DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.2
Document No.: FT_000816 Clearance No.: FTDI# 331
Future Technology Devices
International Ltd.
DS_FT312D
(USB Android Host IC)
The FT312D is a USB 2.0 Full Speed host IC
specifically targeted at providing access to
peripheral hardware from an Android platform with
a USB device port. The device will bridge the USB
port to a UART interface via the Android Open
Accessory protocol and has the following advanced
features:
Single chip USB to UART interface.
Entire USB protocol handled on the chip. No
USB specific firmware programming required.
Supports USB bulk transfer mode
Basic UART interface with RXD, TXD, RTS#,
CTS# pins.
TX_ACTIVE signal for controlling transceivers
on RS485 interfaces.
UART RX buffer size is 5512 bytes
UART TX buffer size is 256 bytes
USB_ERROR indicator pin
Suitable for use on any Android platform
supporting Android Open Accessory Mode
(Typically
3.1
onwards,
however
some
platforms may port Open Accessory Mode to
version 2.3.4)
12MHz oscillator using external crystal.
Integrated power-on-reset circuit.
+3V3Single Supply Operation with 5V tolerant
inputs.
USB 2.0 Full Speed compatible.
Extended operating temperature range; -40⁰C
to 85⁰C.
Available in compact Pb-free 32 Pin LQFP and
QFN packages (both RoHS compliant).
Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced
in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are
supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology
Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or fa ilure of this product. Your
statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in
which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary
information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by
the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow
G41 1HH United Kingdom. Scotland Registered Company Number: SC136640
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DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.2
Document No.: FT_000816 Clearance No.: FTDI# 331
1 Typical Applications
Connecting Android phones to USB accessories
Home automation via Android devices
Connecting Android tablets to USB accessories
Data logging from USB accessories
Controlling
devices.
Connecting serial printing devices to Android
devices
instrumentation
from
Android
1.1 Part Numbers
Part Number
FT312D-32Q1C-x
FT312D-32L1C-x
Package
32 Pin QFN
32 Pin LQFP
Note: Packing codes for x is:
- R: Taped and Reel, QFN 3,000pcs per reel, LQFP 1500 pcs per reel.
- (no suffix): Tray packing, 260pcs per tray QFN, 250 pcs per tray LQFP
For example: FT312D-32Q1C-R is 3,000pcs QFN taped and reel packing
1.2 USB Compliant
At the time of writing this datasheet, the FT312D had not completed the USB Compliancy Test.
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DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.2
Document No.: FT_000816 Clearance No.: FTDI# 331
2 FT312D Block Diagram
USB_ERROR#
TXD
RXD
USBDP
USBDM
USB
Transceiver
RTS#
USB Host
Buffer
UART
CTS#
TX_ACTIVE
Figure 2.1 FT312D Block Diagram
For a description of the function please refer to Section 4.
