency of 333 MHz. Table 74. Memory Bus Clocking Specifications (MPC8548E and MPC8547E) Maximum Processor Core Frequency Characteristic 1000, 1200, 1333 MHz Min Memory bus clock speed 166 Max 266 MHz 1, 2 Unit Notes Notes: 1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2. The memory bus speed is half of the DDR/DDR2 data rate, hence, half of the platform clock frequency. Table 75. Memory Bus Clocking Specifications (MPC8545E) Maximum Processor Core Frequency Characteristic 800, 1000, 1200 MHz Min Memory bus clock speed 166 Max 200 MHz 1, 2 Unit Notes Notes: 1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2. The memory bus speed is half of the DDR/DDR2 data rate, hence, half of the platform clock frequency. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 124 Freescale Semiconductor Clocking Table 76. Memory Bus Clocking Specifications (MPC8543E) Maximum Processor Core Frequency Characteristic Min Memory bus clock speed 166 800, 1000 MHz Max 200 MHz 1, 2 Unit Notes Notes: 1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2. The memory bus speed is half of the DDR/DDR2 data rate, hence, half of the platform clock frequency. 19.2 CCB/SYSCLK PLL Ratio The CCB clock is the clock that drives the e500 core complex bus (CCB), and is also called the platform clock. The frequency of the CCB is set using the following reset signals, as shown in Table 77: • SYSCLK input signal • Binary value on LA[28:31] at power up Note that there is no default for this PLL ratio; these signals must be pulled to the desired values. Also note that the DDR data rate is the determining factor in selecting the CCB bus frequency, since the CCB frequency must equal the DDR data rate. For specifications on the PCI_CLK, refer to the PCI 2.2 Specification. Table 77. CCB Clock Ratio Binary Value of LA[28:31] Signals 0000 0001 0010 0011 0100 0101 0110 0111 CCB:SYSCLK Ratio 16:1 Reserved 2:1 3:1 4:1 5:1 6:1 Reserved Binary Value of LA[28:31] Signals 1000 1001 1010 1011 1100 1101 1110 1111 CCB:SYSCLK Ratio 8:1 9:1 10:1 Reserved 12:1 20:1 Reserved Reserved MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 125 Clocking 19.3 e500 Core PLL Ratio Table 78 describes the clock ratio between the e500 core complex bus (CCB) and the e500 core clock. This ratio is determined by the binary value of LBCTL, LALE, and LGPL2 at power up, as shown in Table 78. Table 78. e500 Core to CCB Clock Ratio Binary Value of LBCTL, LALE, LGPL2 Signals 000 001 010 011 Binary Value of LBCTL, LALE, LGPL2 Signals 100 101 110 111 e500 core:CCB Clock Ratio e500 core:CCB Clock Ratio 4:1 9:2 Reserved 3:2 2:1 5:2 3:1 7:2 19.4 Frequency Options Table 79 shows the expected frequency values for the platform frequency when using a CCB clock to SYSCLK ratio in comparison to the memory bus clock speed. Table 79. Frequency Options of SYSCLK with Respect to Memory Bus Speeds CCB to SYSCLK Ratio 16.66 25 33.33 41.66 SYSCLK (MHz) 66.66 83 100 111 133.33 Platform/CCB Frequency (MHz) 2 3 4 5 6 8 9 10 12 16 20 333 400 500 333 400 533 333 375 417 500 333 400 533 333 415 500 400 500 333 445 400 533 Note: Due to errata Gen 13 the max sys clk frequency should not exceed 100 MHz if the core clk frequency is below 1200 MHz. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 126 Freescale Semiconductor Thermal 20 Thermal This section describes the thermal specifications of the MPC8548. 20.1 Thermal for Version 2.0 Silicon HiCTE FC-CBGA with Full Lid This section describes the thermal specifications for the HiCTE FC-CBGA package for revision 2.0 silicon. Table 80 shows the package thermal characteristics. Table 80. Package Thermal Characteristics for HiCTE FC-CBGA Characteristic Die junction-to-ambient (natural convection) Die junction-to-ambient (natural convection) Die junction-to-ambient (200 ft/min) Die junction-to-ambient (200 ft/min) Die junction-to-board Die junction-to-case JEDEC Board Single-layer board (1s) Four-layer board (2s2p) Single-layer board (1s) Four-layer board (2s2p) N/A N/A Symbol RθJA RθJA RθJA RθJA RθJB RθJC Value 17 12 11 8 3 0.8 Unit °C/W °C/W °C/W °C/W °C/W °C/W Notes 1, 2 1, 2 1, 2 1, 2 3 4 Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. 2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. 3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the interface layer. 