FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
Future Technology Devices
International Ltd.
FT900/1/2/3
(Embedded Microcontroller)
The FT90x series includes the FT900,
FT901, FT902 and FT903 which are
complete System-On-Chip 32-bit RISC
microcontrollers
for
embedded
applications featuring a high level of
integration
and
low
power
consumption. It has the following
features:
Two SPI slaves support single data transfer
with 25MHz clock.
Two I2C bus interfaces can be configured as
master or slave, which support standard / fast
/ fast plus / high speed mode data transfers.
Max data transfer rate up to 3.4 Mbit/s. Clock
stretching is supported.
I2S bus interface can be configured as master
or slave. Two clock input options (24.576 MHz
and 22.5792 MHz) to support I2S master mode
for different audio sample rates.
UART interface can be configured as one full
programmable UART0 or two simple interfaces,
UART0 and UART1 with CTS / RTS control
function.
High performance, low power 32-bit FT32 core
processor, running at a frequency of 100MHz.
256kB on-chip Flash memory.
256kB on-chip shadow program memory.
True Zero Wait States (0WS) up to 3.1 DMIPS
per MHz performance
Four user timers
watchdog function.
64kB on-chip data memory.
EFUSE for security configuration.
8-bit parallel data interface supports camera
data capturing.
Integrated Phase-Locked Loop (PLL) supports
external 12MHz crystal and direct external clock
source input.
Support 7 independent PWM channels. Channel
0 and 1 can be configured as PCM 8-bit/16-bit
stereo audio output.
32.768 kHz real time clock support.
One USB2.0 EHCI compatible host controller
supports high-speed (480 Mbit/s), full-speed
(12 Mbit/s), and low-speed (1.5 Mbit/s).
SD host controller is compatible to standard
specification V3.0, it supports up to 25 MHz SD
clock speed and software supports SD card
format in SD/SDHC/SDXC.
One USB2.0 peripheral controller supports highspeed (480 Mbit/s) and full-speed (12 Mbit/s).
Support two 10-bit DAC 0/1 channels output,
sample rate at ~1 MS/s.
USB2.0 host and peripheral controllers support
the Isochronous, Interrupt, Control, and Bulk
transfers.
Support seven 10-bit ADC 1/7 channels input,
sample rate is up to ~960 kS/s.
Single 3.3 volt power supply, built-in 1.2 V
regulators.
3.3 volt I/O power supply.
Support USB Battery Charging Specification
Rev 1.2. Downstream port can be configured as
SDP, CDP or DCP. Upstream port can perform
BCD mode detection.
with
pre-scaling
and
a
10/100 Mbps Ethernet that is compliant with the
IEEE 802.3/802.3u standards. (FT900 and
FT901 only)
Supports One-Wire debugger for downloading
firmware to Flash memory or shadow program
memory, and supports a software debugger.
Two CAN controllers support CAN protocol 2.0
parts A & B, data rate is up to 1 Mbit/s. (FT900
and FT902 only)
Support VBUS
current control.
Power-On Reset (POR).
One SPI master supports single / dual / quad
modes of data transfer. Clock rate is up to 25
MHz
-40°C to 85°C extended operating temperature
range.
Available in compact Pb-free 100-Pin packages
(all RoHS compliant).
power
switching
Copyright © 2015 Future Technology Devices International Limited
and
over
1
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced
in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are
supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology
Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your
statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in
which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary
information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by
the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41
1HH United Kingdom. Scotland Registered Company Number: SC136640
Copyright © 2015 Future Technology Devices International Limited
2
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
1
Typical Applications
Home security system
CCTV monitor
Home Automation
Industrial automation
Embedded audio application
Medical appliances
Motor drive and application control
Instrumentation
E-meter
DAQ System
1.1
Part Numbers
Part Number
Package
FT900Q-X
100 Pin QFN, pitch 0.4mm, body 12mm x 12mm x 0.75mm, support both CAN
Bus and Ethernet features.
FT900L-X
100 Pin LQFP, pitch 0.5mm, body 14mm x 14mm x 1.40mm, support both CAN
Bus and Ethernet features.
FT901Q-X
100 Pin QFN, pitch 0.4mm, body 12mm x 12mm x 0.75mm, support Ethernet,
doesn’t support CAN Bus.
FT901L-X
100 Pin LQFP, pitch 0.5mm, body 14mm x 14mm x 1.40mm, support Ethernet,
doesn’t support CAN Bus.
FT902Q-X
100 Pin QFN, pitch 0.4mm, body 12mm x 12mm x 0.75mm, support CAN Bus,
doesn’t support Ethernet.
FT902L-X
100 Pin LQFP, pitch 0.5mm, body 14mm x 14mm x 1.40mm, support CAN Bus,
doesn’t support Ethernet.
FT903Q-X
100 Pin QFN, pitch 0.4mm, body 12mm x 12mm x 0.75mm, doesn’t support
both CAN Bus and Ethernet features.
FT903L-X
100 Pin LQFP, pitch 0.5mm, body 14mm x 14mm x 1.40mm, doesn’t support
both CAN Bus and Ethernet features.
Table 1-1 FT90x series Part Numbers
Common Interfaces on all packages include: USB Host, USB Peripheral, SPI, UART, ADC, DAC, I2S, PWM,
RTC, Timers/Watchdog, Interrupt Controller.
Note: Packaging codes for X is:
-R: Tape and Reel (Qty per reel is 1000)
-T: Tray packing (Qty per tray for LQFP is 90, qty per tray for QFN is 152)
1.2
USB2.0 Compliant
The FT90x series contains a USB2.0 host controller and peripheral controller that both are compliant with
USB2.0 specification.
Copyright © 2015 Future Technology Devices International Limited
3
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
2
FT900 Block Diagram
Figure 2-1 FT900 Block Diagram
For a description of each function please refer to Section 5.
Copyright © 2015 Future Technology Devices International Limited
4
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
Table of Contents
1
Typical Applications ...................................................................... 3
1.1
Part Numbers...................................................................................... 3
1.2
USB2.0 Compliant ............................................................................... 3
2
FT900 Block Diagram.................................................................... 4
3
Device Pin Out and Signal Description .......................................... 8
3.1
Pin Out – FT900 QFN-100 .................................................................. 8
3.2
Pin Out – FT900 LQFP-100 ............................................................... 12
3.3
Pin Description ................................................................................. 16
4
Function Description................................................................... 25
4.1
Architectural Overview ..................................................................... 25
4.2
FT32 Core Processor ......................................................................... 25
4.3
256kB Flash Memory......................................................................... 25
4.4
Boot Sequence .................................................................................. 25
4.5
Interrupt........................................................................................... 26
4.6
Memory Mapping .............................................................................. 27
4.7
USB2.0 Host Controller ..................................................................... 28
4.7.1
4.8
Features: .................................................................................................................. 28
USB2.0 Peripheral Contoller.............................................................. 29
4.8.1
4.9
Features: .................................................................................................................. 29
Ethernet Controller ........................................................................... 29
4.9.1
4.10
Features: .................................................................................................................. 29
CAN Bus Controller ......................................................................... 29
4.10.1
4.11
Features: .............................................................................................................. 30
Real Time Clock .............................................................................. 30
4.11.1
4.12
Features: .............................................................................................................. 30
One-Wire Debugger Interface ........................................................ 30
4.12.1
4.13
Features: .............................................................................................................. 30
SPI Interface ................................................................................. 30
4.13.1
4.14
Features: .............................................................................................................. 30
I2C Interface .................................................................................. 31
4.14.1
4.15
Features: .............................................................................................................. 31
UART Interface .............................................................................. 31
4.15.1
4.16
Features: .............................................................................................................. 31
Timers and Watchdog Timer .......................................................... 32
4.16.1
4.17
Features: .............................................................................................................. 32
2
I S Interface .................................................................................. 32
Copyright © 2015 Future Technology Devices International Limited
5
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
4.17.1
4.18
Features: .............................................................................................................. 32
Camera Parallel Interface (Data Capture) ...................................... 32
4.18.1
4.19
Features: .............................................................................................................. 33
PWM............................................................................................... 33
4.19.1
4.20
Features: .............................................................................................................. 33
SD host controller .......................................................................... 33
4.20.1
4.21
Features: .............................................................................................................. 33
Analog to Digital Converter (ADC) ................................................. 34
4.21.1
4.22
