FMP16N50ES

FMP16N50ES Super FAP-E3S series Features Maintains both low power loss and low noise Lower RDS (on) characteristic More controllable switching dv/dt by gate resistance Smaller VGS ringing waveform during switching Narrow band of the gate threshold voltage (4.2± 0.5V) High avalanche durability FUJI POWER MOSFET N-CHANNEL SILICON POWER MOSFET Outline Drawings [mm] TO-220AB Equivalent circuit schematic Drain(D) Applications Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters Gate(G) Source(S) Maximum Ratings and Characteristics Absolute Maximum Ratings at Tc=25°C (unless otherwise specified) Description Drain-Source Voltage Continuous Drain Current Pulsed Drain Current Gate-Source Voltage Repetitive and Non-Repetitive Maximum Avalanche Current Non-Repetitive Maximum Avalanche Energy Repetitive Maximum Avalanche Energy Peak Diode Recovery dV/dt Peak Diode Recovery -di/dt Maximum Power Dissipation Operating and Storage Temperature range Symbol VDS VDSX ID I DP VGS I AR E AS E AR dV/dt -di/dt PD Tch Tstg Characteristics 500 500 ±16 ± 64 ± 30 16 485 22.5 4.8 100 2.02 225 150 -55 to + 150 Unit V V A A V A mJ mJ kV/µs A/µs W °C °C Remarks VGS = - 30V Note*1 Note*2 Note*3 Note*4 Note*5 Ta=25°C Tc=25°C Electrical Characteristics at Tc=25°C (unless otherwise specified) Description Drain-Source Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Drain Current Gate-Source Leakage Current Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Time Turn-Off Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate-Drain Crossover Charge Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge Symbol BVDSS VGS (th) I DSS I GSS R DS (on) gfs Ciss Coss Crss td(on) tr td(off) tf QG Q GS Q GD Q SW I AV VSD trr Qrr Conditions I D =250 µ A, VGS =0V I D =250 µ A, VDS =VGS VDS =500V, VGS =0V VDS =400V, VGS =0V VGS = ± 30V, VDS =0V I D =8A, VGS =10V I D =8A, VDS =25V VDS =25V VGS =0V f=1MHz Vcc =300V VGS =10V I D =8A RGS =18Ω Vcc =250V I D =16A VGS =10V L=1.52mH, Tch =25°C I F =16A, VGS =0V, Tch =25°C I F =16A, VGS =0V -di/dt=100A/µs, Tch=25°C min. 500 3.7 5.5 16 typ. 4.2 10 0.33 11 1700 210 13 37 30 87 17 48 17 18 7 0.90 0.46 6.0 max. 4.7 25 250 100 0.38 2550 315 19.5 55.5 45 130.5 25.5 72 25.5 27 10.5 1.35 Unit V V µA nA Ω S pF Tch =25°C Tch =125°C ns nC A V µs µC Thermal Characteristics Description Thermal resistance Symbol Rth (ch-c) Rth (ch-a) Test Conditions Channel to Case Channel to Ambient min. typ. max. 0.560 62.0 Unit °C/W °C/W Note *1 : Tch≤150°C. Note *2 : Stating Tch=25°C, IAS =7A, L=18.1mH, Vcc=50V, RG =50Ω. E AS limited by maximum channel temperature and avalanche current. See to 'Avalanche Energy' graph. Note *3 : Repetitive rating : Pulse width limited by maximum channel temperature. See to the 'Transient Themal impeadance' graph. Note *4 : I F ≤ -I D, -di/dt=100A/μs, Vcc ≤ BVDSS, Tch≤150°C. Note *5 : I F ≤ -I D, dv/dt=4.8kV/μs, Vcc ≤ BVDSS, Tch≤150°C. 1 FMP16N50ES Allowable Power Dissipation PD=f(Tc) Safe Operating Area ID=f(VDS):Duty=0(Single pulse),Tc=25 °c FUJI POWER MOSFET 300 10 2 t= 1µs 10µs 250 10 200 1 100µs PD [W] 100 10 50 -1 ID [A] 150 10 0 1 ms P o w e r l o s s w a v e fo r m : Squ a r e w a ve fo r m PD t 0 0 25 50 75 Tc [°C] 100 125 150 10 -2 10 0 10 1 VDS [V] 10 2 10 3 40 Typical Output Characteristics ID=f(VDS):80 µs pulse test,Tch=25 °C 100 Typical Transfer Characteristic ID=f(VGS):80 µs pulse test,VDS=25V,Tch=25 °C 10V 30 8 .0 V ID[A] 10 I D [ A] 20 7.5V 1 7.0V 10 6 .5 V VGS=6.0V 0 0 4 8 12 VDS [V] 16 20 24 0 2 4 6 VGS[V] 8 10 12 0.1 100 Typical Transconductance gfs=f(ID):80 µs pulse test,VDS=25V,Tch=25 °C 0.8 Typical Drain-Source on-state Resistance RDS(on)=f(ID):80 µs pulse test,Tch=25 °C VGS=6.5V 0.7 7V 10 RDS(on) [ Ω ] 0.6 8V 10V 20V g f s [ S] 0.5 1 0.4 0.3 0.1 0.1 1 ID [A] 10 100 0.2 0 10 20 ID [A] 30 40 2 FMP16N50ES Drain-Source On-state Resistance RDS(on)=f(Tch):ID=8A,VGS=10V FUJI POWER MOSFET 1.2 1.1 1.0 0.9 0.8 RDS(on) [ Ω ] 8 7 6 VGS(th) [V] Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=250µA 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -50 -25 0 25 50 Tch [°C] 75 100 125 150 m ax. typ. 5 4 3 2 1 0 -50 -25 0 25 m ax. typ. m in. 50 75 Tch [°C] 100 125 150 14 Typical Gate Charge Characteristics VGS=f(Qg):ID=16A,Tch=25 °C 10 4 Typical Capacitance C=f(VDS):VGS=0V,f=1MHz 12 10 Vcc= 100V 250V 400V 10 3 Ciss V GS [ V] C [pF] 8 10 2 6 Coss 4 10 1 2 Crss 0 0 20 40 Qg [nC] 60 80 10 0 10 -2 10 -1 10 0 10 1 10 2 VDS [V] 100 Typical Forward Characteristics of Reverse Diode IF=f(VSD):80 µs pulse test,Tch=25 °C 10 3 Typical Switching Characteristics vs. ID t=f(ID):Vcc=300V,VGS=10V,RG=18 Ω td(off) 10 10 2 I F [ A] td(on) t [ns] tf tr 10 1 1 0.1 0.00 0.25 0.50 0.75 VSD [V] 1.00 1.25 1.50 10 0 10 -1 10 0 10 1 10 2 ID [A] 3 FMP16N50ES Maximum Avalanche Energy vs. starting Tch E(AV)=f(starting Tch):Vcc=50V,I(AV)