MPXV5050VC6T1

Freescale Semiconductor Technical Data MPXV5050VC6T1 Rev 1, 05/2005 High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV5050VC6T1 sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer. The MPXV5050VC6T1 piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features • • • • • • • 2.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from Over –40° to +125°C Patented Silicon Shear Stress Strain Gauge Durable Thermoplastic (PPS) Surface Mount Package Easy-to-Use Chip Carrier Option Ideal for Automotive and Non-Automotive Applications MPXV5050VC6T1 INTEGRATED PRESSURE SENSOR –50 to 0 kPa (–7.25 to 0 psi) 0.1 to 4.6 Volts Output SMALL OUTLINE PACKAGE MPXV5050VC6T1 CASE 482A-01 PIN NUMBER(1) 1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C Typical Applications • Vacuum Pump Monitoring ORDERING INFORMATION Device Type Options Case No. 482A MPX Series Order No. MPXV5050VC6T1 Packing Options Device Marking 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Ported Vacuum, Element Axial Port Tape & Reel MPXV5050VC6T1 VS Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry Vout GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic MPXV5050VC6T1 Sensors Freescale Semiconductor 1 Table 1. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 –40° to +125° –40° to +125° Units kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.) Characteristic Pressure Range Supply Voltage(1) Supply Current Full Scale Output(2) @ VS = 5.0 Volts Full Scale Span(3) @ VS = 5.0 Volts Accuracy(4) Sensitivity Response Time(5) Warm-Up Time(6) Offset Stability(7) Pressure Offset(8) (0 to 85°C) (0 to 85°C) (Pdiff = 0 kPa) (0 to 85°C) Symbol POP VS Io VFSO Min –50 4.75 — 4.488 Typ — 5.0 7.0 4.6 Max 0 5.25 10 4.713 Unit kPa Vdc mAdc Vdc VFSS — 4.5 — Vdc (0 to 85°C) — V/P tR — — Voff — — — — — 0 — 90 1.0 20 ± 0.5 0.1 ±2.5 ————0.213 %VFSS mV/kPa ms ms %VFSS Vdc 1. Device is ratiometric within this specified excitation range. 2. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of errors, including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 8. Offset (Voff) is defined as the output voltage at the minimum rated pressure. MPXV5050VC6T1 2 Sensors Freescale Semiconductor FLUOROSILICONE GEL DIE COAT P1 WIRE BOND LEAD FRAME DIE STAINLESS STEEL CAP THERMOPLASTIC CASE +5 V Vout Vs IPS 1.0 µF 0.01 µF GND OUTPUT 470 pF P2 DIFFERENTIAL SENSING ELEMENT DIE BOND Figure 2. Cross-Sectional Diagram (not to scale) Figure 3. Typical Application Circuit (Output Source Current Operation) TRANSFER FUNCTION MPXV5050VC6T1 Transfer Function MPXV5050VC Series 5 Transfer Function: Vout = VS x (0.018 x P + 0.92) ± (PE x TM x 0.018 x Vs) Vs = 5.0 ± 0.25 vdc PE = 1.25 TM = 1 Temperature = 0 to 85°C Output Range (Typ) Offset (Typ) Span Range (Typ) 0 4 Output Voltage (V) 3 MAX 2 MIN 1 TYPICAL 0 –50 –40 –30 Pressure (kPa) –20 –10 Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV5050VC6T1 pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. MPXV5050VC6T1 Sensors Freescale Semiconductor 3 Transfer Function (MPXV5050VC6T1 Nominal Transfer Value: Vout = VS x (0.018 x P + 0.92) ± (Pressure Error x Temp Multi x 0.018 x VS) VS = 5.0 ± 0.25 V Temperature Error Band MPXV5050V 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C Break Points Temp –40 0 to 85 +125 Multiplier 3 1 3 NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band MPXV5050V Error Limits for Pressure 1.25 Pressure Error (kPa) 1.00 0.75 0 –0.75 –1.00 –1.25 Pressure –50 to 0 kPa Error (Max) ±1.25 kPa –50 –40 –30 –20 –10 0 Pressure (in kPa) MPXV5050VC6T1 4 Sensors Freescale Semiconductor MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.660 16.76 0.100 TYP 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 5. SOP Footprint (Case 482A) MPXV5050VC6T1 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS -A4 5 D 8 PL 0.25 (0.010) M TB S A S N -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -TSEATING PLANE DIM A B C D G H J K M N S V W CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV5050VC6T1 6 Sensors Freescale Semiconductor NOTES MPXV5050VC6T1 Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005. All rights reserved. MPXV5050VC6T1 Rev. 1 05/2005