UMFT602X

UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Future Technology Devices International Ltd UMFT602A/ UMFT602X The UMFT602A/X is an evaluation/development module with either HSMC or FMC (LPC) connectors for interfacing FTDI’s FT602 32bit FIFO bus to USB 3.1 GEN 1 USB video class (UVC) bridge IC with external hardware. The UMFT602A/X allows for bridging a FIFO bus to a USB3.0 host and evaluating the functionality of the FT602. As a daughter card, the UMFT602A/X must work with a FIFO master board which has either a HSMC or FMC connector. There are 2 models which provide different FIFO bus interfaces with 32bit data width. The modules are designed such that they can plug into most FPGA development platforms supplied by vendors such as Xilinx or Altera. Refer to Ordering Information for module options. The UMFT602A/X supports 2 parallel slave FIFO bus protocols (Multi-Channel FIFO / 245 Synchronous FIFO) with a data “burst” rate of up to 400MB/s. For a full list of the FT602’s features refer to the FT602 datasheet. The UMFT602A/X module has the following features:  Supports USB 3.1 GEN 1 Super Speed (5Gbps)/USB 2.0 High Speed (480Mbps) transfer  UVC 1.1, resolutions  Up to 4 video input channels. One I2C bus master interface for video source device configuration  Supports multi voltage I/O: 1.8V, 2.5V and 3.3V  High speed connector for FIFO bus : FMC(Field Programmable Mezzanine Card) or HSMC (High Speed Mezzanine Card)  FMC connector is compatible with most Xilinx FPGA reference design boards  HSMC is compatible with most Altera FPGA reference design boards  Multi powered options: external DC powered, BUS powered, FMC/HSMC powered  Hardware Reset  Micro-USB3.0 receptacle, USB3.0 compliant and certified Raw YUV422, support 14 UVC Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology Devices International Ltd will not accept any claim for damages howsoever arising as a result of u se or failure of this product. Your statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in which the failure of the product might reasonably be expected to result in personal injury. Th is document provides preliminary information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH United Kingdom. Scotland Registered Company Number: SC136640 Copyright © Future Technology Devices International Limited 1 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 1 Ordering Information Part No. Description UMFT602A-B 32 Bit FIFO bus, HSMC connector UMFT602X-B 32 Bit FIFO bus, FMC(Low Pin Count) connector Table 1.1 UMFT60xx Ordering Information Copyright © Future Technology Devices International Limited 2 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Table of Contents 1 Ordering Information ................................................ 2 2 Hardware Description ................................................ 4 2.1 Physical Description ............................................................5 2.1.1 Dimensions ........................................................................................ 5 2.2 Connectors, Jumpers and Push Buttons ..............................7 2.2.1 CN1 - Micro USB3.0 Receptacle ............................................................ 7 2.2.2 CN2 – POWER JACK 2.1MM .................................................................. 7 2.2.3 JP1 – External/VBUS Powered Selection ................................................. 7 2.2.4 JP2 – VCC33 Selection ......................................................................... 8 2.2.5 JP3, JP6– VCCIO Selection ................................................................... 8 2.2.6 SW1, SW2 – Push Buttons for Reset and Remote Wake Up ...................... 8 2.2.7 CN4 – FMC / HSMC FIFO bus interface connector .................................... 8 3 Board Schematics .................................................... 13 4 Hardware Setup Guide ............................................. 