MRF6S9125NBR1

Freescale Semiconductor Technical Data MRF6S9125NR1/NBR1 replaced by MRFE6S9125NR1/NBR1. Refer to Device Migration PCN12895 for more details. Document Number: MRF6S9125N Rev. 5, 8/2008 RF Power Field Effect Transistors N - Channel Enhancement - Mode Lateral MOSFETs Designed for broadband commercial and industrial applications with frequencies up to 1000 MHz. The high gain and broadband performance of these devices make them ideal for large - signal, common - source amplifier applications in 28 volt base station equipment. N - CDMA Application • Typical Single - Carrier N - CDMA Performance: VDD = 28 Volts, IDQ = 950 mA, Pout = 27 Watt Avg., Full Frequency Band (865 - 960 MHz), IS - 95 CDMA (Pilot, Sync, Paging, Traffic Codes 8 Through 13) Channel Bandwidth = 1.2288 MHz. PAR = 9.8 dB @ 0.01% Probability on CCDF. Power Gain — 20.2 dB Drain Efficiency — 31% ACPR @ 750 kHz Offset = - 47.1 dBc in 30 kHz Bandwidth GSM EDGE Application • Typical GSM EDGE Performance: VDD = 28 Volts, IDQ = 700 mA, Pout = 60 Watts Avg., Full Frequency Band (865 - 960 MHz or 921 - 960 MHz) Power Gain — 20 dB Drain Efficiency — 40% Spectral Regrowth @ 400 kHz Offset = - 63 dBc Spectral Regrowth @ 600 kHz Offset = - 78 dBc EVM — 1.8% rms GSM Application • Typical GSM Performance: VDD = 28 Volts, IDQ = 700 mA, Pout = 125 Watts, Full Frequency Band (921 - 960 MHz) Power Gain — 19 dB Drain Efficiency — 62% • Capable of Handling 10:1 VSWR, @ 28 Vdc, 880 MHz, 125 Watts CW Output Power Features • Characterized with Series Equivalent Large - Signal Impedance Parameters • Internally Matched for Ease of Use • Qualified Up to a Maximum of 32 VDD Operation • Integrated ESD Protection • 225°C Capable Plastic Package • N Suffix Indicates Lead - Free Terminations. RoHS Compliant. • In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel. MRF6S9125NR1 MRF6S9125NBR1 865 - 960 MHz, 27 W AVG., 28 V SINGLE N - CDMA, GSM EDGE LATERAL N - CHANNEL RF POWER MOSFETs CASE 1486 - 03, STYLE 1 TO - 270 WB - 4 PLASTIC MRF6S9125NR1 CASE 1484 - 04, STYLE 1 TO - 272 WB - 4 PLASTIC MRF6S9125NBR1 Table 1. Maximum Ratings Rating Drain - Source Voltage Gate - Source Voltage Storage Temperature Range Case Operating Temperature Operating Junction Temperature (1,2) Symbol VDSS VGS Tstg TC TJ Value - 0.5, +68 - 0.5, +12 - 65 to +150 150 225 Unit Vdc Vdc °C °C °C 1. Continuous use at maximum temperature will affect MTTF. 2. MTTF calculator available at http://www.freescale.com/rf . Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product. © Freescale Semiconductor, Inc., 2006, 2008. All rights reserved. MRF6S9125NR1 MRF6S9125NBR1 1 RF Device Data Freescale Semiconductor LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 LIFETIME BUY Table 2. