MPXV2053GVP

Pressure Freescale Semiconductor 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors The MPX2053 series devices are silicon piezoresistive pressure sensors that provide a highly accurate and linear voltage output directly proportional to the applied pressure. A single, monolithic silicon diaphragm with the strain gauge and an integrated thin-film resistor network. Precise span and offset calibration with temperature compensation are achieved by laser trimming. MPX2053 Rev 7, 10/2008 MPX2053 Series 0 to 50 kPa (0 to 7.25 psi) 40 mV Full Scale (Typical) Features • • • • • • Temperature Compensated Over 0°C to +85°C Easy-to-Use Chip Carrier Package Options Ratiometric to Supply Voltage Gauge Ported and Non Ported Options Available in Easy-to-Use Tape & Reel Differential and Gauge Pressure Options ORDERING INFORMATION Device Name Case No. None # of Ports Single Dual Gauge Application Examples • • • • • • Pump/Motor Control Robotics Level Detectors Medical Diagnostics Pressure Switching Blood Pressure Measurement Pressure Type Differential Absolute Device Marking Small Outline Package (MPXV2053G Series) MPXV2053GP 1369 MPXV2053DP 1351 MPXV2053GVP 1368 Unibody Package (MPX2053 Series) MPX2053D 344 • MPX2053DP 344C MPX2053GP 344B MPAK Package (MPXM2053 Series) MPXM2053D 1320 • MPXM2053DT1 1320 • MPXM2053GS 1320A MPXM2053GST1 1320A • • • • • • • • • • • MPXV2053GP MPXV2053DP MPXV2053GV MPX2053D MPX2053DP MPX2053GP MPXM2053D MPXM2053D MPXM2053GS MPXM2053GS • • • • • • © Freescale Semiconductor, Inc., 2005-2008. All rights reserved. Pressure UNIBODY PACKAGES MPX2053D CASE 344-15 MPX2053GP CASE 344B-01 MPX2053DP CASE 344C-01 SMALL OUTLINE PACKAGES MPXV2053GP CASE 1368-01 MPXV2053GP CASE 1369-01 MPXV2053DP CASE 1351-01 MPAK PACKAGES MPXM2053D/DT1 CASE 1320-02 MPXM2053GS/GST1 CASE 1320A-02 MPX2053 Sensors Freescale Semiconductor 2 Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range(1) Supply Voltage Supply Current Full Scale Span Offset(4) Sensitivity Non-Linearity Pressure Hysteresis (0 to 50 kPa) Temperature Hysteresis (-40° to 125°C) Temperature Coefficient of Full Scale Temperature Coefficient of Offset Input Impedance Output Impedance Response Time(5) (10% to 90%) Warm-Up Time Offset Stability(6) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. (3) (2) Symbol POP VS IO VFS — — — — — TCVFS TCVOFF ZIN ZOUT tR — — Min 0 — — 38.5 –1.0 ΔV/ΔP –0.6 — — –2.0 –1.0 1000 1400 — — — Typ — 10 6.0 40 — — — ±0.1 ±0.5 — — — — 1.0 20 ±0.5 Max 50 16 — 41.5 1.0 0.8 0.4 — — 2.0 1.0 2500 3000 — — — Units kPa VDC mAdc mV mV — %VFS %VFS %VFS %VFS mV Ω Ω ms ms %VFS Maximum Ratings Table 2. Maximum Ratings(1) Rating Supply Voltage Pressure (P1 > P2) Storage Temperature Operating Temperature Range Max Value 16 200 –40 to +125 –40 to +125 Unit V kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX2053 Sensors Freescale Semiconductor 3 Pressure Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration X-ducer Sensing Element 2 4 Vout+ Vout- 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side relative to the vacuum side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum side relative to the pressure side. On-Chip Temperature Compensation and Calibration Figure 2 shows the minimum, maximum and typical output characteristics of the MPX2053 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. 40 35 Output (mVdc) 30 25 20 15 10 5 0 -5 0 VS = 10 Vdc TA = 25°C TYP MAX SPAN RANGE (TYP) MIN kPa PSI 12.5 1.8 25 3.6 37.5 5.4 50 7.25 OFFSET (TYP) Figure 2. Output vs. Pressure Differential MPX2053 Sensors Freescale Semiconductor 4 Pressure LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 3) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. The specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Squares Fit Exaggerated Performance Relative Voltage Output Least Square Deviation Straight Line End Point Straight Line Fit OFFSET 0 50 Pressure (% Full scale) 100 Figure 3. Linearity Specification Comparison Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2053 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Refer to application note AN3728, for more information regarding media compatibility. Silicone Die Coat Wire Bond Die P1 Stainless Steel Metal Cover Epoxy Case Lead Frame P2 RTV Die Bond Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale) MPX2053 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS C R M 1 B -AN PIN 1 1234 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 L -TJ SEATING PLANE G F M F Y D 4 PL 0.136 (0.005) TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE -TR H N PORT #1 POSITIVE PRESSURE (P1) -AU L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC -Q- B 12 34 PIN 1 K S -P0.25 (0.010) J C M TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2053 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS V R PORT #2 PORT #1 -AU W H N PORT #2 VACUUM (P2) L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 PORT #1 POSITIVE PRESSURE (P1) -QSEATING PLANE B SEATING PLANE PIN 1 1234 -P-TJ C -T0.25 (0.010) M K S TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE MPX2053 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor 8 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2053 9 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor 10 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2053 11 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1320-02 ISSUE B MPX2053 Sensors Freescale Semiconductor 12 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1320-02 ISSUE B MPX2053 Sensors Freescale Semiconductor 13 PACKAGE DIMENSIONS PIN 4 PIN 1 PAGE 1 OF 2 CASE 1320A-02 ISSUE A MPX2053 Sensors Freescale Semiconductor 14 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1320A-02 ISSUE A MPX2053 Sensors Freescale Semiconductor 15 PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MPX2053 Sensors Freescale Semiconductor 16 PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MPX2053 Sensors Freescale Semiconductor 17 PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MPX2053 Sensors Freescale Semiconductor 18 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. All rights reserved. MPX2053 Rev. 7 10/2008