17 4.1 Power Configuration.......................................................... 17 4.2 Jumpers Default Position .................................................. 17 4.3 Power Consumption .......................................................... 18 5 Contact Information ................................................ 19 Appendix A – References ............................................. 20 Document References ............................................................... 20 Acronyms and Abbreviations..................................................... 20 Appendix B – List of Tables & Figures .......................... 21 List of Tables.............................................................................21 List of Figures ...........................................................................21 Appendix C – Revision History ..................................... 22 Copyright © Future Technology Devices International Limited 3 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 2 Hardware Description Figure 2-1 UMFT602A Module Top and Bottom View Figure 2-2 UMFT602X Module Top and Bottom View The main functions of the UMFT602A/X module are as follows:        Provides Multi-channel FIFO mode and 245 Synchronous FIFO mode Protocols. YUV422 uncompressed format is supported. FIFO clock: 100MHz, driven by FT602. High speed FIFO bus interface: FMC (Low Pin Count) and HSMC optional. See Ordering Information. Jumper’s selection allowing powered options: VBUS-powered, External DC-powered, FIFO master board-powered. Multi voltage VCCIO option: 1.8V, 2.5V, 3.3V, default is 2.5V. Hardware reset and System wake up. Copyright © Future Technology Devices International Limited 4 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 2.1 Physical Description The UMFT602A and UMFT602X modules dimensions are illustrated in Figure 2.5 to Figure 2.8. 2.1.1 Dimensions Figure 2-3 UMFT602A Dimensions (Top view) Figure 2-4 UMFT602A Dimensions (Side view) ±0.10mm Tolerance Copyright © Future Technology Devices International Limited 5 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Figure 2-5 UMFT602X Dimensions (Top view) Figure 2-6 UMFT602X Dimensions (Side view) ±0.10mm Tolerance Copyright © Future Technology Devices International Limited 6 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 2.2 Connectors, Jumpers and Push Buttons Connectors, jumpers and push buttons are described in the following sections. 2.2.1 CN1 - Micro USB3.0 Receptacle Pin No. Name Type Description 1 VBUS P 5V DC power supply 2 D- IO USB D- line 3 D+ IO USB D+ line 4 ID IO OTG identification(N.C.) 5 GND P Ground 6 SSTX- O Super Speed USB transmitter differential pair (-) 7 SSTX+ O Super Speed USB transmitter differential pair(+) 8 GND P Ground 9 SSRX- I Super Speed USB receiver differential pair (-) 10 SSRX+ I Super Speed USB receiver differential pair (+) Table 2.1 CN1 - Micro USB3.0 Pin-out 2.2.2 CN2 – POWER JACK 2.1MM Optional external DC 5V input. Pin No. Name Type Description 1 5V P 5V power supply 2 GND P Ground 3 GND P Ground Table 2.2 CN2 – POWER JACK 2.1MM 2.2.3 JP1 – External/VBUS Powered Selection Select whether the module power is supplied by an external DC 5V or VBUS. Note this setting must be chosen in conjunction with the JP2 setting. Default is open. [Note] Jumper position Description Short pin 1-2 Select VBUS Power Short pin 2-3 Select external DV 5V Table 2.3 JP1 – 5V input Options Copyright © Future Technology Devices International Limited 7 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 2.2.4 JP2 – VCC33 Selection Select whether the module main power is supplied by DC5V or the FIFO master board DC3.3V.