MPXV2202GC6TI

Pressure Freescale Semiconductor + MPX2202 Rev 6, 10/2008 200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors The MPX2202 devices series are silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/ motor controllers, robotics, level indicators, medical diagnostics, pressure switching, barometers, altimeters, etc. MPX2202 Series 0 to 200 kPa (0 to 29 psi) 40 mV Full Scale (Typical) Application Examples • • • • • • • Pump/Motor Controllers Robotics Level Indicators Medical Diagnostics Pressure Switching Barometers Altimeters Features • • • • • Temperature Compensated Over 0°C to +85°C Easy-to-Use Chip Carrier Package Options Available in Absolute, Differential and Gauge Configurations Ratiometric to Supply Voltage Available in Easy-to-Use Tape and Reel ORDERING INFORMATION Case Device Name No. None Unibody Package (MPX2202 Series) MPX2202A 344 • MPX2202DP 344C MPX2202AP MPX2202GP MPX2202ASX 344B 344B # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking MPX2202A MPX2202DP MPX2202AP MPX2202GP MPX2202A MPXV2202GP • • • • • • • • • • • • • • • • • • • • • • • • • • 344F Small Outline Package (MPXV2202 Series) MPXV2202GP 1369 MPXV2202DP MPXV2202GC6TI MPXV2202GC6U 1351 482A MPXV2202DP MPXV2202G MPXV2202G MPXM2202D MPXM2202D MPXM2202A MPXM2202GS MPXM2202GS MPXM2202AS 482A MPAK Package (MPXM2202 Series) MPXM2202D 1320 • MPXM2202DT1 1320 • MPXM2202A MPXM2202GS MPXM2202GST1 MPXM2202AS 1320 1320A 1320A 1320A • © Freescale Semiconductor, Inc., 2005-2008. All rights reserved. Pressure UNIBODY PACKAGES MPX2202A CASE 344-15 MPX2202AP/GP CASE 344B-01 MPX2202DP CASE 344C-01 MPX2202ASX CASE 344F-01 SMALL OUTLINE PACKAGES MPAK MPXV2202GP CASE 1351-01 MPXV2202GP CASE 1369-01 MPXV2202GP CASE 482A-01 MPXM2202A CASE 1320-02 MPXM2202GS/AS CASE 1320A-02 MPX2202 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) MPX2202D, MPXM2202D/G Series MPX2202A, MPXM2202A Series Sensitivity Linearity(5) MPXM2202D/G, MPX2202D Series MPXM2202A, MPX2202A Series Pressure Hysteresis(5) (0 to 200 kPa) Temperature Hysteresis(5) (-40°C to +125°C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Offset Stability(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. — -0.6 -1.0 — — -2.0 -1.0 1000 1400 — — — — — ± 0.1 ± 0.5 — — — — 1.0 20 ± 0.5 0.4 1.0 2.0 1.0 2500 3000 — — — %VFSS Voff ΔV/ΔP -1.0 -2.0 — — — 0.2 1.0 2.0 — mV Symbol POP VS Io VFSS Min 0 — — 38.5 Typ 10 6.0 40 Max 200 16 41.5 Unit kPa Vdc mAdc mV mV/kPa — — TCVFSS TCVoff Zin Zout tR — — %VFSS %VFSS %VFSS mV Ω Ω ms ms %VFSS MPX2202 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Max Value 400 -40 to 125 -40 to 125 Unit kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output versus Applied Differential The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure VS 3 Thin Film Temperature Compensation and Calibration Circuitry 1 GND (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. 2 4 Sensing Element +VOUT –VOUT Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic MPX2202 4 Sensors Freescale Semiconductor Pressure On-Chip Temperature Compensation and Calibration 40 35 30 25 Output (mVDC) 20 15 10 5 0 kPa PSI -5 0 VS = 10 VDC TA = 25°C P1 > P2 MAX TYP Span Range (TYP) MIN 25 50 7.25 75 100 125 14.5 Pressure 150 21.75 175 200 29 Offset (TYP) Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2202 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. Silicone Gel Die Coat Wire Bond Differential/Gauge Die P1 Stainless Steel Metal Cover Epoxy Case Silicone Gel Die Coat Wire Bond Absolute Die P1 Stainless Steel Metal Cover Epoxy Case Lead Frame Differential/Gauge Element P2 Bond Die Lead Frame Absolute Element P2 Die Bond Figure 3. Cross Sectional Diagram (not to scale) Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2202 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Squares Fit Exaggerated Performance Curve Least Square Deviation Straight Line Deviation Relative Voltage Output End Point Straight Line Fit Offset 0 50 Pressure (% Full Scale) 100 Figure 4. Linearity Specification Comparison MPX2202 Sensors Freescale Semiconductor 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX Table 3. Pressure (P1) Side Delineation Part Number MPX2202A MPX2202DP MPX2202GP/AP MPX2202ASX MPX2202GP MPX2202DP MPXV2202GP MPXV2202DP MPXV2202GC6TI/U MPXM2202A/ATI/DT/DTI MPXM2202GS/GSTI/AS/ASTI Case Type 344 344C 344B 344F 1369 1351 1369 1351 482A 1320 1320A Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking Side with Port Attached Side with Part Marking Side with Port Attached Side with Part Marking Side with Port Attached Pressure (P1) Side Identifier pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. MPX2202 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS –A– 4 5 D 8 PL 0.25 (0.010) M TB S A S N –B– G 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER –T– SEATING PLANE CASE 482A–01 ISSUE A DATE 05/13/98 MPX2202 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS C R M 1 B -AN PIN 1 1234 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 L -TJ SEATING PLANE G F M F Y D 4 PL 0.136 (0.005) TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE -TR H N PORT #1 POSITIVE PRESSURE (P1) -AU L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC -Q- B 12 34 PIN 1 K S -P0.25 (0.010) J C M TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2202 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS V R PORT #2 PORT #1 -AU W H N PORT #2 VACUUM (P2) L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 PORT #1 POSITIVE PRESSURE (P1) -QSEATING PLANE B SEATING PLANE PIN 1 1234 -P-TJ C -T0.25 (0.010) M K S TQ S F G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE -TC E A U -Q- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B -P0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) G STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT M TP S Q S CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2202 Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 1 OF 2 MPX2202 10 Sensors Freescale Semiconductor Pressure PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2202 Sensors Freescale Semiconductor 11 Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2202 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2202 Sensors Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2202 14 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2202 Sensors Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2202 16 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK MPX2202 Sensors Freescale Semiconductor 17 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. All rights reserved. MPX2202 Rev. 6 10/2008