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MPXM2053

MPXM2053

  • 厂商:

    FREESCALE(飞思卡尔)

  • 封装:

  • 描述:

    MPXM2053 - 50 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors - Freescale ...

  • 数据手册
  • 价格&库存
MPXM2053 数据手册
Freescale Semiconductor Technical Data MPXM2053 Rev. 2, 10/2004 50 kPa On- Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPXM2053 device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output — directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin--film resistor network integrated on--chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Features • Temperature Compensated Over 0°C to +85°C • Available in Easy--to--Use Tape & Reel • Ratiometric to Supply Voltage • Gauge Ported & Non Ported Options Application Examples • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Non--Invasive Blood Pressure Measurement Figure 1 shows a block diagram of the internal circuitry on the stand--alone pressure sensor chip. VS 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY 1 GND MPXM2053 SERIES Freescale Semiconductor Preferred Device 0 to 50 kPa (0 to 7.25 psi) 40 mV FULL SCALE SPAN (TYPICAL) MPAK PACKAGE SCALE 1:1 MPXM2053D/DT1 CASE 1320 SCALE 1:1 2 4 X--ducer SENSING ELEMENT Vout+ Vout-- MPXM2053GS/GST1 CASE 1320A PIN NUMBER 1 2 Gnd +Vout 3 4 VS --Vout Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Preferred devices are Freescale Semiconductor recommended choices for future use and best overall value. © Freescale Semiconductor, Inc., 2004. All rights reserved. MPXM2053 SERIES 1 Sensor Device Data Freescale Semiconductor MAXIMUM RATINGS(NOTE) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 --40 to +125 --40 to +125 Unit kPa °C °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Supply Range(1) Voltage(2) Symbol POP VS Io VFSS Voff ∆V/∆P — (0 to 50 kPa) — — TCVFSS TCVoff Zin Zout (10% to 90%) tR — — Min 0 — — 38.5 --1.0 — --0.6 — — --2.0 --1.0 1000 1400 — — — Typ — 10 6.0 40 — 0.8 — ±0.1 ±0.5 — — — — 1.0 20 ±0.5 Max 50 16 — 41.5 1.0 — 0.4 — — 2.0 1.0 2500 3000 — — — Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV Ω Ω ms ms %VFSS Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) Temperature Hysteresis(5) (--40°C to +125°C) Temperature Effect on Full Scale Span(5) Temperature Effect on Input Impedance Output Impedance Response Warm--Up Offset Stability(7) Time(6) Offset(5) NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self--heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXM2053 SERIES 2 Sensor Device Data Freescale Semiconductor LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale Semiconductor’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. LEAST SQUARES FIT RELATIVE VOLTAGE OUTPUT EXAGGERATED PERFORMANCE CURVE LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION END POINT STRAIGHT LINE FIT OFFSET 0 50 PRESSURE (% FULLSCALE) 100 Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the minimum, maximum and typical output characteristics of the MPXM2053 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. 40 35 OUTPUT (mVdc) 30 25 20 15 10 5 kPa PSI 0 --5 0 VS = 10 Vdc TA = 25°C P1 > P2 MAX TYP SPAN RANGE (TYP) MIN 12.5 1.8 25 3.6 37.5 5.4 50 7.25 OFFSET (TYP) Figure 3. Output versus Pressure Differential ORDERING INFORMATION De ice Type Device Type MPXM2053D MPXM2053DT1 MPXM2053GS MPXM2053GST1 Options Options Non--ported Non--ported, Tape and Reel Ported Ported, Tape and Reel Case No ase o. 1320 1320 1320A 1320A MPXM2053 SERIES Sensor Device Data Freescale Semiconductor 3 PACKAGE DIMENSIONS 2X 0.006 C A B E e PIN 4 NOTES: 1. DIMENSIONS ARE IN INCHES. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSION. MOLD FLASH OR PROTRUSION SHALL NOT EXCEED .006” PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM. 5. DIMENSIONS ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 MAXIMUM. INCHES MIN MAX .155 .165 .002 .010 .014 .018 .120 .130 .245 .255 .475 .485 .325 .335 .050 BSC .025 BSC .038 .048 0° 7° STYLE 1: PIN 1. 2. 3. 4. e/2 b1 0.004 M PIN 1 CAB 4X b CAB 0.004 M E1 B A D DIM A A1 b b1 D E E1 e e/2 L θ GND +Vout Vs --Vout A 0.004 DETAIL E C SEATING PLANE .014 GAGE PLANE A1 L DETAIL E θ CASE 1320-02 ISSUE A MPAK, STYLE 1 MPXM2053 SERIES 4 Sensor Device Data Freescale Semiconductor PACKAGE DIMENSIONS 2X 0.006 C A B E e e/2 A1 L DETAIL E 4X .014 GAGE PLANE θ b CAB b1 0.004 M N CAB 0.004 M P NOTES: 1. DIMENSIONS ARE IN INCHES. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSION. MOLD FLASH OR PROTRUSION SHALL NOT EXCEED .006” PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM. 5. DIMENSIONS ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 MAXIMUM. INCHES MIN MAX .377 .397 .002 .010 .014 .018 .120 .130 .245 .255 .475 .485 .325 .335 .050 BSC .025 BSC .013 .023 .283 .293 .363 .373 .107 .117 .192 .202 0° 7° S A DETAIL E 0.004 E1 C SEATING PLANE B A D DIM A A1 b b1 D E E1 e e/2 L M N P S θ CASE 1320A-02 ISSUE O MPAK, STYLE 1 MPXM2053 SERIES Sensor Device Data Freescale Semiconductor 5 NOTES MPXM2053 SERIES 6 Sensor Device Data Freescale Semiconductor NOTES MPXM2053 SERIES Sensor Device Data Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1--800--521--6274 or +1--480--768--2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Technical Information Center 3--20--1, Minami--Azabu, Minato--ku Tokyo 106--0047, Japan 0120 191014 or +81 3 3440 3569 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1--800--441--2447 or 303--675--2140 Fax: 303--675--2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2004. All rights reserved. MPXM2053 Rev. 2 10/2004 MPXM2053 SERIES 8 Sensor Device Data Freescale Semiconductor
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