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DS_FT312D USB ANDROID HOST IC Datasheet
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Table of Contents
1
Typical Applications....................................................... 2
1.1
Part Numbers............................................................................. 2
1.2
USB Compliant ........................................................................... 2
2
FT312D Block Diagram .................................................. 3
3
Device Pin Out and Signal Description ........................... 6
3.1
Package Symbol ......................................................................... 6
3.1.1
4
Package Pin Out Description ......................................................................... 6
Function Description ..................................................... 8
4.1
Key Features .............................................................................. 8
4.2
Functional Block Descriptions .................................................... 8
4.2.1
UART Interface Module ................................................................................ 8
4.2.2
Buffers....................................................................................................... 8
4.2.3
USB Host ................................................................................................... 8
4.2.4
USB Transceivers ........................................................................................ 8
4.3
Default Descriptor Strings ......................................................... 8
5
UART Interface ............................................................ 10
6
USB Error Detection..................................................... 12
7
Absolute Maximum Ratings ......................................... 13
7.1
DC Characteristics .................................................................... 13
7.2
ESD and Latch-up Specifications .............................................. 14
8
Application Examples .................................................. 15
8.1
USB to UART Converter ............................................................ 15
8.2
USB to RS232 Converter .......................................................... 16
9
Package Parameters .................................................... 17
9.1
FT312D Package Markings ....................................................... 17
9.1.1
QFN-32 .................................................................................................... 17
9.1.2
LQFP-32 ................................................................................................... 18
9.2
FT312D Package Dimensions ................................................... 19
9.2.1
QFN-32 Package Dimensions ...................................................................... 19
9.2.2
LQFP-32 Package Dimensions ..................................................................... 20
9.3
Solder Reflow Profile ............................................................... 20
10 Contact Information .................................................... 22
Appendix A – References ................................................... 23
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Document References ...................................................................... 23
Useful utilities and examples firmware ............................................ 23
Appendix B - List of Figures and Tables ............................. 24
List of Figures .................................................................................. 24
List of Tables.................................................................................... 24
Appendix C - Revision History ............................................ 25
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DS_FT312D USB ANDROID HOST IC Datasheet
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3 Device Pin Out and Signal Description
9
10
12
13
11
NC
TEST0
RESET#
TEST2
8
7
6
5
4
3
2
1
33
32
26
25
31
TXD
RXD
RTS#
24
NC
NC
USB_ERROR#
GND
23
30
22
29
21
XTOUT
XTIN
AVCC
VCC
GND
FT312D
QFN 32
28
20
USBDP
USBDM
GND
NC
NC
VCCIO
27
19
TEST1
VREGOUT
GND
CTS#
GND
VCCIO
TX_ACTIVE
18
14
15
17
GND
GND
VCCIO
GND
16
3.1 Package Symbol
Figure 3.1QFN Schematic Symbol
Note 1: The pinout is the same for the QFN and LQFP packages.
Note 2: Pin 33 on the symbol is the copper pad in the centre of the QFN package
3.1.1
Package Pin Out Description
Note: # denotes an active low signal.
Pin No.
Name
2
VCC
3
AVCC
13, 22, 28
VCCIO
7
VREGOUT
1,6,14,15,16,19,27
GND
Type
Description
POWER
3V3 supply to IC internal 1V8 regulator
Input
POWER
1V8 supply to IC core
Input
POWER
3V3 supply for the IO cells
Input
POWER
1V8 output. May be used as input source for pin 3.
Output
POWER
0V Ground input.
Input
Table 3.1 Power and Ground
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Pin No.
Name
Type
Description
4
XTIN
INPUT
5
XTOUT
OUTPUT
8
TEST1
INPUT
For internal use. Pull to GND
9
TEST2
INPUT
For factory use. Pull to 3V3.
10
RESET#
INPUT
Reset input (active low).
11
TEST0
OUTPUT
12
NC
-
17
USBDP
INPUT/OUTPUT
USB Data Signal Plus.
18
USBDM
INPUT/OUTPUT
USB Data Signal Minus.
20
NC
-
No connect pins. Leave unterminated.
21
NC
-
No connect pins. Leave unterminated.
23
TXD
OUTPUT
24
RXD
INPUT
25
RTS#
OUTPUT
26
CTS#
INPUT
29
TX_ACTIVE
OUTPUT
30
NC
-
No connect pins. Leave un-terminated
31
NC
-
No connect pins. Leave un-terminated
32
USB_ERROR#
OUTPUT
Input to 12MHz Oscillator Cell. Connect 12MHz crystal
across pins 4 and 5.
Output from 12MHz Oscillator Cell. Connect 12MHz
crystal across pins 4 and 5.
Leave unterminated.
No connect pins. Leave unterminated.
Transmit asynchronous data output
Receive asynchronous data input
Request to send control output
Clear to send control input
UART active signal (typically used with RS485)
Output signal to indicate a problem with the USB
connection
Table 3.2 Function Pins
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DS_FT312D USB ANDROID HOST IC Datasheet
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4 Function Description
The FT312D is FTDI’s second dedicated Android Open Accessory Mode integrated circuit device or Android
Host. The FT312D USB host port is dedicated to support of the Android Open Accessory class and will
bridge data between this port and the UART interface.
