MPXV5050V

Pressure Freescale Semiconductor High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV5050V series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer. The MPXV5050V series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXV5050VC6T1 Rev 2, 11/2009 MPXV5050V Series -50 to 0 kPa (-7.25 to 0 psi) 0.1 to 4.6 V Output Application Examples • Vacuum Pump Monitoring Features • • • • • • • 2.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from Over -40° to +125°C Patented Silicon Shear Stress Strain Gauge Durable Thermoplastic (PPS) Surface Mount Package Easy-to-Use Chip Carrier Option Ideal for Automotive and Non-Automotive Applications ORDERING INFORMATION Device Name Small Outline Package MPXV5050VC6T1 482A • • Vacuum/Gauge MPXV5050V Case No. # of Ports None Single Dual Gauge Pressure Type Differential Absolute Device Marking SMALL OUTLINE PACKAGE MPXV5050VC6T1 CASE 482A-01 © Freescale Semiconductor, Inc., 2005, 2009. All rights reserved. Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range Supply Voltage(1) Supply Current Full Scale Output(2) @ VS = 5.0 Volts Full Scale Span(3) @ VS = 5.0 Volts Accuracy(4) Sensitivity Response Time (5) Symbol POP VS Io (0 to 85°C) (0 to 85°C) (0 to 85°C) VFSO VFSS — V/P tR — — (0 to 85°C) Voff Min -50 4.75 — 4.488 Typ — 5.0 7.0 4.6 Max 0 5.25 10 4.713 Unit kPa Vdc mAdc Vdc — 4.5 — Vdc — — — — — 0 — 90 1.0 20 ± 0.5 0.100 ±2.5 — — — — 0.213 %VFSS mV/kPa ms ms %VFSS Vdc Warm-Up Time(6) Offset Stability(7) Pressure Offset(8) 1. Device is ratiometric within this specified excitation range. 2. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. 8. Offset (Voff) is defined as the output voltage at the minimum rated pressure. MPXV5050VC6T1 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 -40 to +125 -40 to +125 Units kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Sensing Element Thin Film Temperature Compensation And Gain Stage #1 Gain Stage #2 And Ground Reference Shift Circuitry 4 Vout GND 3 Pins 1, 5, 6, 7, and 8 are no connects Figure 1. Fully Integrated Pressure Sensor Schematic MPXV5050VC6T1 Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 482A). Figure 3 shows a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0° to 85°C temperature range. The output will saturate outside of the rated pressure range. Fluorosilicone Gel Die Coat P1 Wire Bond Lead Frame P2 Differential Sensing Element Thermoplastic Case Vout Vs IPS 1.0 μF 0.01 μF GND 470 pF OUTPUT A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV5050 series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Die Stainless Steel Cap +5 V Die Bond Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 3. Typical Application Circuit (Output Source Current Operation) Transfer Function MPXV5050VC Series 5 Transfer Function: Vout = VS x (0.018 x P + 0.92) ± (PE x TM x 0.018 x Vs) Vs = 5.0 ± 0.25 vdc PE = 1.25 TM = 1 Temperature = 0 to 85°C Output Range (Typ) Offset (Typ) Span Range (Typ) 0 4 Output Voltage (V) 3 MAX 2 MIN 1 TYPICAL 0 –50 –40 –30 Pressure (kPa) –20 –10 Figure 4. Output vs. Absolute Pressure MPXV5050VC6T1 4 Sensors Freescale Semiconductor Pressure Transfer Function (MPXV5050V) Nominal Transfer Value: VOUT = VS x (0.018 x P + 0.92) ± (Pressure Error x Temp Multi x 0.018 x VS) VS = 5.0 ± 0.25 V Temperature Error Band MPXV5050V 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C Break Points Temp –40 0 to 85 +125 Multiplier 3 1 3 NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band MPXV5050V Error Limits for Pressure 1.25 Pressure Error (kPa) 1.00 0.75 0 –0.75 –1.00 –1.25 Pressure –50 to 0 kPa Error (Max) ±1.25 kPa –50 –40 –30 –20 –10 0 Pressure (in kPa) MPXV5050VC6T1 Sensors Freescale Semiconductor 5 Pressure SURFACE MOUNTING INFORMATION MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.660 16.76 0.100 TYP 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 5. SOP Footprint (Case 482A) MPXV5050VC6T1 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS -A4 5 D 8 PL 0.25 (0.010) M TB S A S N -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -TSEATING PLANE DIM A B C D G H J K M N S V W CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV5050VC6T1 Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MPXV5050VC6T1 Rev. 2 11/2009