MPXY8020A6T1

Freescale Semiconductor Technical Data Document Number: MPXY8000 Rev 3, 02/2006 Tire Pressure Monitoring Sensor Temperature Compensated and Calibrated, Fully Integrated, Digital Output The Freescale Semiconductor MPXY8000 series sensor is an 8-pin tire monitoring sensor which is comprised of a variable capacitance pressure sensing element, a temperature sensing element, and an interface circuit (with a wake-up feature) all on a single chip. It is housed in a Super-Small Outline Package (SSOP), which includes a media protection filter. Specifically designed for the low power consumption requirements of tire pressure monitoring systems, it can combine with a Freescale Semiconductor remote keyless entry (RKE) system to facilitate a low-cost, highly integrated system. DETAILED DESCRIPTION The block diagram of the MPXY8000 series sensor is shown in Figure 1. The pressure sensor is a capacitive transducer constructed using surface micromachining, the temperature sensor is constructed using a diffused resistor, and the interface circuit is integrated onto the same die as the sensors using a standard silicon CMOS process. The conditioning of the pressure signal begins with a capacitance to voltage conversion (C to V) followed by a switched capacitor amplifier. This amplifier has adjustable offset and gain trimming. The offset and gain are factory calibrated, with calibration values stored in the EEPROM trim register. This amplifier also has temperature compensation circuits for both sensitivity and offset, which also are factory adjusted using the EEPROM trim register. The pressure is monitored by a voltage comparator, which compares the measured value against an 8-bit threshold adjusted by a serial input. By adjusting the threshold and monitoring the state of the OUT pin the external device can check whether a low-pressure threshold has been crossed, or perform up to 8-bit A/D conversions. The temperature is measured by a diffused resistor with a positive temperature coefficient driven by a current source, thereby creating a voltage. The room temperature value of this voltage is factory calibrated using the EEPROM trim register. A two-channel multiplexer can route either the pressure or temperature signal to a sampling capacitor that is monitored by a voltage comparator with variable threshold adjust, providing a digital output for temperature. An internal low frequency, low power 5.4 kHz oscillator with a 14-stage divider provides a periodic pulse to the OUT pin (divide by 16384 for 3 seconds). This pulse can be used to wake up an external MCU to begin an interface with the device. An additional 10-stage divider will provide a pulse every 52 minutes which can be used to reset an external MCU. The power consumption can be controlled by several operational modes selected by external pins. MPXY8020A MPXY8040A TIRE PRESSURE MONITORING SENSOR MPXY8020A: OPTIMIZED FOR 250 kPa – 450 kPa MPXY8040A: OPTIMIZED FOR 500 kPa – 900 kPa SUPER SMALL OUTLINE PACKAGE CASE 1352-03 PIN ASSIGNMENT S1NPP 1 VDD 2 VSS 3 OUT 4 8 7 6 5 SO CLK DATA RST 8-pin Super Small Outline Package (SSOP) ORDERING INFORMATION Shipped in Rails MPXY8020A6U MPXY8040A6U Shipped in Tape & Reel MPXY8020A6T1 MPXY8040A6T1 © Freescale Semiconductor, Inc., 2006. All rights reserved. VDD PX Clock Gen fHF Internal HF OSC. Power Control PREF C to V Convert Digital Control S1 S0 Data CLK AMP Internal LF OSC. P-Cell P-Off Trim P-Gain Trim P-TCO Trim P-TCS Trim f LF 14-Stage Divider Lock 10-Stage Divider T-Off Trim 8-Bit Current Source 2-Chan MUX 8-Bit D/A Register RST 2-Chan MUX t PTC Res. AVSS COMP + Sample CAP AVSS 3-Chan MUX OUT VSS AVSS Figure 1. MPXY8000 Series Sensor Block Diagram OPERATING MODES The device has several operating modes dependent on the applied voltages to the S1 and S0 pins as shown in Table 1. In all the modes listed the channel multiplexers, D/A Register, LFO, and the