[Note] Jumper position Description Short pin 1-2 Select powered by external DV5V or VBUS Short pin 2-3 Select powered by FIFO master Board(default) Table 2.4 JP3 – VCC33 Option 2.2.5 JP3, JP6– VCCIO Selection Select the IO voltage level. [Note] Jumper position Description JP3 JP6 Short pin 1-2 Open VCCIO=2.5V(default) Short pin 2-3 Open VCCIO=1.8V Open Short VCCIO=3.3V Table 2.5 JP3 – VCCIO Option Note: Refer to section 4 Hardware setup guide for more details on power configuration options and jumpers positions. JP6 is not fitted on the PCB. 2.2.6 SW1, SW2 – Push Buttons for Reset and Remote Wake Up SW1 – Reset, module hardware reset, mapped to FMC/HSMC connector, can be used for FIFO master reset. Drive low when press down. SW2 – FT602 device Wake Up, driven low when pressed down. This pin mapped is to the FMC/HSMC connector, and is normally used for I2C interrupt. 2.2.7 CN4 – FMC / HSMC FIFO bus interface connector 2.2.7.1 FMC connector configurations- UMFT602X Module FMC Pin#/Name UMFT602X U1: FT602 Pin#/Name C14/LA10_P 16 /INT_N/Wake Up_N C15/LA10_N 15 /RESET_N C18/LA14_P 17 /I2C_SCL C19/LA14_N 18 /I2C_SDA Copyright © Future Technology Devices International Limited 8 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 FMC Pin#/Name Clearance No.: FTDI#518 UMFT602X U1: FT602 Pin#/Name C22/LA18_P_CC 68 /D_CLK (FIFO bus clock,FT602 output) C26/LA27_P 62 /DATA18 C27_LA27_N 60 /DATA16 D14/LA09_P 8 /BE_N_3 D15/LA09_N 7 /BE_N_2 D20/LA17_P_CC 76 /DATA31 D21/LA17_N_CC 75 /DATA30 D23/LA23_P 70 /DATA25 D24/LA23_N 69 /DATA24 D26/LA26_P 63 /DATA19 D27/LA26_N 61 /DATA17 G6/LA00_P_CC 13 /RESERVE3 G7/LA00_N_CC 12 /RESERVE2 G12/LA08_P 11 /WR_N G13/LA08_N 10 /RESERVE1 G21/LA20_P 74 /DATA29 G22/LA20_N 73 /DATA28 G24/LA22_P 67 /DATA23 G25/_LA22_N 65 /DATA21 G27/LA25_P 57 /DATA15 G28/LA25_N 55 /DATA13 G30/LA29_P 53 /DATA11 G31/LA29_N 51 /DATA9 G33/LA31_P 47 /DATA7 G34/LA31_N 45 /DATA5 G36/LA33_P 43 /DATA3 G37/LA33_N 41 /DATA1 H13/LA07_P 9 /RXF_N Copyright © Future Technology Devices International Limited 9 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 FMC Pin#/Name Clearance No.: FTDI#518 UMFT602X U1: FT602 Pin#/Name H14/LA07_N 8 /TXE_N H19/LA15_P 5 /BE_N_1 H20/LA15_N 4 /BE_N_0 H22/LA19_P 72 /DATA27 H23/LA19_N 71 /DATA26 H25/LA21_P 66 /DATA22 H26/LA21_N 64 /DATA20 H28/LA24_P 56 /DATA14 H29/LA24_N 54 /DATA12 H31/LA28_P 52 /DATA10 H32/LA28_N 50 /DATA8 H34/LA30_P 46 /DATA6 H35/LA30_N 44 /DATA4 H37/LA32_P 42 /DATA2 H38/LA32_N 40 /DATA0 Table 2.6 CN4 – FMC connector configuration for FIFO bus 2.2.7.2 CN4 – HSMC connector configurations-UMFT602A Module UMFT602A HSMC Pin#/Name U1: FT602 Pin#/Name 40 /CLKIN0 68 /D_CLK (FIFO bus clock,FT602 output) 41 /D0 40 /DATA0 42 /D1 60 /DATA16 43 /D2 41 /DATA1 44 /D3 61 /DATA17 47 /D4 42 /DATA2 48 /D5 62 /DATA18 49 /D6 43 /DATA3 Copyright © Future Technology Devices International Limited 10 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 UMFT602A HSMC Pin#/Name U1: FT602 Pin#/Name 50 /D7 63 /DATA19 53 /D8 44 /DATA4 54 /D9 64 /DATA20 55 /D10 45 /DATA5 56 /D11 65 /DATA21 59 /D12 46 /DATA6 60 /D13 66 /DATA22 61 /D14 47 /DATA7 62 /D15 67 /DATA23 65 /D16 50 /DATA8 66 /D17 69 /DATA24 67 /D18 51 /DATA9 68 /D19 70 /DATA25 71 /D20 52 /DATA10 72 /D21 71 /DATA26 73 /D22 53 /DATA11 74 /D23 72 /DATA27 77 /D24 54 /DATA12 78 /D25 73 /DATA28 79 /D26 55 /DATA13 80 /D27 74 /DATA29 83 /D28 56 /DATA14 84 /D29 75 /DATA30 85 /D30 57 /DATA15 86 /D31 76 /DATA31 101 /D40 4 /BE_N_0 102 /D41 8 /TXE_N 103 /D42 5 /BE_N_1 Copyright © Future Technology Devices International Limited 11 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 UMFT602A HSMC Pin#/Name U1: FT602 Pin#/Name 104 /D43 9 /RXF_N 107 /D44 7 /BE_N_2 108 /D45 10 /RESERVE1 109 /D46 8 /BE_N_3 110 /D47 11 /WR_N 113 /D48 18 /I2C_SDA 114 /D49 12 /RESERVE2 115 /D50 17 /I2C_SCL 116 /D51 13 /RESERVE3 119 /D52 15 /RESET_N 121 /D54 16 / INT_N/Wake up_N Table 2.7 CN4 – HSMC connector configuration for FIFO bus Note: Refer to the FT602 device datasheet section 3 for details of the device pin out and signal descriptions. The reserved pins (Pin10, Pin12, and Pin13) are connected to the FIFO master via the FMC/HSMC connector, the FIFO master IOs whose connect to these pins should be configured to pull up in the normal operation. Copyright © Future Technology