MPX2100AP

Pressure Freescale Semiconductor + MPX2100 Rev 10, 10/2008 100 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors The MPX2100 series devices silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration an temperature compensation. MPX2100 Series 0 to 100 kPa (0 to 14.5 psi) 40 mV Full Scale Span (Typical) Application Examples • • • • • • Pump/Motor Controllers Robotics Level Indicators Medical Diagnostics Pressure Switching Barometers Features • • • • • Temperature Compensated Over 0°C to +85°C Available in Absolute, Differential and Gauge Configurations Easy to Use Chip Carrier Package Options Ratiometric to Supply Voltage ± 0.25% Linearity (MPX2100D Series) ORDERING INFORMATION Package Case Device Name Options No. Unibody Package (MPX2100 Series) MPX2100A Tray 344 MPX2100D Tray 344 MPX2100AP MPX2100GP MPX2100DP MPX2100GVP MPX2100ASX Tray Tray Tray Tray Tray 344B 344B 344C 344D 344F None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking MPX2100A MPX2100D MPX2100AP MPX2100GP MPX2100DP MPX2100GVP • • • • • • • PACKAGES • • • • • • • MPX2100A MPX2100A/D CASE 344-15 MPX2100AP/GP CASE 344B-01 MPX2100DP CASE 344C-01 MPX2100GVP CASE 344D-01 MPX2100ASX CASE 344F-01 © Freescale Semiconductor, Inc., 2002, 2008. All rights reserved. Pressure Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration Circuitry 2 Sensing Element +VOUT 4 -V OUT 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). MPX2100 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) MPX2100D Series MPX2100A Series Sensitivity Linearity(5) MPX2100D Series MPX2100A Series Pressure Hysteresis(5) (0 to 100 kPa) Temperature Hysteresis(5) (-40°C to +125°C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Offset Stability(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. — — — — TCVFSS TCVoff Zin Zout tR — — -0.25 -1.0 — — -1.0 -1.0 1000 1400 — — — — — ± 0.1 ± 0.5 — — — — 1.0 20 ± 0.5 0.25 1.0 — — 1.0 1.0 2500 3000 — — — %VFSS Voff ΔV/ΔP -1.0 -2.0 — — — 0.4 1.0 2.0 — mV Symbol POP VS Io VFSS Min 0 — — 38.5 Typ — 10 6.0 40 Max 100 16 — 41.5 Unit kPa Vdc mAdc mV mV/kPa %VFSS %VFSS %VFSS mV Ω Ω ms ms %VFSS 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2100 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 400 -40 to +125 -40 to +125 Unit kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Squares Fit Exaggerated Performance Curve Least Square Deviation Relative Voltage Output Straight Line Deviation End Point Straight Line Fit Offset 0 50 Pressure (% Fullscale) 100 Figure 2. Linearity Specification Comparison MPX2100 4 Sensors Freescale Semiconductor Pressure On-Chip Temperature Compensation and Calibration Figure 3 shows the output characteristics of the MPX2100 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. 40 35 Output (mVdc) 30 25 20 15 10 5 0 -5 kPa 0 PSI Offset (Typ) MIN VS = 10 Vdc TA = 25°C P1 > P2 MAX The effects of temperature on Full-Scale Span and Offset are very small and are shown under Operating Characteristics. TYP Span Range (Typ) 25 3.62 50 7.25 75 10.87 100 14.5 Figure 3. Output versus Pressure Differential Silicone Gel Die Coat Wire Bond Differential/Gauge Die P1 Stainless Steel Metal Cover Epoxy Case Silicone Gel Die Coat Wire Bond Absolute Die P1 Stainless Steel Metal Cover Epoxy Case Lead Frame Differential/Gauge Element P2 Bond Die Lead Frame Absolute Element P2 Die Bond Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2100 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. MPX2100 Sensors Freescale Semiconductor 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Part Number MPX2100A, MPX2100D MPX2100DP MPX2100AP, MPX2100GP MPX2100ASX MPX2100GVP Case Type 344 344C 344B 344F 344D Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Stainless Steel Cap MPX2100 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS C R M 1 B -AN PIN 1 1234 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 L -TJ SEATING PLANE G F M F Y D 4 PL 0.136 (0.005) TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE -TR H N PORT #1 POSITIVE PRESSURE (P1) -AU L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC -Q- B 12 34 PIN 1 K S -P0.25 (0.010) J C M TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2100 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS V R PORT #2 PORT #1 -AU W H N PORT #2 VACUUM (P2) L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 PORT #1 POSITIVE PRESSURE (P1) -QSEATING PLANE B SEATING PLANE PIN 1 1234 -P-TJ C -T0.25 (0.010) M K S TQ S F G D 4 PL 0.13 (0.005) M TS S Q S CASE 344C-01 ISSUE B UNIBODY PACKAGE STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT -TC E A U -Q- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B -P0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) G STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT M TP S Q S CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2100 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS -AU -TR N -QSEATING PLANE PORT #2 VACUUM (P2) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.158 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC L H POSITIVE PRESSURE (P1) B 12 34 K S PIN 1 C J -P0.25 (0.010) M F TQ S G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344D-01 ISSUE B UNIBODY PACKAGE MPX2100 Sensors Freescale Semiconductor 9 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. All rights reserved. MPX2100 Rev. 10 10/2008