output pulse dividers will always be powered up as long as there is a voltage source connected to the VDD pin. When only the S0 pin is at a logic one the pressure measuring circuit in the device is powered up and the pressure output signal is connected to the sample capacitor through a multiplexer. When the S0 pin returns to the low state the multiplexer will first turn off to store the signal on the sample capacitor before powering down the measuring circuitry. When only the S1 pin is at a logic one the temperature measuring circuit in the device is powered up and the temperature output signal is connected to the sample capacitor through a multiplexer. When the S1 pin returns to the low state the multiplexer will first turn off to store the signal on the sample capacitor before powering down the measuring circuitry. NOTE: All of the EEPROM trim bits will be powered up regardless of whether the pressure or temperature measuring circuitry is activated. NOTE: If the voltage on the S1 pin exceeds 2.5 times the voltage on the VDD pin the device will be placed into its Trim/Test Mode. NOTE: If the VDD supply source is switched off in order to reduce current consumption, it is important that all input pins be driven LOW to avoid powering up the device. If any input pin (S1, S0, DATA, or CLK) is driven HIGH while the VDD supply is switched off, the device may be powered up through an ESD protection diode. Such a case should be avoided. The effective source voltage of the device will be less than the applied voltage due to diode voltage drop. In addition, the entire source current will be drawn from the input pin. MPXY8000 2 Sensors Freescale Semiconductor Table 1. Operating Modes Circuitry Powered S1 S0 Operating Mode Pressure Measure System OFF ON OFF OFF Temp Measure System OFF OFF ON OFF A/D Output Comp. OFF OFF OFF ON LFO Oscill. ON ON ON ON Serial Data Counter 0 0 1 1 0 1 0 1 Standby/Reset Measure Pressure Measure Temperature Output Read ACTIVE RESET RESET ACTIVE PIN FUNCTIONS The following paragraphs give a description of the general function of each pin. VDD and VSS Pins Power is supplied to the control IC through VDD and VSS. VDD is the positive supply and VSS is the digital and analog MPXY8020A VDD 0.1 µF VSS ground. The control IC operates from a single power supply. Therefore, the conductors to the power supply should be connected to the VDD and VSS pins and locally decoupled as shown in Figure 2. To Other VDD Loads VDD To Power Supply VSS To Other VSS Returns Figure 2. Recommended Power Supply Connections OUT Pin The OUT pin normally provides a digital signal related to the voltage applied to the voltage comparator and the threshold level shifted into an 8-bit register from an external device. When the device is placed in the standby mode the OUT pin is driven high and will be clocked low when an overflow is detected from a clock divider (divide by 16384) driven by the LFO. This allows the OUT pin to wake up an external device such as an MCU. OUT 2/f LFO 2/f LFO Operation Measure Standby Measure 3 Sec Wake Up Figure 3. Pulse on OUT Pin During Standby Mode RST Pin The RST pin is normally driven high and will be clocked low when an overflow is detected from total clock divider MPXY8000 Sensors Freescale Semiconductor (divide by 16,777,216) driven by the LFO. This allows the RST pin to reset an external device such as an MCU. This pulse will appear on the RST pin approximately every 52 minutes regardless of the operating mode of the device. 