MPX2102_10

Pressure Freescale Semiconductor + MPX2102 Rev 8, 10/2010 100 kPa On-Chip Temperature Compensated Silicon Pressure Sensors The MPX2102 series devices are silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. MPX2102 Series 0 to 100 kPa (0 to 14.5 psi) 40 mV Full Scale (Typical) Application Examples • • • • • • • Pump/Motor Control Robotics Level Detectors Medical Diagnostics Pressure Switching Barometers Altimeters Features • • • • Temperature Compensated Over 0°C to +85°C Easy-to-Use Chip Carrier Package Options Available in Absolute, Differential and Gauge Configurations Absolute, Differential and Gauge Options ORDERING INFORMATION Package Device Name Options Unibody Package (MPX2102 Series) MPX2102A Tray MPX2102AP Tray MPX2102ASX MPX2102DP MPX2102GP MPX2102GVP Tray Tray Tray Case No. 344 344B 344F 344C 344B None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking MPX2102A MPX2102AP MPX2102A MPX2102DP MPX2102GP MPX2102GVP MPXV2102GP • • • • • • • • • • • • • • • • • • • • • • • • • • Tray 344D Small Outline Package (MPXV2102G Series) MPXV2102GP Tray 1369 MPAK Package (MPXM2102 Series) MPXM2102A Rail 1320 MPXM2102AT1 Tape and Reel 1320 MPXM2102AS MPXM2102AST1 MPXM2102D MPXM2102DT1 MPXM2102GS MPXM2102GST1 Rail Tape and Reel Rail Tape and Reel Rail Tape and Reel 1320A 1320A 1320 1320 1320A 1320A • • • • MPXM2102A MPXM2102A MPXM2102AS MPXM2102AS MPXM2102D MPXM2102D MPXM2102GS MPXM2102GS © Freescale Semiconductor, Inc., 2005-2008, 2010. All rights reserved. Pressure UNIBODY PACKAGES MPX2102A CASE 344 MPX2102AP/GP CASE 344B MPX2102DP CASE 344C MPX2102GVP CASE 344D MPX2102ASX CASE 344F SMALL OUTLINE PACKAGE MPAK MPXV2102GP CASE 1369 MPXM2102A/ATI MPXM2102D/DT1 CASE 1320 MPXM2102AS/AST1 MPXM2102GS/AS CASE 1320A MPX2102 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Differential Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) MPX2102D Series MPX2102A Series MPXM2102D/G Series MPXM2102A Series Sensitivity Linearity(5) MPX2102D Series MPX2102A Series MPXM2102D/G Series MPXM2102A Series Pressure Hysteresis(5) (0 to 100 kPa) Temperature Hysteresis(5)(-40°C to +125°C) Temperature Coefficient of Full Scale Span(5) Temperature Coefficient of Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Time Offset Stability(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: • • • • Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25°C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. — — — — — — TCVFSS TCVOFF ZIN ZOUT tR — — -0.6 -1.0 -0.6 -1.0 — — -2.0 -1.0 1000 1400 — — — — — — — ±0.1 ±0.5 — — — — 1.0 20 ±0.5 0.4 1.0 0.4 1.0 — — 2.0 1.0 2500 3000 — — — %VFSS %VFSS %VFSS %VFSS %VFSS mV W W ms ms %VFSS VOFF VOFF ΔV/ΔΡ -1.0 -2.0 -1.0 -2.0 — — — — — 0.4 1.0 2.0 1.0 2.0 — mV mV Symbol POP VS IO VFSS Min 0 — — 38.5 Typ — 10 6.0 40 Max 100 16 — 41.5 Units kPa VDC mAdc mV mV/kPa 6. Response Time is defined as the time from the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2102 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 400 -40 to +125 -40 to +125 Unit kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output vs. Applied Differential The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 X-ducer Sensing Element Thin Film Temperature Compensation and Calibration Circuitry 1 GND 2 +V OUT 4 -V OUT Figure 1. Temperature Compensated Pressure Sensor Schematic MPX2102 4 Sensors Freescale Semiconductor Pressure On-Chip Temperature Compensation and Calibration Figure 2 shows the output characteristics of the MPX2102 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. 40 35 30 25 Output (mVDC) 20 15 10 5 0 kPa PSI -5 0 25 3.62 50 7.25 75 10.88 14.5 Offset (TYP) MIN MAX VS = 10 VDC TA = 25°C MPX2102 P1 > P2 The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. TYP Span Range (TYP) 100 Figure 2. Output vs. Pressure Differential Silicone Gel Die Coat Differential/Gauge Die P1 Stainless Steel Metal Cover Epoxy Case Silicone Gel Die Coat Wire Bond Absolute Die P1 Stainless Steel Metal Cover Epoxy Case Wire Bond Lead Frame Differential/GaugeElement P2 Bond Die Lead Frame Absolute Element P2 Die Bond Figure 3. Cross Sectional Diagrams (Not to Scale) Figure 3 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2102 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. LINEARITY Linearity refers to how well a transducer's output follows the equation: VOUT = VOFF + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Squares Fit Exaggerated Performance Curve Relative Voltage Output Least Square Deviation Straight Line Deviation End Point Straight Line Fit Offset 0 50 Pressure (% Full scale) 100 Figure 4. Linearity Specification Comparison MPX2102 Sensors Freescale Semiconductor 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using Table 3. Table 3. Pressure (P1) Side Delineation Part Number MPX2102A MPX2102DP MPX2102AP, MPX2102GP MPX2102GVP MPX2102ASX MPXV2102GP MPXM2102A, MPX2102ATI, MPXM2102D, MPXM2102DT1 MPXM2102AS, MPXM2102GS, MPXM2102ASTI, MPXM2102GSTI Case Type 344 344C 344B 344D 344F 1369 Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Stainless Steel Cap Side with Port Marking Side with Port Attached 1320 Stainless Steel Cap 1320A Side with Port Attached MPX2102 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS C R M 1 B -AN PIN 1 1234 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 L -TJ SEATING PLANE G F M F Y D 4 PL 0.136 (0.005) TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE -TR H N PORT #1 POSITIVE PRESSURE (P1) -AU L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC -Q- B 12 34 PIN 1 K S -P0.25 (0.010) J C M TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2102 7 Sensors Freescale Semiconductor Pressure 16 PACKAGE DIMENSIONS V R PORT #2 PORT #1 -AU W H N PORT #2 VACUUM (P2) L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 PORT #1 POSITIVE PRESSURE (P1) -QSEATING PLANE B SEATING PLANE PIN 1 1234 -P-TJ C -T0.25 (0.010) M K S TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE -AU -TR N -QSEATING PLANE PORT #2 VACUUM (P2) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.158 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC L H POSITIVE PRESSURE (P1) B 12 34 K S PIN 1 C J -P0.25 (0.010) M F TQ S G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344D-01 ISSUE B UNIBODY PACKAGE MPX2102 Sensors Freescale Semiconductor 8 Pressure PACKAGE DIMENSIONS -TC E A U -QNOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B -P0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) G STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT M TP S Q S CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2102 9 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2102 Sensors Freescale Semiconductor 10 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2102 11 Sensors Freescale Semiconductor Pressure CASE 1320-02 ISSUE B MPAK MPX2102 12 Sensors Freescale Semiconductor Pressure CASE 1320-02 ISSUE B MPAK MPX2102 Sensors Freescale Semiconductor 13 Pressure PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2102 14 Sensors Freescale Semiconductor Pressure CASE 1320A-02 ISSUE A MPAK MPX2102 Sensors Freescale Semiconductor 15 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2010. All rights reserved. MPX2102 Rev. 8 10/2010