MPL115A1

Pressure Freescale Semiconductor Miniature SPI Digital Barometer The MPL115A1 is an absolute pressure sensor with digital output for low cost applications. A miniature 5 x 3 x 1.2 mm LGA package ideally suits it for portable electronics and space constrained applications. Low current consumptions of 5 μA during Active mode and 1 μA during Shutdown (Sleep) mode target battery and other low-power applications. A wide operating temperature range from -40°C to +105°C fits demanding environmental requirements. MPL115A1 employs a MEMS pressure sensor with a conditioning IC to provide accurate pressure measurement from 50 to 115 kPa. An integrated ADC provides digitized temperature and pressure sensor outputs via a SPI port. Calibration Data is stored in internal ROM. Utilizing raw sensor output, the host microcontroller executes a compensation algorithm to render Compensated Absolute Pressure with 1 kPa accuracy. The MPL115A1 pressure sensor’s small form factor, low power capability, precision, and digital output optimize it for barometric measurement applications. MPL115A1 Rev 3, 08/2009 MPL115A1 50 to 115 kPa Application Examples • • • • • • • Barometry (portable and desk-top) Altimeters Weather Stations Hard Disk-Drives (HDD) Industrial Equipment Health Monitoring Air Control Systems Features • Digitized pressure and temperature information together with programmed calibration coefficients for host micro use. • Factory Calibrated • 50 kPa to 115 kPa Absolute Pressure • 1 kPa Accuracy • 2.375 V to 5.5 V Supply • Integrated ADC • SPI Interface • Monotonic Pressure and Temperature Data Outputs • Surface Mount RoHS Compliant Package ORDERING INFORMATION Device Name MPL115A1T1 Package Options Tape & Reel Case No. 2015 # of Ports None • Single Dual Pressure Type Gauge Differential Absolute • Digital Interface SPI LGA PACKAGE Pin Description PIN 1 2 MPL115A1 5.0 mm X 3.0 mm X 1.2 mm MAX VDD CAP GND SHDN 1 2 3 4 8 7 6 5 SCLK DIN DOUT CS NAME VDD CAP GND SHDN CS DOUT DIN SCLK FUNCTION VDD Power Supply Connection. External Capacitor Ground Shutdown (Sleep): Connect to GND to disable the device. When in shut down the part draws < 1μA supply current CS: SPI Chip Select line. DOUT: Serial data output. DIN: Serial data input. SPI Serial Clock Input. 3 4 5 6 7 8 PIN CONNECTIONS © Freescale Semiconductor, Inc., 2009. All rights reserved. Pressure Maximum Ratings Voltage (with respect to GND unless otherwise noted) VDD .............................................................................................................................. -0.3 V to +5.5 V SCLK, CS, DIN, DOUT ................................................................................................. -0.3 V to VDD+0.3 V Operating Temperature Range .................................................................................... -40°C to +105°C Storage Temperature Range........................................................................................ -40°C to +125°C Overpressure ............................................................................................................... 1000 kPa Operating Characteristics (VDD = 2.375 V to 5.5 V, TA = -40°C to +105°C, unless otherwise noted. Typical values are at VDD = 3.3 V, TA = +25°C. Ref 1 2 Parameters Operating Supply Voltage Supply Current Symbol VDD IDD Shutdown (SHDN = GND) Standby Average – at one measurement per second Pressure Sensor 3 4 5 6 Range Resolution Accuracy Conversion Time (Start Pressure Convert) tcp -20ºC to 85ºC Time between start convert command and data available in the Pressure register 50 — — — — 0.15 ±1 0.6 115 — — 0.7 kPa kPa kPa ms Conditions Min 2.375 — — — Typ 3.3 — 3.5 5 Max 5.5 1 10 — Units V μA μA μA Temperature Sensor 7 8 9 Range Conversion Time (Start Temperature Convert) Conversion Time (Start Both Convert) Resolution tct tcb Time between start convert command and data available in the Temperature register Time between start convert command and data available in the Pressure and Temperature registers Temperature ADC is 472 counts at 25ºC -40 — — — 0.6 0.8 105 0.7 1 ºC ms ms 10 — -5.35 — counts/ºC SPI Inputs: SCLK, CS, DIN 11 12 13 SCLK Clock Frequency Low Level Input Voltage High Level Input Voltage fSCLK VIL VIH (1) — — 0.7VDD — — — 8 0.3VDD — MHz V V SPI Outputs: DOUT 14 Low Level Output Voltage VOL1 VOL2 15 High Level Output