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Case Temperature 80°C, 125 W CW Case Temperature 76°C, 27 W CW Symbol RθJC Value (1,2) 0.44 0.45 Unit °C/W Table 3. ESD Protection Characteristics Test Methodology Human Body Model (per JESD22 - A114) Machine Model (per EIA/JESD22 - A115) Charge Device Model (per JESD22 - C101) Class 1B (Minimum) C (Minimum) IV (Minimum) Table 4. Moisture Sensitivity Level Test Methodology Per JESD 22 - A113, IPC/JEDEC J - STD - 020 Rating 3 Package Peak Temperature 260 Unit °C LIFETIME BUY Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted) Characteristic Symbol IDSS IDSS IGSS Min — — — Typ — — — Max 10 1 1 Unit μAdc μAdc μAdc Off Characteristics Zero Gate Voltage Drain Leakage Current (VDS = 68 Vdc, VGS = 0 Vdc) Zero Gate Voltage Drain Leakage Current (VDS = 28 Vdc, VGS = 0 Vdc) Gate - Source Leakage Current (VGS = 5 Vdc, VDS = 0 Vdc) Gate Threshold Voltage (VDS = 10 Vdc, ID = 400 μAdc) Gate Quiescent Voltage (VDD = 28 Vdc, ID = 950 mAdc, Measured in Functional Test) Drain - Source On - Voltage (VGS = 10 Vdc, ID = 2.74 Adc) Reverse Transfer Capacitance (VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc) Output Capacitance (VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc) On Characteristics VGS(th) VGS(Q) VDS(on) 1 2 0.05 2.1 2.89 0.23 3 4 0.3 Vdc Vdc Vdc Dynamic Characteristics (3) Crss Coss — — 2 60 — — pF pF Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 950 mA, Pout = 27 W Avg. N - CDMA, f = 880 MHz, Single - Carrier N - CDMA, 1.2288 MHz Channel Bandwidth Carrier. ACPR measured in 30 kHz Channel Bandwidth @ ±750 kHz Offset. PAR = 9.8 dB @ 0.01% Probability on CCDF. Power Gain Drain Efficiency Adjacent Channel Power Ratio Input Return Loss Gps ηD ACPR IRL 19 29 — — 20.2 31 - 47.1 - 16 24 — - 45 -9 dB % dBc dB 1. MTTF calculator available at http://www.freescale.com/rf . Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product. 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf . Select Documentation/Application Notes - AN1955. 3. Part is internally input matched. (continued) MRF6S9125NR1 MRF6S9125NBR1 2 RF Device Data Freescale Semiconductor LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted) (continued) Characteristic Symbol Min Typ Max Unit Typical GSM EDGE Performances (In Freescale GSM EDGE Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 700 mA, Pout = 60 W Avg., 921 - 960 MHz, EDGE Modulation Power Gain Drain Efficiency Error Vector Magnitude Spectral Regrowth at 400 kHz Offset Spectral Regrowth at 600 kHz Offset Gps ηD EVM SR1 SR2 — — — — — 20 40 1.8 - 63 - 78 — — — — — dB % % rms dBc dBc Typical CW Performances (In Freescale GSM Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 700 mA, Pout = 125 W, 921 - 960 MHz Power Gain Drain Efficiency Input Return Loss Gps ηD IRL P1dB — — — — 19 62 - 12 125 — — — — dB % dB W Pout @ 1 dB Compression Point, CW (f = 880 MHz) MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 3 LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 LIFETIME BUY R1 VBIAS + C10 RF INPUT C9 + C8 + C7 R2 C6 L1 Z1 C1 C2 C3 C5 Z2 Z3 Z4 Z5 Z6 Z7 C4 Z8 C11 DUT C12 C13 C14 Z9 Z10 L2 Z11 Z12 Z13 Z14 C18 C19 + C20 + C21 + C22 VSUPPLY C23 Z15 Z16 C17 C15 C16 LIFETIME BUY Z1, Z17 Z2 Z3 Z4 Z5 Z6 Z7 Z8 Z9 0.200″ 1.060″ 0.382″ 0.108″ 0.200″ 0.028″ 0.236″ 0.050″ 0.238″ x 0.080″ x 0.080″ x 0.220″ x 0.220″ x 0.420″ x 0.620″ x 0.620″ x 0.620″ x 0.620″ Microstrip Microstrip Microstrip Microstrip x 0.620″ Taper Microstrip Microstrip Microstrip Microstrip Z10 Z11 Z12 Z13 Z14 Z15 Z16 PCB 0.057″ x 0.620″ Microstrip 0.119″ x 0.620″ Microstrip 0.450″ x 0.220″ Microstrip 0.061″ x 0.220″ Microstrip 0.078″ x 