4.1 Key Features
Easy to use Android Open Accessory IC translating the Device port of the Android device into UART
capabilities.
4.2 Functional Block Descriptions
The following paragraphs describe each function within FT312D. Please refer to the block diagram shown
in Figure 2.1.
4.2.1
UART Interface Module
The FT312DUART module controls the UART interface providing basic RXD, TXD signalling with
RTS#/CTS# hardware flow control. An additional TX_Active signal is supplied to control external RS485
transceivers for users wishing to create a USB to RS485 bridge. The UART supports baud rates from 300
baud to 921600 baud. A full description of the UART module is provided in Section 5.
4.2.2
Buffers
The FT312D provides internal buffering between the USB port and the UART port of the IC for smooth
data streaming.
The Android device can send NAK’s to the USB OUT token sent from the FT312D. This can happen when
the UART application on the Android is running in the background or multiple applications are launched in
the Android device. When the UART application on the Android device is not accepting data, the data will
be buffered in the UART RX buffer in FT312D. The UART RX buffer size is 5512 bytes.
The UART_TX buffer which stores data from the USB port, heading for the UART is 256 bytes.
4.2.3
USB Host
The USB Host block handles the parallel-to-serial and serial-to-parallel conversion of the USB physical
layer. This includes bit stuffing, CRC generation.
4.2.4
USB Transceivers
USB transceiver cells provide the physical USB device interface supporting USB 1.1 and USB 2.0
standards. Low-speed and full-speed USB data rates are supported. The output driver provides 3V3 level
slew rate control signalling, whilst a differential receiver and two single ended receivers provide USB
DATA IN, SE0 and USB Reset condition detection. These cells also include integrated internal pull-down
resistors as required for host mode.
4.3 Default Descriptor Strings
When the USB port is connected to the Android USB port, the Android platform will determine which
application to load based on the strings read from the FT312D. These strings are configurable with a
Windows utility: FT312D_Cofiguration available for download from the FTDI website. Please refer to the
application note AN_236 User Guide for FT312D Configuration to change the default string values.
Default values for the strings are set in the device as per Table 4.1.
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Descriptor String
Manufacturer
Model
Version
Serial
URL
Description
Default Value
FTDI
Android Accessory FT312D
1.0
FTDI FT312D
http://www.ftdichip.com/Android.htm
FTDI Android Accessory FT312D
Table 4.1 Default Descriptor Strings
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5 UART Interface
The interface implements a standard asynchronous serial UART port with flow control, for example
RS232/422/485. The UART can support baud rates from 300 to 921600 with RTS/CTS flow control. The
UART can support baud rates from 300 to 115200 with no flow control.
Data transfer uses NRZ (Non-Return to Zero) data format consisting of 1 start bit, 7 or 8 data bits, an
optional parity bit, and one or two stop bits. When transmitting the data bits, the least significant bit is
transmitted first. Transmit and receive waveforms are illustrated in Figure 5-1 and Figure 5-2.
Figure 5-1 UART Receive Waveform
Figure 5-2 UART Transmit Waveform
Baud rate (default =9600 baud), flow control settings (default = None), number of data bits (default=8),
parity (default is no parity) and number of stop bits (default=1) are all configurable from the Android
application. Please refer to FT31xD Android Programmers Guide for further details.
TX_ACTIVE is transmit enable, this output may be used in RS485 designs to enable the line driver for
transmit mode.
UART RX buffer size is 5512 bytes and UART TX buffer size is 256 bytes.
Note: UART software flow control with XON/XOFF is not supported
UART hardware flow control with DTR/DSR is not supported
Note:
The FT312D has to enumerate the Android device before receiving data from the UART device.
This can be implemented by disconnecting the UART TXD signal of external UART device connected to the
FT312D RXD signal until after the FT312D has established the USB link with Android device.