Features: .............................................................................................................. 34
Digital to Analog Converter (DAC) ................................................. 34
4.22.1
4.23
Features: .............................................................................................................. 34
General Purpose Input Output ....................................................... 34
4.23.1
4.24
Features: .............................................................................................................. 34
System Clocks ................................................................................ 35
4.24.1
12 MHz Oscillator ................................................................................................... 35
4.24.2
Phase Locked Loop ................................................................................................ 35
4.24.3
32.768 KHz RTC Oscillator ....................................................................................... 35
4.24.4
Internal Slow Clock Oscillator................................................................................... 35
4.25
Power Management ....................................................................... 35
4.25.1
Power Supply ......................................................................................................... 35
4.25.2
Power Down Mode .................................................................................................. 36
5
Devices Characteristics and Ratings ........................................... 37
5.1
Absolute Maximum Ratings............................................................... 37
5.2
DC Characteristics............................................................................. 38
5.3
AC Characteristics ............................................................................. 43
6
Application Information ............................................................. 53
6.1
Crystal Oscillator .............................................................................. 53
6.1.1
Crystal oscillator application circuit .............................................................................. 53
6.1.2
External clock input.................................................................................................... 53
6.2
RTC Oscillator ................................................................................... 53
6.3
Standard I/O Pin Configuration ........................................................ 54
6.4
USB2.0 Peripheral and Host Interface .............................................. 55
6.5
10/100 Mb/s Ethernet Interface ...................................................... 56
6.6
Ethernet Connection when Unused (FT900 & FT901) ........................ 57
6.7
USB Connection when Unused (FT900_1_2_3) ................................. 58
7
Package Parameters ................................................................... 59
7.1
QFN-100 Package Dimensions .......................................................... 59
7.2
QFN-100 Device Marking .................................................................. 60
7.2.1
FT90XQ Top Side ....................................................................................................... 60
Copyright © 2015 Future Technology Devices International Limited
6
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
7.3
LQFP-100 Package Dimensions ......................................................... 61
7.4
LQFP-100 Device Marking ................................................................. 62
7.4.1
7.5
FT90XL Top Side ........................................................................................................ 62
Solder Reflow Profile ........................................................................ 63
8
Abbreviations ............................................................................. 64
9
FTDI Chip Contact Information ................................................... 66
Appendix A – References ........................................................................... 67
Appendix B - List of Figures and Tables ..................................................... 67
Appendix C - Revision History .................................................................... 69
Copyright © 2015 Future Technology Devices International Limited
7
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
VETH3V3
EREFSET
VOUT2
VETH3V3
78
77
76
RXIP
80
79
TXOP
RXIN
81
83
82
RTC_XIO
TXON
84
NC
ADC1/CAM_XCLK/GPIO6
87
RTC_XI/RTC_CLKIN
ADC2/CAM_PCLK/GPIO7
88
85
ADC3/CAM_VD/GPIO8
89
86
ADC5/CAM_D7/GPIO10
ADC4/CAM_HD/GPIO9
90
ADC6/CAM_D6/GPIO11
92
91
AGND
ADC7/CAM_D5/GPIO12
93
VCC3V3A
95
94
DAC1/CAM_D4/GPIO13
DAC_REFP
98
96
DAC0/CAM_D3/GPIO14
99
97
CAN0_RXD/CAM_D1/GPIO16
CAN0_TXD/CAM_D2/GPIO15
100
Pin Out – FT900 QFN-100
CAN1_TXD/CAM_D0/GPIO17
CAN1_RXD/GPIO18
SD_CLK/GPIO19
SD_CMD/GPIO20
SD_DATA3/GPIO21
1
2
3
75
4
5
72
H_DM
71
DRREF
SD_DATA2/GPIO22
SD_DATA1/GPIO23
6
70
D_DP
SD_DATA0/GPIO24
SD_CD/GPIO25
D_DM
8
69
68
VUSB3V3
67
VCC1V2
66
XIO
XI/CLKIN
FTDI
7
9
SD_WP/GPIO26
10
SPIM_CLK/GPIO27
SPIM_SS0/GPIO28
11
SPIM_MOSI/GPIO29
SPIM_MISO/GPIO30
13
SPIM_IO2/GPIO31
SPIM_IO3/GPIO32
15
XXXXXXXXXX
FT900Q
YYWW-X
12
14
16
SPIM_SS1/GPIO33
17
SPIM_SS2/GPIO34
18
AGND
73
H_DP
65
64
VCCIO3V3
63
VOUT1
62
ENET_LED1/GPIO5
ENET_LED0/GPIO4
61
60
59
58
SPIM_SS3/GPIO35
19
20
56
SPIS0_SS/GPIO37
SPIS0_MOSI/GPIO38
21
55
22
54
SPIS0_MISO/GPIO39
23
SPIS1_CLK/GPIO40
24
SPIS1_SS/GPIO41
25
53
52
51
49
50
48
PWM1/GPIO57
PWM2/GPIO58
47
I2S_SDAO/GPIO60
46
VCCIO3V3
45
PWM0/GPIO56
44
GND
41
UART0_DTR/UART1_TXD/PWM4/GPIO52
UART0_RI/UART1_CTS/PWM7/GPIO55
40
UART0_CTS/GPIO51
42
39
UART0_RTS/GPIO50
43
38
UART0_DCD/UART1_RTS/PWM6/GPIO54
37
UART0_TXD/GPIO48
UART0_RXD/GPIO49
UART0_DSR/UART1_RXD/PWM5/GPIO53
36
33
VPP
DEBUG
32
FSOURCE
35
31
I2C1_SDA/GPIO47
34
30
I2C1_SCL/GPIO46
RESETN
29
STESTRESTN
28
I2C0_SCL/GPIO44
I2C0_SDA/GPIO45
57
27
HRREF
74
SPIS0_CLK/GPIO36
26
3.1
Device Pin Out and Signal Description
SPIS1_MOSI/GPIO42
SPIS1_MISO/GPIO43
3
VBUS_DTC/GPIO3
PSW_N/GPIO2
OC_N/GPIO1
VBUS_DISCHG/GPIO0
I2SM_CLK24/GPIO66
I2SM_CLK22/GPIO65
I2S_MCLK/GPIO64
I2S_LRCLK/GPIO63
I2S_BCLK/GPIO62
I2S_SDAI/GPIO61
Figure 3-1 Pin Configuration FT900Q (top-down view)
Copyright © 2015 Future Technology Devices International Limited
8
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
RXIP
VETH3V3
EREFSET
VOUT2
VETH3V3
80
79
78
77
76
TXOP
RXIN
82
81
RTC_XIO
TXON
84
83
87
NC
ADC1/CAM_XCLK/GPIO6
88
RTC_XI/RTC_CLKIN
ADC2/CAM_PCLK/GPIO7
89
85
ADC3/CAM_VD/GPIO8
90
86
ADC5/CAM_D7/GPIO10
ADC4/CAM_HD/GPIO9
91
ADC7/CAM_D5/GPIO12
ADC6/CAM_D6/GPIO11
93
92
VCC3V3A
AGND
95
94
DAC1/CAM_D4/GPIO13
DAC_REFP
98
96
DAC0/CAM_D3/GPIO14
99
97
CAM_D1/GPIO16
CAM_D2/GPIO15
100
Document No.: FT_000965 Clearance No.: FTDI#421
CAM_D0/GPIO17
GPIO18
SD_CLK/GPIO19
SD_CMD/GPIO20
SD_DATA3/GPIO21
1
2
3
75
4
5
72
H_DM
71
DRREF
SD_DATA2/GPIO22
SD_DATA1/GPIO23
6
70
D_DP
SD_DATA0/GPIO24
SD_CD/GPIO25
D_DM
8
69
FTDI
7
9
SD_WP/GPIO26
10
SPIM_CLK/GPIO27
SPIM_SS0/GPIO28
11
SPIM_MOSI/GPIO29
SPIM_MISO/GPIO30
13
SPIM_IO2/GPIO31
SPIM_IO3/GPIO32
15
SPIM_SS1/GPIO33
17
SPIM_SS2/GPIO34
18
XXXXXXXXXX
FT901Q
YYWW-X
12
14
16
AGND
73
H_DP
68
VUSB3V3
67
VCC1V2
66
XIO
XI/CLKIN
65
64
VCCIO3V3
63
VOUT1
62
ENET_LED1/GPIO5
ENET_LED0/GPIO4
61
60
59
58
SPIM_SS3/GPIO35
19
SPIS0_CLK/GPIO36
20
56
SPIS0_SS/GPIO37
SPIS0_MOSI/GPIO38
21
55
22
54
SPIS0_MISO/GPIO39
23
SPIS1_CLK/GPIO40
24
SPIS1_SS/GPIO41
25
53
52
51
48
49
50
PWM2/GPIO58
I2S_SDAO/GPIO60
47
PWM1/GPIO57
46
VCCIO3V3
45
GND
PWM0/GPIO56
44
UART0_RI/UART1_CTS/PWM7/GPIO55
41
UART0_DTR/UART1_TXD/PWM4/GPIO52
42
40
UART0_CTS/GPIO51
43
39
UART0_RTS/GPIO50
UART0_DCD/UART1_RTS/PWM6/GPIO54
38
UART0_DSR/UART1_RXD/PWM5/GPIO53
37
34
UART0_TXD/GPIO48
33
VPP
RESETN
UART0_RXD/GPIO49
32
FSOURCE
35
31
I2C1_SDA/GPIO47
36
30
I2C1_SCL/GPIO46
DEBUG
29
STESTRESTN
28
I2C0_SCL/GPIO44
I2C0_SDA/GPIO45
26
27
57
SPIS1_MOSI/GPIO42
SPIS1_MISO/GPIO43
HRREF
74
VBUS_DTC/GPIO3
PSW_N/GPIO2
OC_N/GPIO1
VBUS_DISCHG/GPIO0
I2SM_CLK24/GPIO66
I2SM_CLK22/GPIO65
I2S_MCLK/GPIO64
I2S_LRCLK/GPIO63
I2S_BCLK/GPIO62
I2S_SDAI/GPIO61
Figure 3-2 Pin Configuration FT901Q (top-down view)
Copyright © 2015 Future Technology Devices International Limited
9
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
NC
NC
NC
78
77
76
NC
81
NC
NC
82
NC
NC
83
79
RTC_XIO
84
80
NC
ADC1/CAM_XCLK/GPIO6
87
RTC_XI/RTC_CLKIN
ADC2/CAM_PCLK/GPIO7
88
85
ADC3/CAM_VD/GPIO8
89
86
ADC5/CAM_D7/GPIO10
92
ADC4/CAM_HD/GPIO9
ADC6/CAM_D6/GPIO11
93
90
ADC7/CAM_D5/GPIO12
94
91
VCC3V3A
AGND
95
DAC1/CAM_D4/GPIO13
DAC_REFP
98
96
DAC0/CAM_D3/GPIO14
99
97
CAN0_RXD/CAM_D1/GPIO16
CAN0_TXD/CAM_D2/GPIO15
100
Document No.: FT_000965 Clearance No.: FTDI#421
CAN1_TXD/CAM_D0/GPIO17
CAN1_RXD/GPIO18
SD_CLK/GPIO19
SD_CMD/GPIO20
SD_DATA3/GPIO21
1
2
3
75
4
5
72
H_DM
71
DRREF
SD_DATA2/GPIO22
SD_DATA1/GPIO23
6
70
D_DP
SD_DATA0/GPIO24
SD_CD/GPIO25
D_DM
8
69
68
VUSB3V3
67
VCC1V2
66
XIO
XI/CLKIN
FTDI
7
9
SD_WP/GPIO26
10
SPIM_CLK/GPIO27
SPIM_SS0/GPIO28
11
SPIM_MOSI/GPIO29
SPIM_MISO/GPIO30
13
SPIM_IO2/GPIO31
SPIM_IO3/GPIO32
15
XXXXXXXXXX
FT902Q
YYWW-X
12
14
16
AGND
73
H_DP
65
64
VCCIO3V3
63
VOUT1
62
GPIO5
GPIO4
61
60
SPIM_SS1/GPIO33
17
SPIM_SS2/GPIO34
18
SPIM_SS3/GPIO35
19
SPIS0_CLK/GPIO36
20
56
SPIS0_SS/GPIO37
SPIS0_MOSI/GPIO38
21
55
22
54
SPIS0_MISO/GPIO39
23
SPIS1_CLK/GPIO40
24
SPIS1_SS/GPIO41
25
53
52
51
59
58
48
49
50
PWM2/GPIO58
I2S_SDAO/GPIO60
41
UART0_DTR/UART1_TXD/PWM4/GPIO52
PWM1/GPIO57
40
UART0_CTS/GPIO51
47
39
UART0_RTS/GPIO50
PWM0/GPIO56
38
46
37
UART0_TXD/GPIO48
UART0_RXD/GPIO49
VCCIO3V3
36
DEBUG
45
35
STESTRESTN
GND
34
44
33
VPP
RESETN
UART0_RI/UART1_CTS/PWM7/GPIO55
32
FSOURCE
42
31
I2C1_SDA/GPIO47
43
30
I2C1_SCL/GPIO46
UART0_DCD/UART1_RTS/PWM6/GPIO54
29
UART0_DSR/UART1_RXD/PWM5/GPIO53
28
I2C0_SCL/GPIO44
I2C0_SDA/GPIO45
26
27
57
SPIS1_MOSI/GPIO42
SPIS1_MISO/GPIO43
HRREF
74
VBUS_DTC/GPIO3
PSW_N/GPIO2
OC_N/GPIO1
VBUS_DISCHG/GPIO0
I2SM_CLK24/GPIO66
I2SM_CLK22/GPIO65
I2S_MCLK/GPIO64
I2S_LRCLK/GPIO63
I2S_BCLK/GPIO62
I2S_SDAI/GPIO61
Figure 3-3 Pin Configuration FT902Q (top-down view)
Copyright © 2015 Future Technology Devices International Limited
10
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
NC
NC
NC
NC
79
78
77
76
NC
NC
81
80
NC
NC
82
RTC_XIO
84
83
NC
RTC_XI/RTC_CLKIN
ADC1/CAM_XCLK/GPIO6
85
ADC2/CAM_PCLK/GPIO7
88
87
86
ADC4/CAM_HD/GPIO9
ADC3/CAM_VD/GPIO8
90
89
ADC6/CAM_D6/GPIO11
ADC5/CAM_D7/GPIO10
92
91
AGND
ADC7/CAM_D5/GPIO12
93
VCC3V3A
95
94
DAC1/CAM_D4/GPIO13
DAC_REFP
98
96
DAC0/CAM_D3/GPIO14
99
97
CAM_D1/GPIO16
CAM_D2/GPIO15
100
Document No.: FT_000965 Clearance No.: FTDI#421
CAM_D0/GPIO17
GPIO18
SD_CLK/GPIO19
SD_CMD/GPIO20
SD_DATA3/GPIO21
1
2
3
75
4
5
72
H_DM
71
DRREF
SD_DATA2/GPIO22
SD_DATA1/GPIO23
6
70
D_DP
SD_DATA0/GPIO24
SD_CD/GPIO25
D_DM
8
69
FTDI
7
9
SD_WP/GPIO26
10
SPIM_CLK/GPIO27
SPIM_SS0/GPIO28
11
SPIM_MOSI/GPIO29
SPIM_MISO/GPIO30