0.220″ Microstrip 0.692″ x 0.080″ Microstrip 0.368″ x 0.080″ Microstrip Arlon CuClad 250GX - 0300 - 55 - 22, 0.030″, εr = 2.55 Figure 1. MRF6S9125NR1(NBR1) Test Circuit Schematic Table 6. MRF6S9125NR1(NBR1) Test Circuit Component Designations and Values Part Description 20 pF Chip Capacitor 6.2 pF Chip Capacitor 0.8 - 8.0 pF Variable Capacitors, Gigatrim 11 pF Chip Capacitors 0.56 μF, 50 V Chip Capacitors 47 μF, 16 V Tantalum Capacitors 47 pF Chip Capacitors 100 μF, 50 V Electrolytic Capacitor 12 pF Chip Capacitors 5.1 pF Chip Capacitors 0.3 pF Chip Capacitor 39 pF Chip Capacitor 22 μF, 35 V Tantalum Capacitors 470 μF, 63 V Electrolytic Capacitor 7.15 nH Inductor 8.0 nH Inductor 15 Ω, 1/3 W Chip Resistor 560 kΩ, 1/4 W Chip Resistor Part Number ATC100B200FT500XT ATC100B6R2BT500XT 27291SL ATC100B110FT500XT C1825C564J5RAC T491D476K016AT ATC700B470FT500XT MCHT101M1HB - 1017 - RF ATC100B120FT500XT ATC100B5R1BT500XT ATC700B0R3BT500XT ATC700B390FT500XT T491X226K035AT ESME630ELL471MK25S 1606 - 7J A03T CRCW121015R0FKEA CRCW12065603FKEA ATC ATC Johanson ATC Kemet Kemet ATC Multicomp ATC ATC ATC ATC Kemet United Chemi - Con CoilCraft CoilCraft Vishay Vishay Manufacturer C1 C2 C3, C15 C4, C5 C6, C18, C19 C7, C8 C9, C23 C10 C11, C12 C13, C14 C16 C17 C20, C21 C22 L1 L2 R1 R2 MRF6S9125NR1 MRF6S9125NBR1 4 RF Device Data Freescale Semiconductor LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 RF Z17 OUTPUT C8 C7 C9 VGG C10 C1 CUT OUT AREA L1 C2 C5 C3 C6 C19 C20 C21 C22 R2 R1 VDD C18 C14 L2 C23 C17 C4 C11 C13 C12 C15 C16 900 MHz TO272 WB Rev. 0 Figure 2. MRF6S9125NR1(NBR1) Test Circuit Component Layout MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 5 LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 LIFETIME BUY TYPICAL CHARACTERISTICS ηD, DRAIN EFFICIENCY (%) 20.5 20.3 Gps, POWER GAIN (dB) 20 19.8 19.5 19.3 19 18.8 ALT1 18.5 850 860 870 880 890 900 f, FREQUENCY (MHz) −70 910 ηD VDD = 28 Vdc, Pout = 27 W (Avg.) IDQ = 950 mA, N−CDMA IS−95 Pilot Sync, Paging, Traffic Codes 8 Through 13 IRL ACPR Gps 34 32 30 28 −30 −40 −50 −60 ACPR (dBc), ALT1 (dBc) −5 −10 −15 −20 −25 Figure 3. Single - Carrier N - CDMA Broadband Performance @ Pout = 27 Watts Avg. 19.6 19.4 Gps, POWER GAIN (dB) 19.2 19 18.8 18.6 18.4 18.2 18 850 860 870 880 890 900 IRL ALT1 ηD VDD = 28 Vdc, Pout = 62.5 W (Avg.) IDQ = 950 mA, N−CDMA IS−95 Pilot Sync, Paging, Traffic Codes 8 Through 13 ACPR 52 48 44 40 −30 −40 −50 −60 −70 910 ηD, DRAIN EFFICIENCY (%) Gps ACPR (dBc), ALT1 (dBc) −5 −10 −15 −20 −25 f, FREQUENCY (MHz) Figure 4. Single - Carrier N - CDMA Broadband Performance @ Pout = 62.5 Watts Avg. 22 21 −10 IMD, THIRD ORDER INTERMODULATION DISTORTION (dBc) VDD = 28 Vdc f1 = 880 MHz, f2 = 880.1 MHz Two−Tone Measurements IDQ = 1425 mA 475 mA −40 712 mA IDQ = 1475 mA 1187 mA −20 20 19 18 17 16 1 950 mA 712 mA 475 mA −30 −50 1187 mA −60 1 10 Pout, OUTPUT POWER (WATTS) PEP 950 mA 100 VDD = 28 Vdc, f1 = 880 MHz, f2 = 880.1 MHz Two−Tone Measurements 10 Pout, OUTPUT POWER (WATTS) PEP 100 300 300 Figure 5. Two - Tone Power Gain versus Output Power Figure 6. Third Order Intermodulation Distortion versus Output Power MRF6S9125NR1 MRF6S9125NBR1 6 RF Device Data Freescale Semiconductor LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 LIFETIME BUY Gps, POWER GAIN (dB) IRL, INPUT RETURN LOSS (dB) IRL, INPUT RETURN LOSS (dB) TYPICAL CHARACTERISTICS IMD, INTERMODULATION DISTORTION (dBc) VDD = 28 Vdc, IDQ = 950 mA f1 = 880 MHz, f2 = 880.1 MHz Two−Tone Measurements IMD, INTERMODULATION DISTORTION (dBc) −10 −20 −30 −40 −50 5th Order −60 7th Order −70 1 10 100 300 Pout, OUTPUT POWER (WATTS) PEP 3rd Order 0 VDD = 28 Vdc, Pout = 125 W (PEP) IDQ = 950 mA, Two−Tone Measurements (f1 + f2)/2 = Center Frequency of 880 MHz −20 3rd Order −30 5th Order −40 −50 −60 0.1 1 10 100 TWO−TONE SPACING (MHz) 7th Order Figure 7. Intermodulation Distortion Products versus Output Power 56 55 Pout, OUTPUT POWER (dBm) 54 53 52 51 50 49 48 28 29 30 31 32 33 P1dB = 51.5 dBm (139.3 W) Figure 8. Intermodulation Distortion Products versus Tone Spacing P3dB = 52.4 dBm (172.5 W) Ideal Actual VDD = 28 Vdc, IDQ = 950 mA Pulsed CW, 8 μsec(on), 1 msec(off) f = 880 MHz 34 35 36 Pin, INPUT POWER (dBm) Figure 9. Pulsed CW Output Power versus Input Power ηD, DRAIN EFFICIENCY (%), Gps, POWER GAIN (dB) 50 VDD = 28 Vdc, IDQ = 950 mA f = 880 MHz, N−CDMA IS−95 (Pilot 40 Sync, Paging, Traffic Codes 8 Through 13) 30 Gps 25_C 10 0 0.1 1 25_C 85_C 10 100 −30_C −30 25_C ALT1 −40 85_C −30_C −50 25_C 85_C ACPR −70 −80 200 ACPR, ADJACENT CHANNEL POWER RATIO (dBc) ALT1, CHANNEL POWER (dBc) TC = −30_C ηD 20 −60 Pout, OUTPUT POWER (WATTS) AVG. Figure 10. Single - Carrier N - CDMA ACPR, ALT1, Power Gain and Drain Efficiency versus Output Power MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 7 LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 −10 LIFETIME BUY TYPICAL CHARACTERISTICS 22 21 Gps, POWER GAIN (dB) 20 19 18 17 16 15 1 10 Pout, OUTPUT POWER (WATTS) CW 100 Gps 25_C 85_C VDD = 28 Vdc IDQ = 950 mA f = 880 MHz TC = −30_C −30_C 70 60 ηD, DRAIN EFFICIENCY (%) 20 Gps, POWER GAIN (dB) 50 40 ηD 30 20 10 0 200 16 0 50 100 150 200 Pout, OUTPUT POWER (WATTS) CW 21 25_C 85_C 19 18 28 V 17 VDD = 24 V 32 V IDQ = 950 mA f = 880 MHz 250 Figure 11. Power Gain and Drain Efficiency versus CW Output Power 108 Figure 12. Power Gain versus Output Power MTTF (HOURS) 107 106 105 90 110 130 150 170 190 210 230 250 TJ, JUNCTION TEMPERATURE (°C) This above graph displays calculated MTTF in hours when the device is operated at VDD = 28 Vdc, Pout = 27 W Avg., and ηD = 31%. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product. Figure 13. MTTF Factor versus Junction Temperature MRF6S9125NR1 MRF6S9125NBR1 8 RF Device Data Freescale Semiconductor LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 LIFETIME BUY N - CDMA TEST SIGNAL 100 10 PROBABILITY (%) 1 0.1 0.01 0.001 0.0001 0 2 4 6 8 10 PEAK−TO−AVERAGE (dB) IS−95 CDMA (Pilot, Sync, Paging, Traffic Codes 8 Through 13) 1.2288 MHz Channel Bandwidth Carriers. ACPR Measured in 30 kHz Bandwidth @ ±750 kHz Offset. ALT1 Measured in 30 kHz Bandwidth @ ±1.98 MHz Offset. PAR = 9.8 dB @ 0.01% Probability on CCDF. (dB) −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 −110 −3.6 −2.9 −2.2 −1.5 −0.7 0 0.7 1.5 2.2 2.9 3.6 1.2288 MHz Channel BW .. ... ..... . .. .............................. ............ ............. . . .. . . . . . . . . . . . . . . . . . . −ALT1 in 30 kHz +ALT1 in 30 kHz . . . . Integrated BW Integrated BW .... . . . ............ ........... ...... .... ........ ..... ... . ....... ....... .. ... ....... . .... .... .. . . .. ......... ......... ... . ..... ...... ....... .. ..... . ..... ... ... . .... .... . ..... .... . ..... . .... ......... . .. .. . ...... .... ....... .. ........ −ACPR in 30 kHz +ACPR in 30 kHz .............. . . .. . . ... .... .......... ..... . ............... . ......... .... ........... Integrated BW Integrated BW .. ...... ............ . . ...... ... . .. .. ...... ....... ... Figure 14. Single - Carrier CCDF N - CDMA f, FREQUENCY (MHz) Figure 15. Single - Carrier N - CDMA Spectrum MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 9 LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 LIFETIME BUY f = 900 MHz Zload f = 860 MHz Zo = 5 Ω LIFETIME BUY f = 900 MHz Zsource f = 860 MHz VDD = 28 Vdc, IDQ = 950 mA, Pout = 27 W Avg. f MHz 860 865 870 875 880 885 890 895 900 Zsource Ω 0.62 - j2.13 0.64 - j2.31 0.62 - j2.45 0.59 - j2.43 0.57 - j2.42 0.54 - j2.36 0.57 - j2.18 0.58 - j1.94 0.59 - j1.86 Zload Ω 1.48 - j0.14 1.56 - j0.09 1.66 - j0.02 1.73 + j0.04 1.74 + j0.11 1.68 + j0.19 1.61 + j0.25 1.52 + j0.33 1.48 + j0.37 Zsource = Test circuit impedance as measured from gate to ground. Zload = Test circuit impedance as measured from drain to ground. Device Under Test Output Matching Network Input Matching Network Z source Z load Figure 16. Series Equivalent Source and Load Impedance MRF6S9125NR1 MRF6S9125NBR1 10 RF Device Data Freescale Semiconductor LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 EDGE CHARACTERIZATION L1 VBIAS + C21 RF INPUT + C1 + C2 C3 R1 Z8 Z1 C4 C5 C6 C7 Z2 Z3 Z4 Z5 Z6 C8 Z7 C9 DUT C11 C12 C13 C14 L2 C10 Z9 Z10 Z11 Z12 Z13 Z14 C16 C17 + C18 + C19 + C20 VSUPPLY RF OUTPUT Z15 C15 LIFETIME BUY Z1, Z15 Z2 Z3 Z4 Z5 Z6 Z7, Z8 0.150″ 1.050″ 0.330″ 0.220″ 0.420″ 0.200″ 0.040″ x 0.080″ x 0.080″ x 0.220″ x 0.100″ x 0.100″ x 0.620″ x 0.620″ Microstrip Microstrip Microstrip x 0.420″ Taper x 0.620″ Taper Microstrip Microstrip Z9 Z10 Z11 Z12 Z13 Z14 PCB 0.620″ x 0.100″ x 0.420″ Taper 0.420″ x 0.100″ x 0.220″ Taper 0.325″ x 0.220″ Microstrip 0.040″ x 0.220″ Microstrip 0.475″ x 0.080″ Microstrip 0.400″ x 0.080″ Microstrip Arlon CuClad 250GX - 0300 - 55 - 22, 0.030″, εr = 2.55 Figure 17. MRF6S9125NR1(NBR1) Test Circuit Schematic Table 7. MRF6S9125NR1(NBR1) Test Circuit Component Designations and Values Part Description 47 μF, 16 V Tantalum Capacitors 0.56 μF, 50 V Chip Capacitors 20 pF Chip Capacitor 6.2 pF Chip Capacitors 0.8 - 8.0 pF Variable Capacitors, Gigatrim 11 pF Chip Capacitors 5.1 pF Chip Capacitor 4.7 pF Chip Capacitor 0.3 pF Chip Capacitor 39 pF Chip Capacitor 22 μF, 35 V Tantalum Capacitors 470 μF, 63 V Electrolytic Capacitor 100 μF, 50 V Electrolytic Capacitor 7.15 nH Inductor 8 nH Inductor 15 Ω, 1/4 W Chip Resistor Part Number T491D476K016AT C1825C564J5GAC ATC100B200FT500XT ATC100B6R2BT500XT 27291SL ATC100B110FT500XT ATC100B5R1BT500XT ATC100B4R7BT500XT ATC700B0R3BT500XT ATC700B390FT500XT T491X226K035AT ESME630ELL471MK25S MCHT101M1HB - 1017 - RF 1606 - 7 A03T - 5 CRCW120615R0FKEA Manufacturer Kemet Kemet ATC ATC Johanson Dielectrics