MPX2010GSX

Freescale Semiconductor Technical Data MPX2010 Rev 11, 11/2006 10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2010/MPXV2010G series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output directly proportional to the applied pressure. These sensors house a single monolithic silicon die with the strain gauge and thin film resistor network integrated on each chip. The sensor is laser trimmed for precise span, offset calibration and temperature compensation. Features • Temperature Compensated over 0°C to +85°C • Ratiometric to Supply Voltage • Differential and Gauge Options Typical Applications • Respiratory Diagnostics • Air Movement Control • Controllers • Pressure Switching ORDERING INFORMATION Device Type Ported Elements Options Case No. MPX Series Order No. MPXV2010GP MPXV2010DP Packing Options Trays Trays Device Marking MPXV2010G MPXV2010G MPX2010 MPXV2010G SERIES COMPENSATED PRESSURE SENSOR 0 to 10 kPa (0 to 1.45 psi) FULL SCALE SPAN: 25 mV SMALL OUTLINE PACKAGES MPXV2010GP CASE 1369-01 MPXV2010DP CASE 1351-01 SMALL OUTLINE PACKAGE (MPXV2010G SERIES) Gauge, Side Port, SMT Differential, Dual Port, SMT Basic Element Ported Elements Differential Differential, Dual Port Gauge Gauge, Axial Gauge, Axial PC Mount 1369 1351 SMALL OUTLINE PACKAGE PIN NUMBERS 1 2 3 4 GND(1) +VOUT VS –VOUT 5 6 7 8 N/C N/C N/C N/C UNIBODY PACKAGE (MPX2010 SERIES) 344 344C 344B 344E 344F MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX — — — — — MPX2010D MPX2010DP 1. Pin 1 in noted by the notch in the lead. UNIBODY PACKAGE PIN NUMBERS MPX2010GP MPX2010D MPX2010D 1 2 GND(1) +VOUT 3 4 VS –VOUT 1. Pin 1 in noted by the notch in the lead. UNIBODY PACKAGES MPX2010GP CASE 344-15 MPX2010GP CASE 344B-01 MPX2010DP CASE 344C-01 MPX2010GS CASE 344E-01 MPX2010GSX CASE 344F-01 © Freescale Semiconductor, Inc., 2006. All rights reserved. VS 3 Thin Film Temperature Compensation and Calibration Circuitry 1 GND 2 4 Sensing Element +VOUT –VOUT Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. Table 1. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 75 –40 to +125 –40 to +125 Unit kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX2010 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range(1) Supply Voltage Supply Current Full Scale Span Offset(4) Sensitivity Linearity(5) Pressure Hysteresis (5) (3) (2) Symbol POP VS IO VFSS VOFF ∆V/∆Ρ — Min 0 — — 24 –1.0 — –1.0 — — –1.0 –1.0 1000 1400 — — — Typ — 10 6.0 25 — 2.5 — ±0.1 ±0.5 — — — — 1.0 2.0 ±0.5 Max 10 16 — 26 1.0 — 1.0 — — 1.0 1.0 2550 3000 — — — Units kPa VDC mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV W W ms ms %VFSS (0 to 50 kPa) — — TCVFSS TCVOFF ZIN ZOUT Temperature Hysteresis(5) (–40°C to +125°C) Temperature Effect on Full Scale Span Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time Warm-Up Time Offset Stability(7) (6) (5) (10% to 90%) tR — — 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2010 Sensors Freescale Semiconductor 3 ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION VS = 10 Vdc TA = 25°C P1 > P2 TYP a 30 25 20 Output (mVdc) 15 10 5 0 –5 kPa PSI MAX Span Range (Typical) MIN 2.5 0.362 5 0.725 7.5 1.09 10 1.45 Offset (Typical) Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2010/ MPXV2010G series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. This performance over temperature is achieved by having both the shear stress strain gauge and the thin-film resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration and temperature compensation. Silicone Die Coat Wire Bond Die P1 Stainless Steel Metal Cover Epoxy Case Lead Frame P2 RTV Die Bond Figure 3. Unibody Package: Cross Sectional Diagram (Not to Scale) Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2010/MPXV2010G series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. MPX2010 4 Sensors Freescale Semiconductor LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Squares Fit Exaggerated Performance Curve Least Square Deviation Straight Line Deviation Relative Voltage Output End Point Straight Line Fit Offset 0 50 Pressure (% Full Scale) 100 Figure 4. Linearity Specification Comparison PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3. Pressure (P1) Side Delineation Part Number MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX MPXV2010GP MPXV2010DP Case Type 344 344C 344B 344E 344F 1369 1351 Pressure (P1) Side Identifier Stainless Steep Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking MPX2010 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS C R M 1 B -AN PIN 1 1234 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 L -TJ SEATING PLANE G F M F Y D 4 PL 0.136 (0.005) TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE -TR H N PORT #1 POSITIVE PRESSURE (P1) -AU L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC -Q- B 12 34 PIN 1 K S -P0.25 (0.010) J C M TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2010 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS V R PORT #2 PORT #1 -AU W H N PORT #2 VACUUM (P2) L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 PORT #1 POSITIVE PRESSURE (P1) -QSEATING PLANE B SEATING PLANE PIN 1 1234 -P-TJ C -T0.25 (0.010) M K S TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE PORT #1 POSITIVE PRESSURE (P1) C BACK SIDE VACUUM (P2) A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K N R S V INCHES MILLIMETERS MIN MAX MIN MAX 0.690 0.720 17.53 18.28 0.245 0.255 6.22 6.48 0.780 0.820 19.81 20.82 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.345 0.375 8.76 9.53 0.300 0.310 7.62 7.87 0.178 0.186 4.52 4.72 0.220 0.240 5.59 6.10 0.182 0.194 4.62 4.93 STYLE 1: PIN 1. 2. 3. 4. -B- V 43 21 PIN 1 K J R SEATING PLANE S G F D 4 PL 0.13 (0.005) M N -T- TB M GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344E-01 ISSUE B UNIBODY PACKAGE MPX2010 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS -TC E A U -Q- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B -P0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) G STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT M TP S Q S CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2010 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 12 Sensors Freescale Semiconductor NOTES MPX2010 Sensors Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. All rights reserved. MPX2010 Rev. 11 11/2006