The connection sequence should be:
1. Connect FT312D to Android and complete enumeration.
2. Connect the TXD of UART device to FT312D’s RXD then start to receive data.
There are two methods to implement this function:
1. When FT312D connects to the Android device and enumeration is completed, the
USB_ERROR# will become Logic 0 (default Logic 1). This signal can be used to control the
TTL gate (74LVC2G241, 74LVC1G125 or others) ON/OFF such that the TXD/RXD lines are
connected/disconnected.
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Figure 5-3 UART RXD and TXD connection gated by Enumeration
If the UART device has an enable pin(active high enable) such as on the GPS module, the USB_ERROR#
can also be used. The USB_ERROR# pin may be inverted with an NPN BJT then connected to the enable
pin of the GPS module.
Figure 5-4 Inverting Gate Control signal to enable GPS module (active high enable)
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6 USB Error Detection
Pin 32 of the device is provided to indicate a problem has occurred with the USB connection. The errors
are USB device not supported, USB hub not supported and USB device not responding. USB device not
supported would occur if the USB port was connected to a non-Android class device port. E.g. The
FT312D is not designed to host memory sticks or printers etc. USB hub not supported would be reported
if FT312D is connected to a USB hub. USB device not responding would occur if the USB device connected
to the FT312D host port did not respond and the enumeration failed. The signal states are as follows:
Pin state
Logic 0
Logic 1
One 50ms logic 0 pulse
Two 50ms logic 0 pulses
Three 50ms logic 0 pulses
Definition
Device connected to USB and functional
Device not connected
Device not responding. This pulse occurs at plug-in
and then the signal returns to logic 1. This then
repeats every second.
Device not supported. These pulses occur at plugin and then the signal returns to logic 1. This then
repeats every second.
Hub not supported. These pulses occur at plug-in
and then the signal returns to logic 1. This then
repeats every second.
Table 6.1 Error Detection
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7 Absolute Maximum Ratings
The absolute maximum ratings for FT312D are shown in Table 7.1. These are in accordance with the
Absolute Maximum Rating System (IEC 60134). Exceeding these may cause permanent damage to the
device.
Parameter
Storage Temperature
Value
-65°C to 150°C
168 Hours
(IPC/JEDEC J-STD-033A MSL Level 3
Compliant)*
Floor Life (Out of Bag) At Factory Ambient
( 30°C / 60% Relative Humidity)
Ambient Temperature (Power Applied)
Hours
Degrees
C.
V
V
V
V
-40°C to 85°C
Vcc Supply Voltage
0 to +3.63
VCCIO
0 to +3.63
AVCC
0 to + 1.98
DC Input Voltage - USBDP and USBDM
-0.5 to +(Vcc +0.5)
DC Input Voltage - High Impedance
-0.5 to +5.00
Bidirectional
DC Input Voltage - All other Inputs
-0.5 to +(Vcc +0.5)
DC Output Current - Outputs
4
DC Output Current - Low Impedance
4
Bidirectional
Table 7.1 Absolute Maximum Ratings
*
Unit
Degrees C
V
V
mA
mA
If devices are stored out of the packaging beyond this time limit the devices should be baked before
use. The devices should be ramped up to a temperature of 125°C and baked for up to 17 hours.