20.2 Thermal for Version 2.1.1 and 2.1.2 Silicon FC-PBGA with Full Lid This section describes the thermal specifications for the FC-PBGA package for revision 2.1.1 silicon. Table 81 shows the package thermal characteristics. Table 81. Package Thermal Characteristics for FC-PBGA Characteristic Die junction-to-ambient (natural convection) Die junction-to-ambient (natural convection) Die junction-to-ambient (200 ft/min) Die junction-to-ambient (200 ft/min) Die junction-to-board JEDEC Board Single-layer board (1s) Four-layer board (2s2p) Single-layer board (1s) Four-layer board (2s2p) N/A Symbol RθJA RθJA RθJA RθJA RθJB Value 18 13 13 9 5 Unit °C/W °C/W °C/W °C/W °C/W Notes 1, 2 1, 2 1, 2 1, 2 3 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 127 System Design Information Table 81. Package Thermal Characteristics for FC-PBGA (continued) Characteristic Die junction-to-case JEDEC Board N/A Symbol RθJC Value 0.8 Unit °C/W Notes 4 Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. 2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. 3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the interface layer. 20.3 Heat Sink Solution Every system application has different conditions that the thermal management solution must solve. As such, providing a recommended heat sink has not been found to be very useful. When a heat sink is chosen, give special consideration to the mounting technique. Mounting the heat sink to the printed-circuit board is the recommended procedure using a maximum of 10 lbs force (45 Newtons) perpendicular to the package and board. Clipping the heat sink to the package is not recommended. 21 System Design Information This section provides electrical design recommendations for successful application of the MPC8548E. 21.1 System Clocking This device includes five PLLs, as follows: 1. The platform PLL generates the platform clock from the externally supplied SYSCLK input. The frequency ratio between the platform and SYSCLK is selected using the platform PLL ratio configuration bits as described in Section 19.2, “CCB/SYSCLK PLL Ratio.” 2. The e500 core PLL generates the core clock as a slave to the platform clock. The frequency ratio between the e500 core clock and the platform clock is selected using the e500 PLL ratio configuration bits as described in Section 19.3, “e500 Core PLL Ratio.” 3. The PCI PLL generates the clocking for the PCI bus. 4. The local bus PLL generates the clock for the local bus. 5. There is a PLL for the SerDes block. 21.2 PLL Power Supply Filtering Each of the PLLs listed above is provided with power through independent power supply pins (AVDD_PLAT, AVDD_CORE, AVDD_PCI, AVDD_LBIU, and AVDD_SRDS, respectively). The AVDD level should always be equivalent to VDD, and preferably these voltages will be derived directly from VDD through a low frequency filter scheme such as the following. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 128 Freescale Semiconductor System Design Information There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to provide independent filter circuits per PLL power supply as illustrated in Figure 56, one to each of the AVDD pins. By providing independent filters to each PLL the opportunity to cause noise injection from one PLL to the other is reduced. This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL). Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value capacitor. Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AV DD pin, which is on the periphery of the footprint, without the inductance of vias. Figure 56 through Figure 58 shows the PLL power supply filter circuits. 150 Ω V DD 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors AVDD_PLAT GND Figure 56. PLL Power Supply Filter Circuit with PLAT Pins 180 Ω 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors GND V DD AVDD_CORE Figure 57. PLL Power Supply Filter Circuit with CORE Pins 10 Ω V DD 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors AVDD_PCI/AVDD_LBIU GND Figure 58. PLL Power Supply Filter Circuit with PCI/LBIU Pins The AVDD_SRDS signal provides power for the analog portions of the SerDes PLL. To ensure stability of the internal clock, the power supplied to the PLL is filtered using a circuit similar to the one shown in following figure. For maximum effectiveness, the filter circuit is placed as closely as possible to the AVDD_SRDS ball to ensure it filters out as much noise as possible. The ground connection should be near the AVDD_SRDS ball. The 0.003-µF capacitor is closest to the ball, followed by the two 2.2 µF capacitors, and finally the 1 Ω resistor to the board supply plane. The capacitors are connected from AVDD_SRDS to the ground plane. Use ceramic chip capacitors with the highest possible self-resonant frequency. All traces should be kept short, wide and direct. