MPXHZ6116A

Pressure Freescale Semiconductor Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXHZ6116A series pressure sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor’s packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of onchip integration make this sensor a logical and economical choice for the system designer. The MPXHZ6116A series pressure sensor is a state-of-the-art, monolithic, signal conditioned sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This piezoresistive transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. MPXHZ6116A Rev 2, 06/2010 MPXHZ6116A Series 20 to 115 kPa (2.9 to 16.7 psi) 0.399 to 4.645 V Output Features • • • • • Resistant to High Humidity and Common Automotive Media 1.43% Maximum Error over 0 to 85°C Temperature Compensated from -40°C to +125°C Durable Thermoplastic (PPS) Surface Mount Package (SSOP) Ideally Suited for Microprocessor or Microcontroller-Based Systems ORDERING INFORMATION # of Ports Package Case Device Name Options No. None Single Dual Super Small Outline Package (Media Resistant Gel) (MPXHZ6116A Series) MPXHZ6116A6U MPXHZ6116A6T1 Rail Tape & Reel 1317 1317 Gauge Pressure Type Differential Absolute Device Marking • • • • MPXHZ6116A MPXHZ6116A SUPER SMALL OUTLINE PACKAGE MPXHZ6116A6U/6T1 CASE 1317 © Freescale Semiconductor, Inc., 2009, 2010. All rights reserved. Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Range Supply Voltage(1) Supply Current Full Scale Span(2) Offset(3) Sensitivity Accuracy(4) Pressure Range 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of VSS span at 25°C due to all sources of error including the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: Offset Stability: TcSpan: TcOffset: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. Output deviation, after 1000 temperature cycles, -40° to 125°C, and 1.5 million pressure cycles, with minimum rated pressure applied. Output deviation over the temperature range of 0° to 85°C, relative to 25°C. Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. (0 to 85°C) (0 to 85°C) (0 to 85°C) Symbol POP VS IS VFSS Voff V/P — POP Min 20 4.75 — — 0.335 — -1.5 20 Typ — 5.0 6.0 4.2 0.399 44.2 — — Max 115 5.25 10 — 0.463 — +1.5 115 Unit kPa Vdc mAdc Vdc Vdc mV/kPa %VFSS kPa MPXHZ6116A 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure Storage Temperature Operating Temperature Output Source Current @ Full Scale Output(2) Output Sink Current @ Minimum Pressure Offset(2) Symbol Pmax Tstg TA I o+ Io Value 400 -40 to +125 -40 to +125 +0.5 -0.5 Units kPa °C °C mAdc mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT GND 3 Pins 1, 5, 6, 7, and 8 are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic MPXHZ6116A Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear–stress strain gauge, temperature compensation, calibration, and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the configuration in the basic chip carrier (case 1317) prior to porting. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable thermoplastic package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as common automotive media. NOTE: The MPXHZ6116A series pressure sensor’s operating characteristics, internal reliability and qualification tests are based on use of air as the pressure media. Media, other than air, may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Fluoro Silicone Gel Die Coat Die Wire Bond Lead Frame P1 Stainless Steel Cap Thermoplastic Case +5.0 V VS Pin 2 100 nF MPXHZ6116A Vout Pin 4 GND Pin 3 47 pF 51 K to ADC Absolute Element Sealed Vacuum Reference Die Bond Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 3. Typical Application Circuit (Output Source Current Operation) 5.0 Vout = VS (0.008938 x P (kPa) - 0.09895) 4.5 ± (1.5 x TM x V x 0.008938) 4.0 TEMP = 0 to 85ºC VS = 5.0 V ± 0.25 3.5 OUTPUT (V) 3.0 2.5 2.0 1.5 1.0 0.5 0 20 40 0 MAX 60 100 120 140 80 MIN NOM S PRESSURE (kPa) Figure 4. Output vs. Absolute Pressure MPXHZ6116A 4 Sensors Freescale Semiconductor Pressure Temperature Error Band MPXHZ6116A SERIES Temperature Error Factor (TM) 4.0 3.0 2.0 1.0 0.0 -40 -20 0 20 80 40 60 Temperature in Cº 100 120 140 Break Points Temp - 40 0 to 85 125 Multiplier 2.85 0.96 1.66 NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC Pressure Error Band 3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 Pressure 20 to 115 (kPa) Error (Max) ±1.5 (kPa) Pressure (in kPa) 20 40 60 80 100 120 Error Limits for Pressure MPXHZ6116A Sensors Freescale Semiconductor 5 Pressure MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.050 1.27 TYP 0.150 3.81 solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.387 9.83 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317) MPXHZ6116A 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6116A Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6116A 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXHZ6116A Sensors Freescale Semiconductor 9 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2010. All rights reserved. MPXHZ6116A Rev.2 06/2010