MPXV10GC7U

Freescale Semiconductor Technical Data MPX10 Rev 12, 01/2007 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 and MPXV10GC series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output — directly proportional to the applied pressure. These standard, low cost, uncompensated sensors permit manufacturers to design and add their own external temperature compensation and signal conditioning networks. Compensation techniques are simplified because of the predictability of Freescale's single element strain gauge design. Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. Features • Low Cost • Patented Silicon Shear Stress Strain Gauge Design • Ratiometric to Supply Voltage • Easy to Use Chip Carrier Package Options • Differential and Gauge Options • Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package Functional Description • Air Movement Control • Environmental Control Systems • Level Indicators • Leak Detection • Medical Instrumentation • Industrial Controls • Pneumatic Control Systems • Robotics ORDERING INFORMATION(1) Device Type Options Case No. Order Number SMALL OUTLINE PACKAGE (MPXV10G SERIES) Ported Rails 482A MPXV10GC6U Elements Tape and Reel 482A MPXV10GC6T1 Rails 482C MPXV10GC7U UNIBODY PACKAGE (MPX10 SERIES) Basic Differential 344 MPX10D Element Ported Differential 344C MPX10DP Elements Gauge 344B MPX10GP Gauge 344E MPX10GS Device Marking MPXV10G MPXV10G MPXV10G MPX10D MPX10DP MPX10GP MPX10D MPX10 MPXV10GC SERIES UNCOMPENSATED PRESSURE SENSOR 0 TO 10 kPA (0–1.45 psi) 35 mV FULL SCALE SPAN (TYPICAL) SMALL OUTLINE PACKAGES MPXV10GC6U CASE 482A-01 MPXV10GC7U CASE 482C-03 SMALL OUTLINE PACKAGE PIN NUMBERS 1 2 3 4 GND +Vout Vs –Vout 5 6 7 8 N/C N/C N/C N/C NOTE: Pin 1 is noted by the notch in the lead. UNIBODY PACKAGE PIN NUMBERS 1 2 GND +Vout 3 4 Vs –Vout NOTE: Pin 1 is noted by the notch in the lead. 1. MPX10 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. UNIBODY PACKAGES MPX10D CASE 344-15 MPX10GP CASE 344B-01 MPX10DP CASE 344C-01 MPX10GS CASE 344E-01 © Freescale Semiconductor, Inc., 2007. All rights reserved. 3 +VS 2 Sensing Element 4 +VOUT –VOUT 1 GND Figure 1. Uncompensated Pressure Sensor Schematic VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Table 1. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Burst Pressure (P > P2) Storage Temperature Operating Temperature Symbol PMAX PBURST TSTG TA Value 75 100 –40 to +125 –40 to +125 Unit kPa kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX10 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Differential Pressure Range Supply Voltage(2) (1) Symbol POP VS IO VFSS VOFF ∆V/∆Ρ — — — TCVFSS TCVOFF TCR ZIN ZOUT tR — — Min 0 — — 20 0 — –1.0 — — –0.22 — 0.28 400 750 — — — Typ — 3.0 6.0 35 20 3.5 — ±0.1 ±0.5 — ±15 — — — 1.0 20 ±0.5 Max 10 6.0 — 50 35 — 1.0 — — –0.16 — 0.34 550 1250 — — — Units kPa VDC mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS/°C µV/°C %/ZIN/°C Ω Ω ms ms %VFSS Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) (0 to 10 kPa) Temperature Hysteresis(5) (–40°C to +125°C) (5) Temperature Coefficient of Full Scale Span Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Time(7) Offset Stability(8) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: • • • • • Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25°C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. TCR: ZIN deviation with minimum rated pressure applied, over the temperature range of -40°C to ±125°C, relative to 25°C. 6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 8. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX10 Sensors Freescale Semiconductor 3 TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPX10 and MPXV10GC series over temperature. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the MPX2010D series sensor. Several approaches to external temperature compensation over both –40 to +125°C and 0 to +80°C ranges are presented in Application Note AN840. LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: 1) end point straight line fit or 2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. 80 70 60 Output (mVdc) 50 40 30 20 10 0 PSI 0 kPa 0.3 2.0 0.6 4.0 0.9 6.0 1.2 8.0 10 1.5 Offset (Typ) +125°C Span Range (Typ) VS = 3 VDC P1 > P2 -40°C +25°C Pressure Differential Figure 2. Output versus Pressure Differential 70 60 50 Output (mVdc) 40 30 20 10 0 0 Offset (Voff) Pressure (kPA) Max POP Theoretical Actual Linearity Span (VFSS) Figure 3. Linearity Specification Comparison MPX10 4 Sensors Freescale Semiconductor Silicone Die Coat Wire Bond Die P1 Stainless Steel Metal Cover Epoxy Case Lead Frame P2 RTV Die Bond Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX10 and MPXV10GC series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Part Number MPX10D MPX10DP MPX10GP MPX10GS MPXV10GC6U MPXV10GC7U Case Type 344 344C 344B 344E 482A 482C Pressure (P1) Side Identifier Stainless Steep Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Part Marking Side with Part Marking MPX10 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS C R M 1 B -AN PIN 1 1234 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 L -TJ SEATING PLANE G F M F Y D 4 PL 0.136 (0.005) TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE -TR H N PORT #1 POSITIVE PRESSURE (P1) -AU L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC -Q- B 12 34 PIN 1 K S -P0.25 (0.010) J C M TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX10 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -AU PORT #1 V R PORT #2 W H PORT #2 VACUUM (P2) L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 N PORT #1 POSITIVE PRESSURE (P1) -QSEATING PLANE B SEATING PLANE PIN 1 1234 -P-TJ C -T0.25 (0.010) M K S TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE PORT #1 POSITIVE PRESSURE (P1) C BACK SIDE VACUUM (P2) A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K N R S V INCHES MILLIMETERS MIN MAX MIN MAX 0.690 0.720 17.53 18.28 0.245 0.255 6.22 6.48 0.780 0.820 19.81 20.82 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.345 0.375 8.76 9.53 0.300 0.310 7.62 7.87 0.178 0.186 4.52 4.72 0.220 0.240 5.59 6.10 0.182 0.194 4.62 4.93 STYLE 1: PIN 1. 2. 3. 4. -B- V 43 21 PIN 1 K J R SEATING PLANE S G F D 4 PL 0.13 (0.005) M N -T- TB M GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344E-01 ISSUE B UNIBODY PACKAGE MPX10 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX10 8 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2007. All rights reserved. MPX10 Rev. 12 01/2007