MPX5010D

Pressure Freescale Semiconductor Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPxx5010 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing. MPX5010 Rev 12, 09/2009 MPX5010 MPXV5010 MPVZ5010 Series 0 to 10 kPa (0 to 1.45 psi) (0 to 1019.78 mm H2O) 0.2 to 4.7 V Output Application Examples • • • • • Hospital Beds HVAC Respiratory Systems Process Control Washing Machine Water Level Measurement (Reference AN1950) • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Appliance Liquid Level and Pressure Measurement Features • • • • • • • 5.0% Maximum Error over 0° to 85°C Ideally Suited for Microprocessor or Microcontroller-Based Systems Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package Temperature Compensated over -40° to +125°C Patented Silicon Shear Stress Strain Gauge Available in Differential and Gauge Configurations Available in Surface Mount (SMT) or Through-hole (DIP) Configurations ORDERING INFORMATION Device Name Case No. None # of Ports Single Dual • • • • • • • • • • • • • • • • • • Gauge Pressure Type Differential • Absolute Device Marking MPX5010DP MPX5010GP MPX5010D MPX5010D MPXV5010DP MPXV5010G MPXV5010G MPXV5010G MPXV5010G MPXV5010GP MPVZ5010G MPVZ5010G MPVZ5010G MZ5010GW MZ5010GW Unibody Package (MPX5010 Series) MPX5010DP 867C MPX5010GP 867B MPX5010GS 867E MPX5010GSX 867F Small Outline Package (MPXV5010 Series) MPXV5010DP 1351 • MPXV5010G6U 482 • MPXV5010GC6T1 482A • MPXV5010GC6U 482A • MPXV5010GC7U 482C • MPXV5010GP 1369 • Small Outline Package (Media Resistant Gel) (MPVZ5010 Series) MPVZ5010G6U MPVZ5010G6T1 MPVZ5010G7U MPVZ5010GW6U MPVZ5010GW7U 482 482 482B 1735 1560 • • • • • © Freescale Semiconductor, Inc., 2007-2009. All rights reserved. Pressure SMALL OUTLINE PACKAGES SURFACE MOUNT MPXV5010GC6U/C6T1 CASE 482A-01 MPXV5010G6U, MPVZ5010G6U/T1 CASE 482-01 MPXV5010DP CASE 1351-01 MPXV5010GP CASE 1369-01 MPVZ5010GW6U CASE 1735-01 SMALL OUTLINE PACKAGES THROUGH-HOLE J MPVZ5010G7U CASE 482B-03 MPXV5010GC7U CASE 482C-03 MPVZ5010GW7U CASE 1560-02 UNIBODY PACKAGES MPX5010GP CASE 867B-04 MPX5010DP CASE 867C-05 MPX5010GS CASE 867E-03 MPX5010GSX CASE 867F-03 MPX5010 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Pressure Range Supply Voltage(1) Supply Current Minimum Pressure Offset(2) @ VS = 5.0 Volts Full Scale Output(3) @ VS = 5.0 Volts Full Scale Span(4) @ VS = 5.0 Volts Accuracy(5) Sensitivity (0 to 85°C) Symbol POP VS Io Voff Min 0 4.75 — 0 Typ — 5.0 5.0 0.2 Max 10 1019.78 5.25 10 0.425 Unit kPa mm H2O Vdc mAdc Vdc (0 to 85°C) VFSO 4.475 4.7 4.925 Vdc (0 to 85°C) VFSS 4.275 4.5 4.725 Vdc (0 to 85°C) — V/P — — — 450 4.413 1.0 0.1 20 ± 0.5 ±5.0 — %VFSS mV/mm mV/mm H2O ms mAdc ms %VFSS Response Time(6) Output Source Current at Full Scale Output Warm-Up Time(7) Offset Stability(8) 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. tR IO+ — — — — — — — — — — 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX5010 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 40 –40 to +125 –40 to +125 Unit kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 (SOP) 3 (Unibody) Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry Vout 1 (Unibody) 4 (SOP) 2 (Unibody) 3 (SOP) GND Pins 1 and 5 through 8 are NO CONNECTS for small outline package. Pins 4, 5, and 6 are NO CONNECTS for unibody package. Figure 1. Fully Integrated Pressure Sensor Schematic MPX5010 4 Sensors Freescale Semiconductor Pressure ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPxx5010G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, Stainless Steel Cap other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Fluoro Silicone Gel Die Coat P1 Wire Bond Lead Frame Die +5 V Thermoplastic Case Vout Vs IPS 1.0 μF 0.01 μF GND OUTPUT 470 pF P2 Differential Sensing Element Die Bond Figure 2. Cross-Sectional Diagram SOP (not to scale) Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) 5.0 4.0 3.0 Output (V) 2.0 1.0 0 Transfer Function (kPa): Vout = VS × (0.09 × P + 0.04) ± 5.0% VFSS VS = 5.0 Vdc TEMP = 0 to 85°C MAX MIN TYPICAL 0 2.0 4.0 6.0 8.0 10 Differential Pressure (kPa) Figure 4. Output vs. Pressure Differential MPX5010 Sensors Freescale Semiconductor 5 Pressure Transfer Function Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04) ± (Pressure Error x Temp. Factor x 0.09 x VS) VS = 5.0 V ± 0.25 Vdc Temperature Error Band 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Temp –40 0 to 85 +125 Multiplier 3 1 3 Pressure Error Band 0.5 0.4 0.3 Pressure Error (kPa) 0.2 0.1 0 –0.1 –0.2 –0.3 –0.4 –0.5 Pressure 0 to 10 (kPa) Error (Max) ±0.5 (kPa) 0 1 2 3 4 5 6 7 8 9 10 Pressure (kPa) MPX5010 6 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure Part Number MPX5010DP MPX5010GP MPX5010GS MPX5010GSX MPXV5010G6U MPXV5010GC6U/6T1 MPXV5010GC7U MPXV5010GP MPXV5010DP MPVZ5010G6U/6T1 MPVZ5010G7U MPVZ5010GW6U MPVZ5010GW7U sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type 867C 867B 867E 867F 482 482A 482C 1369 1351 482 482B 1735 1560 Pressure (P1) Side Identifier Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Stainless Steel Cap Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking Stainless Steel Cap Stainless Steel Cap Vertical Port Attached Vertical Port Attached MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 TYP 8X 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPX5010 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS -A4 5 D 8 PL 0.25 (0.010) M TB S A S -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 S N C H -TPIN 1 IDENTIFIER SEATING PLANE J K M DIM A B C D G H J K M N S CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE –A– 4 5 D 8 PL 0.25 (0.010) M TB S A S N –B– G 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER –T– SEATING PLANE CASE 482A-0 ISSUE A SMALL OUTLINE PACKAGE MPX5010 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS -A4 5 -BG 8 1 0.25 (0.010) S N M TB D 8 PL S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.210 0.220 5.33 5.59 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0˚ 15˚ 0˚ 15˚ 0.405 0.415 10.29 10.54 0.540 0.560 13.72 14.22 DETAIL X PIN 1 IDENTIFIER C -TK M J DETAIL X SEATING PLANE CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE –A– 4 5 N –B– G 8 1 0.25 (0.010) M TB D 8 PL SA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. S DIM A B C D G J K M N S V W SEATING PLANE INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17 DETAIL X S W V C PIN 1 IDENTIFIER –T– K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS C R M B –A– N PIN 1 SEATING PLANE 1 2 3 4 5 6 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _NOM 0.475 0.495 0.430 0.450 0.090 0.105 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _NOM 12.07 12.57 10.92 11.43 2.29 2.66 L –T– G F D 6 PL 0.136 (0.005) M J S TA M DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY –VOUT OPEN STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND –VOUT VSUPPLY +VOUT OPEN STYLE 3: PIN 1. 2. 3. 4. 5. 6. CASE 867-08 ISSUE N UNIBODY PACKAGE -TC E A U -Q- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. V N B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 -P0.25 (0.010) M TQ M 6 5 4 3 2 1 S K J 0.13 (0.005) M TP S D 6 PL QS F G VOUT GROUND VCC V1 V2 VEX CASE 867F-03 ISSUE D UNIBODY PACKAGE MPX5010 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5010 Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5010 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5010 14 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5010 16 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 1560-03 ISSUE C SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor 17 Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5010 18 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor 19 Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX5010 20 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor 21 Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX5010 22 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MPX5010 Rev. 12 09/2009