13
SPIM_IO2/GPIO31
SPIM_IO3/GPIO32
15
SPIM_SS1/GPIO33
17
SPIM_SS2/GPIO34
18
XXXXXXXXXX
FT903Q
YYWW-X
12
14
16
AGND
73
H_DP
68
VUSB3V3
67
VCC1V2
66
65
XIO
XI/CLKIN
64
VCCIO3V3
63
VOUT1
62
GPIO5
GPIO4
61
60
59
58
SPIM_SS3/GPIO35
19
SPIS0_CLK/GPIO36
20
56
SPIS0_SS/GPIO37
SPIS0_MOSI/GPIO38
21
55
22
54
SPIS0_MISO/GPIO39
23
SPIS1_CLK/GPIO40
24
SPIS1_SS/GPIO41
25
53
52
51
49
50
48
PWM1/GPIO57
PWM2/GPIO58
47
PWM0/GPIO56
I2S_SDAO/GPIO60
45
46
GND
VCCIO3V3
44
41
UART0_DTR/UART1_TXD/PWM4/GPIO52
UART0_RI/UART1_CTS/PWM7/GPIO55
40
UART0_CTS/GPIO51
42
39
UART0_RTS/GPIO50
43
38
UART0_RXD/GPIO49
UART0_DCD/UART1_RTS/PWM6/GPIO54
37
UART0_DSR/UART1_RXD/PWM5/GPIO53
36
DEBUG
33
VPP
UART0_TXD/GPIO48
32
FSOURCE
35
31
I2C1_SDA/GPIO47
34
30
I2C1_SCL/GPIO46
RESETN
29
STESTRESTN
28
I2C0_SCL/GPIO44
I2C0_SDA/GPIO45
26
27
57
SPIS1_MOSI/GPIO42
SPIS1_MISO/GPIO43
HRREF
74
VBUS_DTC/GPIO3
PSW_N/GPIO2
OC_N/GPIO1
VBUS_DISCHG/GPIO0
I2SM_CLK24/GPIO66
I2SM_CLK22/GPIO65
I2S_MCLK/GPIO64
I2S_LRCLK/GPIO63
I2S_BCLK/GPIO62
I2S_SDAI/GPIO61
Figure 3-4 Pin Configuration FT903Q (top-down view)
Copyright © 2015 Future Technology Devices International Limited
11
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
VETH3V3
EREFSET
VOUT2
VETH3V3
77
76
RXI P
78
RXI N
81
80
79
TXON
TXOP
83
82
RTC_XI/ RTC_CLKI N
RTC_XI O
85
84
ADC1/ CAM_XCLK/ GPI O6
NC
86
ADC2/ CAM_PCLK/ GPI O7
88
87
ADC4/ CAM_HD/ GPI O9
ADC3/ CAM_VD/ GPI O8
89
ADC5/ CAM_D7/ GPI O10
91
90
AGND
ADC7/ CAM_D5/ GPI O12
VCC3V3A
94
ADC6/ CAM_D6/ GPI O11
DAC_REFP
95
92
DAC1/ CAM_D4/ GPI O13
97
96
93
CAN0_TXD/ CAM_D2/ GPI O15
DAC0/ CAM_D3/ GPI O14
98
CAN0_RXD/ CAM_D1/ GPI O16
99
Pin Out – FT900 LQFP-100
100
3.2
CAN1_TXD/CAM_D0/GPIO17
1
75
HRREF
CAN1_RXD/GPIO18
2
74
AGND
SD_CLK/GPIO19
3
73
H_DP
SD_CMD/GPIO20
4
72
H_DM
SD_DATA3/GPIO21
5
71
DRREF
SD_DATA2/GPIO22
6
70
D_DP
SD_DATA1/GPIO23
7
69
D_DM
SD_DATA0/GPIO24
8
68
VUSB3V3
SD_CD/GPIO25
9
67
VCC1V2
SD_WP/GPIO26
10
SPIM_CLK/GPIO27
11
SPIM_SS0/GPIO28
12
SPIM_MOSI/GPIO29
13
SPIM_MISO/GPIO30
14
SPIM_IO2/GPIO31
15
SPIM_IO3/GPIO32
16
SPIM_SS1/GPIO33
17
SPIM_SS2/GPIO34
SPIM_SS3/GPIO35
FTDI
XXXXXXXXXX
FT900L
YYWW-X
66
XIO
65
XI/CLKIN
64
VCCIO3V3
63
VOUT1
62
ENET_LED1/GPIO5
61
ENET_LED0/GPIO4
60
VBUS_DTC/GPIO3
59
PSW_N/GPIO2
18
58
OC_N/GPIO1
19
57
VBUS_ DISCHG/ GPIO0
SPIS0_CLK/GPIO36
20
56
I2SM_CLK24/GPIO66
45
46
47
48
49
50
GND
PWM0/ GPI O56
PWM1/ GPI O57
PWM2/ GPI O58
I2S_SDAO/ GPI O60
UART0_RI/ UART1_CTS/ PWM7/ GPI O55
VCCIO3V3
43
44
UART0_DCD/ UART1_RTS/ PWM6/ GPI O54
41
42
UART0_DTR/ UART1_TXD/ PWM4/ GPI O52
40
UART0_CTS/ GPI O51
UART0_DSR/ UART1_RXD/ PWM5/ GPI O53
38
39
UART0_RTS/ GPI O50
37
UART0_TXD/ GPI O48
UART0_RXD/ GPI O49
35
36
34
RESETN
DEBUG
33
VPP
STESTRESTN
32
FSOURCE
I2S_SDAI/GPIO61
31
51
I2C1_SDA/ GPI O47
25
29
I2S_BCLK/GPIO62
SPIS1_SS/GPIO41
30
I2S_LRCLK/GPIO63
52
I2C1_SCL/ GPI O46
53
24
I2C0_SDA/ GPI O45
23
SPIS1_CLK/GPIO40
28
SPIS0_MISO/GPIO39
I2C0_SCL/ GPI O44
I2S_MCLK/GPIO64
26
I2SM_CLK22/GPIO65
54
27
55
22
SPI S1_MOSI/ GPI O42
21
SPI S1_MI SO/ GPI O43
SPIS0_SS/GPIO37
SPIS0_MOSI/GPIO38
Figure 3-5 Pin Configuration FT900L (top-down view)
Copyright © 2015 Future Technology Devices International Limited
12
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
VETH3V3
EREFSET
VOUT2
VETH3V3
77
76
RXI P
78
RXI N
81
80
79
TXON
TXOP
83
82
RTC_XI/ RTC_CLKI N
RTC_XI O
85
84
ADC1/ CAM_XCLK/ GPI O6
NC
86
ADC2/ CAM_PCLK/ GPI O7
88
87
ADC4/ CAM_HD/ GPI O9
ADC3/ CAM_VD/ GPI O8
89
ADC5/ CAM_D7/ GPI O10
91
90
AGND
ADC7/ CAM_D5/ GPI O12
VCC3V3A
94
ADC6/ CAM_D6/ GPI O11
DAC_REFP
95
92
DAC1/ CAM_D4/ GPI O13
97
96
93
CAM_D2/ GPI O15
DAC0/ CAM_D3/ GPI O14
98
CAM_D1/GPIO16
99
100
Document No.: FT_000965 Clearance No.: FTDI#421
CAM_D0/GPIO17
1
75
HRREF
GPIO18
2
74
AGND
SD_CLK/GPIO19
3
73
H_DP
SD_CMD/GPIO20
4
72
H_DM
SD_DATA3/GPIO21
5
71
DRREF
SD_DATA2/GPIO22
6
70
D_DP
SD_DATA1/GPIO23
7
69
D_DM
SD_DATA0/GPIO24
8
68
VUSB3V3
SD_CD/GPIO25
9
67
VCC1V2
SD_WP/GPIO26
10
SPIM_CLK/GPIO27
11
SPIM_SS0/GPIO28
12
SPIM_MOSI/GPIO29
13
SPIM_MISO/GPIO30
14
SPIM_IO2/GPIO31
15
SPIM_IO3/GPIO32
16
SPIM_SS1/GPIO33
17
SPIM_SS2/GPIO34
SPIM_SS3/GPIO35
FTDI
XXXXXXXXXX
FT901L
YYWW-X
66
XIO
65
XI/CLKIN
64
VCCIO3V3
63
VOUT1
62
ENET_LED1/GPIO5
61
ENET_LED0/GPIO4
60
VBUS_DTC/GPIO3
59
PSW_N/GPIO2
18
58
OC_N/GPIO1
19
57
VBUS_ DISCHG/ GPIO0
SPIS0_CLK/GPIO36
20
56
I2SM_CLK24/GPIO66
45
46
47
48
49
50
GND
PWM0/ GPI O56
PWM1/ GPI O57
PWM2/ GPI O58
I2S_SDAO/ GPI O60
UART0_RI/ UART1_CTS/ PWM7/ GPI O55
VCCIO3V3
43
44
UART0_DCD/ UART1_RTS/ PWM6/ GPI O54
41
42
UART0_DTR/ UART1_TXD/ PWM4/ GPI O52
40
UART0_CTS/ GPI O51
UART0_DSR/ UART1_RXD/ PWM5/ GPI O53
38
39
UART0_RTS/ GPI O50
37
UART0_TXD/ GPI O48
UART0_RXD/ GPI O49
35
36
34
RESETN
DEBUG
33
VPP
STESTRESTN
32
FSOURCE
I2S_SDAI/GPIO61
31
51
I2C1_SDA/ GPI O47
25
29
I2S_BCLK/GPIO62
SPIS1_SS/GPIO41
30
I2S_LRCLK/GPIO63
52
I2C1_SCL/ GPI O46
53
24
I2C0_SDA/ GPI O45
23
SPIS1_CLK/GPIO40
28
SPIS0_MISO/GPIO39
I2C0_SCL/ GPI O44
I2S_MCLK/GPIO64
26
I2SM_CLK22/GPIO65
54
27
55
22
SPI S1_MOSI/ GPI O42
21
SPI S1_MI SO/ GPI O43
SPIS0_SS/GPIO37
SPIS0_MOSI/GPIO38
Figure 3-6 Pin Configuration FT901L (top-down view)
Copyright © 2015 Future Technology Devices International Limited
13
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
NC
NC
NC
NC
77
76
NC
78
NC
81
80
79
NC
NC
83
82
RTC_XI/ RTC_CLKI N
RTC_XI O
85
84
ADC1/ CAM_XCLK/ GPI O6
NC
86
ADC2/ CAM_PCLK/ GPI O7
88
87
ADC4/ CAM_HD/ GPI O9
ADC3/ CAM_VD/ GPI O8
89
ADC5/ CAM_D7/ GPI O10
91
90
AGND
ADC7/ CAM_D5/ GPI O12
VCC3V3A
94
ADC6/ CAM_D6/ GPI O11
DAC_REFP
95
92
DAC1/ CAM_D4/ GPI O13
97
96
93
CAN0_TXD/ CAM_D2/ GPI O15
DAC0/ CAM_D3/ GPI O14
98
CAN0_RXD/ CAM_D1/ GPI O16
99
100
Document No.: FT_000965 Clearance No.: FTDI#421
CAN1_TXD/CAM_D0/GPIO17
1
75
HRREF
CAN1_RXD/GPIO18
2
74
AGND
SD_CLK/GPIO19
3
73
H_DP
SD_CMD/GPIO20
4
72
H_DM
SD_DATA3/GPIO21
5
71
DRREF
SD_DATA2/GPIO22
6
70
D_DP
SD_DATA1/GPIO23
7
69
D_DM
SD_DATA0/GPIO24
8
68
VUSB3V3
SD_CD/GPIO25
9
67
VCC1V2
SD_WP/GPIO26
10
SPIM_CLK/GPIO27
11
FTDI
XXXXXXXXXX
FT902L
YYWW-X
66
XIO
65
XI/CLKIN
64
VCCIO3V3
63
VOUT1
62
GPIO5
SPIM_SS0/GPIO28
12
SPIM_MOSI/GPIO29
13
SPIM_MISO/GPIO30
14
SPIM_IO2/GPIO31
15
SPIM_IO3/GPIO32
16
SPIM_SS1/GPIO33
17
SPIM_SS2/GPIO34
18
SPIM_SS3/GPIO35
19
57
VBUS_ DISCHG/ GPIO0
SPIS0_CLK/GPIO36
20
56
I2SM_CLK24/GPIO66
61
GPIO4
60
VBUS_DTC/GPIO3
59
PSW_N/GPIO2
58
OC_N/GPIO1
45
46
47
48
49
50
GND
PWM0/ GPI O56
PWM1/ GPI O57
PWM2/ GPI O58
I2S_SDAO/ GPI O60
UART0_RI/ UART1_CTS/ PWM7/ GPI O55
VCCIO3V3
43
44
UART0_DCD/ UART1_RTS/ PWM6/ GPI O54
41
42
UART0_DTR/ UART1_TXD/ PWM4/ GPI O52
40
UART0_CTS/ GPI O51
UART0_DSR/ UART1_RXD/ PWM5/ GPI O53
38
39
UART0_RTS/ GPI O50
37
UART0_TXD/ GPI O48
UART0_RXD/ GPI O49
35
36
34
RESETN
DEBUG
33
VPP
STESTRESTN
32
FSOURCE
I2S_SDAI/GPIO61
31
51
I2C1_SDA/ GPI O47
25
29
I2S_BCLK/GPIO62
SPIS1_SS/GPIO41
30
I2S_LRCLK/GPIO63
52
I2C1_SCL/ GPI O46
53
24
I2C0_SDA/ GPI O45
23
SPIS1_CLK/GPIO40
28
SPIS0_MISO/GPIO39
I2C0_SCL/ GPI O44
I2S_MCLK/GPIO64
26
I2SM_CLK22/GPIO65
54
27
55
22
SPI S1_MOSI/ GPI O42
21
SPI S1_MI SO/ GPI O43
SPIS0_SS/GPIO37
SPIS0_MOSI/GPIO38
Figure 3-7 Pin Configuration FT902L (top-down view)
Copyright © 2015 Future Technology Devices International Limited
14
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
NC
NC
NC
77
76
NC
79
78
NC
NC
81
80
NC
NC
83
82
RTC_XI/ RTC_CLKI N
RTC_XI O
85
84
ADC1/ CAM_XCLK/ GPI O6
NC
86
ADC2/ CAM_PCLK/ GPI O7
88
87
ADC4/ CAM_HD/ GPI O9
ADC3/ CAM_VD/ GPI O8
89
ADC5/ CAM_D7/ GPI O10
91
90
AGND
ADC7/ CAM_D5/ GPI O12
VCC3V3A
94
ADC6/ CAM_D6/ GPI O11
DAC_REFP
95
92
DAC1/ CAM_D4/ GPI O13
97
96
93
CAM_D2/ GPI O15
DAC0/ CAM_D3/ GPI O14
98
CAM_D1/ GPI O16
99
100
Document No.: FT_000965 Clearance No.: FTDI#421
CAM_D0/GPIO17
1
75
HRREF
GPIO18
2
74
AGND
SD_CLK/GPIO19
3
73
H_DP
SD_CMD/GPIO20
4
72
H_DM
SD_DATA3/GPIO21
5
71
DRREF
SD_DATA2/GPIO22
6
70
D_DP
SD_DATA1/GPIO23
7
69
D_DM
SD_DATA0/GPIO24
8
68
VUSB3V3
SD_CD/GPIO25
9
67
VCC1V2
SD_WP/GPIO26
10
SPIM_CLK/GPIO27
11
FTDI
XXXXXXXXXX
FT903L
YYWW-X
66
XIO
65
XI/CLKIN
64
VCCIO3V3
63
VOUT1
62
GPIO5
SPIM_SS0/GPIO28
12
SPIM_MOSI/GPIO29
13
SPIM_MISO/GPIO30
14
SPIM_IO2/GPIO31
15
SPIM_IO3/GPIO32
16
SPIM_SS1/GPIO33
17
SPIM_SS2/GPIO34
18
SPIM_SS3/GPIO35
19
57
VBUS_ DISCHG/ GPIO0
SPIS0_CLK/GPIO36
20
56
I2SM_CLK24/GPIO66
61
GPIO4
60
VBUS_DTC/GPIO3
59
PSW_N/GPIO2
58
OC_N/GPIO1
47
48
49
50
PWM2/ GPI O58
I2S_SDAO/ GPI O60
GND
VCCIO3V3
PWM0/ GPI O56
45
46
UART0_RI/ UART1_CTS/ PWM7/ GPI O55
PWM1/ GPI O57
43
44
UART0_DCD/ UART1_RTS/ PWM6/ GPI O54
41
42
UART0_DTR/ UART1_TXD/ PWM4/ GPI O52
40
UART0_CTS/ GPI O51
UART0_DSR/ UART1_RXD/ PWM5/ GPI O53
38
39
UART0_RTS/ GPI O50
37
UART0_TXD/ GPI O48
UART0_RXD/ GPI O49
35
36
34
RESETN
DEBUG
33
VPP
STESTRESTN
32
FSOURCE
I2S_SDAI/GPIO61
31
51
I2C1_SDA/ GPI O47
25
29
I2S_BCLK/GPIO62
SPIS1_SS/GPIO41
30
I2S_LRCLK/GPIO63
52
I2C1_SCL/ GPI O46
53
24
I2C0_SDA/ GPI O45
23
SPIS1_CLK/GPIO40
28
SPIS0_MISO/GPIO39
I2C0_SCL/ GPI O44
I2S_MCLK/GPIO64
26
I2SM_CLK22/GPIO65
54
27
55
22
SPI S1_MOSI/ GPI O42
21
SPI S1_MI SO/ GPI O43
SPIS0_SS/GPIO37
SPIS0_MOSI/GPIO38
Figure 3-8 Pin Configuration FT903L (top-down view)
Copyright © 2015 Future Technology Devices International Limited
15
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
3.3
Pin
No.
1
Pin Description
Name
CAN1_TXD/CAM_D0/GPIO17
Type
I/O
Description
GPIO17 input/output. (By default is GPIO input, internal
pull-low)
Camera data 0 input.
CAN1 transmitter output.
2
CAN1_RXD/GPIO18
I/O
[1]
GPIO18 input/output. (By default is GPIO input, internal
pull-low)
CAN1 receiver input.[1]
3
SD_CLK/GPIO19
I/O
GPIO19 input/output. (By default is GPIO input, internal
pull-low)
SD card serial clock output.
4
SD_CMD/GPIO20
I/O
GPIO20 input/output. (By default is GPIO input, internal
pull-low)
SD card command signal input/output.
5
SD_DATA3/GPIO21
I/O
GPIO21 input/output. (By default is GPIO input, internal
pull-low)
SD card data bus line 3 input/output.
6
SD_DATA2/GPIO22
I/O
GPIO22 input/output. (By default is GPIO input, internal
pull-low)
SD card data bus line 2 input/output.
7
SD_DATA1/GPIO23
I/O
GPIO23 input/output. (By default is GPIO input, internal
pull-low)
SD card data bus line 1 input/output.
8
SD_DATA0/GPIO24
I/O
GPIO24 input/output. (By default is GPIO input, internal
pull-low)
SD card data bus line 0 input/output.
9
SD_CD/GPIO25
I/O
GPIO25 input/output. (By default is GPIO input, internal
pull-low)
SD card detect input.
10
SD_WP/GPIO26
I/O
GPIO26 input/output. (By default is GPIO input, internal
pull-low)
SD card write protection input.
11
SPIM_CLK/GPIO27
I/O
GPIO27 input/output. (By default is GPIO input, internal
pull-low)
Serial clock output for SPI master.
12
SPIM_SS0/GPIO28
I/O
GPIO28 input/output. (By default is GPIO input, internal
pull-low)
Slave select 0 output for SPI master.
13
SPIM_MOSI/GPIO29
I/O
GPIO29 input/output. (By default is GPIO input, internal
Copyright © 2015 Future Technology Devices International Limited
16
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
Pin
No.
