FMI12N50E
Features
FUJI POWER MOSFET
Super FAP-E3 series
Maintains both low power loss and low noise Lower RDS (on) characteristic More controllable switching dv/dt by gate resistance Smaller VGS ringing waveform during switching Narrow band of the gate threshold voltage (3.0±0.5V) High avalanche durability
T-Pack(L)
N-CHANNEL SILICON POWER MOSFET
Outline Drawings [mm] Equivalent circuit schematic
Drain(D)
Applications
Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters
Gate(G) Source(S)
Maximum Ratings and Characteristics
Absolute Maximum Ratings at Tc=25°C (unless otherwise specified)
Description Drain-Source Voltage Continuous Drain Current Pulsed Drain Current Gate-Source Voltage Repetitive and Non-Repetitive Maximum Avalanche Current Non-Repetitive Maximum Avalanche Energy Repetitive Maximum Avalanche Energy Peak Diode Recovery dV/dt Peak Diode Recovery -di/dt Maximum Power Dissipation Operating and Storage Temperature range Isolation Voltage Symbol VDS VDSX ID I DP VGS I AR E AS E AR dV/dt -di/dt PD Tch Tstg VISO Characteristics 500 500 ±12 ±48 ±30 12 400 16.5 6.5 100 1.67 165 150 -55 to +150 2 Unit V V A A V A mJ mJ kV/µs A/µs W °C °C kVrms Remarks VGS = - 30V
Note*1 Note*2 Note*3 Note*4 Note*5 Ta=25°C Tc=25°C
t = 60sec, f = 60Hz
Electrical Characteristics at Tc=25°C (unless otherwise specified)
Description Drain-Source Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Drain Current Gate-Source Leakage Current Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Time Turn-Off Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge Symbol BVDSS VGS (th) I DSS I GSS R DS (on) gfs Ciss Coss Crss td(on) tr td(off) tf QG Q GS Q GD I AV VSD trr Qrr Conditions I D =250 µA, VGS =0V I D =250 µA, VDS =VGS VDS =500V, VGS =0V VDS =400V, VGS =0V VGS = ±30V, VDS =0V I D =6A, VGS =10V I D =6A, VDS =25V VDS =25V VGS =0V f=1MHz Vcc =300V VGS =10V I D =6A RG =15Ω Vcc =300V I D =12A VGS =10V L=2.12mH, Tch=25°C I F =12A, VGS =0V, Tch =25°C I F =12A, VGS =0V -di/dt=100A/µs, Tch=25°C min. 500 2.5 6.5 12 typ. 3.0 10 0.444 13 1600 160 11.5 20 9 100 18 47 10.5 14 0.88 0.36 4.1 max. 3.5 25 250 100 0.52 2400 240 17.5 30 13.5 150 27 70.5 16 21 1.32 Unit V V µA nA Ω S pF
Tch =25°C Tch =125°C
ns
nC A V µs µC
Thermal Characteristics
Description Thermal resistance Symbol Rth (ch-c) Rth (ch-a) Test Conditions Channel to Case Channel to Ambient min. typ. max. 0.758 75.0 Unit °C/W °C/W
Note *1 : Tch≤150°C Note *2 : Stating Tch=25°C, IAS =5A, L=29.2mH, Vcc=50V, RG =50Ω E AS limited by maximum channel temperature and avalanche current. See to 'Avalanche Energy' graph.
Note *3 : Repetitive rating : Pulse width limited by maximum channel temperature. See to the 'Transient Themal impeadance' graph. Note *4 : I F ≤-I D, -di/dt=100A/µs, Vcc ≤BVDSS, Tch≤150°C. Note *5 : I F ≤-I D, dv/dt=6.5kV/µs, Vcc ≤BVDSS, Tch≤150°C.
1
FMI12N50E
Allowable Power Dissipation PD=f(Tc)
Safe Operating Area ID=f(VDS):Duty=0(Single pulse),Tc=25 °c
10
2
FUJI POWER MOSFET
200 180 160 140 120
PD [W]
t= 1µs 10µs 100µs
10
1
ID [A]
100 80 60 40 20 0 0 25 50 75 Tc [°C] 100 125 150
10
0
1ms
10
-1
P o w e r lo s s w a v e f o r m : S q u a re w a v e f o r m PD
t
DC
0
10
-2
10
-1
10
10 VDS [V]
1
10
2
10
3
Typical Output Characteristics ID=f(VDS):80 µs pulse test,Tch=25 °C
20 18 16 14 12
ID [A]
Typical Transfer Characteristic ID=f(VGS):80 µs pulse test,VDS=25V,Tch=25 °C
2 0V 1 0V 6 .0V 5.0V
10
1
10
0
ID[A]
10 8 6 4 2 0 0 2 4 6 8 VDS [V] 10 12 14
10
-1
10
-2
4.5V
10
-3
VGS=4.0V
10
-4
2
3
4 VGS[V]
5
6
100
Typical Transconductance gfs=f(ID):80 µs pulse test,VDS=25V,Tch=25 °C
0.9
Typical Drain-Source on-state Resistance RDS(on)=f(ID):80 µs pulse test,Tch=25 °C
VGS=4.0V 4.5V 5V
0.8 10 0.7
RDS(on) [ Ω ]
gfs [S]
1
6V 0.6
10V 20V
0.5 0.1 0.4
0.01 0.01
0.3 0.1 1 ID [A] 10 100 0 5 10 ID [A] 15 20
2
FMI12N50E
Drain-Source On-state Resistance RDS(on)=f(Tch):ID=6A,VGS=10V
FUJI POWER MOSFET
1.6 1.4 1.2 1.0
RDS(on) [ Ω ]
6
Gate T hreshold Voltage vs. T ch VGS(th)=f(Tch):VDS=VGS,ID=250 µA
5
VGS(th) [V]
4 m ax. 3 typ.
0.8 0.6 0.4 0.2 0.0 -50 -25 0 25
max. typ.
2
min.
1
0 50 Tch [°C] 75 100 125 150 -50 -25 0 25 50 75 Tch [°C] 100 125 150
Typical Gate Charge Characteristics VGS=f(Qg):ID=12A,Tch=25 °C
20 18 16 14 12
VGS [V]
Typical Capacitance C=f(VDS):VGS=0V,f=1MHz
10
4
Vcc= 100V 250V 400V
Ciss 10
C [pF]
3
10 8 6 4 2 0 0 10 20 30 40 Qg [nC] 50 60 70 80
10
2
Coss
10
1
Crss
10
0
10
-2
10
-1
10
0
10
1
10
2
VDS [V]
100
Typical Forward Characteristics of Reverse Diode IF=f(VSD):80 µs pulse test,Tch=25 °C
10
3
Typical Switching Characteristics vs. ID t=f(ID):Vcc=300V,VGS=10V,RG=15 Ω
10 10
2
td(off) tf
IF [A]
t [ns]
1
td(on) 10
1
tr
0.1
0.01 0.00
10 0.25 0.50 0.75 VSD [V] 1.00 1.25 1.50
0
10
-1
10
0
10
1
10
2
ID [A]
3
FMI12N50E
Maximum Avalanche Energy vs. starting Tch E(AV)=f(starting Tch):Vcc=50V,I(AV)
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