ATC ATC ATC ATC ATC Kemet United Chemi - Con Multicomp Coilcraft Coilcraft Vishay C1, C2 C3, C16, C17 C4 C5, C7, C8 C6, C13 C9, C10 C11 C12 C14 C15 C18, C19 C20 C21 L1 L2 R1 MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 11 LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 EDGE CHARACTERIZATION C21 C1 C2 L1 C3 C17 C18 C19 C20 C16 C12 L2 CUT OUT AREA C4 C5 C7 C11 C9 C13 C14 900 MHz TO−272 WB Rev. 2 C15 R1 C8 C10 C6 Figure 18. MRF6S9125NR1(NBR1) Test Circuit Component Layout MRF6S9125NR1 MRF6S9125NBR1 12 RF Device Data Freescale Semiconductor LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 LIFETIME BUY EDGE CHARACTERIZATION EVM, ERROR VECTOR MAGNITUDE (% ms) EVM, ERROR VECTOR MAGNITUDE (% ms) 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 900 910 920 930 940 950 20 W Avg. 60 W Avg. VDD = 28 Vdc IDQ = 700 mA Pout = 70 W Avg. 15 VDD = 28 Vdc IDQ = 700 mA f = 943 MHz EDGE Modulation TC = 25_C EVM 60 75 9 ηD 6 45 30 3 0 1 10 100 Pout, OUTPUT POWER (WATTS) AVG. 15 0 300 960 970 980 990 f, FREQUENCY (MHz) LIFETIME BUY Figure 19. EVM versus Frequency Figure 20. EVM and Drain Efficiency versus Output Power SPECTRAL REGROWTH @ 400 kHz AND 600 kHz (dBc) −52.5 VDD = 28 Vdc, IDQ = 700 mA f = 943 MHz, EDGE Modulation SR @ 400 kHz Pout = 70 W Avg. −60 60 W Avg. −67.5 SR @ 600 kHz −75 −82.5 900 910 920 930 940 950 20 W Avg. 70 W Avg. 60 W Avg. 20 W Avg. 960 970 980 f, FREQUENCY (MHz) Figure 21. Spectral Regrowth at 400 kHz and 600 kHz versus Frequency −45 −53 SPECTRAL REGROWTH @ 600 kHz (dBc) VDD = 28 Vdc IDQ = 700 mA f = 943 MHz EDGE Modulation −56 −59 −62 −65 −68 −71 −74 −77 −80 −83 0 22.5 45 67.5 90 112.5 135 0 22.5 45 67.5 90 112.5 Pout, OUTPUT POWER (WATTS) Pout, OUTPUT POWER (WATTS) TC = 25_C VDD = 28 Vdc IDQ = 700 mA f = 943 MHz EDGE Modulation SPECTRAL REGROWTH @ 400 kHz (dBc) −48 −51 −54 −57 −60 −63 −66 −69 −72 −75 TC = 25_C 135 Figure 22. Spectral Regrowth at 400 kHz versus Output Power Figure 23. Spectral Regrowth at 600 kHz versus Output Power MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 13 ηD, DRAIN EFFICIENCY (%) 12 LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 EDGE CHARACTERIZATION TEST SIGNAL −10 −20 −30 −40 −50 (dB) −60 −70 −80 −90 −100 −110 Center 943 MHz 200 kHz Span 2 MHz 400 kHz 600 kHz 400 kHz 600 kHz Reference Power LIFETIME BUY Figure 24. EDGE Spectrum MRF6S9125NR1 MRF6S9125NBR1 14 RF Device Data Freescale Semiconductor LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 VBW = 30 kHz Sweep Time = 70 ms RBW = 30 kHz f = 980 MHz f = 900 MHz Zo = 5 Ω f = 980 MHz Zsource f = 900 MHz VDD = 28 Vdc, IDQ = 700 mA, Pout = 60 W Avg. f MHz 900 905 910 915 920 925 930 935 940 945 950 955 960 965 970 975 980 Zsource W 1.04 - j2.65 1.04 - j2.60 1.03 - j2.55 1.02 - j2.51 1.01 - j2.46 1.01 - j2.41 1.00 - j2.36 0.98 - j2.32 0.97 - j2.27 0.96 - j2.22 0.95 - j2.17 0.94 - j2.12 0.94 - j2.08 0.93 - j2.03 0.93 - j1.99 0.92 - j1.94 0.92 - j1.90 Zload W 1.66 - j0.56 1.66 - j0.50 1.67 - j0.43 1.68 - j0.37 1.68 - j0.31 1.69 - j0.24 1.70 - j0.18 1.70 - j0.12 1.71 - j0.05 1.72 - j0.00 1.73 + j0.07 1.74 + j0.14 1.76 + j0.20 1.77 + j0.26 1.79 + j0.32 1.80 + j0.39 1.82 + j0.45 Z source Z load Input Matching Network