Name
Type
Description
pull-low)
Master out slave in for SPI master.
Data line 0 input/output for SPI master dual & quad mode.
GPIO30 input/output. (By default is GPIO input, internal
pull-low)
14
SPIM_MISO/GPIO30
I/O
Master in slave out for SPI master.
Data line 1 input/output for SPI master dual & quad mode.
15
SPIM_IO2/GPIO31
I/O
GPIO31 input/output. (By default is GPIO input, internal
pull-low)
Data line 2 input/output for SPI master quad mode.
16
SPIM_IO3/GPIO32
I/O
GPIO32 input/output. (By default is GPIO input, internal
pull-low)
Data line 3 input/output for SPI master quad mode.
17
SPIM_SS1/GPIO33
I/O
GPIO33 input/output. (By default is GPIO input, internal
pull-low)
Slave select 1 output for SPI master.
18
SPIM_SS2/GPIO34
I/O
GPIO34 input/output. (By default is GPIO input, internal
pull-low)
Slave select 2 output for SPI master.
19
SPIM_SS3/GPIO35
I/O
GPIO35 input/output. (By default is GPIO input, internal
pull-low)
Slave select 3 output for SPI master.
20
SPIS0_CLK/GPIO36
I/O
GPIO36 input/output. (By default is GPIO input, internal
pull-low)
Serial clock input for SPI slave 0.
I/O
21
SPIS0_SS/GPIO37
GPIO37 input/output. (By default is GPIO input, internal
pull-low)
Slave select input for SPI slave 0.
I/O
22
SPIS0_MOSI/GPIO38
GPIO38 input/output. (By default is GPIO input, internal
pull-low)
Master out slave in for SPI slave 0.
I/O
23
SPIS0_MISO/GPIO39
GPIO39 input/output. (By default is GPIO input, internal
pull-low)
Master in slave out for SPI slave 0.
I/O
24
SPIS1_CLK/GPIO40
GPIO40 input/output. (By default is GPIO input, internal
pull-low)
Serial clock input for SPI slave 1.
25
SPIS1_SS/GPIO41
I/O
GPIO41 input/output. (By default is GPIO input, internal
pull-low)
Copyright © 2015 Future Technology Devices International Limited
17
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
Pin
No.
Name
Type
Description
Slave select input for SPI slave 1.
26
SPIS1_MOSI/GPIO42
I/O
GPIO42 input/output. (By default is GPIO input, internal
pull-low)
Master out slave in for SPI slave 1.
27
SPIS1_MISO/GPIO43
I/O
GPIO43 input/output. (By default is GPIO input, internal
pull-low)
Master in slave out for SPI slave 1.
28
I2C0_SCL/GPIO44
I/O
GPIO44 input/output. (By default is GPIO input, internal
pull-low)
I2C 0 serial clock input/output. (By default is I2C 0 master)
29
I2C0_SDA/GPIO45
I/O
GPIO45 input/output. (By default is GPIO input, internal
pull-low)
I2C 0 data line input/output. (By default is I2C 0 master)
30
I2C1_SCL/GPIO46
I/O
GPIO46 input/output. (By default is GPIO input, internal
pull-low)
I2C 1 serial clock input/output. (By default is I2C 1 slave)
31
I2C1_SDA/GPIO47
I/O
GPIO47 input/output. (By default is GPIO input, internal
pull-low)
I2C 1 data line input/output. (By default is I2C 1 slave)
EFUSE Program source input (3.6V-3.8V).
32
FSOURCE
I
33
VPP
I
34
RESETN
I
35
STESTRESETN
I
36
DEBUG
I/O
One-wire debugger interface input/output.
37
UART0_TXD/GPIO48
I/O
GPIO48 input/output. (By default is GPIO input, internal
pull-low)
If not used for EFUSE programming, leave this pin floating
or short to Ground.
EFUSE Program source input (1.8V-1.9V).
If not used for EFUSE programming, leave this pin floating.
Chip reset input for normal operation. Active low.
Connect external 10k pull-up to VCC3V3 for safe operation.
Chip reset input for test mode.
Short to Ground for normal operation.
Transmitter output for UART0.
38
UART0_RXD/GPIO49
I/O
GPIO49 input/output. (By default is GPIO input, internal
pull-low)
Receiver input for UART0.
39
UART0_RTS/GPIO50
I/O
GPIO50 input/output. (By default is GPIO input, internal
pull-low)
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Pin
No.
Name
Type
Description
Request to send output for UART0.
40
UART0_CTS/GPIO51
I/O
GPIO51 input/output. (By default is GPIO input, internal
pull-low)
Clear to send input for UART0.
GPIO52 input/output. (By default is GPIO input, internal
pull-low)
41
UART0_DTR/UART1_TXD/
PWM4/GPIO52
I/O
PWM channel 4, output.
Transmitter output for UART1.
Data terminal ready output for UART0.
GPIO53 input/output. (By default is GPIO input, internal
pull-low)
42
UART0_DSR/UART1_RXD/
PWM5/GPIO53
I/O
PWM channel 5, output.
Receiver input for UART1.
Data set ready input for UART0.
GPIO54 input/output. (By default is GPIO input, internal
pull-low)
43
UART0_DCD/UART1_RTS/
PWM6/GPIO54
I/O
PWM channel 6, output.
Request to send output for UART1.
Data carrier detection input for UART0.
GPIO55 input/output. (By default is GPIO input, internal
pull-low)
44
UART0_RI/UART1_CTS/
PWM7/GPIO55
I/O
PWM channel 7, output.
Clear to send input for UART1.
Ring indicator input for UART0.
45
GND
P
Ground
+3.3V supply voltage.
46
VCCIO3V3
P
This is the supply voltage for all the I/O ports. Connect
10uF and 0.1uF decoupling capacitors to GND. This pin
must be connected to pin 64.
GPIO56 input/output. (By default is GPIO input, internal
pull-low)
47
PWM0/GPIO56
I/O
PWM channel 0, output.
A stereo 16/8-bit PCM audio data channel output.
GPIO57 input/output. (By default is GPIO input, internal
pull-low)
48
PWM1/GPIO57
I/O
PWM channel 1, output.
A stereo 16/8-bit PCM audio data channel output.
49
PWM2/GPIO58
I/O
GPIO58 input/output. (By default is GPIO input, internal
pull-low)
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Pin
No.
Name
Type
Description
PWM channel 2, output.
50
I2S_SDAO/GPIO60
I/O
GPIO60 input/output. (By default is GPIO input, internal
pull-low)
Serial data line output for I2S master or slave.
51
I2S_SDAI/GPIO61
I/O
GPIO61 input/output. (By default is GPIO input, internal
pull-low)
Serial data line input for I2S master or slave.
52
I2S_BCLK/GPIO62
I/O
53
I2S_LRCLK/GPIO63
I/O
54
I2S_MCLK/GPIO64
I/O
GPIO62 input/output. (By default is GPIO input, internal
pull-low)
Bit clock line output for I2S master transmitter or input for
I2S slave receiver.
GPIO63 input/output. (By default is GPIO input, internal
pull-low)
Left / Right clock line output for I2S master transmitter or
input for I2S slave receiver.
GPIO64 input/output. (By default is GPIO input, internal
pull-low)
I2S master transmitter clock output.
55
I2SM_CLK22/GPIO65
I/O
GPIO65 input/output. (By default is GPIO input, internal
pull-low)
I2S master external 22.5792MHz clock input.
56
I2SM_CLK24/GPIO66
I/O
GPIO66 input/output. (By default is GPIO input, internal
pull-low)
I2S master external 24.576MHz clock input.
57
VBUS_DISCHG/GPIO0
I/O
GPIO0 input/output. (By default is GPIO input, internal
pull-high)
USB host VBUS discharge.
58
OC_N/GPIO1
I/O
GPIO1 input/output. (By default is GPIO input, internal
pull-high)
USB host port over current status output. Active low.
59
PSW_N/GPIO2
I/O
GPIO2 input/output. (By default is GPIO input, internal
pull-high)
USB host port external VBUS power switcher. Active low.
60
VBUS_DTC/GPIO3
I/O
GPIO3 input/output. (By default is GPIO input, internal
pull-low)
USB peripheral VBUS detection.
61
ENET_LED0/GPIO4
I/O
GPIO4 input/output. (By default is GPIO input, internal
pull-low)
Ethernet activity indicator LED 0.[2]
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Pin
No.
62
Name
ENET_LED1/GPIO5
Type
I/O
Description
GPIO5 input/output. (By default is GPIO input, internal
pull-low)
Ethernet activity indicator LED 1.[2]
+1.2V Regulator power output.
63
VOUT1
P
This is internal regulator output. Connect 4.7uF and 0.1uF
decoupling capacitors to GND.
This pin must be connected to pin 67.
+3.3V supply voltage.
This is the supply voltage for all the I/O ports. Connect a
0.1uF decoupling capacitor. This pin must be connected to
pin 46.
64
VCCIO3V3
P
65
XI/CLKIN
AI
12MHz clock frequency input to the Oscillator circuit or to
internal clock generator circuit.
66
XIO
AO
Output from the Oscillator amplifier.
67
VCC1V2
P
+1.2V Regulator power supply for USB.
Provide +1.2V power to this pin. This pin must be
connected to pin 63. Connect 0.1uF decoupling capacitor.
+3.3V supply voltage.
This is the supply voltage for USB peripheral and host I/O
ports. Connect 10uF and 0.1uF decoupling capacitors. This
pin could be connected to all +3.3V power supply pins
without 10uF capacitor.
68
VUSB3V3
P
69
D_DM
AI/O
USB peripheral bidirectional DM line.
70
D_DP
AI/O
USB peripheral bidirectional DP line.
71
DRREF
AI
72
H_DM
AI/O
USB host bidirectional DM line.
73
H_DP
AI/O
USB host bidirectional DP line.
74
AGND
P
75
HRREF
AI
USB peripheral reference voltage input.
Connect 12Kohm +/- 1% resistor to GND.
Analog Ground
USB host reference voltage input.
Connect 12Kohm +/- 1% resistor to GND.
+3.3V supply voltage.
76
VETH3V3
P
77
VOUT2
P
This is the supply voltage for Ethernet I/O ports. Connect
10uF and 0.1uF decoupling capacitors. This pin could be
connected to all +3.3V power supply pins without 10uF
capacitor.
+1.2V Regulator power supply.[2]
This is an internal regulator output. Connect 0.1uF
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Pin
No.
Name
Type
Description
decoupling capacitors.
78
EREFSET
AI
Ethernet reference voltage input.[2]
Connect 12.3Kohm +/- 1% resistor to GND.
+3.3V supply voltage.
This is the supply voltage for Ethernet I/O ports. Connect a
0.1uF decoupling capacitor. This pin must be connected to
pin 76.
79
VETH3V3
P
80
RXIP
I
81
RXIN
I
82
TXOP
O
83
TXON
O
84
RTC_XIO
AO
Output from the RTC Oscillator amplifier.
85
RTC_XI/RTC_CLKIN
AI
32.768KHz clock frequency input to the RTC Oscillator
circuit or to internal RTC clock generator circuit.
86
NC
-
Ethernet receive data positive input.[2]
Differential receive signal pair.
Ethernet receive data negative input.[2]
Differential receive signal pair.
Ethernet transmit data positive output.[2]
Differential transmit signal pair.
Ethernet transmit data negative output.[2]
Differential transmit signal pair.
Not connected.
GPIO6 input/output. (By default is GPIO input, internal
pull-low)
87
ADC1/CAM_XCLK/GPIO6
I/O
Camera external clock output.
10-bit A/D converter 1, input.
GPIO7 input/output. (By default is GPIO input, internal
pull-low)
88
ADC2/CAM_PCLK/GPIO7
I/O
Camera pixel clock input.
10-bit A/D converter 2, input.
GPIO8 input/output. (By default is GPIO input, internal
pull-low)
89
ADC3/CAM_VD/GPIO8
I/O
Camera vertical sync input.
10-bit A/D converter 3, input.
GPIO9 input/output. (By default is GPIO input, internal
pull-low)
90
ADC4/CAM_HD/GPIO9
I/O
Camera horizontal reference input.
10-bit A/D converter 4, input.
91
ADC5/CAM_D7/GPIO10
I/O
GPIO10 input/output. (By default is GPIO input, internal
pull-low)
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Pin
No.
Name
Type
Description
Camera data 7 input.
10-bit A/D converter 5, input.
GPIO11 input/output. (By default is GPIO input, internal
pull-low)
92
ADC6/CAM_D6/GPIO11
I/O
Camera data 6 input.
10-bit A/D converter 6, input.
GPIO12 input/output. (By default is GPIO input, internal
pull-low)
93
ADC7/CAM_D5/GPIO12
I/O
Camera data 5 input.
10-bit A/D converter 7, input.
94
AGND
P
Analog Ground
+3.3V supply voltage.
95
VCC3V3A
P
This is the supply voltage for Analog I/O ports. Connect
10uF and 0.1uF decoupling capacitors. This pin could be
connected to all VCC3V3 pins without 10uF capacitor.
96
DAC_REFP
I
10-bit DAC positive reference voltage.
GPIO13 input/output. (By default is GPIO input, internal
pull-low)
97
DAC1/CAM_D4/GPIO13
I/O
Camera data 4 input.
10-bit D/A converter 1, output.
GPIO14 input/output. (By default is GPIO input, internal
pull-low)
98
DAC0/CAM_D3/GPIO14
I/O
Camera data 3 input.
10-bit D/A converter 0, output.
GPIO15 input/output. (By default is GPIO input, internal
pull-low)
99
CAN0_TXD/CAM_D2/GPIO15
I/O
CAN0 transmitter output. [1]
Camera data 2 input.
GPIO16 input/output. (By default is GPIO input, internal
pull-low)
100
CAN0_RXD/CAM_D1/GPIO16
I/O
CAN0 receiver input. [1]
Camera data 1 input.
Table 3-1 FT900 pin description
[1]
CAN Bus 0/1 only are featured on both FT900 and FT902 packages.
[2]
Ethernet pins are available on FT900 and FT901 only. For FT902 and FT903, shall leave all
Ethernet pins as NC pin floating except for pin61 and pin62 as GPIO by default.
Notes:
P
: Power or ground
I
: Input
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O
: Output
AI
: Analog Input
OD
: Open drain output
AO
: Analog Output
I/O
: Bi-direction Input and Output
AI/O
: Analog Input / Output
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4
Function Description
4.1
Architectural Overview
The FT90x series embedded microcontrollers include a high performance 32-bit FT32 RISC core
processor and 256kB hi-speed Flash memory for software program downloading with a OneWire debugger interface. The core processor uses a 32-bit I/O system bus to connect to all of
the peripherals.