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 129 System Design Information SVDD 1.0 Ω AVDD_SRDS 2.2 µF 1 2.2 µF 1 0.003 µF GND Note: 1. An 0805 sized capacitor is recommended for system initial bring-up. Figure 59. SerDes PLL Power Supply Filter Note the following: • AVDD_SRDS should be a filtered version of SVDD. • Signals on the SerDes interface are fed from the XVDD power plane. 21.3 Decoupling Recommendations Due to large address and data buses, and high operating frequencies, the device can generate transient power surges and high frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from reaching other components in the MPC8548E system, and the device itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer place at least one decoupling capacitor at each VDD, TVDD, BVDD, OVDD, GVDD, and LVDD pin of the device. These decoupling capacitors should receive their power from separate VDD, TVDD, BVDD, OVDD, GVDD, LVDD, and GND power planes in the PCB, utilizing short low impedance traces to minimize inductance. Capacitors must be placed directly under the device using a standard escape pattern as much as possible. If some caps are to be placed surrounding the part it should be routed with large trace to minimize the inductance. These capacitors should have a value of 0.1 µF. Only ceramic SMT (surface mount technology) capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes. In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the VDD, TVDD, BVDD, OVDD, GVDD, and LVDD, planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick response time necessary. They should also be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk capacitors—100–330 µF (AVX TPS tantalum or Sanyo OSCON). However, customers should work directly with their power regulator vendor for best values, types and quantity of bulk capacitors. 21.4 SerDes Block Power Supply Decoupling Recommendations The SerDes block requires a clean, tightly regulated source of power (SVDD and XVDD) to ensure low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is outlined below. Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections from all capacitors to power and ground should be done with multiple vias to further reduce inductance. • First, the board should have at least 10 × 10-nF SMT ceramic chip capacitors as close as possible to the supply balls of the device. Where the board has blind vias, these capacitors should be placed MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 130 Freescale Semiconductor System Design Information • • directly below the chip supply and ground connections. Where the board does not have blind vias, these capacitors should be placed in a ring around the device as close to the supply and ground connections as possible. Second, there should be a 1-µF ceramic chip capacitor from each SerDes supply (SVDD and XVDD) to the board ground plane on each side of the device. This should be done for all SerDes supplies. Third, between the device and any SerDes voltage regulator there should be a 10-µF, low equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-µF, low ESR SMT tantalum chip capacitor. This should be done for all SerDes supplies. 21.5 Connection Recommendations To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal level. All unused active low inputs should be tied to VDD, TVDD, BVDD, OVDD, GVDD, and LVDD, as required. All unused active high inputs should be connected to GND. All NC (no-connect) signals must remain unconnected. Power and ground connections must be made to all external VDD, TVDD, BVDD, OVDD, GVDD, LVDD, and GND pins of the device. 