MPVZ7025G6T1

Pressure Freescale Semiconductor + MPXV7025 Rev 5, 1/2009 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV7025 Series -25 to 25 kPa (-3.6 to 3.6 psi) 0.2 to 4.7 V Output The MPXV7025 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Application Examples • • • • Respiratory Systems Process Control Patient Monitoring Remote Monitoring Devices Features • • • • • • 5.0% Maximum Error Over 0° to 85°C Ideally Suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated Over –40° to +125°C Thermoplastic (PPS) Surface Mount Package Patented Silicon Shear Stress Strain Gauge Available in Differential and Gauge Configurations ORDERING INFORMATION Package Case Device Name No. Options Small Outline Package (MPXV7025 Series) MPXV7025GC6U Rails 482A MPXV7025GC6T1 Tape & Reel 482A MPXV7025GP MPXV7025DP Trays 1369 None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking MPXV7025G MPXV7025G MPXV7025GP • • • • • • • • • • • • • • Trays 1351 Small Outline Package (Media Resistant Gel) (MPVZ7025 Series) MPVZ7025GC6T1 Tape & Reel 482A • MPVZ7025GC6U Rails 482A • MPVZ7025GP MPVZ7025G6T1 MPVZ7025G6U MPVZ7025DP Trays Tape & Reel Rails Trays 1369 482 482 1351 MPXV7025DP MPVZ7025G MPVZ7025G MPVZ7025GP MPVZ7025G MPVZ7025G MPVZ7025DP • • • • SMALL OUTLINE PACKAGE MPXV7025GC6U/T1 MPVZ7025GC6U/T1 CASE 482A-01 MPVZ7025G6U/T1 CASE 482-01 MPXV7025GP MPVZ7025GP CASE 1369-01 MPXV7025DP MPVZ7025DP CASE 1351-01 © Freescale Semiconductor, Inc., 2007-2009. All rights reserved. Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.0 Volts Full Scale Output(4) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy Sensitivity Response Time(6) Output Source Current at Full Scale Output Warm-Up Time(7) Offset Stability(8) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. (0 to 85°C) Symbol POP VS Io Voff Min -25 4.75 — 0.116 Typ — 5.0 7.0 0.25 Max 25 5.25 10 0.384 Unit kPa Vdc mAdc Vdc (0 to 85°C) VFSO 4.610 4.75 4.890 Vdc (0 to 85°C) (0 to 85°C) VFSS — 4.5 — Vdc — V/P tR Io+ — — — — — — — — — 90 1.0 0.1 20 ± 0.5 ±5.0 —————- %VFSS mV/kPa ms mAdc ms %VFSS MPXV7025 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 –40 to +125 –40 to +125 Unit kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry Vout 4 GND 3 Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device Figure 1. Integrated Pressure Sensor Schematic MPXV7025 Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration The MPXV7025 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. 5.0 4.5 Transfer Function: Vout = VS*(0.018*P+0.5) ± ERROR 4.0 VS = 5.0 Vdc 3.5 TEMP = 0 to 85°C 3.0 Output (V) 2.5 2.0 1.5 1.0 0.5 0 -25 0 Differential Pressure (kPa) 25 MAX MIN TYPICAL Figure 2. Output versus Pressure Differential +5 V Vout Vs IPS 1.0 µF 0.01 µF GND OUTPUT 470 pF Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)) MPXV7025 4 Sensors Freescale Semiconductor Pressure Transfer Function Nominal Transfer Value: Vout = VS (P x 0.018 + 0.5) ± (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V ± 0.25 Vdc Temperature Error Band MPXV7025 SERIES 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Temp –40 0 to 85 +125 Multiplier 3 1 3 Pressure Error Band Error Limits for Pressure 3.0 2.0 Pressure Error (kPa) 1.0 0.0 –1.0 –2.0 –3.0 Pressure -25 to 25 (kPa) Error (Max) ±1.25 (kPa) -25 0 25 Pressure (in kPa) MPXV7025 Sensors Freescale Semiconductor 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table: Pressure (P1) Side Identifier Side with Port Attached Side with Port Attached Side with Part Marking Side with Part Marking Part Number MPXV7025GC6U/C6T1, MPVZ7025GC6U/T1 MPXV7025GP, MPVZ7025GP MPXV7025DP, MPVZ7025DP MPVZ7025G6U/T1 Case Type 482A 1369 1351 482 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 TYP 8X 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 4. Small Outline Package Footprint MPXV7025 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS -A4 5 D 8 PL 0.25 (0.010) M TB S A S N -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -TSEATING PLANE DIM A B C D G H J K M N S V W CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE -A4 5 D 8 PL 0.25 (0.010) M TB S A S -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 S N C H -TPIN 1 IDENTIFIER SEATING PLANE J K M DIM A B C D G H J K M N S CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7025 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.006 (0.15) C A B A E e 5 4 GAGE PLANE e/2 .014 (0.35) θ D L DETAIL G A1 8 1 F b 0.004 (0.1) 8X M CAB B E1 STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. GND +Vout Vs -Vout N/C N/C N/C N/C STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. N/C Vs GND Vout N/C N/C N/C N/C NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T θ INCHES MILLIMETERS MIN MAX MIN MAX 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0˚ 7˚ 0˚ 7˚ N ∅T A M P 8X 0.004 (0.1) SEATING PLANE K DETAIL G C CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7025 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B A E e 5 4 GAGE PLANE e/2 .014 (0.35) θ D L DETAIL G A1 8 1 8X F b 0.004 (0.1) M CAB B E1 NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T θ INCHES MILLIMETERS MIN MAX MIN MAX 0.300 0.330 7.11 7.62 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.245 0.255 6.22 6.47 0.120 0.130 3.05 3.30 0.061 0.071 1.55 1.80 0.270 0.290 6.86 7.36 0.080 0.090 2.03 2.28 0.009 0.011 0.23 0.28 0.115 0.125 2.92 3.17 0˚ 7˚ 0˚ 7˚ ∅T N K A 0.004 (0.1) SEATING PLANE M P 8X DETAIL G C CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7025 Sensors Freescale Semiconductor 9 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MPXV7025 Rev. 5 1/2009