USB2.0 host controller
USB2.0 peripheral controller
10/100Mbps Ethernet controller (FT900 and FT901 only)
Two CAN bus interfaces (FT900 and FT902 only)
Real Time Clock
One-Wire debugger interface
One SPI master interface and two SPI slave interfaces
Two I2C bus interfaces
One I2S bus interface
UART interface
Four timers and a 32-bit watchdog timer
Camera parallel interface
SD host controller
PWM motor controller
10-bit DAC0/1 channel
10-bit ADC1-7 channel
General purpose I/O interface
The functions for each controller / interface are briefly described in the following subsections.
4.2
FT32 Core Processor
The FT32 core processor is running at frequencies of up to 100MHz. The processor contains the
CPU itself with control logic and its 256kB program memory and 64kB data memory. The
outside connections for the core processor are the memory-mapped I/O interface, the interrupt
interface, asynchronous reset and the system clock.
4.3
256kB Flash Memory
The internal 256kB Flash memory is used to store a boot loader or user application of the
FT90x series. It is a high performance and low power consumption memory that supports upto
80MHz serial clock. The system will perform memory copy from Flash memory to CPU program
memory automatically after system power on.
4.4
Boot Sequence
After the initial memory copy completes, the CPU jumps to program memory location zero.
This may be the start of the user application which is stored in advance in Flash memory, or a
boot loader only which allows program memory to perform modification via (e.g.) UART or
USB.
The option of a boot loader is a special purpose routine in the FT90x series embedded
microcontroller. It is a small routine stored in the Flash memory. Typically the boot loader is 14kbytes in size, and is loaded at the top of the available memory.
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4.5
Interrupt
The FT900 interrupt controller handles 32 interrupt inputs. When an interrupt occurred, the
Interrupt Service Route (ISR) will process this event via the CPU. The ISR vector range is from
0 to 31, which corresponds to interrupt 0 to 31. See Table 4-1 information.
Each interrupt shall be assigned the interrupt vector number and priority before use. By
default, the highest priority interrupt is interrupt 0, and the lowest is interrupt 31. However,
the interrupt priority can be rearranged by register settings and also allows multiple interrupts
at the same priority.
To prevent the loss and delay of high priority interrupts, the FT90x series uses nested
interrupts if enabled. Nested interrupts allow interrupt requests of a high priority to pre-empt
interrupt requests of a lower priority. FT90x series supports up to 16-levels deep of nested
interrupts.
The interrupt controller has a global interrupt mask bit to temporarily block all interrupts. If
this bit is set to “1”, then with the exception of an interrupt assigned priority as “0”, which is a
non-maskable interrupt (NMI) input, all interrupts are masked.
See Table 4-2 for FT90x series default interrupt priority.
Peripherals of Interrupt
Interrupt Vector Index
Default Priority
Power Management
0
0 (NMI)
USB2.0 Host Controller
1
1
USB2.0 Peripheral Controller
2
2
Ethernet Controller
3
3
SD Host Controller
4
4
CAN Bus 0
5
5
CAN Bus 1
6
6
Camera
7
7
SPI Master
8
8
SPI Slave 0
9
9
SPI Slave 1
10
10
I2C 0
11
11
I2C 1
12
12
UART 0
13
13
UART 1
14
14
I2S Bus
15
15
PWM
16
16
Timers
17
17
GPIO
18
18
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Peripherals of Interrupt
Interrupt Vector Index
Default Priority
RTC
19
19
ADC
20
20
DAC
21
21
Slow Clock Timer
22
22
UNUSED
23-31
23-31
Table 4-1 FT90x series default interrupt priority
4.6
Memory Mapping
A list of the I/O memory mapping for registers and memory in the FT90x series is given below
in table 4-2. Please refer to FT900 User Manual for detail description of registers.
Function
Address Memory Range
Comment
General setup registers
0x10000
0x100BF
DW/W/B
Interrupt controller registers
0x100C0
0x100FF
DW/W/B
USB2.0 host controller registers
0x10100
0x1017F
DW/W/B
USB2.0 host controller RAM
memory
0x11000
0x12FFF
DW/W/B
USB2.0 peripheral controller
registers
0x10180
0x1021F
DW/W/B
Ethernet controller registers
0x10220
0x1023F
DW/W/B (Uses DW to access
FIFO)
CAN BUS 0 registers
0x10240
0x1025F
B
CAN BUS 1 registers
0x10260
0x1027F
B
RTC registers
0x10280
0x1029F
DW
SPI master registers
0x102A0
0x102BF
DW
SPI slave 0 registers
0x102C0
0x102DF
DW
SPI slave 1 registers
0x102E0
0x102FF
DW
I2C master registers
0x10300
0x1030F
B (I2C 0 and I2C 1 both can
be configure as master or
slave)
I2C slave registers
0x10310
0x1031F
B (I2C 0 and I2C 1 both can
be configure as master or
slave)
UART 0 register
0x10320
0x1032F
B
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Function
Address Memory Range
Comment
UART 1 registers
0x10330
0x1033F
B
Timers (include Watchdog)
registers
0x10340
0x1034F
B
I2S master or slave registers
0x10350
0x1035F
W
Camera registers
0x10360
0x1036F
DW
Reserved
0x10370
0x103BF
-
PWM registers
0x103C0
0x103FF
SD host controller registers
0x10400
0x107FF
DW
Flash controller registers
0x10800
0x108BF
B
Reserved
0x108C0
0x10FFF
-
Registers: B access
FIFO: W access
Table 4-2 FT90x series I/O memory mapping
Notes: DW / W / B are length of register operation.
DW:
Double Word (32-bit)
W:
4.7
USB2.0 Host Controller
Word (16-bit)
B:
Byte (8-bit)
The Hi-Speed USB2.0 single-port host controller is compliant with the USB2.0 specification and
the Enhanced Host Controller Interface (EHCI) specification. There is an option to enable a
downstream port with a Battery Charging (BC) feature, which can be configured as Standard
Downstream Port (SDP), or Charging Downstream Port (CDP), or Dedicated Charging Port
(DCP). The battery charging feature is compatible with the Battery Charging Specification
Revision 1.2 (BC 1.2) by USB-IF.
4.7.1 Features:
•
•
•
•
•
•
•
•
•
Compliant with the USB specification revision 2.0.
Compliant with EHCI specification revision 1.0.
The USB1.1 host is integrated into the USB2.0 EHCI compatible host controller.
Supports data transfer at hi-speed (480 Mbit/s), full-speed (12 Mbit/s) and low-speed
(1.5 Mbit/s).
Supports the split transaction for hi-speed Hubs and the preamble transaction fullspeed hubs.
Supports the Isochronous/Interrupt/Control/Bulk data transfers.
8kB high speed RAM memory integrated.
Supports Battery Charging specification revision 1.2.
Supports VBUS power switching and over current control.
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4.8
USB2.0 Peripheral Contoller
The USB 2.0 peripheral controller is fully compliant with the USB2.0 specification. There is also
an option to enable a battery charger detection (BCD) feature on the upstream port, which can
identify whether the connected downstream port supports SDP, CDP or DCP charging function.
Battery charge detection allows the USB device to determine if higher currents may be
available from the USB connection for rapid battery charging.
4.8.1 Features:
4.9
Supports data transfer at hi-speed (480 Mbit/s) and full-speed (12 Mbit/s).
Software configurable EP0 control endpoint size 8-64 bytes
Software configurable 7 IN/OUT endpoints.
EP1-EP7 has double buffering which contains 2kB IN and 2kB OUT buffers.
Supports the Isochronous/Interrupt/Control/Bulk data transfers.
Max endpoint packet sizes upon 1024 bytes.
Supports VBUS detection.
Supports suspend and resume power management functions.
Supports remote wakeup feature.
Supports Battery Charging specification revision 1.2.
Ethernet Controller
The Ethernet controller contains an on-chip 10/100BASE-TX Ethernet transceiver and Media
Access Control (MAC) designed to provide high performance of frame transmission and
reception. The Ethernet transceiver is compliant with 10/100BASE-TX Ethernet standards, such
as IEEE802.3/802.3u and ANSI X3.263-1995, and MAC protocol refers to an IEEE standard
802.3-2000.
4.9.1 Features:
10/100 Mbps data transfer.
Conforms to IEEE 802.3-2002 specification.
Supports full-duplex and half-duplex modes.
- Supports CSMA/CD protocol for half-duplex operation.
- Supports IEEE802.3x flow control for full-duplex operation.
Programmable MAC address.
CRC-32 algorithm calculates the FCS nibble at a time, automatic FCS generation and
checking, able to capture frames with CRC errors if required.
Promiscuous mode support.
Station Management (STA) entity included.
Supports double buffering for 2kB TX and 2kB RX memory.
Two LED indicators used by Ethernet multi-function.
4.10 CAN Bus Controller
The FT90x series contains two CAN controllers, CAN bus 0 and CAN bus 1. Controller Area
Network (CAN) is a high performance communication protocol for serial data communication. It
is widely used in automotive and industrial applications. However this is expanding due to its
reliability and feasibility. CAN bus uses a multi-master bus scheme with one logic bus line and
equal nodes. The number of nodes is not limited by the protocol. Nodes do not have specific
addresses. Instead, message identifiers are used, indicating the message content and priority
of the message. FT900 CAN bus supports multicasting and broadcasting with an external CAN
transceiver.
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4.10.1 Features:
Conforms to protocol version 2.0 parts A and B.
Supports bit rates of up to 1 Mbit/s.
Supports standard (11-bit identifier) and extended (29-bit identifier) frames.
Support hardware message filtering with dual/single filters.
64 Bytes receiver and 16 Bytes transmitter FIFO.
No overload frames are generated.
Supports normal and listen-only modes.
Supports single shot transmission.
Supports an abort transmission feature.
Readable error counters and last error code capture supported.
4.11 Real Time Clock
The Real Time Clock (RTC) is a set of counters for measuring time when system power is on,
and the internal regulator will provide power to the RTC. It is clocked by a 32.768 kHz
oscillator.
4.11.1 Features:
No need external battery power supply.
Alarm interrupt can be generated for a specific data/time setting.
Hardware reset does not interrupt the RTC counter.
4.12 One-Wire Debugger Interface
The Debugger interface provides the capability, over a One-Wire half duplex serial link, to
access memory mapped address space, such as the FT900 Flash memory, program memory,
data memory and I/O memory. However, there is no transfer capability from any of the
internal memory to the debugger interface.
4.12.1 Features:
Single wire half duplex link that has one Start, eight Data and one Stop bits at a 1M
bit/s rate.
Supports debugger command read / write operation with variable data transfer.
Supports CHIP ID read out.
Supports checksum check by Flash memory operation.
Supports CPU software debugging to execute Run, Stop, Step, Halt, Set software
breakpoint, etc. operations.
Use semaphore flag to control resource allocated by CPU or Debugger.
4.13 SPI Interface
The FT90x series contains an SPI master and SPI0, SPI1 slave controllers. SPI is a full duplex
serial interface designed to handle multiple masters and slaves connected to a given bus.
4.13.1 Features:
Maximum SPI data bit rate 25MHz in master and slave modes.
Full duplex synchronous serial data transfer.
Compliant with SPI specification, support four transfer formats.
SPI master supports Single, Dual and Quad SPI transfer.
SPI0, SPI1 slave support Single transfer only.
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Support SPI mode and FIFO mode operations.
Multi-master system supported.
Support bus error detection.
SPI master can address up to 4 SPI slave devices.
Support 64 Bytes receiver and 64 Bytes transmitter FIFO respectively.
4.14 I2C Interface
The FT90x series supports an I2C bus controller which is a bidirectional two wire interface. The
two wires are Serial Clock line (SCL) and Serial Data line (SDA). The interface can be
programed to operate with arbitration and clock synchronization allowing it to operate in multimaster systems. I2C0 and I2C1 support transmission speed up to 3.4Mb/s.
4.14.1 Features:
Conforms to v2.1 and v3.0 of the I2C specification.
- UM10204 I2C-bus specification and user manual Rev. 6 – 4 April 2014
Support flexible transmission speed modes:
- Standard (up to 100 kb/s)
- Fast (up to 400 kb/s)
- Fast-plus (up to 1 Mb/s)
- High-speed (up to 3.4 Mb/s)
I2C0 and I2C1 can be configured for Master or Slave mode.
Perform arbitration and clock synchronization.
Multi-master systems supported.
Support both 7-bit and 10-bit addressing modes on the I2C bus.
Support clock stretching.
4.15 UART Interface
The FT90x series contains two UART controllers with standard transmit and receive data lines.
UART0 provides a full modem control handshake interface and support for 9-bit data, allowing
automatic address detection while 9-bit data mode is enabled.
UART1 is a simplified programmable serial interface with CTS and RTS flow control logic. The
signals are multiplexed with UART0 and can only be used if UART0 is used in simple mode
(CTS/RTS only).
4.15.1 Features:
Maximum UART data bit rate of 8 Mbit/s.
Support UART mode and FIFO mode operation.
128 Bytes buffering both Receive and Transmit FIFOs used.
Software compatible with 16450, 16550, 16750 and 16950 industry standard.
Modem control function (CTS, RTS, DSR, DTR, RI, and DCD) support for UART0.
Programmable automatic out-of- band flow control logic through Auto-RTS and AutoCTS.
Programmable automatic flow control logic using DTR and DSR.
Programmable automatic in-band flow control logic using XON/XOFF characters.
Support external RS-485 buffer enable.
Fully programmable serial interface characteristics:
- 5-, 6-, 7-, 8-, or 9-bit data characters
- Even, Odd, or No-parity bit generation and detection
- 1-, 1.5- or 2-stop bit generation
- Baud rate generation
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- Detection of bad data in Receive FIFO
Support Transmitter and Receiver disable capability.
4.16 Timers and Watchdog Timer
The FT90x series has four 16-bit user timers with pre-scaling and a 32-bit watchdog feature.
The watchdog timer is controlled from the main clock. The watchdog can be initialized with a
5-bit register. The value of this register points to a bit of the 32-bit counter which will be set
by the application firmware. As the timer decrements, an interrupt occurs when the timer rolls
over. Once started and initialized the watchdog can’t be stopped. It can only be cleared by
writing into a register.