3 The pulse lasts for two cycles of the LFO oscillator as shown in Figure 4. Since the RST pin is clocked from the same divider string as the OUT pin, there will also be a pulse on the OUT pin when the RST pin pulses every 52 minutes. OUT RST 2/f LFO 2/f LFO Standby ≈ 3 Sec ≈ 52 Minutes Figure 4. Pulse on RST Pin S0 Pin The S0 pin is used to select the mode of operation as shown in Table 1. The S0 pin contains an internal Schmitt trigger as part of its input to improve noise immunity. The S0 pin has an internal pull-down device in order to provide a low level when the pin is left unconnected. S1 Pin The S1 pin is used to select the mode of operation, as shown in Table 1. The S1 pin contains an internal Schmitt trigger as part of its input to improve noise immunity. This pin has an internal pull-down device to provide a low level when the pin is left unconnected. The S1 pin also serves the purpose of enabling factory trim and test of the device. The higher VPP programming voltage for the internal EEPROM trim register is also supplied through the S1 pin. DATA Pin The DATA pin is the serial data in (SDI) function for setting the threshold of the voltage comparator. The DATA pin contains an internal Schmitt trigger as part of its input to improve noise immunity. This pin has an internal pull-down device to provide a low level when the pin is left unconnected. Table 2. D/A Threshold Bit Assignment Function LSB Bit Weight 1 2 4 Voltage Comparator Threshold Adjust (8 bits) 8 16 32 64 MSB 128 Data Bit D0 D1 D2 D3 D4 D5 D6 D7 CLK Pin The CLK pin is used to provide a clock used for loading and shifting data into the DATA pin. The data on the DATA pin is clocked into a shift register on the rising edge of the CLK pin signal. The data is transferred to the D/A Register on the eighth falling edge of the CLK pin. This protocol may be handled by the SPI or SIOP serial I/O function found on some MCU devices. The CLK pin contains an internal Schmitt trigger as part of its input to improve noise immunity. The CLK pin has an internal pull-down device to provide a low level when the pin is left unconnected. Output Threshold Adjust The state of the OUT pin is driven by a voltage comparator whose output state depends on the level of the input voltage on the sample capacitor and the level of an adjustable 8-bit threshold voltage. The threshold is adjusted by shifting data bits into the D/A Register (DAR) via the DATA pin while clocking the CLK pin. The timing of this data is shown in Figure 4. Data is transferred into the serial shift register on the rising edge of the CLK pin. On the falling edge of the 8th clock the data in the serial shift register is latched into the parallel DAR register. The DAR remains powered up whenever VDD is present. The serial data is clocked into the DATA pin starting with the MSB first. This sequence of threshold select bits is shown in Table 2. MPXY8000 4 Sensors Freescale Semiconductor An analog to digital (A/D) conversion can be accomplished with eight (8) different threshold levels in a successive approximation algorithm; or the OUT pin can be set to trip at some alarm level. The voltage on the sample capacitor will maintain long enough for a single 8-bit conversion, but may need to be refreshed with a new measured reading if the read interval is longer than the specified hold time, tSH. The counter that determines the number of clock pulses into the device is reset whenever the device is placed into the Measure Pressure or Measure Temperature Modes. This provides a means to reset the data transfer count in case the 1 CLK Data MSB BIT6 BIT5 BIT4 2 3 4 clock stream is corrupted during a transmission. In these two modes the DATA and CLK pins should not be clocked to reduce noise in the captured pressure or temperature data. Any change in the DAR contents should be done during the Standby or Output Read Modes. Both the serial bit counter and the state of the DAR are undefined following power up of the device. The serial bit counter can be reset by cycling either the SO pin or the S1/VPP pin to a high level and then back low. The DAR can then be reset to the lowest level by holding the DATA pin low while bursting the CLK pin with eight (8) clock pulses. 