MRFIC0970

Freescale Semiconductor, Inc. Technical Data MRFIC0970/D Rev. 0, 07/2002 3.2 V GSM GaAs Integrated Power Amplifier MRFIC0970 (Scale 2:1) Package Information Plastic Package Case 1308 (QFN-20) Freescale Semiconductor, Inc... Ordering Information Device MRFIC0970 Marking 0970 Package QFN-20 The MRFIC0970 is a single supply, RF power amplifier designed for the 2.0 W GSM900 handheld radios. The device is packaged in the QFN-20 package, with exposed backside pad, which allows excellent electrical and thermal performance through a solderable contact. • Target 3.2 V Characteristics: RF Output Power: 34.5 dBm Typical Efficiency: 50% Typical Single Positive Supply Solution Available in Tape and Reel only. R2 Suffix = 2500 Units per 12 mm, 13 inch Reel • • Definitive Data: Motorola reserves the right to change the Production detail specifications as may be required to permit improvements in the design of its product. © Motorola, Inc., 2002. All rights reserved. For More Information On This Product, Go to: www.freescale.com Electrical Characteristics Freescale Semiconductor, Inc. D1 D2 RFin (G1) D3 VG1,2 ABC1,2 VGG1,2 ABC ABC3 VGG3 VG3 GND Freescale Semiconductor, Inc... Vref Figure 1. Functional Block Diagram 1 Electrical Characteristics Table 1. Maximum Ratings Rating Supply Voltage Symbol VD1,2,3, Vabc Vref Pin Pout TC Tstg TJ Value 8.0 5.0 15 38 -40 to 85 -40 to 85 150 Unit V V dBm dBm °C °C °C RF Input Power RF Output Power Operating Case Temperature Range Storage Temperature Range Junction Temperature NOTES: 1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics or Recommended Operating Conditions tables. 2 ESD (electrostatic discharge) immunity meets Human Body Model (HBM) ≤250 V and Machine Model (MM) ≤60 V. This device is rated Moisture Sensitivity Level (MSL) 1. Additional ESD data available upon request. Table 2. Recommended Operating Conditions Characteristic Supply Voltage Symbol VD1,2,3 Vabc Vref Pin Min 2.8 0 0.04 5.0 Typ Max 5.5 5.5 1.8 10 Unit Vdc V V dBm Input Power 2 MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com MOTOROLA Freescale Semiconductor, Inc.lectrical Characteristics E Table 3. Electrical Specifications (VD1,2,3 = 3.2 V, Vabc = 2.6 V, Pin = 5.0 dBm, Peak measurement at 12.5% duty cycle, 4.6 ms period, TA = 25°C, unless otherwise noted.) Characteristic Frequency Range Output Power Power Added Efficiency Minimum Output Power (Vref = 0.04, Vabc = 2.6 V) Power Control Slope (Vref = 0.1 to 1.8 V, ∆Vref = 0.01 V) Symbol BW Pout PAE Min 880 34.5 50 Typ Max 915 -17 50:1 Unit MHz dBm % dBm RFVrms /Vref -36 dBm Freescale Semiconductor, Inc... Bleed thru Power (Pin(fo) ≤ -12dBm, Vref = 0.04, Vabc = 10 k load) RF Leakage Current (IDD1 + IDD2 +IDD3, Pin (fo) ≤5.0 dBm) (Vabc = 10 k load, Vref = 0.04 V) Output Power Switching Speed (± step input of Vref RF Pout within 1.0 dB of final value) Input Return Loss Noise Power in Rx band 925 to 935 MHz 935 to 960 MHz Stability-Spurious Output (Load VSWR 6:1 all phase angles, Adjust VD1, 2&3 for specified power) Load Mismatch Stress (Load VSWR = 10:1 all phase angles, 5 seconds, Adjust VD1, 2&3 for specified power) |S11| NP - - 35 mA - - 1.0 µs dB dBm - - 6.0 Pspur - - -73 -85 -30 dBc No Degradation in Output Power Before & After Test MOTOROLA MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com 3 Pin Connections Freescale Semiconductor, Inc. 2 Pin Connections D1 20 D2 1 N.C. 2 N.C. 3 N.C. 4 N.C. 5 6 7 8 9 10 S1/ RFin N.C. GND N.C. (G1) 19 18 17 16 15 VG1,2 