The four user timers can be controlled from the main clock or a common 16-bit pre-scaler,
which can be selected by each timer individually. These timers can be started, stopped and
cleared / initialized. The current value of all timers can be read from registers. All timers can
count up / down and signal an interrupt when the timer rolls over. The timers can also be
configured to be one-shot or in continuous mode.
4.16.1 Features:
Four user timers with pre-scaler.
Supports 16-bit pre-scaler with system clock reference.
Supports individual timer interrupt generated.
Supports one-shot and continuous count for timer.
Supports 32-bit counter watchdog.
Supports watchdog interrupt generated.
4.17 I2S Interface
The FT900 I2S interface supports both Master and Slave modes. The formats supported are
I2S, Left Justified and Right Justified.
In Master mode, two clock sources are to be provided externally. One is 24.576MHz and the
other is 22.5792MHz. The LRCLK, BCLK and MCLK as output signals will be generated by the
Master based on sampling rate and data bit length.
In Slave mode, the LRCLK and BCLK are input signals to the FT900. The MCLK source is not
used in this case. The application can configure the two clock source pins (I2SM_CLK22,
I2SM_CLK24) to GPIO operation.
4.17.1 Features:
Configure I2S interface as master or slave.
Support I2S, Left Justified and Right Justified format.
Support different sample rates: 11.025KHz, 22.05KHz, 44.1KHz, 16KHz, 32KHz, 48KHz,
96KHz and 192KHz.
Support different audio data bit length: 16 bits, 20 bits, 24 bits and 32 bits.
2kB FIFO for I2S receiver and 2kB FIFO for transfer audio data.
Support FIFO flow control.
Support master clock sources: 24.576MHz and 22.5792MHz.
4.18 Camera Parallel Interface (Data Capture)
The Camera Parallel Interface (CPI) implements an 8-bit parallel link from an image sensor to
the FT900. The interface will provide a clock to the external camera module at a Max rate of
25MHz.
Camera control signals are VSYNC, HREF and PCLK. The VSYNC signal determines when a new
frame begins. The HREF signal represents the period of data transfer of a row in the
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transmitted frame. When the HREF signal is active, there is valid data over the data lines every
pixel clock (PCLK) cycle. The PCLK signal indicates a valid data byte over the data lines and it
is used as a transfer trigger.
4.18.1 Features:
Configure camera registers via I2C two-wire interface.
8-bit data is clocked by an external clock provided by the camera module.
With VSYNC, HREF and PCLK control signals.
Programmable data capture trigger position.
2kB FIFO for camera capture data.
4.19 PWM
The FT90x series supports 7 separate independent PWM output channels. All channels share an
8-bit pre-scaler to scale the system clock frequency to the desired channels.
Each channel has its own 16-bit comparator value. This is the value that would be matched to
a preset 16-bit counter. When a channel’s 16-bit comparator value matches that of the 16-bit
counter, the corresponding PWM channel output will toggle. This 16-bit comparator value will
continue to count until it reaches its preset value, and the counter will just roll over.
A special feature allows the 7 channels each to also toggle its own output based on the
comparison results of other channels. Hence each channel potentially can have up to 8 toggle
edges. The PWM signal generated can be output as a single-shot or continuous output.
The PWM counter also supports an external trigger. There are 6 GPIOs selectable for an
external trigger.
PWM channel 0 and channel 1 can double as a stereo 11 KHz or 22 KHz PCM audio channel.
Once this feature is setup, the 16-bit or 8-bit PCM audio data can be downloaded to the PWM
local FIFO which can hold up to 64 bytes stereo or 128 bytes mono audio data. The data will
playback based on the pre-scaler and 16-bit counter, and the data will be automatically scaled
to fit in the playback period if necessary.
4.19.1 Features:
Support 7 PWM output channels.
Support single-shot or continuous PWM data output.
Support external GPIO trigger.
Support 16-bit / 8-bit stereo PCM audio data output.
Control PCM FIFO full, empty, half-empty, overflow and underflow buffer management.
Support PCM volume control for audio playback.
4.20 SD host controller
The FT90x series contains one SD host controller offering access to external large capacity
non-volatile memory.
4.20.1 Features:
Compliant with SD host controller standard specification, version 3.0.
Supports both streaming and non-streaming data transfers.
Compliant with SD physical layer specification, version 3.0.
Supports configurable SD bus modes: 4-bit mode and 8-bit mode.
Compliant with SDIO card specification, version 2.0.
Support 4K SRAM for data FIFO.
Supports configurable 1-bit/4-bit SD card bus.
Configurable CPRM function for security.
Built-in generation and check for 7-bit and 16-bit CRC data.
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Card detection (Insertion/Removal).
Supports read wait mechanism for SDIO function.
Supports suspend/resume mechanism for SDIO function.
4.21 Analog to Digital Converter (ADC)
The FT90x series has a low-power, high-speed, successive approximation Analog-to-Digital
Converter (ADC) that supports a 10-bit resolution and superior maximum sampling frequencies
of up to 1 Mega Samples Per-second (MSPS). This ADC accepts analog inputs ranging from the
ground supplies to the power supplies. This ADC can be used in various low-power and
medium-resolution applications.
4.21.1 Features:
10-bit successive approximation ADC.
Supports 7 channel input.
Individual channels can be selected for conversion.
Power-down mode support.
Max conversion rate up to 1MSPS.
Measurement range 0 to VCC3V3A, by default the range voltage is 10% off of
VCC3V3A. See Table 5-7.
INL: 0.56/-1.05 LSB (Typ.).
DNL: 0.66/-0.58 LSB (Typ.).
4.22 Digital to Analog Converter (DAC)
The FT90x series has two 10-bit, 1 Mega Samples Per-second (MSPS) Digital-Analog converter
(DAC). It includes digital logic for registering the DAC value and a unity-gain buffer capable of
driving off-chip. The module can also be switched to a power-down state where it consumes a
minimum amount of current. The maximum output value of the DAC is DAC_REFP.
4.22.1 Features:
Two 10-bit DACs (0/1).
10-bit R-2R DAC ladder structure.
Buffered output.
Power-down mode support.
Programmable conversion rate, the maximum rate is 1MHz.
Selectable output drive.
4.23 General Purpose Input Output
The FT90x series provides up to 65 configurable Input / Output pins controlled by GPIO
registers. All pins have multiple functions with special peripheral connection. Separate
registers allow setting or clearing any number of outputs simultaneously. All GPIO pins default
to inputs with pull-down resistors enabled on reset except GPIO0/1/2 inputs that have pull-up
resistors enabled.
All GPIOs can function as an interrupt. The polarity can be either positive edge or negative
edge if its interrupt capability is enabled. In this case, the GPIO pin must be configured as a
GPIO input.
4.23.1 Features:
All GPIO default to inputs after reset (except GPIO0/1/2).
Multi-function selection on GPIO pins.
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Pull-up/Pull-down resistor configuration and open-drain configuration can be
programmed through the pin connect block for each GPIO pin.
Direction control of individual bits.
Supports GPIO input Schmitt trigger to help remove noise.
Supports GPIO interrupt, where each enabled GPIO interrupt can be used to wake-up
the system from power-down mode.
4.24 System Clocks
4.24.1 12 MHz Oscillator
The oscillator generates a 12 MHz reference frequency output to the clock multiplier PLL. The
oscillator clock source comes from either an external 12 MHz crystal or a 12 MHz square wave
clock. The external crystal is connected across XI/CLKIN and XIO in the configuration shown in
Section 6.1. The optional external clock input is connected to XI/CLKIN only.
4.24.2 Phase Locked Loop
The internal PLL takes a 12 MHz clock input from a crystal oscillator. The PLL outputs the 100
MHz system clock frequency to the CPU processor and other peripheral circuits. Each
peripheral has an individual enable control signal to gate the clock source.
4.24.3 32.768 KHz RTC Oscillator
The RTC oscillator provides a clock to the RTC time counter. Either an external 32.768 kHz
crystal or a 32.768 kHz square wave clock can be used as the clock source. The external
crystal is connected across RTC_XI/RTC_CLKIN and RTC_XIO in the configuration shown in
Section 6.2. The optional external clock input is connected to RTC_XI/RTC_CLKIN only.
4.24.4 Internal Slow Clock Oscillator
The internal slow clock oscillator provides at least 5ms slow clock source to generate an
interrupt for the USB2.0 device remote wake-up feature. A USB2.0 device with remote wakeup capability may not generate resume signalling unless the bus has been continuously in the
idle state for 5ms. The detail description for USB2.0 suspend/resume, please refer to USB2.0
specification chapter7.1.7.7.
4.25 Power Management
4.25.1 Power Supply
The FT90x series may be operated with a single supply of +3.3V applied to VCCIO3V3,
VUSB3V3, VETH3V3 and VCC3V3A pins. The +1.2V internal regulator VOUT1 provides the
power to the core circuit after VCCIO3V3 power on and the system will generate a Power on
Reset (POR) pulse when the output voltage rises above the POR threshold.
The second +1.2V internal regulator VOUT2 will provide the power to the Ethernet transceiver
when VETH3V3 gets the power supply.
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4.25.2 Power Down Mode
Power down mode applies to the entire system. In the power down mode, the system 12MHz
oscillator and PLL both switch off and the system clock to the core and all peripherals stop
except for the RTC oscillator and internal regulator. The internal regulator retains the power for
the core and RTC running.
An interrupt from GPIO or wake-up events from the USB2.0 peripheral controller and host
controller can wake-up the system from the power down mode independently.
If the USB2.0 host controller was used and the respective interrupt bit enabled before the
system entered into power down mode, then the following events can wake-up the system.
Remote wake-up interrupt to USB2.0 host controller.
USB device connected interrupt to USB2.0 host controller.
USB device disconnected interrupt to USB2.0 host controller.
USB host controller detected the over-current (OC) protection event.
If the USB2.0 peripheral controller was used and the respective interrupt bit was also enabled
before the system entered into power down mode, then the following events can wake-up the
system.
USB2.0 peripheral controller detects connect interrupt.
USB2.0 peripheral controller detects disconnect interrupt.
USB host issue reset signal to USB2.0 peripheral controller.
USB host issue resume signal to USB2.0 peripheral controller.
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5
Devices Characteristics and Ratings
5.1
Absolute Maximum Ratings
The absolute maximum ratings for the FT900 series devices are as follows. These are in
accordance with the Absolute Maximum Rating System (IEC 60134). Exceeding these may
cause permanent damage to the device.
Parameter
Value
Unit
Storage Temperature
-65 to +150
°C
Floor Life (Out of Bag) At Factory Ambient
168 Hours
(30°C / 60% Relative Humidity)
(IPC/JEDEC J-STD-033A MSL Level 3
Compliant)*
Hours
Ambient Temperature (Power Applied)
-40 to +85
°C
VCC3V3 Supply Voltage
-0.5 to +4.6
V
DC Input Voltage – Host H_DP and H_DM
-0.5 to +5
V
DC Input Voltage – Peripheral D_DP and
D_DM
-0.5 to +5
V
DC Input Voltage – Ethernet TXON, TXOP,
RXIN and RXIP
-0.5 to +5.6
V
DC Input Voltage – 5V tolerance I/O cells
-0.5 to +5.8
V
Others (ADC, DAC) – 3V I/O cells
-0.5 to VCC3V3+0.5
V
Table 5-1 Absolute Maximum Ratings
* If devices are stored out of the packaging beyond this time limit the devices should be baked before
use. The devices should be ramped up to a temperature of +125°C and baked for up to 17 hours.
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5.2
DC Characteristics
Electrical Characteristics (Ambient Temperature = -40°C to +85°C)
The typical values are obtained at room temperature (Tj = 25°C), VCC3V3 = 3.3V, and VCC1V2 = 1.2V.
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
VCCIO3V3
I/O operating supply
voltage
2.97
3.3
3.63
V
Normal Operation
Icc1
Power down current
-
700
-
uA
Power Down Mode
Icc2
Idle current
-
42
-
mA
Idle
mA
USB2.0 Host
controller high
speed transfer
data
-
Icc3
VOUT1
System operating
current*
Internal LDO voltage
75
-
-
75
-
mA
USB2.0 Peripheral
controller high
speed transfer
data
-
100
-
mA
10/100 Mbit/s
Ethernet transfer
data
-
50
-
mA
ADC / DAC
Operation
-
1.2
-
V
Normal Operation
Table 5-2 Operating Voltage and Current
Note*: The system operating typical current measured based on each function implements normal
operation with FT32 core active, and other peripherals keep idle status.
DC characteristics of I/O cells
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Voh
Output Voltage High
2.4
-
-
V
|Ioh|=2mA~16mA
Vol
Output Voltage Low
-
-
0.4
V
|Iol|=2mA~16mA
Vopu*
Output pull-up
Voltage for 5V
tolerance I/Os
VCCIO3V
3-0.9
-
-
V
|Ipu| = 1uA
Vih
Input High Voltage
2.0
-
-
V
LVTTL
Vil
Input Low Voltage
-
-
0.8
V
LVTTL
Vth
Schmitt trigger
positive threshold
Voltage
-
1.6
2.0
V
LVTTL
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Vtl
Rpu
Rpd
Schmitt-trigger
negative threshold
Voltage
Input pull-up
resistance equivalent
Input pull-down
resistance equivalent
0.8
1.1
-
V
LVTTL
40
75
190
KΩ
Vin = 0V
40
75
190
KΩ
Vin = VCCIO3V3
Iin
Input leakage current
-10
±1
+10
uA
Cin*
Input Capacitance
-
2.8
-
pF
Vin = VCCIO3V3 or
0
VCCIO3V3 with 5V
tolerance I/O
Table 5-3 Digital I/O Pin Characteristics (VCCIO3V3 = +3.3V, Standard Drive Level)
Note*: This parameter indicates that the pull-up resistor for the 5V tolerance I/O cells cannot reach
VCCIO3V3 DC level even without DC loading current.
Cin includes the cell layout capacitance and pad capacitance.
