1MB30-060,1MBH30D-060, 600V / 30A Molded Package
Features
· Small molded package · Low power loss · Soft switching with low switching surge and noise · High reliability, high ruggedness (RBSOA, SCSOA etc.) · Comprehensive line-up
Molded IGBT
Applications
· Inverter for Motor drive · AC and DC Servo drive amplifier · Uninterruptible power supply
Maximum ratings and characteristics
Absolute maximum ratings (at Tc=25°C unless otherwise specified) 1MB30-060 / IGBT
Item Collector-Emitter voltage Gate-Emitter voltaga Collector DC Tc=25°C current Tc=80°C 1ms Tc=25°C Max. power dissipation(IGBT) Operating temperature Storage temperature Screw torque Symbol VCES VGES IC25 IC80 Icp PC Tj Tstg Rating 600 ±20 48 30 192 180 +150 -40 to +150 50 Unit V V A A A W °C °C N·cm
Equivalent Circuit Schematic
IGBT
C:Collector
G:Gate
E:Emitter
1MBH30D-060 / IGBT+FWD
Item Collector-Emitter voltage Gate-Emitter voltaga Collector DC Tc=25°C current Tc=100°C 1ms Tc=25°C Max. power dissipation (IGBT) Max. power dissipation (FWD) Operating temperature Storage temperature Screw torque Symbol VCES VGES IC25 IC100 Icp PC PC Tj Tstg Rating 600 ±20 58 30 232 220 120 +150 -40 to +150 70 Unit V V A A A W W °C °C N·cm IGBT + FWD
C:Collector
G:Gate
E:Emitter
1MB30-060, 1MBH30D-060
Electrical characteristics (at Tj=25°C unless otherwise specified) 1MB30-060 / IGBT
I tem Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Turn-on time Turn-off time Symbol ICES IGES VGE(th) VCE(sat) Cies Coes Cres ton tr toff tf Characteristics Min. Typ. – – 5.5 – – – – – – – – – – – – 1900 400 100 – – – – Conditions Max. 1.0 20 8.5 3.0 – – – 1.2 0.6 1.0 0.35 VGE=0V, VCE=600V VCE=0V, VGE=±20V VCE=20V, IC=30mA VGE=15V, IC=30A VGE=0V VCE=10V f=1MHz VCC=300V IC=30A VGE=±15V RG=82 ohm (Half Bridge)
Molded IGBT
Unit mA µA V V pF
µs
1MBH30D-060 / IGBT+FWD
Item Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Turn-on time Turn-off time FWD forward on voltage Reverse recovery time Symbol ICES IGES VGE(th) VCE(sat) Cies Coes Cres ton tr toff tf VF trr Characteristics Min. Typ. – – 5.5 – – – – – – – – – – – – – – 1900 400 100 – – – – – – Conditions Max. 1.0 20 8.5 3.0 – – – 1.2 0.6 1.0 0.35 3.0 0.3 VGE=0V, VCE=600V VCE=0V, VGE=±20V VCE=20V, IC=30mA VGE=15V, IC=30A VGE=0V V CE=10V f=1MHz VCC=300V, IC=30A VGE=±15V RG=82 ohm (Half Bridge) IF=30A, VGE=0V IF=30A, VGE=-10V, di/dt=100A/µs mA µA V V pF Unit
µs
V µs
Thermal resistance characteristics 1MB30-060 / IGBT
Item Thermal resistance Symbol Rth(j-c) Characteristics Min. Typ. – – Conditions Max. 0.69 IGBT °C/W Unit
1MBH30D-060 / IGBT+FWD
Item Thermal resistance Symbol Rth(j-c) Rth(j-c) Characteristics Min. Typ. – – – – Conditions Max. 0.56 1.04 IGBT FWD °C/W °C/W Unit
Outline drawings, mm
1MB30-060 TO-3P 1MBH30D-060 TO-3PL
1MB30-060, 1MBH30D-060
Characteristics
1MB30-060,1MBH30D-060 Collector current vs. Collector-Emitter voltage Tj=25°C
100 100
Molded IGBT
Collector current vs. Collector-Emitter voltage Tj=125°C
80
Collector current : Ic [A] Collector current : Ic [A]
80
60
60
40
40
20
20
0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
Collector-Emitter vs. Gate-Emitter voltage Tj=25°C
10 10
Collector-Emitter vs. Gate-Emitter voltage Tj=125°C
Collector-Emitter voltage : VCE [V]
8
Collector-Emitter voltage : VCE [V]
8
6
6
4
4
2
2
0 0 5 10 15 20 Gate-Emitter voltage : VGE [V]
0 0 5 10 15 20 Gate-Emitter voltage : VGE [V]
Switching time vs. Collector current Vcc=300V, RG=82 ohm, VGE=±15V, Tj=25°C
1000 1000
Switching time vs. Collector current Vcc=300V, RG=82 ohm, VGE=±15V, Tj=125°C
Switching time : ton, tr, toff, tf [n sec.]
