1MBH50-060,1MBH50D-060, 600V / 50A Molded Package
Features
· Small molded package · Low power loss · Soft switching with low switching surge and noise · High reliability, high ruggedness (RBSOA, SCSOA etc.) · Comprehensive line-up
Molded IGBT
Applications
· Inverter for Motor drive · AC and DC Servo drive amplifier · Uninterruptible power supply
Maximum ratings and characteristics
Absolute maximum ratings (at Tc=25°C unless otherwise specified) 1MBH50-060 / IGBT
Item Collector-Emitter voltage Gate-Emitter voltaga Collector DC Tc=25°C current Tc=100°C 1ms Tc=25°C Max. power dissipation(IGBT) Operating temperature Storage temperature Screw torque Symbol VCES VGES IC25 IC100 Icp PC Tj Tstg Rating 600 ±20 82 50 328 310 +150 -40 to +150 70 Unit V V A A A W °C °C N·cm
Equivalent Circuit Schematic
IGBT
C:Collector
G:Gate
E:Emitter
1MBH50D-060 / IGBT+FWD
Item Collector-Emitter voltage Gate-Emitter voltaga Collector DC Tc=25°C current Tc=100°C 1ms Tc=25°C Max. power dissipation (IGBT) Max. power dissipation (FWD) Operating temperature Storage temperature Screw torque Symbol VCES VGES IC25 IC100 Icp PC PC Tj Tstg Rating 600 ±20 82 50 328 310 140 +150 -40 to +150 70 Unit V V A A A W W °C °C N·cm IGBT + FWD
C:Collector
G:Gate
E:Emitter
1MBH50-060, 1MBH50D-060
Electrical characteristics (at Tj=25°C unless otherwise specified) 1MBH50-060 / IGBT
I tem Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Turn-on time Turn-off time Symbol ICES IGES VGE(th) VCE(sat) Cies Coes Cres ton tr toff tf Characteristics Min. Typ. – – 5.5 – – – – – – – – – – – – 3000 650 150 – – – – Conditions Max. 1.0 20 8.5 3.0 – – – 1.2 0.6 1.0 0.35 VGE=0V, VCE=600V VCE=0V, VGE=±20V VCE=20V, IC=50mA VGE=15V, IC=50A VGE=0V VCE=10V f=1MHz VCC=300V, IC=50A VGE=±15V RG=62 ohm (Half Bridge)
Molded IGBT
Unit mA µA V V pF
µs
1MBH50D-060 / IGBT+FWD
Item Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Turn-on time Turn-off time FWD forward on voltage Reverse recovery time Symbol ICES IGES VGE(th) VCE(sat) Cies Coes Cres ton tr toff tf VF trr Characteristics Min. Typ. – – 5.5 – – – – – – – – – – – – – – 3000 650 150 – – – – – – Conditions Max. 1.0 20 8.5 3.0 – – – 1.2 0.6 1.0 0.35 3.0 0.3 VGE=0V, VCE=600V VCE=0V, VGE=±20V VCE=20V, IC=50mA VGE=15V, IC=50A VGE=0V V CE=10V f=1MHz VCC=300V, IC=50A VGE=±15V RG=62 ohm (Half Bridge) IF=50A, VGE=0V IF=50A, VGE=-10V, di/dt=100A/µs mA µA V V pF Unit
µs
V µs
Thermal resistance characteristics 1MBH50-060 / IGBT
Item Thermal resistance Symbol Rth(j-c) Characteristics Min. Typ. – – Conditions Max. 0.40 IGBT °C/W Unit
1MBH50D-060 / IGBT+FWD
Item Thermal resistance Symbol Rth(j-c) Rth(j-c) Characteristics Min. Typ. – – – – Conditions Max. 0.40 0.89 IGBT FWD °C/W °C/W Unit
Outline drawings, mm
1MBH50-060, 1MBH50D-060 TO-3PL
1MBH50-060, 1MBH50D-060
Characteristics
1MBH50-060,1MBH50D-060 Collector current vs. Collector-Emitter voltage Tj=25°C
100 100
Molded IGBT
Collector current vs. Collector-Emitter voltage Tj=125°C
80
Collector current : Ic [A] Collector current : Ic [A]
80
60
60
40
40
20
20
0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
Collector-Emitter vs. Gate-Emitter voltage Tj=25°C
10 10
Collector-Emitter vs. Gate-Emitter voltage Tj=125°C
Collector-Emitter voltage : VCE [V]
8
Collector-Emitter voltage : VCE [V]
8
6
6
4
4
2
2
0 0 5 10 15 20 Gate-Emitter voltage : VGE [V]
0 0 5 10 15 20 Gate-Emitter voltage : VGE [V]
Switching time vs. Collector current Vcc=300V, RG=62 ohm, VGE=±15V, Tj=25°C
1000
Switching time : ton, tr, toff, tf [n sec.] Switching time : ton, tr, toff, tf [n sec.]
