MPX2050_08

Pressure Freescale Semiconductor + MPX2050 Rev 9, 10/2008 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors MPX2050 Series 0 to 50 kPa (0 to 7.25 psi) 40 mV Full Scale Span (Typical) The MPX2050 series devices are silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output, directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Application Examples Features • • • • • • Temperature Compensated Over 0°C to +85°C Unique Silicon Shear Stress Strain Gauge Easy to Use Chip Carrier Package Options Ratiometric to Supply Voltage Differential and Gauge Options ± 0.25% Linearity • • • • • • Pump/Motor Controllers Robotics Level Indicators Medical Diagnostics Pressure Switching Non-Invasive Blood Pressure ORDERING INFORMATION Package Case Device Name Options No. Unibody Package (MPX2050 Series) MPX2050D Tray 344 MPX2050GP Tray 344B MPX2050DP MPX2050GSX Tray Tray 344C 344F None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking MPX2050D MPX2050GP MPX2050DP MPX2050D • • • • PACKAGES • • • • MPX2050D CASE 344-15 MPX2050GP CASE 344B-01 MPX2050DP CASE 344C-01 MPX2050GSX CASE 344F-01 © Freescale Semiconductor, Inc., 2002, 2008. All rights reserved. Pressure Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration Circuitry 2 Sensing Element +VOUT 4 -V OUT 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). MPX2050 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity (5) Symbol POP VS Io VFSS Voff ΔV/ΔP — — — TCVFSS TCVoff Zin Zout tR — — Min 0 — — 38.5 -1.0 — -0.25 — — -1.0 -1.0 1000 1400 — — — Typ — 10 6.0 40 — 0.8 — ± 0.1 ± 0.5 1.0 20 ± 0.5 Max 50 16 — 41.5 1.0 — 0.25 — — 1.0 1.0 2500 3000 — — — Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV Ω Ω ms ms %VFSS Pressure Hysteresis(5) (0 to 50 kPa) Temperature Hysteresis(5) (-40°C to +125°C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Offset Stability(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2050 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 -40 to +125 -40 to +125 Unit kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Squares Fit Exaggerated Performance Curve Least Square Deviation Relative Voltage Output Straight Line Deviation End Point Straight Line Fit Offset 0 50 Pressure (% Fullscale) 100 Figure 2. Linearity Specification Comparison MPX2050 4 Sensors Freescale Semiconductor Pressure On-Chip Temperature Compensation and Calibration Figure 3 shows the minimum, maximum and typical output characteristics of the MPX2050 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. 40 35 Output (mVdc) 30 25 20 15 10 5 0 -5 kPa 0 PSI Offset (Typ) MIN VS = 10 Vdc TA = 25°C MPX2050 P1 > P2 MAX The effects of temperature on Full-Scale Span and Offset are very small and are shown under Operating Characteristics. TYP Span Range (Typ) 12.5 1.8 25 3.6 37.5 5.4 50 7.25 Figure 3. Output versus Pressure Differential Silicone Die Coat Wire Bond Die P1 Stainless Steel Metal Cover Epoxy Case Lead Frame P2 RTV Die Bond Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2050 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. MPX2050 Sensors Freescale Semiconductor 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3. Pressure (P1) Side Delineation Part Number MPX2050D MPX2050DP MPX2050GP MPX2050GSX Case Type 344 344C 344B 344F Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached MPX2050 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS C R M 1 B -AN PIN 1 1234 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 L -TJ SEATING PLANE G F M F Y D 4 PL 0.136 (0.005) TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE -TR H N PORT #1 POSITIVE PRESSURE (P1) -AU L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC -Q- B 12 34 PIN 1 K S -P0.25 (0.010) J C M TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2050 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS V R PORT #2 PORT #1 -AU W H N PORT #2 VACUUM (P2) L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 PORT #1 POSITIVE PRESSURE (P1) -QSEATING PLANE B SEATING PLANE PIN 1 1234 -P-TJ C -T0.25 (0.010) M K S TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE -TC E A U -Q- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B -P0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) G STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT M TP S Q S CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2050 8 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. All rights reserved. MPX2050 Rev. 9 10/2008