7.1 DC Characteristics
DC Characteristics (Ambient Temperature -40˚C to +125˚C)
Parameter
Vcc1
Vcc2
AVCC
Icc1
Icc2
Description
Minimum
Typical
Maximum
VCC Operating Supply
2.97
3.3
3.63
Voltage
VCCIO Operating
2.97
3.3
3.63
Supply Voltage
VCC_PLL Operating
1.62
1.8
1.98
Supply Voltage
Operating Supply
Current
25
48MHz
Operating Supply
128
Current
Table 7.2 Operating Voltage and Current
Parameter
Description
Minimum
Voh
Output Voltage High
2.4
Vol
Output Voltage Low
Input Switching
1.5
Threshold
Table 7.3 I/O Pin Characteristics
Vin
Parameter
UVoh
UVol
UVse
Description
I/O Pins Static Output
( High)
I/O Pins Static Output
( Low )
Single Ended Rx
Threshold
Minimum
Typical
Maximum
Units
V
V
V
mA
Normal
Operation
µA
USB Suspend
Units
Conditions
I source =
8mA
I sink = 8mA
V
Typical
0.4
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V
V
Maximum
2.8
0.8
Conditions
Units
Conditions
V
0.3
V
2.0
V
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Parameter
UCom
UVdif
UDrvZ
Parameter
VCCK
VCC18IO
TJ
Iin
Ioz
Description
Minimum
Typical
Maximum
Units
Differential Common
0.8
2.5
V
Mode
Differential Input
0.2
V
Sensitivity
Driver Output
3
6
9
Ohms
Impedance
Table 7.4 USB I/O Pin (USBDP, USBDM) Characteristics
Conditions
Description
Power supply of
internal core cells and
I/O to core interface
Power supply of 1.8V
OSC pad
Operating junction
temperature
Minimum
Typical
Maximum
Units
Conditions
1.62
1.8
1.98
V
1.8V power
supply
1.62
1.8
1.98
V
1.8V power
supply
-40
25
125
°C
Input leakage current
-10
±1
10
µA
Tri-state output
-10
±1
10
leakage current
Table 7.5 Crystal Oscillator 1.8 Volts DC Characteristics
Iin= VCC18IO
or 0V
µA
7.2 ESD and Latch-up Specifications
Description
Specification
Human Body Mode (HBM)
± 2000V
Machine mode (MM)
± 200V
Charged Device Mode (CDM)
± 500V
Latch-up
> ± 200mA
Table 7.6 ESD and Latch-up Specifications
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8 Application Examples
The following sections illustrate possible applications of the FT312D.
8.1
USB to UART Converter
5V
3V3
3V3
REGULATOR
5V Power to USB
VCC
Ferrite
Bead
VCCIO
1
UART_TXD
TXD
RESET#
27R
2
USBDM
RXD
3
UART_RXD
USBDP
27R
4
RTS#
5
47pF
47pF
CTS#
MCU/FPGA
UART_RTS#
UART_CTS#
SHIELD
FT312D
UART_TX_ACTIVE
TX_ACTIVE
100nF
GND
GND
LED
AVCC
620R
3V3
GN
D
VREGOUT
3V3
100nF
USB_ERROR
+
4.7uF
100nF
GND
GND
Figure 8.1 Application Example showing USB to UART Converter
The UART signals are at 3V3 level and may be used to drive directly into a FPGA or MCU with a 3V3
interface, or could be level shifted with an RS232, RS422 or RS485 transceiver. The TX_ACTIVE signal is
used mostly with RS485 transceivers to enable the Transmit line drivers.
The unused pins may be left unterminated.
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8.2 USB to RS232 Converter
5V
3V3
3V3
REGULATOR
5V Power to USB
VCC
Ferrite
Bead
VCCIO
1
DB9
TXD
UART_TXD
3
TXD
RESET#
27R
2
USBDM
RXD
3
RXD
UART_RXD
2
USBDP
27R
4
RTS#
5
47pF
47pF
CTS#
RS232
LEVEL
CONVERTER
UART_RTS#
RTS
7
CTS
UART_CTS#
8
SHIELD
10
FT312D
5
TX_ACTIVE
100nF
GND
SHIELD
GND
AVCC
LED
620R
3V3
100nF
3V3
GN
D
VREGOUT
USB_ERROR
+
4.7uF
100nF
GND
GND
Figure 8.2 Application Example showing USB to RS232 Converter
An example of using the FT312D as a USB to RS232 converter is illustrated in Figure 8.2. In this
application, a TTL to RS232 Level Converter IC is used on the serial UART interface of the FT312D to
convert the TTL levels of the FT312D to RS232 levels. This level shift can be done using line drivers from
a variety of vendors e.g. Zywyn.