5 6 7 8 BIT3 BIT2 BIT1 LSB Serial Data ∗ MSB BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 LSB DAR Load * DAR * (*) Denotes Internal Signal Data Figure 5. Serial Data Timing Pressure Sensor Output The pressure channel compares the output of its analog measurement circuit to the D/A reference voltage. The device is calibrated at two different nominal values depending on the calibration option. Temperature Sensor Output The temperature channel compares the output of a positive temperature coefficient (PTC) resistor driven by a switched current source. The current source is only active when the temperature channel is selected. APPLICATIONS Suggested application example is shown in Figure 6. Optional + Motion Sense VDD S1 S0 Data State Machine or MCU RF Transmitter 3.0 V MPXY8000 Series Sensor 0.1 µF CLK RST OUT VSS Figure 6. Application Example MPXY8000 Sensors Freescale Semiconductor 5 ELECTRICAL SPECIFICATIONS Maximum ratings are the extreme limits to which the device can be exposed without permanently damaging it. The device contains circuitry to protect the inputs against damage Table 3. Maximum Ratings Rating Supply Voltage Short Circuit Capability (all pins excluding VDD and VSS) Maximum High Voltage for 5 minutes Minimum Low Voltage for 5 minutes Substrate Current Injection Current from any pin to VSS –0.3 VDC) Electrostatic Discharge Human Body Model (HBM) Charged Device Model (CDM) Machine Model (MM) Storage Temperature Range Standard Temperature Range from high static voltages; however, do not apply voltages higher than those shown in the table below. Keep VIN and VOUT within the range VSS ≤ (VIN or VOUT) ≤ VDD. Symbol VDD VSC VSC ISUB VESD VESD VESD Tstg Value Unit V V V µA V V V °C –0.3 to +4.0 VDD VSS 600 ±1000 ±1000 ±200 –40 to +150 ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Extra precaution must be taken by the user to protect the chip from ESD. A charge of over 1000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the performance or cause failure of the chip. When handling the pressure sensor, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance. Table 4. Operating Range These are the limits normally expected in the application which define range of operation. Characteristic Supply Voltage Operating Temperature Range Standard Temperature Range Supply Current Drain Standby Mode −40°C to +85°C +85°C to +100°C +100°C to +125°C Read Mode −40°C to +125°C Measure Temperature Mode −40°C to +125°C Measure Pressure Mode −40°C to +10°C +10°C to +60°C +60°C to +125°C Symbol VDD TA Min 2.1 Typ 3.0 — Max 3.6 TH +125 Units V °C –40 TL ISTBY ISTBY ISTBY IREAD ITEMP IPRESS IPRESS IPRESS — — — 0.6 0.8 1.5 0.9 1.2 2.2 µA µA µA — 400 600 µA — 400 600 µA — — — 1400 1300 1200 1800 1700 1700 µA µA µA MPXY8000 6 Sensors Freescale Semiconductor Table 5. Electrical Characteristics +2.1 V ≤ VDD ≤ +3.6 V, TL ≤ TA ≤ TH, unless otherwise specified. Characteristic Output High Voltage DATA, OUT, RST (ILoad = 100 µA) Output Low Voltage DATA, OUT, RST (ILoad = -100 µA) Input High Voltage S0, S1, DATA, CLK Input Low Voltage S0, S1, DATA, CLK Input Hysteresis (VIH — VIL) S0, S1, DATA, CLK Input Low Current (at VIL) S0, S1, DATA, CLK Input High Current (at VIH) S0, S1, DATA, CLK Temperature Measurement (+2.5 V ≤ VDD ≤ 3.0 V) D/A Conversion Code at –40°C D/A Conversion Code at –20°C D/A Conversion Code at 25°C D/A Conversion Code at 70°C D/A Conversion Code at 100°C D/A Conversion Code at 120°C D/A Conversion Code at 125°C Temperature Measurement (+2.1 V ≤ VDD ≤ 3.6 V) D/A Conversion Code at –40°C D/A Conversion Code at –20°C D/A Conversion Code at 25°C D/A Conversion Code at 70°C D/A Conversion Code at 100°C D/A Conversion Code at 120°C D/A Conversion Code at 125°C Temperature Sensitivity at 25°C Approximate Temperature Output Response Symbol VOH VOL VIH VIL VHYS IIL IIH T–40 T–20 T25 T70 T100 T120 T125 T–40 T–20 T25 T70 T100 T120 T125 Min VDD –0.8 — 0.7 x VDD VSS 100 Typ — — — — 200 Max — 0.4 — 0.3 x VDD — Units V V V V mV µA µA (2) counts