21.6 Pull-Up and Pull-Down Resistor Requirements The MPC8548E requires weak pull-up resistors (2–10 kΩ is recommended) on open drain type pins including I2C pins and PIC (interrupt) pins. Correct operation of the JTAG interface requires configuration of a group of system control pins as demonstrated in Figure 62. Care must be taken to ensure that these pins are maintained at a valid deasserted state under normal operating conditions as most have asynchronous behavior and spurious assertion will give unpredictable results. The following pins must not be pulled down during power-on reset: TSEC3_TXD[3], HRESET_REQ, TRIG_OUT/READY/QUIESCE, MSRCID[2:4], ASLEEP. The DMA_DACK[0:1], and TEST_SEL/ TEST_SEL pins must be set to a proper state during POR configuration. Refer to the pinlist table of the individual device for more details Refer to the PCI 2.2 specification for all pull ups required for PCI. 21.7 Output Buffer DC Impedance The MPC8548E drivers are characterized over process, voltage, and temperature. For all buses, the driver is a push-pull single-ended driver type (open drain for I2C). To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 60). The output impedance is the average of two components, the resistances of the pull-up and pull-down devices. When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in value. Then, Z0 = (RP + RN)/2. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 131 System Design Information OVDD RN SW2 Data Pad SW1 RP OGND Figure 60. Driver Impedance Measurement Table 82 summarizes the signal impedance targets. The driver impedances are targeted at minimum VDD, nominal OVDD, 105°C. Table 82. Impedance Characteristics Impedance RN RP Local Bus, Ethernet, DUART, Control, Configuration, Power Management 43 Target 43 Target PCI 25 Target 25 Target DDR DRAM 20 Target 20 Target Symbol Z0 Z0 Unit W W Note: Nominal supply voltages. See Table 1, Tj = 105° C. 21.8 Configuration Pin Muxing The MPC8548E provides the user with power-on configuration options which can be set through the use of external pull-up or pull-down resistors of 4.7 kΩ on certain output pins (see customer visible configuration pins). These pins are generally used as output only pins in normal operation. While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins while HRESET is asserted, is latched when HRESET deasserts, at which time the input receiver is disabled and the I/O circuit takes on its normal function. Most of these sampled configuration pins are equipped with an on-chip gated resistor of approximately 20 kΩ. This value should permit the 4.7-kΩ resistor to pull the configuration pin to a valid logic low level. The pull-up resistor is enabled only during HRESET (and for platform/system clocks after HRESET deassertion to ensure capture of the reset value). When the input receiver is disabled the pull-up is also, thus allowing functional operation of the pin as an output with minimal signal quality or delay disruption. The default value for all configuration bits treated this way has been encoded such that a high voltage level puts the device into the default state and external resistors are needed only when non-default settings are required by the user. Careful board layout with stubless connections to these pull-down resistors coupled with the large value of the pull-down resistor should minimize the disruption of signal quality or speed for output pins thus configured. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 132 Freescale Semiconductor System Design Information The platform PLL ratio and e500 PLL ratio configuration pins are not equipped with these default pull-up devices. 21.9 JTAG Configuration Signals Correct operation of the JTAG interface requires configuration of a group of system control pins as demonstrated in Figure 62. Care must be taken to ensure that these pins are maintained at a valid deasserted state under normal operating conditions as most have asynchronous behavior and spurious assertion will give unpredictable results. Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the IEEE 1149.1 specification, but it is provided on all processors built on Power Architecture technology. The device requires TRST to be asserted during power-on reset flow to ensure that the JTAG boundary logic does not interfere with normal chip operation. While the TAP controller can be forced to the reset state using only the TCK and TMS signals, generally systems assert TRST during the power-on reset flow. Simply tying TRST to HRESET is not practical because the JTAG interface is also used for accessing the common on-chip processor (COP), which implements the debug interface to the chip. The COP function of these processors allow a remote computer system (typically, a PC with dedicated hardware and debugging software) to access and control the internal operations of the processor. The COP interface connects primarily through the JTAG port of the processor, with some additional status monitoring signals. The COP port requires the ability