A suitable level shifting device is the Zywyn ZT3243F which is capable of RS232 communication at up to
1000k baud.
The unused pins may be left unterminated.
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9 Package Parameters
FT312D is available in RoHS Compliant packages, QFN package (32QFN) and an LQFP package (32LQFP).
The packages are lead (Pb) free and use a ‘green’ compound. The package is fully compliant with
European Union directive 2002/95/EC.
The mechanical drawings of the packages are shown in Sections 9.2 - all dimensions are in millimetres.
The solder reflow profile for all packages can be viewed in Section 9.3.
9.1 FT312D Package Markings
9.1.1
QFN-32
An example of the markings on the QFN package are shown in Figure 9-1. The FTDI part number is too
long for the 32 QFN package so in this case the last two digits are wrapped down onto the date code line.
FTDI
I
XXXXXXXX
FT312D-32Q
1C YYWW
32
Line 1 – FTDI Logo
Line 2 – Wafer Lot Number
Line 3 – FTDI Part Number
Line 4 – Revision and Date
Code
1
Figure 9-1QFN Package Markings
1C should be printed on line 4, then a space and then the Date Code.
1.
2.
3.
4.
YYWW = Date Code, where YY is year and WW is week number
Marking alignment should be centre justified
Laser Marking should be used
All marking dimensions should be marked proportionally. Marking font should be using Unisem
standard font (Roman Simplex)
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9.1.2
LQFP-32
An example of the markings on the LQFP package are shown in Figure 9-2.
FTD
I
XXXXXXXXXX
FT312D-32L
1C YYWW
32
Line 1 – FTDI Logo
Line 2 – Wafer Lot Number
Line 3 – FTDI Part Number
Line 4 – Revision, Date Code
1
Figure 9-2 LQFP Package Markings
Notes:
1. YYWW = Date Code, where YY is year and WW is week number
2. Marking alignment should be centre justified
3. Laser Marking should be used
4. All marking dimensions should be marked proportionally. Marking font should be using Unisem
standard font (Roman Simplex)
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9.2
9.2.1
FT312D Package Dimensions
QFN-32 Package Dimensions
Figure 9-3 QFN-32 Package Dimensions
Note 1: Dimensions are in mm
Note 2: The centre pad should be connected to the GND plane for improved thermal conduction and
noise immunity.
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9.2.2
LQFP-32 Package Dimensions
Figure 9-4 LQFP-32 Package Dimensions
Note: Dimensions are in mm
9.3 Solder Reflow Profile
Figure 9-5 All packages Reflow Solder Profile
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Profile Feature
Pb Free Solder
Process
(green material)
SnPb Eutectic and Pb free
(non green material) Solder
Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
217°C
- Temperature (TL)
60 to 150 seconds
- Time (tL)
Peak Temperature (Tp)
260°C
Time within 5°C of actual Peak
30 to 40 seconds
Temperature (tp)
Ramp Down Rate
6°C / second Max.
Time for T= 25°C to Peak Temperature,
8 minutes Max.
Tp
Table 9.1 Reflow Profile Parameter Values
183°C
60 to 150 seconds
see Figure 9-5
20 to 40 seconds
6°C / second Max.
6 minutes Max.
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0 deg C
220 +5/-0 deg C
≥ 2.5 mm
220 +5/-0 deg C
220 +5/-0 deg C
Pb Free (green material) = 260 +5/-0 deg C
Table 9.2 Package Reflow Peak Temperature
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DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.2
Document No.: FT_000816 Clearance No.: FTDI# 331
10
Contact Information
Head Office – Glasgow, UK
Branch Office – Oregon, USA
Future Technology Devices International Limited
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
Future Technology Devices International Limited (USA)
7130 SW Fir Loop
Tigard, OR 97223
USA
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
E-Mail (Sales)
E-Mail (Support)
E-Mail (General Enquiries)
sales1@ftdichip.com
support1@ftdichip.com
admin1@ftdichip.com
us.sales@ftdichip.com
us.support@ftdichip.com
us.admin@ftdichip.com
Branch Office – Shanghai, China
Branch Office – Taipei, Taiwan
Future Technology Devices International Limited
(Taiwan)
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan, R.O.C.