counts counts counts counts counts counts counts counts counts counts counts counts counts °C/bit counts –5 –5 36 52 97 155 204 241 249 36 52 97 154 203 240 249 — –25 –35 42 57 102 163 214 252 255 42 57 102 163 214 252 255 0.80 –100 –140 47 62 107 171 224 255 255 49 64 107 172 225 255 255 OUT = 74.75 + 0.075 x Ta + 0.0041 x Ta^2 8 7 6 Temperature Error (°C) 5 4 3 2 1 0 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Figure 7. Temperature Error vs Temperature at VDD = 3.0 V MPXY8000 Sensors Freescale Semiconductor 7 Table 6. Control Timing +2.1 V ≤ VDD ≤ +3.6 V, TL ≤ TA ≤ TH, unless otherwise specified. Characteristic HFO Measurement Clock Frequency LFO Wake Up Clock Frequency Ta = –40°C, +2.1V ≤ VDD ≤ +3.6 Ta = +25°C, +2.1V ≤ VDD ≤ +3.6 Ta = +125°C, +2.1V ≤ VDD ≤ +3.6 Wake Up Pulse Pulse Timing Pulse Width Reset Pulse Pulse Timing Pulse Width Minimum Setup Time (DATA edge to CLK rise) Minimum Hold Time (CLK rise to DATA change) Measurement Response Time Recommended time to hold device in measurement mode Temperature Pressure Read Response Time (see Figure 8) From 90% VDD on S0 to OUT less than VOL or greater than VOH Sample Capacitor Discharge Time From initial full scale D/A count (255) to drop 2 counts (253) Symbol fHF fLF fLF fLF tWAKE tWPW tRESET tRPW tSETUP tHOLD Min 100 3300 3900 3800 — — — — 100 100 Typ 135 5400 5400 5300 16384 2 16,777,216 2 — — Max 150 8000 7700 7000 — — — — — — Units kHz Hz Hz Hz LFO clocks LFO clocks LFO clocks LFO clocks nSec nSec tTMEAS tPMEAS tREAD tSH — — — 20 200 500 50 — — — 100 — µSec µSec µSec mSec VDD 6.32 kΩ Test Point 50 pF 10.91 kΩ Figure 8. Control Timing Test Load for OUT and RST Pins MPXY8000 8 Sensors Freescale Semiconductor SENSOR CHARACTERISTICS (MPXY8020A) Pressure Transfer Function kPa = 2.5 x Output ± (Pressure Error) Output = 8-bit digital pressure measurement (between 0-255) Pressure Error (±kPa): 50 kPa ≤ P < 250 kPa T[°C] \ VDD[V] 2.1 72.5 57.5 57.5 57.5 57.5 72.5 95.0 2.5 72.5 57.5 57.5 57.5 57.5 72.5 92.5 2.7 32.5 25.0 25.0 25.0 27.5 37.5 57.5 3.0 32.5 25.0 25.0 25.0 25.0 37.5 47.5 3.3 32.5 25.0 25.0 25.0 25.0 37.5 47.5 3.6 35.0 27.5 27.5 27.5 27.5 37.5 47.5 –40 –20 0 25 70 100 125 Pressure Error (±kPa): 250 kPa ≤ P ≤ 450 kPa T[°C] \ VDD[V] 2.1 40.0 32.5 30.0 30.0 35.0 40.0 62.5 2.5 40.0 25.0 25.0 25.0 25.0 40.0 60.0 2.7 25.0 15.0 10.0 7.5 10.0 25.0 35.0 3.0 25.0 15.0 10.0 7.5 7.5 25.0 35.0 3.3 25.0 15.0 10.0 7.5 7.5 25.0 35.0 3.6 30.0 20.0 15.0 15.0 15.0 30.0 35.0 –40 –20 0 25 70 100 125 Pressure Error (±kPa): 450 kPa < P ≤ 600 kPa T[°C] \ VDD[V] 2.1 70.0 55.0 55.0 55.0 55.0 70.0 90.0 2.5 70.0 55.0 55.0 55.0 55.0 70.0 90.0 2.7 37.5 25.0 22.5 22.5 25.0 32.5 47.5 3.0 37.5 25.0 22.5 22.5 25.0 32.5 47.5 3.3 37.5 25.0 22.5 22.5 25.0 32.5 47.5 3.6 40.0 35.0 35.0 35.0 35.0 40.0 52.5 –40 –20 0 25 70 100 125 Areas marked in grey indicate the typical operating range. MPXY8000 Sensors Freescale Semiconductor 9 SENSOR CHARACTERISTICS (MPXY8020A) Pressure Error 30 25 20 15 10 5 0 Error [kPa] 50 100 150 200 250 300 Pressure [kPa] 350 400 450 500 550 600 Figure 9. Pressure Error vs Pressure at T = 25°C, 2.7 V ≤ VDD ≤ 3.3 V 35 30 25 20 Error [kPa] 15 10 5 0 2.1 2.3 2.5 2.7 VDD [V] 2.9 3.1 3.3 3.5 Figure 10. Pressure Error vs VDD at T = 25°C, 250 kPa ≤ P ≤ 450 kPa 40 35 30 25 20 Error [kPa] 15 10 5 0 –40 –20 0 20 40 Temperature [°C] 60 80 100 120 Figure 11. Pressure Error vs Temperature at VDD = 3.0 V, 250 kPa ≤ P ≤ 450 kPa MPXY8000 10 Sensors Freescale Semiconductor SENSOR CHARACTERISTICS (MPXY8040A) Pressure Transfer Function kPa = 5.0 x Output ± (Pressure Error) Output = 8-bit digital pressure measurement (between 0-255) Pressure Error [±kPa]: 50 kPa ≤ P < 500 kPa T[°C] \ VDD[V] 2.1 80 70 60 55 70 80 90 2.1 75 50 40 40 40 60 90 2.1 120 100 90 90 90 90 130 2.1 130 110 90 90 90 130 140 2.1 150 120 110 110 120 160 210 2.3 75 60 50 45 55 70 85 2.3 65 35 30 30 30 45 85 2.3 110 80 60 60 75 90 120 2.3 120 