to independently assert HRESET or TRST in order to fully control the processor. If the target system has independent reset sources, such as voltage monitors, watchdog timers, power supply failures, or push-button switches, then the COP reset signals must be merged into these signals with logic. The arrangement shown in Figure 62 allows the COP port to independently assert HRESET or TRST, while ensuring that the target can drive HRESET as well. The COP interface has a standard header, shown in Figure 61, for connection to the target system, and is based on the 0.025" square-post, 0.100" centered header assembly (often called a Berg header). The connector typically has pin 14 removed as a connector key. The COP header adds many benefits such as breakpoints, watchpoints, register and memory examination/modification, and other standard debugger features. An inexpensive option can be to leave the COP header unpopulated until needed. There is no standardized way to number the COP header; so emulator vendors have issued many different pin numbering schemes. Some COP headers are numbered top-to-bottom then left-to-right, while others use left-to-right then top-to-bottom. Still others number the pins counter-clockwise from pin 1 (as with an IC). Regardless of the numbering scheme, the signal placement recommended in Figure 61 is common to all known emulators. 21.9.1 Termination of Unused Signals If the JTAG interface and COP header will not be used, Freescale recommends the following connections: • TRST should be tied to HRESET through a 0 kΩ isolation resistor so that it is asserted when the system reset signal (HRESET) is asserted, ensuring that the JTAG scan chain is initialized during the power-on reset flow. Freescale recommends that the COP header be designed into the system MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 133 System Design Information • as shown in Figure 62. If this is not possible, the isolation resistor will allow future access to TRST in case a JTAG interface may need to be wired onto the system in future debug situations. No pull-up/pull-down is required for TDI, TMS, TDO, or TCK. COP_TDO COP_TDI COP_RUN/STOP COP_TCK COP_TMS COP_SRESET COP_HRESET COP_CHKSTP_OUT 1 3 5 7 9 11 13 15 2 4 6 8 10 12 KEY No pin 16 GND NC COP_TRST COP_VDD_SENSE COP_CHKSTP_IN NC NC Figure 61. COP Connector Physical Pinout MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 134 Freescale Semiconductor System Design Information OVDD SRESET HRESET 10 kΩ 10 kΩ SRESET 6 HRESET1 From Target Board Sources (if any) 13 11 COP_HRESET COP_SRESET B 5 10 kΩ A 10 kΩ 10 kΩ 10 kΩ TRST1 1 3 5 7 9 11 2 4 6 8 10 12 4 6 5 COP Header 15 14 3 COP_TRST COP_VDD_SENSE2 NC COP_CHKSTP_OUT 10 kΩ 10 Ω CKSTP_OUT 10 kΩ KEY 13 No pin COP_CHKSTP_IN 8 COP_TMS 9 TMS COP_TDO COP_TDI COP_TCK 7 2 10 12 16 NC NC 4 CKSTP_IN 15 16 COP Connector Physical Pinout 1 3 TDO TDI TCK Notes: 1. The COP port and target board should be able to independently assert HRESET and TRST to the processor in order to fully control the processor as shown here. 2. Populate this with a 10−Ω resistor for short-circuit/current-limiting protection. 3. The KEY location (pin 14) is not physically present on the COP header. 4. Although pin 12 is defined as a No-Connect, some debug tools may use pin 12 as an additional GND pin for improved signal integrity. 5. This switch is included as a precaution for BSDL testing. The switch should be closed to position A during BSDL testing to avoid accidentally asserting the TRST line. If BSDL testing is not being performed, this switch should be closed to position B. 6. Asserting SRESET causes a machine check interrupt to the e500 core. Figure 62. JTAG Interface Connection MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 135 System Design Information 21.10 Guidelines for High-Speed Interface Termination This section provides the guidelines for high-speed interface termination when the SerDes interface is entirely unused and when it is partly unused. 21.10.1 SerDes Interface Entirely Unused If the high-speed SerDes interface is not used at all, the unused pin should be terminated as described in this section. The following pins must be left unconnected (float): • SD_TX[7:0] • SD_TX[7:0] • Reserved pins T22, T23, M20, M21 The following pins must be connected to GND: • SD_RX[7:0] • SD_RX[7:0] • SD_REF_CLK • SD_REF_CLK NOTE It is recommended to power down the unused lane through SRDSCR1[0:7] register (offset = 0xE_0F08) (This prevents the oscillations and holds the receiver output in a fixed state.) that maps to SERDES lane 0 to lane 7 accordingly. Pins V28 and M26 must be tied to XVDD. Pins V27 and M25 must be tied to GND through a 300-Ω resistor. In Rev 2.0 silicon, POR configuration pin cfg_srds_en on TSEC4_TXD[2]/TSEC3_TXD[6] can be used to power down SerDes block. 