MZ5004GW

Pressure Freescale Semiconductor Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPxx5004 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. MPXV5004G Rev 12, 09/2009 MPXV5004 MPVZ5004 Series 0 to 3.92 kPa (0 to 400 mm H2O) 1.0 to 4.9 V Output Application Examples • Washing Machine Water Level • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Appliance Liquid Level and Pressure Measurement • Respiratory Equipment Features • • • • • • 1.5% Maximum Error for 0 to 100 mm H2O over +10° to +60°C with Auto Zero 2.5% Maximum Error for 100 to 400 mm H2O over +10° to +60°C with Auto Zero 6.25% Maximum Error for 0 to 400 mm H2O over +10° to +60°C without Auto Zero Temperature Compensated over 10° to 60°C Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations Durable Thermoplastic (PPS) Package ORDERING INFORMATION Device Name Case No. 1351 482A 482A 482C 1369 1369 1368 482 482 482B 482A 1735 1560 • • • • • • • • • • • • # of Ports None Single Dual • • • • • • • • • • • • • Gauge Pressure Type Differential • Absolute Device Marking MPXV5004DP MPXV5004G MPXV5004G MPXV5004G MPXV5004GP MPXV5004GP MPXV5004GVP MPVZ5004G MPVZ5004G MPVZ5004G MPVZ5004G MZ5004GW MZ5004GW Small Outline Package (MPXV5004 Series) MPXV5004DP MPXV5004GC6T1 MPXV5004GC6U MPXV5004GC7U MPXV5004GP MPXV5004GPT1 MPXV5004GVP MPVZ5004G6T1 MPVZ5004G6U MPVZ5004G7U MPVZ5004GC6U MPVZ5004GW6U MPVZ5004GW7U Small Outline Package (Media Resistant Gel) (MPVZ5004 Series) © Freescale Semiconductor, Inc., 2006-2009. All rights reserved. Pressure SMALL OUTLINE PACKAGES THROUGH-HOLE MPVZ5004G7U CASE 482B-03 MPXV5004GC7U CASE 482C-03 MPVZ5004GW7U CASE 1560-02 SMALL OUTLINE PACKAGES SURFACE MOUNT MPVZ5004G6U/6T1 CASE 482-01 MPXV5004G6U/6T1, MPVZ5004GC6U CASE 482A-01 MPXV5004DP CASE 1351-01 MPXV5004GVP CASE 1368-01 MPVZ5004GW6U CASE 1735-01 MPXV5004GP/GPT1 CASE 1369-01 MPXV5004G 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range Supply Voltage(1) Supply Current Span @ 306 mm H2O (3 Full Scale Span @ 400 mm H2O (3.92 kPa)(2) Offset(3) Sensitivity Accuracy (4) (5) 0 to 100 mm H2O (10 to 60°C) 100 to 400 mm H2O (10 to 60°C) 0 to 400 mm H2O (10 to 60°C 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Offset Stability:Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. TcSpan:Output deviation over the temperature range of 10 to 60°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ±5°C between autozero and measurement. kPa)(2) Symbol POP VS IS VFSS VOFF V/P — — — Min 0 4.75 — — — 0.75 — — — — Typ — 5.0 — 3.0 4.0 1.0 1.0 — — — Max 3.92 400 5.25 10 — — 1.25 — ±1.5 ±2.5 ±6.25 Units kPa mm H2O VDC mAdc V V V/kPa %VFSS with auto zero %VFSS with auto zero %VFSS without auto zero MPXV5004G Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 16 –30 to +100 0 to +85 Unit kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Sensing Element Thin Film Temperature Compensation and Calibration Circuitry Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT 3 GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device. Figure 1. Integrated Pressure Sensor Schematic On-chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPxx5004G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and Fluorosilicone Gel Die Coat P1 Wire Bond Thermoplastic Case qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MPxx5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Stainless Steel Cap Die Lead Frame P2 Differential Sensing Element Die Bond Figure 2. Cross-Sectional Diagram (Not to Scale) MPXV5004G 4 Sensors Freescale Semiconductor Pressure +5 V Vout Vs IPS 1.0 μF 0.01 μF GND OUTPUT 470 pF Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to AN1646.) 5.0 4.0 3.0 Output (V) TYPICAL Output (V) MAX 2.0 1.0 0 MIN TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 6.25% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C 5.0 4.0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C MAX 2.0 1.0 0 MIN 3.0 TYPICAL 0 1.0 2.0 Differential Pressure (kPa) 3.0 4.0 0 1.0 2.0 Differential Pressure (kPa) 3.0 4.0 Figure 4. Output vs. Pressure Differential at ±6.25% VFSS (without auto zero, Table 1., note 5) Figure 5. Output vs. Pressure Differential at ±2.5% VFSS (with auto zero, Table 1., note 5)) PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below. Pressure (P1) Side Identifier Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Stainless Steel Cap Stainless Steel Cap Stainless Steel Cap Vertical Port Attached Vertical Port Attached Part Number MPXV5004DP MPXV5004GC6U/6T1, MPVZ5004GC6U MPXV5004GC7U MPXV5004GP/GPT1 MPXV5004GVP MPVZ5004G6U/6T1 MPVZ5004G7U MPVZ5004GW6U MPVZ5004GW7U Case Type 1351 482A 482C 1369 1368 482 482B 1735 1560 MPXV5004G Sensors Freescale Semiconductor 5 Pressure INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 TYP 8X 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 6. SOP Footprint (Case 482) MPXV5004G 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS -A4 5 D 8 PL 0.25 (0.010) M TB S A S -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 S N C H -TPIN 1 IDENTIFIER SEATING PLANE J K M DIM A B C D G H J K M N S CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT -A4 5 D 8 PL 0.25 (0.010) M TB S A S N -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -TSEATING PLANE DIM A B C D G H J K M N S V W CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS –A– 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. S DIM A B C D G J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.210 0.220 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.405 0.415 0.540 0.560 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.33 5.59 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 10.29 10.54 13.72 14.22 –B– G 8 1 0.25 (0.010) S N M TB D 8 PL SA DETAIL X PIN 1 IDENTIFIER C –T– K M J DETAIL X SEATING PLANE CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE -A4 5 N -BG 8 1 0.25 (0.010) M TB D 8 PL S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. S DIM A B C D G J K M N S V W SEATING PLANE INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15˚ 0˚ 15˚ 0˚ 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115 DETAIL X S W V C PIN 1 IDENTIFIER -TK M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE MPXV5004G 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G 14 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G Sensors Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 1560-03 ISSUE C SMALL OUTLINE PACKAGE MPXV5004G 16 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPXV5004G Sensors Freescale Semiconductor 17 Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPXV5004G 18 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G Sensors Freescale Semiconductor 19 Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G 20 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G Sensors Freescale Semiconductor 21 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MPXV5004G Rev. 12 09/2009