90 80 80 75 110 130 2.3 140 100 90 90 120 140 200 2.5 70 55 45 40 50 65 80 2.5 60 25 20 20 20 35 80 2.5 110 80 60 60 75 90 120 2.5 120 90 80 80 75 110 130 2.5 140 100 90 90 120 140 200 2.7 70 55 45 40 50 65 80 2.7 60 25 20 20 20 35 80 2.7 100 60 40 40 60 75 110 2.7 100 60 50 50 60 100 120 2.7 120 80 80 80 120 140 200 3.0 70 55 45 40 50 65 80 3.0 60 25 20 20 20 35 80 3.0 100 60 40 40 60 75 110 3.0 100 70 50 50 60 100 120 3.0 120 80 80 80 120 140 200 3.3 70 55 45 45 50 65 80 3.3 60 40 25 25 25 45 80 3.3 110 80 60 60 75 90 120 3.3 120 90 80 80 75 110 130 3.3 140 100 90 90 130 160 210 3.6 75 60 55 50 55 70 80 3.6 65 50 35 35 35 60 80 3.6 120 100 90 90 90 90 130 3.6 130 110 90 90 90 130 140 3.6 150 120 110 110 150 160 210 –40 –20 0 25 70 100 125 T[°C] \ VDD[V] Pressure Error [±kPa]: 500 kPa ≤ P < 900 kPa –40 –20 0 25 70 100 125 T[°C] \ VDD[V] Pressure Error [±kPa]: 900 kPa ≤ P < 1000 kPa –40 –20 0 25 70 100 125 T[°C] \ VDD[V] Pressure Error [±kPa]: 1000 kPa ≤ P < 1100 kPa –40 –20 0 25 70 100 125 T[°C] \ VDD[V] Pressure Error [±kPa]: 1100 kPa ≤ P ≤1275 kPa –40 –20 0 25 70 100 125 Areas marked in grey indicate the typical operating range. Pressure values beyond 900 kPa are from characterization only. Pressure readings above 680 kPa are not tested in production. MPXY8000 Sensors Freescale Semiconductor 11 SENSOR CHARACTERISTICS (MPXY8040A) Pressure Error 100 80 60 Error [kPa] 40 20 0 50 150 250 350 450 550 650 750 850 950 1050 1150 1250 Pressure [kPa] Figure 12. Pressure Error vs Pressure at T= 25°C, 2.7 V ≤ VDD ≤ 3.0 V 50 40 30 20 10 Error [kPa] 0 2.1 2.3 2.5 2.7 VDD [V] 2.9 3.1 3.3 3.5 Figure 13. Pressure Error vs VDD at T = 25°C, 500 kPa ≤ P ≤ 900kPa 100 80 60 Error [kPa] 40 20 0 –40 –20 0 20 40 Temperature [°C] 60 80 100 120 Figure 14. Pressure Error vs Temperature at VDD = 3.0 V, 500 kPa ≤ P ≤ 900kPa MPXY8000 12 Sensors Freescale Semiconductor MECHANICAL SPECIFICATIONS Maximum ratings are the extreme limits to which the device can be exposed without permanently damaging it. Table 7. Maximum Ratings Rating Maximum Pressure (1) Keep VIN and VOUT within the range VSS ≤ (VIN or VOUT) ≤ VDD. Symbol pmax gCENT gshock Value 1400 2000 2000 Unit kPa(1) g g Centrifugal Force Effects (3 axis) Pressure measurement change less than 1% FSS Unpowered Shock (three sides, 0.5 mSec duration) 1. Tested for 5 minutes at 25°C. MEDIA COMPATIBILITY The Daytona sensor has been designed with the tire pressure application in mind. As such, it has been tested to a variety of media typical of the tire environment. The filter provides limited, but not universal, media protection. The customer must ensure media compatibility of the Daytona sensor in their application. In particular, it is strongly recommended that the customer design the application such that media does not come in direct contact with the sensor. Module housing design and orientation will play a role in protecting the sensor from direct media exposure. In the event that media does come in contact with the sensor it is desirable that the application minimize the duration and severity of exposure. Media may be forced through the filter by mechanical aspects of the application such as g-forces or rapid pressurization of the tire. In addition, the customer maintains responsibility to design and carry out reliability testing verifying compatibility of the Daytona sensor with their module design and application. MPXY8000 Sensors Freescale Semiconductor 13 PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1352-03 ISSUE C SUPER SMALL OUTLINE PACKAGE MPXY8000 14 Sensor Devices Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1352-03 ISSUE C SUPER SMALL OUTLINE PACKAGE MPXY8000 Sensors Freescale Semiconductor 15 PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1352-03 ISSUE C SUPER SMALL OUTLINE PACKAGE MPXY8000 16 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. All rights reserved. MPXY8000 Rev. 3 02/2006