Voltage At 3 mA sink current At 6 mA sink current 0 0 VDD – 0.4 V — — — 0.4 0.6 — V V VOH1 At 3 mA source current 1. Nominal maximum SPI clock frequency. MPL115A1 2 Sensors Freescale Semiconductor Pressure VDD VDD 1 μF ADDR Coefficient Storage Diff Amp MUX ADDR CAP CAP 1 μF ADDR SHDN ADC ADDR ADDR Pressure Temperature SHDN Temp Sensor SCLK SCLK DIN DOUT DIN SPI Interface μC Microcontroller DOUT CS CS GND GND Figure 1. Uncompensated Pressure Sensor Schematic Compensation The pressure compensation for MPL115A1 is based on a 2-dimensional, second order polynomial based on Microsystems mst_trimlib library. The 10-bit compensated pressure output, Pcomp, is calculated as follows: Pcomp = a0 + (b1 + c11*Padc + c12*Tadc) * Padc + (b2 + c22*Tadc) * Tadc Where: Padc is the 10-bit pressure output of the MPL115A1 ADC, Tadc is the 10-bit temperature output of the MPL115A1 ADC, a0 is the pressure offset coefficient, b1 is the pressure sensitivity coefficient, c11 is the pressure linearity (2nd order) coefficient, c12 is the coefficient for temperature sensitivity coefficient (TCS), b2 is the 1st order temperature offset coefficient (TCO), c22 is the 2nd order temperature offset coefficient. Ideally, Pcomp will produce a value of 0 with an input pressure of 50 kPa and will produce a full-scale value of 1023 with an input pressure of 115 kPa. MPL115A1 Sensors Freescale Semiconductor 3 Pressure Coefficient Bit-Width Specs The table below specifies the initial coefficient bit-width specs for the compensation algorithm. Total Coeff. Bits 84 10-bit Output: Compensation Coefficient Specs a0 Total Bits Sign Bits Integer Bits Fractional Bits dec pt zero pad 16 1 12 3 — b1 16 1 2 13 — b2 16 1 1 14 — c12 14 1 0 13 9 c11 11 1 0 11 11 c22 11 1 0 10 15 Example Binary Format Definitions: 1. 2. 3. 4. Sign = 0, Integer Bits = 8, Fractional Bits = 4 : Sign = 1, Integer Bits = 4, Fractional Bits = 7 : Coeff = S I7 I6 I5 I4 I3 I2 I1 I0 . F3 F2 F1 F0 Coeff = S I3 I2 I1 I0 . F6 F5 F4 F3 F2 F1 F0 Sign = 0, Integer Bits = 0, Fractional Bits = 6, dec pt zero pad = 2 : Coeff = S 0 . 0 0 F5 F4 F3 F2 F1 F0 Sign = 0, Integer Bits = 0, Fractional Bits = 5, dec pt zero pad = 3 : Coeff = S 0 . 0 0 0 F4 F3 F2 F1 F0 NOTE: Negative coefficients (Sign = 1) are coded in 2’s complement notation. Coefficient Address Map Address $04 $05 $06 $07 $08 $09 $0A $0B $0C $0D $0E $0F Coefficient a0 MS Byte a0 LS Byte b1 MS Byte b1 LS Byte b2 MS Byte b2 LS Byte c12 MS Byte c12 LS Byte c11 MS Byte c11 LS Byte c22 MS Byte c22 LS Byte For coefficients with less than 16 bits, the lower lsbs are zero. For example, c11 is 11 bits and is stored into 2 bytes as follows: c11 MS byte = c11[10:3] = [c11b10 , c11b9 , c11b8 , c11b7 , c11b6 , c11b5 , c11b4 , c11b3] NOTE: c11 LS byte = c11[2:0] & “00000” = [c11b2 , c11b1 , c11b0 , 0 , 0 , 0 , 0 , 0] MPL115A1 4 Sensors Freescale Semiconductor Pressure Solder Recommendations 1. 2. Use SAC solder alloy (i.e., Sn-Ag-Cu) with a melting point of about 217°C. It is recommended to use SAC305 (i.e., Sn-3.0 wt.% Ag-0.5 wt.% Cu). Reflow • • • • • • Ramp up rate: 2 to 3 C/s. Preheat flat (soak): 110 to 130s. Reflow peak temperature: 250°C to 260°C (depends on exact SAC alloy composition). Time above 217°C: 40 to 90s (depends on board type, thermal mass of the board/quantities in the reflow). Ramp down: 5 to 6 C/s. Using an inert reflow environment (with O2 level about 5 to 15 ppm). NOTE: The stress level and signal offset of the device also depends on the board type, board core material, board thickness and metal finishing of the board. Handling Recommendations It is recommended to handle the MPL115A Pressure Sensor with a vacuum pick and place tool. Sharp objects utilized to move the MPL115A Pressure Sensor increase the possibility of damage via a foreign object/tool into the small exposed port. The sensor die is sensitive to light exposure. Direct light exposure through the port hole can lead to varied accuracy of pressure measurement. Avoid such exposure to the port during normal operation. MPL115A1 Sensors Freescale Semiconductor 5 Pressure PACKAGE DIMENSIONS CASE 2015-02 ISSUE O LGA PACKAGE MPL115A1 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 2015-02 ISSUE O LGA PACKAGE MPL115A1 Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 010 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MPL115A1 Rev. 3 08/2009