Switching time vs. Collector current Vcc=300V, RG=62 ohm, VGE=±15V, Tj=125°C
1000
100
100
10 0 20 40 Collector current : Ic [A] 60 80
10 0 20 40 Collector current : Ic [A] 60 80
1MBH50-060, 1MBH50D-060
Characteristics
1MBH50-060,1MBH50D-060 Switching time vs. RG Vcc=300V, Ic=50A, VGE=±15V, Tj=25°C Switching time vs. RG
IGBT Module
Vcc=300V, Ic=50A, VGE=±15V, Tj=125°C
Switching time : ton, tr, toff, tf [n sec.]
Switching time : ton, tr, toff, tf [n sec.]
1000
1000
100
100
10 0 50 100 150 200 250 Gate resistance : RG [ohm]
10 0 50 100 150 200 250 Gate resistance : RG [ohm]
Dynamic input characteristics
500
Capacitance vs. Collector-Emitter voltage
25
Tj=25°C
Tj=25°C
Collector-Emitter voltage : VCE [V]
400
Capacitance : Cies, Coes, Cres [nF]
20
300
15
200
10
Gate-Emitter voltage : VGE [V]
1000
100
100
5
0 0 50 100 150 200 250 Gate charge : Qg [nC]
0
10 0 5 10 15 20 25 Collector-Emitter voltage : VCE [V] 30 35
Reversed biased safe operating area < > +VGE=15V, -VGE = 15V, Tj < 125°C, RG = 62 ohm =
120 600
Typical short circuit capability Vcc=400V, RG=62 ohm, Tj=125°C
60
100
500
50
Short circuit time current : Isc [A]
Collector current : Ic [A]
80
400
40
60
300
30
40
200
20
20
100
10
0
0
0
0
100
200
300
400
500
600
700
5
10
Collector-Emitter voltage : VCE [V]
15 Gate voltage : VGE [V]
20
25
Short circuit time : tsc [µs]
1MBH50-060, 1MBH50D-060
Characteristics
1MBH50-060,1MBH50D-060 Transient thermal resistance
IGBT Module
Thermal resistance : Rth (j-c) [°C/W]
101
100
10-1
10-2 10-4 10-3 10-2 Pulse width : PW [sec.] 10-1 100
1MBH50D-060 Reverse recovery time vs. Forward current -di/dt=150A / µsec
400
Reverse recovery current vs. Forward current -di/dt=150A / µsec
15
300
reverse recovery time : trr [nsec]
reverse recovery current : Irr [A]
10
200
100
5
0 0 20 40 Forward current : IF [A] 60 80
0
0
20
40 Forward current : IF [A]
60
80
Forward current vs. Foeward voltage
500
100
Reverse recovery time characteristics vs. -di/dt IF=50A, Tj=125°C
25
400
80
20
reverse recovery time : trr [nsec]
300
15
60
Forward current : IF [A]
40
200
10
20
100
5
0
0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 100 200 -di/dt 300 [ A / µsec ] 400 500 Forward voltage : VF [V]
0
reverse recovery current : Irr [A]