Devices International Limited 12 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 3 Board Schematics Figure 3-1 Schematics: Power Supply for UMFT602A/UMFT602X Copyright © Future Technology Devices International Limited 13 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Figure 3-2 Schematics: FIFO TO USB3.0 UVC Bridge_UMFT602A/UMFT602X Copyright © Future Technology Devices International Limited 14 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Figure 3-3 Schematics: HSMC_UMFT602A Copyright © Future Technology Devices International Limited 15 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Figure 3-4 Schematics: FMC_UMFT602X Copyright © Future Technology Devices International Limited 16 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 4 Hardware Setup Guide 4.1 Power Configuration There are 3 methods of powering the UMFT602A/UMFT602X module. 1) FIFO master board Power (3.3V)-Connect the UMFT602A/UMFT602X board to the FIFO master board that has the standard configuration HSMC female or FMC (LPC or HPC) connector. This method is the default setting and is recommended. 2) USB Power (5V) - Connect USB power by micro-USB3.0 or micro-USB2.0 cable to CN1. 3) DC IN (5V) - Connect DC 5V to CN2. The following table summarizes how to power the UMFT60xx module using the various methods. Power Method CN1 CN2 JP1 JP2 JP3 and JP6 FIFO master board Power(Default and Recommended) - N.C. Open Short pin 2-3 Follow FIFO master IO voltage. USB Power 5V N.C. Short pin1-2 Short pin1-2 DC IN(5V) - 5V Short pin2-3 Short pin1-2 Default: JP3 short pin1-2 VCCIO=2.5V Table 4.1 Board Power Configuration 4.2 Jumpers Default Position Jumper JP1 JP2 JP3 Default Position Open 2-3 1-2 Table 4.2 Jumpers Default Position Copyright © Future Technology Devices International Limited 17 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Figure 4.1 shows the Jumpers’ locations on the PCBs. Figure 4-1 Jumpers Locations 4.3 Power Consumption Parameter Description Minimum Typical Maximum Units Conditions IVCC_1 VCC Operating Supply Current - 195 - mA Function Mode IVCC_2 VCC Operating Supply Current - 7.0 - mA Suspend Mode IVBUS1 VBUS Operating Current - 0.34 - mA DC/HSMC/FMC Powered, Function and Suspend Mode IVBUS2 VBUS Operating Current - 191 - mA VBUS-Powered Powered, Function Mode IVBUS3 VBUS Operating Current - 7.3 - mA VBUS-Powered Powered, Suspend Mode Table 4.3 Power Consumption Copyright © Future Technology Devices International Limited 18 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 5 Contact Information Head Office – Glasgow, UK Branch Office – Tigard, Oregon, USA Future Technology Devices International Limited Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 Future Technology Devices International Limited (USA) 7130 SW Fir Loop Tigard, OR 97223-8160 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) sales1@ftdichip.com support1@ftdichip.com admin1@ftdichip.com E-Mail (Sales) E-Mail (Support) E-Mail (General Enquiries) us.sales@ftdichip.com us.support@ftdichip.com us.admin@ftdichip.com Branch Office – Taipei, Taiwan Branch Office – Shanghai, China Future Technology Devices International Limited (Taiwan) 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan , R.O.C. Tel: +886 (0) 2 8797 1330 Fax: +886 (0) 2 8751 9737 Future Technology Devices International Limited (China) Room 1103, No. 666 West Huaihai Road, Shanghai, 200052 China Tel: +86 21 62351596 Fax: +86 21 62351595 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) E-mail (Sales) E-mail (Support) E-mail (General Enquiries) tw.sales1@ftdichip.com tw.support1@ftdichip.com tw.admin1@ftdichip.com cn.sales@ftdichip.com cn.support@ftdichip.com cn.admin@ftdichip.com Web Site http://ftdichip.com Distributor and Sales Representatives Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country. System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level performance requirements. All application-related information in this