21.10.2 SerDes Interface Partly Unused If only part of the high-speed SerDes interface pins are used, the remaining high-speed serial I/O pins should be terminated as described in this section. The following pins must be left unconnected (float) if not used: • SD_TX[7:0] • SD_TX[7:0] • Reserved pins: T22, T23, M20, M21 The following pins must be connected to GND if not used: • SD_RX[7:0] • SD_RX[7:0] • SD_REF_CLK MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 136 Freescale Semiconductor Ordering Information • SD_REF_CLK NOTE It is recommended to power down the unused lane through SRDSCR1[0:7] register (offset = 0xE_0F08) (this prevents the oscillations and holds the receiver output in a fixed state) that maps to SERDES lane 0 to lane 7 accordingly. Pins V28 and M26 must be tied to XVDD. Pins V27 and M25 must be tied to GND through a 300-Ω resistor. 21.11 Guideline for PCI Interface Termination PCI termination if PCI 1 or PCI 2 is not used at all. Option 1 If PCI arbiter is enabled during POR: • All AD pins will be driven to the stable states after POR. Therefore, all ADs pins can be floating. • All PCI control pins can be grouped together and tied to OVDD through a single 10-kΩ resistor. • It is optional to disable PCI block through DEVDISR register after POR reset. Option 2 If PCI arbiter is disabled during POR: • All AD pins will be in the input state. Therefore, all ADs pins need to be grouped together and tied to OVDD through a single (or multiple) 10-kΩ resistor(s). • All PCI control pins can be grouped together and tied to OVDD through a single 10-kΩ resistor. • It is optional to disable PCI block through DEVDISR register after POR reset. 21.12 Guideline for LBIU Termination If the LBIU parity pins are not used, the following is the termination recommendation: • For LDP[0:3]—tie them to ground or the power supply rail via a 4.7-kΩ resistor. • For LPBSE—tie it to the power supply rail via a 4.7-kΩ resistor (pull-up resistor). 22 Ordering Information Ordering information for the parts fully covered by this specification document is provided in Section 22.1, “Part Numbers Fully Addressed by this Document.” 22.1 Part Numbers Fully Addressed by this Document Table 83 provides the Freescale part numbering nomenclature for the MPC8548E. Note that the individual part numbers correspond to a maximum processor core frequency. For available frequencies, contact your local Freescale sales office. In addition to the processor frequency, the part numbering scheme also MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 137 Ordering Information includes an application modifier which may specify special application conditions. Each part number also contains a revision code which refers to the die mask revision number. MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 138 Freescale Semiconductor Ordering Information Table 83. Part Numbering Nomenclature MPC Product Code MPC nnnnn Part Identifier 8548E t Temperature pp Package1, 2, 3 ff Processor Frequency4 AV = 15003 AU = 1333 AT = 1200 AQ = 1000 c Core Frequency J = 533 H = 5005 G = 400 r Silicon Version Blank = Ver. 2.0 (SVR = 0x80390020) A = Ver. 2.1.1 B = Ver. 2.1.2 (SVR = 0x80390021) Blank = Ver. 2.0 (SVR = 0x80310020) A = Ver. 2.1.1 B = Ver. 2.1.2 (SVR = 0x80310021) Blank = 0 to 105°C HX = CBGA C = –40° to 105°C VU = Pb-free CBGA PX = PBGA VT = Pb-free PBGA 8548 8547E AU = 1333 AT = 1200 AQ = 1000 J = 533 G = 400 Blank = Ver. 2.0 (SVR = 0x80390120) A = Ver. 2.1.1 B = Ver. 2.1.2 (SVR = 0x80390121) Blank = Ver. 2.0 (SVR = 0x80390120) A = Ver. 2.1.1 B = Ver. 2.1.2 (SVR = 0x80310121) 8547 8545E AT = 1200 AQ = 1000 AN = 800 G = 400 Blank = Ver. 2.0 (SVR = 0x80390220) A = Ver. 2.1.1 B = Ver. 2.1.2 (SVR = 0x80390221) Blank = Ver. 2.0 (SVR = 0x80310220) A = Ver. 2.1.1 B = Ver. 2.1.2 (SVR = 0x80310221) 8545 8543E AQ = 1000 AN = 800 Blank = Ver. 2.0 (SVR = 0x803A0020) A = Ver. 2.1.1 B = Ver. 2.1.2 (SVR = 0x803A0021) Blank = Ver. 2.0 (SVR = 0x80320020) A = Ver. 2.1.1 B = Ver. 2.1.2 (SVR = 0x80320021) 8543 Notes: 1. See Section 18, “Package Description,” for more information on available package types. 