FMP08N50E

FMP08N50E Super FAP-E3 series Features Maintains both low power loss and low noise Lower RDS (on) characteristic More controllable switching dv/dt by gate resistance Smaller VGS ringing waveform during switching Narrow band of the gate threshold voltage (3.0±0.5V) High avalanche durability FUJI POWER MOSFET N-CHANNEL SILICON POWER MOSFET Outline Drawings [mm] TO-220AB Equivalent circuit schematic Drain(D) Applications Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters Gate(G) Source(S) Maximum Ratings and Characteristics Absolute Maximum Ratings at Tc=25°C (unless otherwise specified) Description Drain-Source Voltage Continuous Drain Current Pulsed Drain Current Gate-Source Voltage Repetitive and Non-Repetitive Maximum Avalanche Current Non-Repetitive Maximum Avalanche Energy Repetitive Maximum Avalanche Energy Peak Diode Recovery dV/dt Peak Diode Recovery -di/dt Maximum Power Dissipation Operating and Storage Temperature range Symbol VDS VDSX ID I DP VGS I AR E AS E AR dV/dt -di/dt PD Tch Tstg Characteristics 500 500 ±7.5 ±30 ±30 7.5 301.1 3.7 5.9 100 2.02 105 150 -55 to +150 Unit V V A A V A mJ mJ kV/µs A/µs W °C °C Remarks VGS = - 30V Note*1 Note*2 Note*3 Note*4 Note*5 Ta=25°C Tc=25°C Electrical Characteristics at Tc=25°C (unless otherwise specified) Description Drain-Source Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Drain Current Gate-Source Leakage Current Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Time Turn-Off Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge Symbol BVDSS VGS (th) I DSS I GSS R DS (on) gfs Ciss Coss Crss td(on) tr td(off) tf QG Q GS Q GD I AV VSD trr Qrr Conditions I D =250 µA, VGS =0V I D =250 µA, VDS =VGS VDS =500V, VGS =0V VDS =400V, VGS =0V VGS = ±30V, VDS =0V I D =3.8A, VGS =10V I D =3.8A, VDS =25V VDS =25V VGS =0V f=1MHz Vcc =300V VGS =10V I D =3.8A RGS =18Ω Vcc =250V I D =7.5A VGS =10V L=3.93mH, Tch=25°C I F =7.5A, VGS =0V, Tch =25°C I F =7.5A, VGS =0V -di/dt=100A/µs, Tch=25°C min. 500 2.5 4 7.5 typ. 3.0 10 0.68 8 1100 100 7.5 17 8.0 80 15 35 9.0 10 0.90 0.35 3.5 max. 3.5 25 250 100 0.79 1650 150 11 26 12 120 23 53 14 15 1.35 Unit V V µA nA Ω S pF Tch =25°C Tch =125°C ns nC A V µs µC Thermal Characteristics Description Thermal resistance Symbol Rth (ch-c) Rth (ch-a) Test Conditions Channel to Case Channel to Ambient min. typ. max. 1.19 62.0 Unit °C/W °C/W Note *1 : Tch≤150°C Note *2 : Stating Tch=25°C, IAS =3.0A, L=61.3mH, Vcc=50V, RG =50Ω E AS limited by maximum channel temperature and avalanche current. See to 'Avalanche Energy' graph. Note *3 : Repetitive rating : Pulse width limited by maximum channel temperature. See to the 'Transient Themal impeadance' graph. Note *4 : I F ≤-I D, -di/dt=100A/µs, Vcc ≤BVDSS, Tch≤150°C. Note *5 : I F ≤-I D, dv/dt=5.9kV/µs, Vcc ≤BVDSS, Tch≤150°C. 1 FMP08N50E Allowable Power Dissipation PD=f(Tc) Safe Operating Area ID=f(VDS):Duty=0(Single pulse),Tc=25 °c FUJI POWER MOSFET 150 t= 1µs 10 1 125 10µs 100µs 100 10 0 PD [W] ID [A] 75 1ms 10 -1 50 10 -2 P o w e r l o s s w a v e fo r m : S qua r e w a v e fo rm PD t D.C. 25 0 0 25 50 75 Tc [°C] 100 125 150 10 -3 10 0 10 1 VDS [V] 10 2 10 3 Typical Output Characteristics ID=f(VDS):80 µs pulse test,Tch=25 °C 18 16 14 12 ID [A] ID[A] Typical Transfer Characteristic ID=f(VGS):80 µs pulse test,VDS=25V,Tch=25 °C 1 0V 6 . 0V 5. 5 V 10 10 8 6 4 2 0 0 4 8 12 VDS [V] 16 20 24 1 5. 0V VGS=4.5V 0.1 0 1 2 3 4 5 VGS[V] 6 7 8 9 10 Typical Transconductance gfs=f(ID):80 µs pulse test,VDS=25V,Tch=25 °C 100 2.4 2.2 2.0 10 RDS(on) [ Ω ] Typical Drain-Source on-state Resistance RDS(on)=f(ID):80 µs pulse test,Tch=25 °C VGS=4.5V 5.0V 1.8 1.6 1.4 1.2 1.0 0.8 0.6 5.5V 6.0V 10V gfs [S] 1 0.1 0.1 1 ID [A] 10 100 0 2 4 6 8 10 ID [A] 12 14 16 18 2 FMP08N50E Drain-Source On-state Resistance RDS(on)=f(Tch):ID=3.8A,VGS=10V Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=250µA FUJI POWER MOSFET 2.5 6 2.0 5 4 RDS(on) [ Ω ] 1.5 VGS(th) [V] max. 3 typ. min. 1.0 max. typ. 2 0.5 1 0.0 -50 -25 0 25 50 Tch [°C] 75 100 125 150 0 -50 -25 0 25 50 75 Tch [°C] 100 125 150 Typical Gate Charge Characteristics VGS=f(Qg):ID=7.5A,Tch=25 °C 14 Typical Capacitance C=f(VDS):VGS=0V,f=1MHz 10 4 12 Vcc= 100V 250V 400V 10 10 3 Ciss VGS [V] C [pF] 8 10 2 6 Coss 4 10 1 2 Crss 0 0 5 10 15 20 25 Qg [nC] 30 35 40 45 50 10 0 10 -1 10 0 10 1 10 2 10 3 VDS [V] 100 Typical Forward Characteristics of Reverse Diode IF=f(VSD):80 µs pulse test,Tch=25 °C 10 3 Typical Switching Characteristics vs. ID t=f(ID):Vcc=300V,VGS=10V,RG=18 Ω tf 10 10 2 td(off) IF [A] t [ns] td(on) 1 10 1 tr 0.1 0.00 0.25 0.50 0.75 1.00 VSD [V] 1.25 1.50 1.75 2.00 10 0 10 -1 10 0 10 1 ID [ A] 3 FMP08N50E Maximum Avalanche Energy vs. starting Tch E(AV)=f(starting Tch):Vcc=50V,I(AV)