2MBI300UC-120
IGBT MODULE (U series) 1200V / 300A / 2 in one package
Features
High speed switching Voltage drive Low Inductance module structure
IGBT Modules
Applications
Inverter for Motor Drive AC and DC Servo Drive Amplifier Uninterruptible Power Supply Industrial machines, such as Welding machines
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at Tc=25°C unless otherwise specified)
Items Collector-Emitter voltage Gate-Emitter voltage Symbols VCES VGES Ic Collector current Ic pulse Conditions Maximum ratings 1200 ±20 400 300 800 600 300 600 1470 150 -40 to +125 2500 3.5 4.5 Units V V
Continuous 1ms
Tc=25°C Tc=80°C Tc=25°C Tc=80°C
A
-Ic -Ic pulse Collector power dissipation Pc Junction temperature Tj Storage temperature Tstg Isolation voltage Between terminal and copper base (*1) Viso Mounting (*2) Screw torque Terminals (*2)
1 device
AC : 1min.
W °C °C VAC N·m
Note *1: All terminals should be connected together when isolation test will be done. Note *2: Recommendable value : Mounting : 2.5-3.5 N·m (M5 or M6), Terminals : 3.5-4.5 N·m (M6)
Electrical characteristics (at Tj= 25°C unless otherwise specified)
Items Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Input capacitance Turn-on time Turn-off time Symbols ICES IGES VGE (th) VCE (sat) (teminal) VCE (sat) (chip) Cies ton tr tr (i) toff tf VF (teminal) VF (chip) trr R lead Conditions VGE = 0V, VCE = 1200V VCE = 0V, VGE = ±20V VCE = 20V, IC = 300mA VGE = 15V IC = 300A VGE Tj=25°C Tj=125°C Tj=25°C Tj=125°C = 0V, VCE = 10V, f = 1MHz Characteristics min. typ. max. 2.0 400 4.5 6.5 8.5 1.90 2.25 2.15 1.75 2.10 2.00 34 0.36 1.20 0.21 0.60 0.03 0.37 1.00 0.07 0.30 1.75 2.05 1.85 1.60 1.90 1.70 0.35 0.53 Units mA nA V V nF
VCC = 600V IC = 300A VGE = ±15V RG = 1.1Ω Tj=25°C Tj=125°C Tj=25°C Tj=125°C
µs
Forward on voltage Reverse recovery time Lead resistance, terminal-chip (*3)
Note *3: Biggest internal terminal resistance among arm.
VGE = 0V IF = 300A IF = 300A
V µs mΩ
Thermal resistance characteristics
Items Thermal resistance (1device) Contact thermal resistance Symbols Rth(j-c) Rth(c-f) Conditions IGBT FWD with Thermal Compound (*4) Characteristics min. typ. max. 0.085 0.14 0.025 Units °C/W
Note *4: This is the value which is defined mounting on the additional cooling fin with thermal compound.
1
2MBI300UC-120
Characteristics (Representative)
Collector current vs. Collector-Emitter voltage Tj= 25°C / chip
IGBT Modules
800 700 Collector current : Ic [A]
800 700
Collector current vs. Collector-Emitter voltage Tj= 125°C / chip
Collector current : Ic [A]
600 500 400 300 200 100 0 0 1
VGE=20V 15V
12V
600 500 400 300 200 100 0
VGE=20V 15V
12V
10V
10V
8V 2 3 4 5
8V
0
1
2
3
4
5
Collector-Emitter voltage : VCE [V]
Collector-Emitter voltage : VCE [V]
800 700 Collector current : Ic [A] 600 500 400 300 200 100 0 0
Collector current vs. Collector-Emitter voltage VGE=15V (typ.) / chip
Collector - Emitter voltage : VCE [ V ]
10
Collector-Emitter voltage vs. Gate-Emitter voltage Tj=25°C / chip
Tj=25°C
Tj=125°C
8
6
4 Ic=600A Ic=300A Ic=150A 5 10 15 20 25
2
0 1 2 3 4
Collector-Emitter voltage : VCE [V]
Gate - Emitter voltage : VGE [ V ]
100.0 Capacitance : Cies, Coes, Cres [ nF ]
Capacitance vs. Collector-Emitter voltage (typ.) VGE=0V, f= 1MHz, Tj= 25°C
Collector-Emitter voltage : VCE [ 200V/div ] Gate - Emitter voltage : VGE [ 5V/div ] Cies
Dynamic Gate charge (typ.) Vcc=600V , Ic=300A , Tj= 25°C
10.0 Cres
VGE
1.0
Coes
0.1 0 10 20 30 Collector-Emitter voltage : VCE [V]
VCE 0 300 600 900 1200 1500 1800
Gate charge : Qg [ nC ]
2
2MBI300UC-120
IGBT Modules
10000 Switching time : ton, tr, toff, tf [ nsec ]
Switching time vs. Collector current (typ.) Vcc=600V, VGE=±15V, Rg=1.1Ω, Tj= 25°C
Switching time : ton, tr, toff, tf [ nsec ]
10000
Switching time vs. Collector current (typ.) Vcc=600V, VGE=±15V, Rg=1.1Ω, Tj=125°C
1000 ton toff tr 100 tf
1000
toff ton tr
100
tf
10 0 100 200 300 400 500 600 Collector current : Ic [ A ]
10 0 100 200 300 400 500 600 Collector current : Ic [ A ]
10000 Switching time : ton, tr, toff, tf [ nsec ]
Switching time vs. Gate resistance (typ.) Vcc=600V, Ic=300A, VGE=±15V, Tj= 25°C
Switching loss : Eon, Eoff, Err [ mJ/pulse ]
60 50 40
Switching loss vs. Collector current (typ.) Vcc=600V, VGE=±15V, Rg=1.1Ω
Eoff(125°C) Eon(125°C)
ton toff 1000
Eoff(25°C) 30 20 10 0 Eon(25°C)
tr 100 tf
Err(125°C) Err(25°C)
10 0.1 1.0 10.0 100.0 Gate resistance : Rg [ Ω ]
0
100
200
300
400
500
600
Collector current : Ic [ A ]
250 Switching loss : Eon, Eoff, Err [ mJ/pulse ]
Switching loss vs. Gate resistance (typ.) Vcc=600V, Ic=300A, VGE=±15V, Tj= 125°C
Eon
800 700 Collector current : Ic [ A ] 600 500 400 300 200 100
Reverse bias safe operating area +VGE=15V,-VGE = 1.1Ω ,Tj
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