DC characteristics of USB I/O cells
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
General characteristics
VUSB3V3
USB power supply
voltage
2.97
3.3
3.63
V
Normal operation
VCC1V2*
USB core supply
voltage
1.08
1.2
1.32
V
Normal operation
Input level for high speed
Vhscm
Vhssq
Vhsdsc
Voltage of high speed
data signal in the
common mode
-50
-
500
mV
-
-
-
100
mV
Squelch is
detected
150
-
-
mV
Squelch is not
detected
625
-
-
mV
Disconnection is
detected
-
-
525
mV
Disconnection is
not detected
High speed squelch
detection threshold
High speed
disconnection
detection threshold
Output level for high speed
Vhsoi
High speed idle output
voltage (Differential)
-10
-
10
mV
-
Vhsol
High speed low level
output voltage
(Differential)
-10
-
10
mV
-
Vhsoh
High speed high level
output voltage
-360
-
400
mV
-
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Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
(Differential)
Vchirpj
Chirp-J output voltage
(Differential)
700
-
1100
mV
-
Vchirpk
Chirp-K output
voltage (Differential)
-900
-
-500
mV
-
Input level for full speed and low speed
Vdi
Differential input
voltage sensitivity
0.2
-
-
V
|Vdp-Vdm|
Vcm
Differential common
mode voltage
0.8
-
2.5
V
-
Vse
Single ended receiver
threshold
0.8
-
2.0
V
-
Output level for full speed and low speed
Vol
Low level output
voltage
0
-
0.3
V
-
Voh
High level output
voltage
2.8
-
3.6
V
-
49.5
ohm
Equivalent
resistance used as
an internal chip
Resistance
Rdrv
Driver output
impedance
40.5
45
Table 5-4 USB I/O Pin (D_DP/D_DM, H_DP/H_DM) Characteristics
Note*: The VCC1V2 is USB Host or Peripheral transceiver core power supply input which need connect to
external +1.2V voltage power while USB Host or Peripheral controller is active.
DC characteristics of Ethernet I/O cells
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
General characteristics
VETH3V3
Ethernet power supply
voltage
2.97
3.3
3.63
V
Normal operation
VOUT2*
Ethernet LDO voltage
-
1.2
-
V
Normal operation
-
-
510
mW
10Base-TX mode
-
-
147
mW
10Base-TX mode
-
-
310
mW
100Base-TX mode
10Base-TX mode
(Including TX current)
Total
dissipative
power
10Base-TX mode
(Excluding TX current)
100Base-TX mode
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Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
(Including TX current)
100Base-TX mode
(Excluding TX current)
Auto-negotiation
mode
-
-
165
mW
100Base-TX mode
-
-
550
mW
100Base-TX mode
-
-
187
mW
100Base-TX mode
-
-
10
mW
Ethernet power
down
(Including TX current)
Auto-negotiation
mode
(Excluding TX current)
Power down mode
Table 5-5 Ethernet I/O pin (TXON/TXOP, RXIN/RXIP) characteristics
Note*: The VOUT2 is the internal Regulator +1.2V voltage output which provides a power supply for the
internal Ethernet transceiver.
DC characteristics of DAC I/O cells
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
VCC3V3A
DAC power supply
voltage
2.97
3.3
3.63
V
Normal Operation
VREFP
Reference voltage
0
-
VCC3V3A
V
DCAP_REFP positive
reference
RES
Resolution
10
-
-
Bits
-
INL
Integral nonlinearity
error
-2
-
2
LSB
DNL
Differential nonlinearity
error
-1
-
1.5
LSB
VREFP = VCC3V3A
-
Conversion latency
-
-
1
Clock
cycle
-
CLOAD
Output load: rated
capacitance
-
-
10
pF
-
RLOAD
Output load: rated
resistance
6.7
-
-
KΩ
-
VREFP = VCC3V3A
Table 5-6 DAC I/O pin (DAC_REFP, DAC0/1) characteristics
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DC characteristics of ADC I/O cells
Parameter
Description
Minimum
Typical
Maximum
Units
VCC3V3A
Analog power supply
voltage
2.97
3.3
3.63
V
XAIN
Analog input range
0
-
VCC3V3A
V
-
RES
Resolution
-
10
-
Bit
-
-3
0.56/1.05
3
LSB
10%-90% of
VCC3V3A
Reference
-4
0.56/1.05
4
LSB
Rail-to-Rail
VCC3V3A
reference
INL
Integral nonlinearity
error
Conditions
Normal operation
DNL
Differential
nonlinearity error
-1
0.66/0.58
1.75
LSB
-
Xsampleclk
Sample rate
-
-
1
MSPS
-
Minimum
Typical
Maximum
Units
Conditions
Table 5-7 ADC I/O Pin Characteristics
DC characteristics EFUSE cells
Parameter
Description
EFUSE Program Mode
VDD
Operating voltage
1.08
1.2
1.32
V
-
VFSOURCE
FSOURCE voltage
3.6
3.7
3.8
V
-
VPP
VPP voltage
1.8
1.85
1.9
V
-
IVPP
VPP current
-
-
3
mA
-
Table 5-8 EFUSE I/O Pin Characteristics
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5.3
AC Characteristics
AC Characteristics (Ambient Temperature = -40°C to +85°C)
System clock dynamic characteristics
Value
Parameter
Unit
Minimum
Typical
Maximum
-
12.00
-
MHz
external clock
jitter
-
-
500
ps
clock duty cycle
45
50
55
%
-
3.3
-
V
Crystal oscillator
Clock frequency
External clock input
Input voltage on
pin XI/CLKIN
Table 5-9 System clock characteristics
Note: Recommended accuracy of the clock frequency is 50ppm for the crystal.
RTC clock dynamic characteristics
Value
Parameter
Unit
Minimum
Typical
Maximum
-
32768
-
Hz
external clock jitter
-
-
500
ps
clock duty cycle
45
50
55
%
Startup time
-
0.5
5
s
Input voltage on pin
RTC_XI/RTC_CLKIN
-
1.2
-
V
Crystal oscillator
Clock frequency
External clock input
Table 5-10 RTC clock characteristics
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Analog USB I/O pins dynamic characteristics
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Driver characteristic for high speed
Thsr
High speed differential
rise time
500
-
-
ps
-
Thsf
High speed differential
fall time
500
-
-
ps
-
Driver characteristic for full speed
Tfr
Rise time of DP/DM
4
-
20
ns
Tff
Fall time of DP/DM
4
-
20
ns
Tfrma
Differential rise/fall
time matching
90
-
110
%
Cl=50pF
10%~90% of |Voh–Vol|
Cl=50pF
10%~90% of |Voh–Vol|
The first transition
exclude from the
idle mode
Driver characteristic for low speed
Tlr
Rise time of DP/DM
75
-
300
ns
Tlf
Fall time of DP/DM
75
-
300
ns
Tlrma
Differential rise/fall
time matching
80
-
125
%
Cl=200pF~600pF
10%~90% of |Voh–Vol|
Cl=200pF~600pF
10%~90% of |Voh–Vol|
The first transition
exclude from the
idle mode
Table 5-11 Analog I/O pins (D_DP/D_DM, H_DP/H_DM) characteristics
Figure 5-1 USB Rise and Fall Times for DP/DM
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Analog Ethernet I/O pins dynamic characteristics
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Transmitter characteristics
2 x Vtxa
Peak-to-peak
differential output
voltage
1.9
2.0
2.1
V
100Base-TX mode
Tr / Tf
Signal rise/fall time
3.0
4.0
5.0
ns
100Base-TX mode
Tj
Output jitter
-
-
1.4
ns
100Base-TX mode,
scrambled idle
signal
Vtxov
Overshoot
-
-
5.0
%
100Base-TX mode
Receiver characteristics
-
Common-mode input
voltage
2.97
3.3
3.63
V
-
-
Error-free cable
length
100
-
-
meter
-
Table 5-12 Analog I/O pins (TXON/TXOP, RXIN/RXIP) characteristics
Figure 5-2 100Base-TX Tr/f Timing
Figure 5-3 100Base-TX Jitter Timing
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Figure 5-4 100Base-TX Transmission Waveform
I2C Bus I/O pins dynamic characteristics (Vcc (I/O) = 3.3V)
Parameter
Description
FSCL
SCL clock
frequency
TSCLL
Standard
mode (SM)
Min
Max
Fast mode
(FM)
Min
Max
Fast mode
Plus (FM+)
Min
Max
High Speed mode
(HS)
Min
Max
Unit
0
100
0
400
0
1000
0
3400
kHz
SCL clock low
period
4.7
-
1.3
-
0.5
-
0.320
-
µs
TSCLH
SCL clock high
period
4.0
-
0.6
-
0.26
-
0.120
-
µs
TSU
data setup time
250
-
100
-
50
-
10
-
ns
THD
data hold time
0
-
0
-
0
-
0
150
ns
Tr
rise time
-
1000
-
300
-
120
20
160
ns
TrCL1
rise time 1st clock
20
160
ns
TrCL
rise time clock
(HS)
20
80
ns
Tf
fall time
20
(SCL)
after Sr (HS)
80
-
300
-
300
-
300
160
ns
(SDA)
Table 5-13 I2C I/O pins (I2C0_SCL/SDA, I2C1_SCL/SDA) characteristics
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Figure 5-5 Definition of I2C Timing F/S mode
Figure 5-6 Definition of I2C Timing HS mode
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SPI Master I/O pins dynamic characteristics (Vcc (I/O) = 3.3V)
Parameter
Description
Vcc (I/O) 3.3V
Min
Typ
Unit
Max
TSCLK
SPI clock period
25
ns
TSCLKL
SPI clock low duration
19
ns
TSCLKH
SPI clock high duration
19
ns
TOD
output data delay
19
20
ns
Table 5-14 SPI I/O pins (SPIM_CLK/MOSI/MISO/SS0/SS1/SS2/SS3) characteristics
Figure 5-7 Definition of SPI Master Timing Mode 0
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SPI Slave I/O pins dynamic characteristics (Vcc (I/O) = 3.3V)
Parameter
Description
Min
Vcc (I/O) 3.3V
Typ
Max
Unit
TSCLK
SPI clock period
40
ns
TSCLKL
SPI clock low duration
16
ns
TSCLKH
SPI clock high duration
16
ns
TSAC
SPI access time
20
ns
TOD
output data delay
TZO
output enable delay
10
ns
TOZ
output disable delay
10
ns
TCSH
CS hold time
0
ns
7
27
ns
Table 5-15 SPI I/O pins (SPIS0_CLK/MOSI/MISO/SS, SPIS1_CLK/MOSI/MISO/SS) characteristics
Figure 5-8 Definition of SPI Slave Timing Mode 0
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I2S Master I/O pins dynamic characteristics (Vcc (I/O) = 3.3V)
Parameter
Description
TD(LRCLK)
LRCLK delay
time
TD(SDAO)
Min
Typ
Max
Unit
0
10
ns
SDAO delay
time
0
15
ns
TSU(SDAI)
setup time
10
ns
TH(SDAI)
hold time
10
ns
Conditions
fs = 48kHz BCLK = 256fs
Table 5-16 I2S Master I/O pins (I2S_LRCLK/BCLK/SDAI/SDAO) characteristics
Figure 5-9 Definition of I2S Master Timing
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I2S Slave I/O pins dynamic characteristics (Vcc (I/O) = 3.3V)
Parameter
Description
Min
TSU(LRCLK)
LRCLK setup time
TH(LRCLK)
Typ
Max
Units
Conditions
10
ns
fs = 48kHz BCLK = 256fs
LRCLK hold time
10
ns
TH(SDAO)
SDAO delay time
0
TSU(SDAI)
SDAI setup time
10
ns
TH(SDAI)
SDAI hold time
10
ns
10
ns
Table 5-17 I2S Slave I/O pins (I2S_LRCLK/BCLK/SDAI/SDAO) characteristics
Figure 5-10 Definition of I2S Slave Timing
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SD Host I/O pins dynamic characteristics (Vcc (I/O) = 3.3V)
Parameter
Description
Conditions
Min
Max
TSCLK
clock period
on pin SD_CLK
40
ns
TISU
data input setup time
16
ns
TIH
data input hold time
-2
ns
TZO
data output valid delay time
TOZ
data output hold time
12
0.3
Unit
ns
ns
Table 5-18 SD Host I/O pins (SD_CLK, SD_CMD, SD_DATA3/DATA2/DATA1/DATA0, SD_CD, SD_WP)
characteristics
Figure 5-11 Definition of SD Host Timing
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6
6.1
Application Information
Crystal Oscillator
The crystal oscillator operates at a frequency of 12MHz. The oscillator can operate one of two
following configuration.
6.1.1 Crystal oscillator application circuit
FT900
XI/CLKIN
XIO
XTAL
12MHz
CL
CL
Figure 6-1 Crystal oscillator connection
Feedback resistance is integrated on chip, only a crystal and capacitors C L need to be
connected externally. With the proper selection of crystal, the oscillator circuit can generate
better quality signals for FT900. Parameter CL is typically 27pF but should be checked with the
crystal manufacturer.
6.1.2 External clock input
FT900
XI/CLKIN
XIO
NC
12MHz
Figure 6-2 External clock input
The 12MHz input clock signal connects XI/CLKIN to internal oscillator directly. The XIO pin can
be left unconnected.
6.2
RTC Oscillator
In the RTC oscillator circuit Figure 6-3, only a 32.768 KHz crystal and capacitors CRTCL need to
be connected externally. The parameter CRTCL should be checked with the crystal manufacturer.
An external input clock Figure 6-4 can be connected to RTC_XI/RTC_CLKIN if RTC_XIO is left
open.
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FT900
RTC_XI/
RTC_CLKIN RTC_XIO
XTAL
32.768
KHz
CRTCL
CRTCL
Figure 6-3 RTC 32.768 KHz oscillator connection
FT900
RTC_XI/
RTC_CLKIN RTC_XIO
NC
32.768KHz
Figure 6-4 External 32.768 KHz clock input
6.3
Standard I/O Pin Configuration
Figure 6-5 shows the possible pin modes for standard I/O pins with multiplex functions:
Output driver enabled
Output driver capability control
Output slew rate control
Open drain output
Input with pull-up enabled
Input with pull-down enabled
Input with keeper enabled
Input with Schmitt trigger
The default configuration for standard I/O pins is input with pull-down enabled except GPIO
0/1/2. All I/O pins have ESD protection.
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FT900 I/O
VDDIO
ESD
Slew rate bit
Enable output driver
Data output
PIN
Output driver capability
VDDIO
Pull-up enable bit
ESD
Rpu
Data input
Keeper
Schmitt trigger
Keeper enable bit
PU
Rpd
PD
Pull-down enable bit
Figure 6-5 GPIO I/O ports connection
6.4
USB2.0 Peripheral and Host Interface
The example diagram in Figure 6-6 shows the FT90x series supporting one USB2.0 host port
and one USB2.0 device port, which makes FT90x system data transfer easier via a USB
adapter.