Tel: +886 (0) 2 8791 3570
Fax: +886 (0) 2 8791 3576
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
tw.sales1@ftdichip.com
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tw.admin1@ftdichip.com
Room 1103, No. 666 West Huaihai Road,
Shanghai, 200052
China
Tel: +86 21 62351596
Fax: +86 21 62351595
E-mail (Sales)
cn.sales@ftdichip.com
cn.support@ftdichip.com
E-mail (Support)
E-mail (General Enquiries)
cn.admin@ftdichip.com
Copyright © Future Technology Devices International Limited
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DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.2
Document No.: FT_000816 Clearance No.: FTDI# 331
Appendix A – References
Document References
WP 001 Connecting Peripherals to an Android Platform
FT31XD Android Programmers Guide
Useful utilities and examples firmware
http://www.ftdichip.com/Support/Utilities/FT312D_Configuration_V010000.zip
http://www.ftdichip.com/Support/SoftwareExamples/Android_Projects.htm
Copyright © Future Technology Devices International Limited
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DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.2
Document No.: FT_000816 Clearance No.: FTDI# 331
Appendix B - List of Figures and Tables
List of Figures
Figure 2.1 FT312D Block Diagram ................................................................................................... 3
Figure 3.1QFN Schematic Symbol ................................................................................................... 6
Figure 5-1 UART Receive Waveform .............................................................................................. 10
Figure 5-2 UART Transmit Waveform ............................................................................................ 10
Figure 5-3 UART RXD and TXD connection gated by Enumeration ..................................................... 11
Figure 5-4 Inverting Gate Control signal to enable GPS module (active high enable) ........................... 11
Figure 8.1 Application Example showing USB to UART Converter ...................................................... 15
Figure 8.2 Application Example showing USB to RS232 Converter ..................................................... 16
Figure 9-1QFN Package Markings .................................................................................................. 17
Figure 9-2 LQFP Package Markings ................................................................................................ 18
Figure 9-3 QFN-32 Package Dimensions ........................................................................................ 19
Figure 9-4 LQFP-32 Package Dimensions ....................................................................................... 20
Figure 9-5 All packages Reflow Solder Profile ................................................................................. 20
List of Tables
Table 3.1 Power and Ground .......................................................................................................... 6
Table 3.2 Function Pins.................................................................................................................. 7
Table 4.1 Default Descriptor Strings ................................................................................................ 9
Table 6.1 Error Detection ............................................................................................................. 12
Table 7.1 Absolute Maximum Ratings ............................................................................................ 13
Table 7.2 Operating Voltage and Current ....................................................................................... 13
Table 7.3 I/O Pin Characteristics ................................................................................................... 13
Table 7.4 USB I/O Pin (USBDP, USBDM) Characteristics .................................................................. 14
Table 7.5 Crystal Oscillator 1.8 Volts DC Characteristics .................................................................. 14
Table 7.6 ESD and Latch-up Specifications ..................................................................................... 14
Table 9.1 Reflow Profile Parameter Values ..................................................................................... 21
Table 9.2 Package Reflow Peak Temperature .................................................................................. 21
Copyright © Future Technology Devices International Limited
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DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.2
Document No.: FT_000816 Clearance No.: FTDI# 331
Appendix C - Revision History
Document Title:
USB Android Host IC DS_FT312D
Document Reference No.:
FT_000816
Clearance No.:
FTDI# 331
Product Page:
http://www.ftdichip.com/FTProducts.htm
Document Feedback:
Send Feedback
Revision
Changes
Date
Version 1.0
Initial Datasheet Created
2013-02-01
Version 1.1
Note added on USB enumeration to
be completed before receiving data
in RXD
Version 1.2
Updated Figure 9-3 and Figure 9-4
package dimensions
Copyright © Future Technology Devices International Limited
2013-11-15
2019-05-27
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