2. The HiCTE FC-CBGA package is available on only Version 2.0 of the device. 3. The FC-PBGA package is available on only Version 2.1.1 and 2.1.2 of the device. 4. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core frequencies. 5. This speed available only for silicon Version 2.1.1.and 2.1.2 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 139 Ordering Information 22.2 Part Marking Parts are marked as the example shown in Figure 63. (F) MPC8548xxxxxx TWLYWW MMMMM CCCCC YWWLAZ Notes: TWLYYWW is final test traceability code. MMMMM is 5 digit mask number. CCCCC is the country of assembly. This space is left blank if parts are assembled in the United States. YWWLAZ is assembly traceability code. Figure 63. Part Marking for CBGA and PBGA Device MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 140 Freescale Semiconductor Document Revision History 23 Document Revision History Table 84 provides a revision history for the MPC8548E hardware specification. Table 84. Document Revision History Revision 6 Date 12/2009 Substantive Change(s) • In Section 5.1, “Power-On Ramp Rate” added explanation that Power-On Ramp Rate is required to avoid falsely triggering ESD circuitry. • In Table 10 changed required ramp rate from 545 V/s for MVREF and VDD/XVDD/SVDD to 3500 V/s for MVREF and 4000 V/s for VDD. • In Table 10 deleted ramp rate requirement for XVDD/SVDD. • In Table 10 footnote 1 changed voltage range of concern from 0–400 mV to 20–500mV. • In Table 10 added footnote 2 explaining that VDD voltage ramp rate is intended to control ramp rate of AVDD pins. • In Table 27, ”GMII Receive AC Timing Specifications,” changed duty cycle specification from 40/60 to 35/75 for RX_CLK duty cycle. • Updated tMDKHDX in Table 37, “MII Management AC Timing Specifications.” • Added a reference to Revision 2.1.2. • Updated Table 55, “MII Management AC Timing Specifications.” • Added Section 5.1, “Power-On Ramp Rate.” • In Table 1, “Absolute Maximum Ratings 1,” and in Table 2, “Recommended Operating Conditions,” moved text, “MII management voltage” from LV DD/TVDD to OVDD, added “Ethernet management” to OVDD row of input voltage section. • In Table 5, “SYSCLK AC Timing Specifications,” added notes 7 and 8 to SYSCLK frequency and cycle time. • In Table 36, “MII Management DC Electrical Characteristics,” changed all instances of LVDD/OVDD to OVDD. • Modified Section 15, “High-Speed Serial Interfaces (HSSI),” to reflect that there is only one SerDes. • Modified DDR clk rate min from 133 to 166 MHz. • Modified note in Table 71, “Processor Core Clocking Specifications (MPC8548E and MPC8547E), “.” • In Table 52, “Differential Transmitter (TX) Output Specifications,” modified equations in Comments column, and changed all instances of “LO” to “L0.” In addition, added note 8. • In Table 53, “Differential Receiver (RX) Input Specifications,” modified equations in Comments column, and in note 3, changed “TRX-EYE-MEDIAN-to-MAX-JITTER,” to “TRX-EYE-MEDIAN-to-MAX-JITTER.” • Modified Table 79, “Frequency Options of SYSCLK with Respect to Memory Bus Speeds.” • Added a note on Section 4.1, “System Clock Timing,” to limit the SYSCLK to 100 MHz if the core frequency is less than 1200 MHz • In Table 67, “MPC8548E Pinout ListingTable 68, “MPC8547E Pinout ListingTable 69, “MPC8545E Pinout ListingTable 70, “MPC8543E Pinout Listing,” added note 5 to LA[28:31]. • Added note to Table 79, “Frequency Options of SYSCLK with Respect to Memory Bus Speeds.” 5 10/2009 4 04/2009 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 141 Document Revision History Table 84. Document Revision History (continued) Revision 3 Date 01/2009 Substantive Change(s) • [Section 4.6, “Platform Frequency Requirements for PCI-Express and Serial RapidIO.” Changed minimum frequency equation to be 527 MHz for PCI x8. • In Table 5, added note 7. • Section 4.5, “Platform to FIFO Restrictions.” Changed platform clock frequency to 4.2. • Section 8.1, “Enhanced Three-Speed Ethernet Controller (eTSEC) (10/100/1Gb Mbps)—GMII/MII/TBI/RGMII/RTBI/RMII Electrical Characteristics.” Added MII after GMII and add ‘or 2.5 V’ after 3.3 V. • In Table 23, modified table title to include GMII, MII, RMII, and TBI. • In Table 24 and Table 25, changed clock period minimum to 5.3. • In Table 25, added a note. • In Table 26, Table 27, Table 28, Table 29, and Table 30, removed subtitle from table title. • In Table 30 