2SK2879-01
FAP-IIS Series
> Features
High Speed Switching Low On-Resistance No Secondary Breakdown Low Driving Power High Voltage VGS = ± 30V Guarantee Repetitive Avalanche Rated
N-channel MOS-FET
500V
0,38Ω ±20A 150W
> Outline Drawing
> Applications
Switching Regulators UPS DC-DC converters General Purpose Power Amplifier
> Maximum Ratings and Characteristics
- Absolute Maximum Ratings (TC=25°C), unless otherwise specified
Item Drain-Source-Voltage Continous Drain Current Pulsed Drain Current Gate-Source-Voltage Repetitive or Non-Repetitive (Tch ≤ 150°C) Avalanche Energy Max. Power Dissipation Operating and Storage Temperature Range Symbol V DS ID I D(puls) V GS I AR E AS PD T ch T stg Rating 500 ±20 ±80 ±30 20 761 150 150 -55 ~ +150
L=34.9mH,Vcc=50V
> Equivalent Circuit
Unit V A A V A mJ W °C °C
- Electrical Characteristics (TC=25°C), unless otherwise specified
Item Drain-Source Breakdown-Voltage Gate Threshhold Voltage Zero Gate Voltage Drain Current Gate Source Leakage Current Drain Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On-Time ton (ton=td(on)+tr) Turn-Off-Time toff (ton=td(off)+tf) Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge - Thermal Characteristics Item Thermal Resistance Symbol BV DSS V GS(th) I DSS I R g C C C t t t t I V t Q
GSS DS(on) fs iss oss rss d(on) r d(off) f AV SD rr rr
Test conditions ID=1mA VGS=0V ID=1mA VDS=VGS VDS=500V Tch=25°C VGS=0V Tch=125°C VGS=±30V VDS=0V ID=10A VGS=10V ID=10A VDS=25V VDS=25V VGS=0V f=1MHz VCC=300V ID=20A VGS=10V RGS=10 Ω Tch=25°C L = 3,49mH IF=2xIDR VGS=0V Tch=25°C IF=IDR VGS=0V -dIF/dt=100A/µs Tch=25°C
Min. 500 2,5
Typ. 3,0 10 0,2 10 0,33 15 2200 330 140 20 160 130 105 1,1 650 10,0
Max. 3,5 500 1,0 100 0,38 3300 500 210 30 240 200 160 1,7
7,5
20
Unit V V µA mA nA Ω S pF pF pF ns ns ns ns A V ns µC
Symbol R th(ch-c) R th(ch-a)
Test conditions channel to case channel to air
Min.
Typ.
Max. 0,83 35,0
Unit °C/W °C/W
N-channel MOS-FET
500V
0,38Ω ±20A 150W
Typical Output Characteristics
ID=f(VDS); 80µs pulse test; TC=25°C
2SK2879-01
FAP-IIS Series
Drain-Source-On-State Resistance vs. Tch
RDS(on) = f(Tch): ID=10A; VGS=10V
> Characteristics
Typical Transfer Characteristics
ID=f(VGS); 80µs pulse test; VDS=25V; Tch=25°C
↑
ID [A]
↑
1
RDS(ON) [Ω ]
↑ 2
ID [A]
3
VDS [V]
→
Tch [°C]
→
VGS [V]
→
Typical Drain-Source-On-State-Resistance vs. ID
RDS(on)=f(ID); 80µs pulse test;TC=25°C
Typical Forward Transconductance vs. ID
gfs=f(ID); 80µs pulse test; VDS=25V; Tch=25°C
Gate Threshold Voltage vs. Tch
VGS(th)=f(Tch); ID=1mA; VDS=VGS
↑
RDS(ON) [Ω ]
↑
gfs [S]
↑ 5
VGS(th) [V]
4
6
ID [A]
→
ID [A]
→
Tch [°C]
→
Typical Capacitances vs. VDS
C=f(VDS); VGS=0V; f=1MHz
Typical Gate Charge Characteristic
VGS=f(Qg): ID=20A; Tc=25°C
Forward Characteristics of Reverse Diode
IF=f(VSD); 80µs pulse test; VGS=0V
↑
C [F]
↑
VDS [V]
↑
VGS [V]
↑
IF [A]
7
8
9
VDS [V]
→
Qg [nC]
→
VSD [V]
→
Avalanche Energy Derating
Eas=f(starting Tch): Vcc=50V; IAV=20A
Safe operation area
ID=f(VDS): D=0,01, Tc=25°C
Zth(ch-c) [K/W]
↑
Transient Thermal impedance
Zthch=f(t) parameter:D=t/T
↑
Eas [mJ]
10
↑
ID [A]
12
Starting Tch [°C]
→
VDS [V]
→
t [s]
→
This specification is subject to change without notice!
N-channel MOS-FET
500V
0,38Ω ±20A 150W
2SK2879-01
FAP-IIS Series
> Characteristics
Power Dissipation PD=f(TC)
125
100
→
75
PD / PDmax [%]
50
25
0 0 0 0 0 TC [°C] 0 0 0
This specification is subject to change without notice!
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