document (including application descriptions, suggested FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640 Copyright © Future Technology Devices International Limited 19 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Appendix A – References Document References FT602 datasheet: DS_FT602Q FT60X PCB Layout Guidelines: AN_430 FT60X PCB Layout Guidelines FT602 Chip Configuration Utility Acronyms and Abbreviations Terms Description FIFO First In First Out FMC Field Programmable Mezzanine Card HPC High Pin Count HSMC IO High Speed Mezzanine Card Input Output LPC Low Pin Count USB Universal Serial Bus Copyright © Future Technology Devices International Limited 20 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Appendix B – List of Tables & Figures List of Tables Table 1.1 UMFT60xx Ordering Information ............................................................................. 2 Table 2.1 CN1 - Micro USB3.0 Pin-out.................................................................................... 7 Table 2.2 CN2 – POWER JACK 2.1MM .................................................................................... 7 Table 2.3 JP1 – 5V input Options .......................................................................................... 7 Table 2.4 JP3 – VCC33 Option .............................................................................................. 8 Table 2.5 JP3 – VCCIO Option............................................................................................... 8 Table 2.6 CN4 – FMC connector configuration for FIFO bus .................................................... 10 Table 2.7 CN4 – HSMC connector configuration for FIFO bus ................................................. 12 Table 4.1 Board Power Configuration ................................................................................... 17 Table 4.2 Jumpers Default Position ...................................................................................... 17 Table 4.3 Power Consumption ............................................................................................ 18 List of Figures Figure 2-1 UMFT602A Module Top and Bottom View ............................................................... 4 Figure 2-2 UMFT602X Module Top and Bottom View ............................................................... 4 Figure 2-3 UMFT602A Dimensions (Top view) ........................................................................ 5 Figure 2-4 UMFT602A Dimensions (Side view) ....................................................................... 5 Figure 2-5 UMFT602X Dimensions (Top view) ........................................................................ 6 Figure 2-6 UMFT602X Dimensions (Side view) ....................................................................... 6 Figure 3-1 Schematics: Power Supply for UMFT602A/UMFT602X ............................................. 13 Figure 3-2 Schematics: FIFO TO USB3.0 UVC Bridge_UMFT602A/UMFT602X ............................ 14 Figure 3-3 Schematics: HSMC_UMFT602A ............................................................................ 15 Figure 3-4 Schematics: FMC_UMFT602X .............................................................................. 16 Figure 4-1 Jumpers Locations ............................................................................................. 18 Copyright © Future Technology Devices International Limited 21 UMFT602X Module Datasheet Version 1.1 Document Reference No.: FT_001390 Clearance No.: FTDI#518 Appendix C – Revision History Document Title: UMFT602X Module Datasheet Document Reference No.: FT_001390 Clearance No.: FTDI#518 Product Page: http://www.ftdichip.com/Products/Modules/ Document Feedback: Send Feedback Revision Changes Date 1.0 Initial Release 2017-02-21 1.1 Updated features/part numbers according to FT602Q Rev-B change 2017-11-23 Copyright © Future Technology Devices International Limited 22