2SK3595-01MR

2SK3595-01MR FUJI POWER MOSFET 200304 Super FAP-G Series Features High speed switching Low on-resistance No secondary breadown Low driving power Avalanche-proof N-CHANNEL SILICON POWER MOSFET Outline Drawings (mm) TO-220F Applications Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters Maximum ratings and characteristicAbsolute maximum ratings (Tc=25°C unless otherwise specified) Item Drain-source voltage Continuous drain current Pulsed drain current Gate-source voltage Non-repetitive Avalanche current Maximum Avalanche Energy Maximum Drain-Source dV/dt Peak Diode Recovery dV/dt Max. power dissipation Operating and storage temperature range Isolation voltage Symbol V DS VDSX *5 ID ID(puls] VGS IAS *2 EAS *1 dVDS/dt *4 dV/dt *3 PD Ta=25°C Tc=25°C Tch Tstg VISO Ratings 200 170 ±45 ±180 ±30 45 258.9 20 5 2.16 95 +150 -55 to +150 2 Unit V V A A V A mJ kV/µs kV/µs W °C °C Equivalent circuit schematic Drain(D) Gate(G) Source(S) *6 *1 L=205µH, Vcc=48V,Tch=25°C, See to Avalanche Energy Graph *2 Tch < 150°C = < 200V *5 VGS=-30V *6 t=60sec f=60Hz < -ID, -di/dt=50A/µs, Vcc < BVDSS, Tch < 150°C *3 IF = *4 VDS = = = Electrical characteristics (Tc =25°C unless otherwise specified) Item Drain-source breakdown voltaget Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on-state resistance Forward transcondutance Input capacitance Output capacitance Reverse transfer capacitance Turn-on time ton Turn-off time toff Total Gate Charge Gate-Source Charge Gate-Drain Charge Avalanche capability Diode forward on-voltage Reverse recovery time Reverse recovery charge Symbol V(BR)DSS VGS(th) IDSS IGSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD IAV V SD t rr Qrr Test Conditions ID= 250µA VGS=0V ID= 250µA VDS=VGS VDS=200V VGS=0V VDS=160V VGS=0V VGS=±30V VDS=0V ID=15A VGS=10V ID=15A VDS=25V VDS =75V VGS=0V f=1MHz VCC=48V ID=15A VGS=10V RGS=10 Ω V CC=100V ID=30A VGS=10V L=205µH Tch=25°C IF=30A VGS=0V Tch=25°C IF=30A VGS=0V -di/dt=100A/µs Tch=25°C Tch=25°C Tch=125°C Min. 200 3.0 Typ. Max. 5.0 25 250 100 66 Units V V µA nA mΩ S pF 10 50 12.5 25 1960 2940 260 390 18 27 20 30 17 26 53 80 19 29 51 76.5 15 22.5 16 24 45 1.10 1.65 0.19 1.4 ns nC A V µs µC Thermalcharacteristics Item Thermal resistance Symbol Rth(ch-c) Rth(ch-a) Test Conditions channel to case channel to ambient Min. Typ. Max. 1.316 58.0 Units °C/W °C/W www.fujielectric.co.jp/denshi/scd 1 2SK3595-01MR Characteristics Allowable Power Dissipation PD=f(Tc) FUJI POWER MOSFET 100 90 80 800 Maximum Avalanche Energy vs. starting Tch E(AS)=f(starting Tch):Vcc=48V 700 IAS=18A 600 70 60 500 IAS=27A EAS [mJ] PD [W] IAS=45A 400 50 40 30 300 200 20 10 0 0 25 50 75 100 125 150 100 0 0 25 50 75 100 125 150 Tc [°C] starting Tch [°C] Typical Output Characteristics ID=f(VDS):80µs Pulse test,Tch=25°C 120 20V 100 10V 8V 80 7.5V 10 100 Typical Transfer Characteristic ID=f(VGS):80µs Pulse test, VDS=25V,Tch=25°C ID [A] 60 7.0V 40 6.5V 6.0V ID[A] 1 20 VGS=5.5V 0 0 2 4 6 8 10 12 0 1 2 3 4 5 6 7 8 9 10 0.1 VDS [V] VGS[V] Typical Transconductance gfs=f(ID):80µs Pulse test, VDS=25V,Tch=25°C 100 0.20 Typical Drain-Source on-state Resistance RDS(on)=f(ID):80µs Pulse test, Tch=25°C 0.15 VGS= 6.0V 5.5V 6.5V 7.0V RDS(on) [ Ω ] 10 7.5V 8V 0.10 10V 20V gfs [S] 1 0.05 0.1 0.1 0.00 1 10 100 0 20 40 60 80 100 120 ID [A] ID [A] 2 2SK3595-01MR FUJI POWER MOSFET Drain-Source On-state Resistance RDS(on)=f(Tch):ID=15A,VGS=10V 200 180 160 7.0 6.5 6.0 5.5 5.0 Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=250µ A RDS(on) [ m Ω ] VGS(th) [V] 140 120 100 80 60 typ. 40 20 0 -50 -25 0 25 50 75 100 125 150 max. max. 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 150 min. Tch [°C] Tch [°C] Typical Gate Charge Characteristics VGS=f(Qg):ID=30A, Tch=25°C 10 14 12 10 0 1 Typical Capacitance C=f(VDS):VGS=0V,f=1MHz Ciss 10 Vcc= 100V VGS [V] 8 6 C [nF] Coss 10 4 2 0 0 10 20 30 40 50 60 70 80 -1 Crss 10 -2 10 -1 10 0 10 1 10 2 Qg [nC] VDS [V] Typical Forward Characteristics of Reverse Diode IF=f(VSD):80µs Pulse test,Tch=25°C 100 10 3 Typical Switching Characteristics vs. ID t=f(ID):Vcc=48V, VGS=10V, RG=10Ω tf 2 10 10 td(off) IF [A] t [ns] td(on) 1 1 10 tr 0.1 0.00 10 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 0 10 -1 10 0 10 1 10 2 VSD [V] ID [A] 3 2SK3595-01MR Maximum Avalanche Current Pulsewidth IAV=f(tAV):starting Tch=25°C,Vcc=48V Single Pulse FUJI POWER MOSFET 10 2 Avalanche Current I AV [A] 10 1 10 0 10 -1 10 -8 10 -2 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 tAV [sec] 10 1 Maximum Transient Thermal Impedance Zth(ch-c)=f(t):D=0 10 0 Zth(ch-c) [°C/W] 10 -1 10 -2 10 -3 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 t [sec] http://www.fujielectric.co.jp/denshi/scd/ 4