Switching time : ton, tr, toff, tf [n sec.]
100
100
10 0 10 20 30 40 50 Collector current : Ic [A]
10 0 10 20 30 40 50 Collector current : Ic [A]
1MB30-060, 1MBH30D-060
Characteristics
1MB30-060,1MBH30D-060 Switching time vs. RG Vcc=300V, Ic=30A, VGE=±15V, Tj=25°C Switching time vs. RG
IGBT Module
Vcc=300V, Ic=30A, VGE=±15V, Tj=125°C
Switching time : ton, tr, toff, tf [n sec.]
Switching time : ton, tr, toff, tf [n sec.]
1000
1000
100
100
10 0 100 200 300 400 Gate resistance : RG [ohm]
10 0 100 200 300 400 Gate resistance : RG [ohm]
Dynamic input characteristics
500
Capacitance vs. Collector-Emitter voltage
25
Tj=25°C
Tj=25°C
Collector-Emitter voltage : VCE [V]
400
Capacitance : Cies, Coes, Cres [nF]
20
1000
300
15
200
10
Gate-Emitter voltage : VGE [V]
100
100
5
0 0 20 40 60 80 100 Gate charge : Qg [nC] 120 140 160
0
10 0 5 10 15 20 25 Collector-Emitter voltage : VCE [V] 30 35
70
Reversed biased safe operating area < > +VGE=15V, -VGE = 15V, Tj < 125°C, RG = 82 ohm =
500
Typical short circuit capability Vcc=400V, RG=82 ohm, Tj=125°C
50
60
Collector current : Ic [A]
50
Short circuit time current : Isc [A]
400
40
40
300
30
30
200
20
20
100 10
10
0
0
0
0
100
200
300
400
500
600
700
5
10
Collector-Emitter voltage : VCE [V]
15 Gate voltage : VGE [V]
20
25
Short circuit time : tsc [µs]
1MB30-060, 1MBH30D-060
Characteristics
1MB30-060,1MBH30D-060 Transient thermal resistance
IGBT Module
Thermal resistance : Rth (j-c) [°C/W]
100
10-1
10-2
10-3 10-4 10-3 10-2 Pulse width : PW [sec.] 10-1 100
1MBH30D-060 Reverse recovery time vs. Forward current -di/dt=90A / µsec
400
8
Reverse recovery current vs. Forward current -di/dt=90A / µsec
300
6
reverse recovery time : trr [nsec]
200
reverse recovery current : Irr [A]
4
100
2
0 0 10 20 Forward current : IF [A] 30 40 50
0
0
10
20
30
40
50
Forward current : IF [A]
Forward current vs. Foeward voltage
500
100
Reverse recovery time characteristics vs. -di/dt IF=30A, Tj=125°C
25
400
80
20
reverse recovery time : trr [nsec]
300
15
60
Forward current : IF [A]
40
200
10
20
100
5
0
0 0 1.0 2.0 3.0 4.0 5.0 0 100 200 -di/dt 300 [ A / µsec ] 400 500 Forward voltage : VF [V]
0
reverse recovery current : Irr [A]