Device Under Test Output Matching Network Zsource = Test circuit impedance as measured from gate to ground. Zload = Test circuit impedance as measured from drain to ground. Figure 25. Series Equivalent Source and Load Impedance for EDGE Characterization Tests MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 15 LAST ORDER 3 APR 08 LAST SHIP 1 OCT 08 Zload LIFETIME BUY PACKAGE DIMENSIONS MRF6S9125NR1 MRF6S9125NBR1 16 RF Device Data Freescale Semiconductor MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 17 MRF6S9125NR1 MRF6S9125NBR1 18 RF Device Data Freescale Semiconductor MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 19 MRF6S9125NR1 MRF6S9125NBR1 20 RF Device Data Freescale Semiconductor MRF6S9125NR1 MRF6S9125NBR1 RF Device Data Freescale Semiconductor 21 PRODUCT DOCUMENTATION Refer to the following documents to aid your design process. Application Notes • AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages • AN1955: Thermal Measurement Methodology of RF Power Amplifiers • AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over - Molded Plastic Packages Engineering Bulletins • EB212: Using Data Sheet Impedances for RF LDMOS Devices REVISION HISTORY The following table summarizes revisions to this document. Revision 5 Date Aug. 2008 Description • Listed replacement part and Device Migration notification reference number, p. 1 • Removed Total Device Dissipation from Max Ratings table as data was redundant (information already provided in Thermal Characteristics table), p. 1 • Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150°C, p. 1 • Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table, related “Continuous use at maximum temperature will affect MTTF” footnote added and changed 200°C to 225°C in Capable Plastic Package bullet, p. 1 • Corrected VDS to VDD in the RF test condition voltage callout for VGS(Q), and added “Measured in Functional Test”, On Characteristics table, p. 2 • Removed Forward Transconductance from On Characteristics table as it no longer provided usable information, p. 2 • Updated PCB information to show more specific material details, Figs. 1, 17, Test Circuit Schematic, p. 4, 11 • Updated Part Numbers in Tables 6, 7, Component Designations and Values, to latest RoHS compliant part numbers, p. 4, 11 • Adjusted scale for Fig. 8, Intermodulation Distortion Products versus Tone Spacing, p. 7 • Removed lower voltage tests from Fig. 12, Power Gain versus Output Power, due to fixed tuned fixture limitations, p. 8 • Replaced Fig. 13, MTTF versus Junction Temperature with updated graph. Removed Amps2 and listed operating characteristics and location of MTTF calculator for device, p. 8 • Replaced Case Outline 1486 - 03, Issue C, with 1486 - 03, Issue D, p. 16 - 18. Added pin numbers 1 through 4 on Sheet 1. • Replaced Case Outline 1484 - 04, Issue D, with 1484 - 04, Issue E, p. 19 - 21. Added pin numbers 1 through 4 on Sheet 1, replacing Gate and Drain notations with Pin 1 and Pin 2 designations. • Added Product Documentation and Revision History, p. 22 MRF6S9125NR1 MRF6S9125NBR1 22 RF Device Data Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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