and Figure 15, changed all instances of PMA to TSECn. • In Section 8.2.5, “TBI Single-Clock Mode AC Specifications.” Replaced first paragraph. • In Table 34, Table 35, Figure 18, and Figure 20, changed all instances of REF_CLK to TSEC n_TX_CLK. • In Table 36, changed all instances of OVDD to LVDD/TV DD. • In Table 37, “MII Management AC Timing Specifications,” changed MDC minimum clock pulse width high from 32 to 48 ns. • Added new section, Section 15, “High-Speed Serial Interfaces (HSSI).” • Section 16.1, “DC Requirements for PCI Express SD_REF_CLK and SD_REF_CLK.” Added new paragraph. • Section 17.1, “DC Requirements for Serial RapidIO SD_REF_CLK and SD_REF_CLK.” Added new paragraph. • Added information to Figure 63, both in figure and in note. • Section 21.3, “Decoupling Recommendations.” Modified the recommendation. • Table 83, “Part Numbering Nomenclature.” In Silicon Version column added Ver. 2.1.2. • • • • • Removed 1:1 support on Table 78, “e500 Core to CCB Clock Ratio.” Removed MDM from Table 18, “DDR SDRAM Input AC Timing Specifications.” MDM is an Output. Figure 56, “PLL Power Supply Filter Circuit with PLAT Pins” (AVDD_PLAT). Figure 57, “PLL Power Supply Filter Circuit with CORE Pins” (AVDD_CORE). Split Figure 58, “PLL Power Supply Filter Circuit with PCI/LBIU Pins,” (formerly called just “PLL Power Supply Filter Circuit”) into three figures: the original (now specific for AVDD_PCI/AVDD_LBIU) and two new ones. 2 04/2008 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 142 Freescale Semiconductor Document Revision History Table 84. Document Revision History (continued) Revision 1 Date 10/2007 Substantive Change(s) • Adjusted maximum SYSCLK frequency down in Table 5, “SYSCLK AC Timing Specifications” per device erratum GEN-13. • Clarified notes to Table 6, “EC_GTX_CLK125 AC Timing Specifications.” • Added Section 4.4, “PCI/PCI-X Reference Clock Timing.” • Clarified descriptions and added PCI/PCI-X to Table 9, “PLL Lock Times.” • Removed support for 266 and 200 Mbps data rates per device erratum GEN-13 in Section 6, “DDR and DDR2 SDRAM.” • Clarified Note 4 of Table 19, “DDR SDRAM Output AC Timing Specifications.” • Clarified the reference clock used in Section 7.2, “DUART AC Electrical Specifications.” • Corrected V IH(min) in Table 22, “GMII, MII, RMII, and TBI DC Electrical Characteristics.” • Corrected V IL(max) in Table 23, “GMII, MII, RMII, TBI, RGMII, RTBI, and FIFO DC Electrical Characteristics.” • Removed DC parameters from Table 24, Table 25, Table 26, Table 27, Table 28, Table 29, Table 32, Table 34, and Table 35. • Corrected V IH(min) in Table 36, “MII Management DC Electrical Characteristics.” • Corrected tMDC(min) in Table 37, “MII Management AC Timing Specifications.” • Updated parameter descriptions for tLBIVKH1, tLBIVKH2, tLBIXKH1, and tLBIXKH2 in Table 40, “Local Bus Timing Parameters (BVDD = 3.3 V)—PLL Enabled” and Table 40, “Local Bus Timing Parameters (BVDD = 2.5 V)—PLL Enabled.” • Updated parameter descriptions for tLBIVKH1, tLBIVKL2, tLBIXKH1, and tLBIXKL2 in Table 42, “Local Bus Timing Parameters—PLL Bypassed.” Note that tLBIVKL2 and tLBIXKL2 were previously labeled tLBIVKH2 and tLBIXKH2. • Added LUPWAIT signal to Figure 23, “Local Bus Signals (PLL Enabled)” and Figure 24, “Local Bus Signals (PLL Bypass Mode).” • Added LGTA signal to Figure 25, Figure 26, Figure 27 and Figure 28. • Corrected LUPWAIT assertion in Figure 26 and Figure 28. • Clarified the PCI reference clock in Section 14.2, “PCI/PCI-X AC Electrical Specifications” • Added Section 17.1, “Package Parameters.” • Added PBGA thermal information in Section 20.2, “Thermal for Version 2.1.1 and 2.1.2 Silicon FC-PBGA with Full Lid.” • Updated.” • Updated Table 83, “Part Numbering Nomenclature.” • Initial Release 0 07/2007 MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 Freescale Semiconductor 143 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale are trademarks or registered trademarks of Freescale Semiconductor, Inc. in the U.S. and other countries. All other product or service names are the property of their respective owners. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. IEEE 802.3, 802.2, 802.1, and 1149.1 are registered trademarks of the Institute of Electrical and Electronics Engineers, Inc. (IEEE). This product is not endorsed or approved by the IEEE. © Freescale Semiconductor, Inc., 2009. All rights reserved. Document Number: MPC8548EEC Rev. 6 12/2009