VCC3V3
USB2.0 Host Port
VBUS
R
VBUS
R
(59) PSW_N/GPIO2
R
(58) OC_N/GPIO1
(57) VBUS_DISCHG/
GPIO0
VBUS
H_DM (72)
DM
H_DP (73)
DP
HRREF (75)
GND
R
FT900
USB
R
VBUS_DTC/GPIO3 (60)
VBUS
DM
D_DM (69)
DP
D_DP (70)
DRREF (71)
GND
R
GND
(67) VCC1V2
(68) VUSB3V3
USB2.0 Device
Port
Figure 6-6 USB2.0 ports connection
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The FT90x System shall provide I/O power (+3.3V supply) on VUSB3V3 and core power
(+1.2V supply) on VCC1V2 for the USB2.0 peripheral / host controller. The internal band-gap
gets a reference voltage from DRREF or HRREF with an external reference resistor R (12 KΩ
±1%) respective connected to GND.
The USB2.0 host control will provide a +5V power voltage output for VBUS and go through the
PSW_N signal to control power switching on/off.
6.5
10/100 Mb/s Ethernet Interface
Figure 6-7 shows the 10/100 Mb/s Ethernet port configuration via the transmit (TXON & TXOP)
and receive (RXIN & RXIP) differential pair pins.
FT 900
10/100 Mb/s
Ethernet
TXON ( 83)
R
TXOP ( 82)
R
R
RXIN (81)
R
RXIP (80)
RD -
VETH3 V3
RJ 45
RD +
C
VETH3 V3
TD-
1: 1 Magnetics
Transformer
NC
NC
TD+
C
NC
NC
GND
ENET_ LED1/GPIO5 (62)
R
ENET _LED0 /GPIO4 (61)
R
C
R
GN D
(77) V OUT2
(7 6) VE TH3 V3
(7 9) VE TH3 V3
EREFSET ( 78)
Figure 6-7 10/100Mbps Ethernet Interface
The FT90x Ethernet connection to a termination network should go through a 1:1 magnetics
transformer and an RJ-45. For space saving, the magnetics and RJ-45 may be a single
integrated component. The system shall provide +3.3V power supply for VETH3V3. The
internal regulator will generate +1.2V output on VOUT2. The EREFSET connects an external
resistor R (12 KΩ ±1%) to GND to provide a reference voltage for the Ethernet transceiver.
There are two Ethernet LEDs output for TX/RX transmission, Full-duplex/Half-duplex, Collision,
Link or 10/100 Mb/s Speed indication. The required function should be set in the chip registers
before using the LED indicator.
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6.6
Ethernet Connection when Unused (FT900 & FT901)
If the Ethernet peripheral is not used in the end application, connect VETH3V3 to ground. See
Figure 6-8 and Figure 6-9.
Figure 6-8 Unused Ethernet Connection (QFN)
Figure 6-9 Unused Ethernet Connection (LQFP)
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6.7
USB Connection when Unused (FT900_1_2_3)
If the USB peripheral (Host and Device) is not used in the end application, connect VUSB3V3,
HRREF, and DRREF to ground. See Figure 6-10 and Figure 6-11.
Figure 6-10 Unused USB Connection (QFN)
Figure 6-11 Unused USB Connection (LQFP)
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7
Package Parameters
The FT90x series is available in two different packages. The FT900Q/FT901Q/FT902Q/FT903Q
are the QFN-100 package and the FT900L/FT901L/FT902L/FT903L are in the LQFP-100
package. The dimensions, markings and solder reflow profile for all packages are described in
following sections.
7.1
QFN-100 Package Dimensions
Figure 7-1 QFN-100 Package Dimensions
Note: On the underside of the package, the exposed thermal pad should be connected to GND.
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7.2
QFN-100 Device Marking
7.2.1 FT90XQ Top Side
100
1
FTDI
XXXXXXXXXX
FT90XQ
YYWW-B
Line 1 – FTDI Logo
Line 2 – Wafer Lot Number
Line 3 – FTDI Part Number
Line 4 – Date Code, Revision
Figure 7-2 FT90XQ Top side
Notes:
1. FT90XQ symbol stands for FT900Q, FT901Q, FT902Q and FT903Q.
2. YYWW = Date Code, where YY is year and WW is week number and following character B
indicates the silicon revision B.
3. Marking alignment should be centre justified.
4. Laser marking should be used.
All marking dimensions should be marked proportionally. Marking font should be using standard font
(Roman Simplex).
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7.3
LQFP-100 Package Dimensions
Figure 7-3 LQFP-100 Package Dimensions
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7.4
LQFP-100 Device Marking
7.4.1 FT90XL Top Side
100
1
FTDI
XXXXXXXXXX
FT90XL
YYWW-B
Line 1 – FTDI Logo
Line 2 – Wafer Lot Number
Line 3 – FTDI Part Number
Line 4 – Date Code, Revision
Figure 7-4 FT90XL Top side
Notes:
1. FT90XL symbol stands for FT900L, FT901L, FT902L and FT903L.
2. YYWW = Date Code, where YY is year and WW is week number and following character B
indicates the silicon revision B.
3. Marking alignment should be centre justified.
4. Laser marking should be used.
5. All marking dimensions should be marked proportionally. Marking font should be using standard
font (Roman Simplex).
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7.5
Solder Reflow Profile
The FT90x series is supplied in Pb free QFN-100 and LQFP-100 packages. The recommended solder
reflow profile for all packages options is shown in Figure 7-5.
Temperature, T (Degrees C)
tp
Tp
Critical Zone: when
T is in the range
TL to Tp
Ramp Up
TL
tL
TS Max
Ramp
Down
TS Min
tS
Preheat
25
T = 25º C to TP
Time, t (seconds)
Figure 7-5 FT900 Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in
Table 7-1 . Values are shown for both a completely Pb free solder process (i.e. the FT900 is used with Pb
free solder), and for a non-Pb free solder process (i.e. the FT900 is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
- Temperature Min (Ts Min.)
150°C
100°C
- Temperature Max (Ts Max.)
200°C
150°C
- Time (ts Min to ts Max)
60 to 120 seconds
60 to 120 seconds
217°C
183°C
60 to 150 seconds
60 to 150 seconds
260°C
240°C
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
6°C / second Max.
Time for T= 25°C to Peak Temperature, Tp
8 minutes Max.
6 minutes Max.
Preheat
Time Maintained Above Critical Temperature
TL:
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak Temperature
(tp)
Table 7-1 Reflow Profile Parameter Values
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8
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
BCD
Battery Charge Device
CAN
Controller Area Network
CDP
Charging Downstream Port
CPI
Camera Parallel Interface
DAC
Digital-to-Analog Converter
DAQ
Data Acquisition
DCP
Dedicated Charging Port
DNL
Differential Nonlinearity
FCS
Ethernet Frame Check Sequence
FIFO
First In First Out
GPIO
General Purpose Input / Output
INL
Integral Nonlinearity
I/O
Input / Output
LQFP
Low profile Quad Flat Package
LSB
Least Significant Bit
MMC
Multimedia Card
MSPS
Mega Samples Per Second
NMI
Non-Maskable Interrupt input
POR
Power On Reset
PWM
Pulse Width Modulator
QFN
Quad Flat No-Lead
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RTC
Real Time Clock
SD
Secure Digital
SDIO
Secure Digital Input Output
SDP
Standard Downstream Port
SPI
Serial Peripheral Interface
UART
Universal Asynchronous Receiver/Transmitter
UHS
Ultra High Speed
USB
Universal Serial Bus
Table 8-1 Abbreviations
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9
FTDI Chip Contact Information
Head Office – Glasgow, UK
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
sales1@ftdichip.com
support1@ftdichip.com
admin1@ftdichip.com
Branch Office – Tigard, Oregon, USA
7130 SW Fir Loop
Tigard, OR 97223
USA
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-Mail (Sales)
E-Mail (Support)
E-Mail (General Enquiries)
us.sales@ftdichip.com
us.support@ftdichip.com
us.admin@ftdichip.com
Branch Office – Shanghai, China
Branch Office – Taipei, Taiwan
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan, R.O.C.
Tel: +886 (0) 2 8797 1330
Fax: +886 (0) 2 8751 9737
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
tw.sales1@ftdichip.com
tw.support1@ftdichip.com
tw.admin1@ftdichip.com
Room 1103, No. 666 West Huaihai Road,
Changning District
Shanghai, 200052
China
Tel: +86 21 62351596
Fax: +86 21 62351595
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
cn.sales@ftdichip.com
cn.support@ftdichip.com
cn.admin@ftdichip.com
Web Site
http://ftdichip.com
System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology
Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level
performance requirements. All application-related information in this document (including application descriptions, suggested
FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this
information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications
assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the
user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from
such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is
implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product
described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent
of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park,
Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640
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Appendix A – References
Useful Application Notes
AN_324 FT900_User_Manual
AN_341 FT32_Technical_Manual
Appendix B - List of Figures and Tables
List of Figures
Figure 2-1 FT900 Block Diagram ..................................................................................................... 4
Figure 3-1 Pin Configuration FT900Q (top-down view) ....................................................................... 8
Figure 3-2 Pin Configuration FT901Q (top-down view) ....................................................................... 9
Figure 3-3 Pin Configuration FT902Q (top-down view) ..................................................................... 10
Figure 3-4 Pin Configuration FT903Q (top-down view) ..................................................................... 11
Figure 3-5 Pin Configuration FT900L (top-down view) ..................................................................... 12
Figure 3-6 Pin Configuration FT901L (top-down view) ..................................................................... 13
Figure 3-7 Pin Configuration FT902L (top-down view) ..................................................................... 14
Figure 3-8 Pin Configuration FT903L (top-down view) ..................................................................... 15
Figure 5-1 USB Rise and Fall Times for DP/DM ............................................................................... 44
Figure 5-2 100Base-TX Tr/f Timing ................................................................................................ 45
Figure 5-3 100Base-TX Jitter Timing ............................................................................................. 45
Figure 5-4 100Base-TX Transmission Waveform ............................................................................. 46
Figure 5-5 Definition of I2C Timing F/S mode ................................................................................. 47
Figure 5-6 Definition of I2C Timing HS mode .................................................................................. 47
Figure 5-7 Definition of SPI Master Timing Mode 0 .......................................................................... 48
Figure 5-8 Definition of SPI Slave Timing Mode 0 ............................................................................ 49
Figure 5-9 Definition of I2S Master Timing ...................................................................................... 50
Figure 5-10 Definition of I2S Slave Timing ...................................................................................... 51
Figure 5-11 Definition of SD Host Timing ....................................................................................... 52
Figure 6-1 Crystal oscillator connection ......................................................................................... 53
Figure 6-2 External clock input ..................................................................................................... 53
Figure 6-3 RTC 32.768 KHz oscillator connection ............................................................................ 54
Figure 6-4 External 32.768 KHz clock input .................................................................................... 54
Figure 6-5 GPIO I/O ports connection ............................................................................................ 55
Figure 6-6 USB2.0 ports connection .............................................................................................. 55
Figure 6-7 10/100Mbps Ethernet Interface ..................................................................................... 56
Figure 6-8 Unused Ethernet Connection (QFN) ............................................................................... 57
Figure 6-9 Unused Ethernet Connection (LQFP) .............................................................................. 57
Figure 6-10 Unused USB Connection (QFN) .................................................................................... 58
Figure 6-11 Unused USB Connection (LQFP) ................................................................................... 58
Figure 7-1 QFN-100 Package Dimensions ....................................................................................... 59
Figure 7-2 FT90XQ Top side ......................................................................................................... 60
Figure 7-3 LQFP-100 Package Dimensions ..................................................................................... 61
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Figure 7-4 FT90XL Top side .......................................................................................................... 62
Figure 7-5 FT900 Solder Reflow Profile .......................................................................................... 63
List of Tables
Table 1-1 FT90x series Part Numbers .............................................................................................. 3
Table 3-1 FT900 pin description .................................................................................................... 23
Table 4-1 FT90x series default interrupt priority ............................................................................. 27
Table 4-2 FT90x series I/O memory mapping ................................................................................. 28
Table 5-1 Absolute Maximum Ratings ........................................................................................... 37
Table 5-2 Operating Voltage and Current ....................................................................................... 38
Table 5-3 Digital I/O Pin Characteristics (VCCIO3V3 = +3.3V, Standard Drive Level) .......................... 39
Table 5-4 USB I/O Pin (D_DP/D_DM, H_DP/H_DM) Characteristics ................................................... 40
Table 5-5 Ethernet I/O pin (TXON/TXOP, RXIN/RXIP) characteristics ................................................. 41
Table 5-6 DAC I/O pin (DAC_REFP, DAC0/1) characteristics ............................................................. 41
Table 5-7 ADC I/O Pin Characteristics ........................................................................................... 42
Table 5-8 EFUSE I/O Pin Characteristics ........................................................................................ 42
Table 5-9 System clock characteristics .......................................................................................... 43
Table 5-10 RTC clock characteristics ............................................................................................. 43
Table 5-11 Analog I/O pins (D_DP/D_DM, H_DP/H_DM) characteristics ............................................. 44
Table 5-12 Analog I/O pins (TXON/TXOP, RXIN/RXIP) characteristics ................................................ 45
Table 5-13 I2C I/O pins (I2C0_SCL/SDA, I2C1_SCL/SDA) characteristics .......................................... 46
Table 5-14 SPI I/O pins (SPIM_CLK/MOSI/MISO/SS0/SS1/SS2/SS3) characteristics ........................... 48
Table 5-15 SPI I/O pins (SPIS0_CLK/MOSI/MISO/SS, SPIS1_CLK/MOSI/MISO/SS) characteristics ........ 49
Table 5-16 I2S Master I/O pins (I2S_LRCLK/BCLK/SDAI/SDAO) characteristics ................................... 50
Table 5-17 I2S Slave I/O pins (I2S_LRCLK/BCLK/SDAI/SDAO) characteristics..................................... 51
Table 5-18 SD Host I/O pins (SD_CLK, SD_CMD, SD_DATA3/DATA2/DATA1/DATA0, SD_CD, SD_WP)
characteristics ............................................................................................................................ 52
Table 7-1 Reflow Profile Parameter Values ..................................................................................... 63
Table 8-1 Abbreviations ............................................................................................................... 65
Copyright © 2015 Future Technology Devices International Limited
68
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.1
Document No.: FT_000965 Clearance No.: FTDI#421
Appendix C - Revision History
Document Title:
FT900/1/2/3 Embedded Microcontroller Datasheet
Document Reference No.:
FT_000965
Clearance No.:
FTDI#421
Product Page:
http://www.ftdichip.com/FTProducts.htm
Document Feedback:
DS_FT900_1_2_3
Version 1.0
Initial draft release
24 Feb 2014
Version 1.1
Full release
24 Sept 2015
Copyright © 2015 Future Technology Devices International Limited
69
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