14 VGG1,2 13 ABC 12 VGG3 11 VG3 Freescale Semiconductor, Inc... D3/ D3/ D3/ D3/ N.C. RF RF RF RF OUT OUT OUT OUT Figure 2. Pin Connections 3 Typical Performance Characteristics 35.6 Pout, OUTPUT POWER (dBm) 35.4 35.2 35 34.8 34.6 34.4 34.2 880 TA = -40°C 25°C Pin = 5.0 dBm VDD = 3.2 V Vref = 1.8 V 85°C 885 890 895 900 905 f, FREQUENCY (MHz) 910 915 Figure 3. Output Power versus Frequency 4 MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com MOTOROLA Freescale Semiconductor, Inc. Typical Performance Characteristics 38 37.5 Pout, OUTPUT POWER (dBm) VDD = 5.5 V Pin = 5.0 dBm TA = 25°C Vref = 1.8 V 3.2 V 37 36.5 36 35.5 35 34.5 34 33.5 880 885 890 2.8 V 895 900 905 f, FREQUNCY (MHz) 910 915 Figure 4. Output Power versus Frequency Freescale Semiconductor, Inc... 65 PAE, POWER ADDED EFFICIENCY (%) 60 TA = -40°C 25°C 55 Pin = 5.0 dBm VDD = 3.2 V Vref = 1.8 V 885 890 895 900 905 f, FREQUENCY (MHz) 85°C 50 45 880 910 915 Figure 5. Power Added Efficiency versus Frequency 65 PAE, POWER ADDED EFFICIENCY (%) 60 55 50 45 40 35 880 Pin = 5.0 dBm TA = 25°C Vref = 1.8 V VDD = 2.8 V 3.2 V 5.5 V 885 890 895 900 905 f, FREQUENCY (MHz) 910 915 Figure 6. Power Added Efficiency versus Frequency MOTOROLA MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com 5 Application Schematic Freescale Semiconductor, Inc. 4 Application Schematic VDD1 1.0 µF Ferrite Bead 120 Ω 0.1 µF 1.0 nF T2 20 19 18 100 pF T3 17 N.C. 16 15 14 13 12 11 7 8 9 N.C. 10 1.0 nF 1.0 nF 1.0 nF 1.0 nF 0.1 µF 680 0.1 µF 240 VG3 VG1,2 Vref ABC 12 470 RF In 470 Freescale Semiconductor, Inc... 1.0 nF 4700 pF 2.7 39 pF 0.01 µF VDD2 T1 1 2 N.C. 3 N.C. 4 N.C. 5 N.C. 6 T1 = .100 in, Zo = 50 Ω T2 = .275 in, Zo = 50 Ω T3 = .166 in, Zo = 50 Ω T4 = .041 in, Zo = 50 Ω T5 = .420 in, Zo = 50 Ω T4 12.55 nH Coilcraft 1601-10 27 pF VDD3 1.0 nF T5 4700 pF 6.8 pF RF Out 0.1 µF 47 µF Figure 7. Application Schematic 6 MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com MOTOROLA Freescale Semiconductor, Inc. Packaging 5 Packaging PIN 1 INDEX AREA 0.1 C 2X A 0.1 C 2X 4 M 0.1 C G 1.0 0.8 1.00 0.75 (0.24) 0.05 0.00 M (0.5) C DETAIL G VIEW ROTATED 90 CLOCKWISE SEATING PLANE 0.05 C 5 4 B Freescale Semiconductor, Inc... 0.1 C A B 16 2.25 1.95 20 DETAIL M PIN 1 INDEX EXPOSED DIE ATTACH PAD 15 1 2.25 1.95 0.1 C A B 11 5 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE IS: HF-PQFP-N. 4. CORNER CHAMFER MAY NOT BE PRESENT. DIMENSIONS OF OPTIONAL FEATURES ARE FOR REFERENCE ONLY. 5. COPLANARITY APPLIES TO LEADS, CORNER LEADS, AND DIE ATTACH PAD. 7. FOR ANVIL SINGULATED QFN PACKAGES, MAXIMUM DRAFT ANGLE IS 12 . 0.5 N 16X 10 6 20X 0.75 0.50 VIEW M-M 20X 0.30 0.18 0.1 0.05 M M CAB C (45 ) (1.19) 0.60 0.24 0.60 0.24 DETAIL N CORNER CONFIGURATION OPTION 20X 0.065 0.015 (0.27) DETAIL N PREFERRED CORNER CONFIGURATION 4 1.1 1.0 0.475 0.425 2X 0.39 0.31 4 DETAIL T BACKSIDE PIN 1 INDEX (90 ) 0.25 R 0.15 DETAIL M PREFERRED BACKSIDE PIN 1 INDEX 2X 0.1 0.0 DETAIL M BACKSIDE PIN 1 INDEX OPTION DETAIL T PREFERRED BACKSIDE PIN 1 INDEX Figure 8. Outline Dimensions for QFN-20 (Case 1308-02, Issue C) MOTOROLA MRFIC0970 Technical Data For More Information On This Product, Go to: www.freescale.com 7 Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution; P.O. 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All other product or service names are the property of their respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. © Motorola, Inc. 2002 MRFIC0970/D For More Information On This Product, Go to: www.freescale.com