FMR21N50ES

FMR21N50ES Super FAP-E3S series Features Maintains both low power loss and low noise Lower RDS (on) characteristic More controllable switching dv/dt by gate resistance Smaller VGS ringing waveform during switching Narrow band of the gate threshold voltage (4.2± 0.5V) High avalanche durability FUJI POWER MOSFET N-CHANNEL SILICON POWER MOSFET Outline Drawings [mm] TO-3PF Equivalent circuit schematic Drain(D) Applications Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters Gate(G) Source(S) Maximum Ratings and Characteristics Absolute Maximum Ratings at Tc=25°C (unless otherwise specified) Description Drain-Source Voltage Continuous Drain Current Pulsed Drain Current Gate-Source Voltage Repetitive and Non-Repetitive Maximum Avalanche Current Non-Repetitive Maximum Avalanche Energy Repetitive Maximum Avalanche Energy Peak Diode Recovery dV/dt Peak Diode Recovery -di/dt Maximum Power Dissipation Operating and Storage Temperature range Isolation Voltage Symbol VDS VDSX ID I DP VGS I AR E AS E AR dV/dt -di/dt PD Tch Tstg VISO Characteristics 500 500 ± 21 ± 84 ± 30 21 714.5 13.5 5.7 100 3.13 135 150 -55 to + 150 2 Unit V V A A V A mJ mJ kV/µs A/µs W °C °C kVrms Remarks VGS = - 30V Note*1 Note*2 Note*3 Note*4 Note*5 Ta=25°C Tc=25°C t = 60sec, f = 60Hz Electrical Characteristics at Tc=25°C (unless otherwise specified) Description Drain-Source Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Drain Current Gate-Source Leakage Current Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Time Turn-Off Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate-Drain Crossover Charge Avalanche Capability Diode Forward On-Voltage Reverse Recovery Time Reverse Recovery Charge Symbol BVDSS VGS (th) I DSS I GSS R DS (on) gfs Ciss Coss Crss td(on) tr td(off) tf QG Q GS Q GD Q SW I AV VSD trr Qrr Conditions I D =250 µ A, VGS =0V I D =250 µ A, VDS =VGS VDS =500V, VGS =0V VDS =400V, VGS =0V VGS = ± 30V, VDS =0V I D =10.5A, VGS =10V I D =10.5A, VDS =25V VDS =25V VGS =0V f=1MHz Vcc =300V VGS =10V I D =10.5A RGS =10Ω Vcc =250V I D =21A VGS =10V L=1.27mH, Tch =25°C I F =21A, VGS =0V, Tch =25°C I F =21A, VGS =0V -di/dt=100A/µs, Tch=25°C min. 500 3.7 7.5 21 typ. 4.2 10 0.23 15 2450 320 19 41 33 90 16 68 23 26 10 0.90 0.45 7.2 max. 4.7 25 250 100 0.27 3675 480 28.5 61.5 49.5 135 24 102 34.5 39 15 1.35 Unit V V µA nA Ω S pF Tch =25°C Tch =125°C ns nC A V µs µC Thermal Characteristics Description Thermal resistance Symbol Rth (ch-c) Rth (ch-a) Test Conditions Channel to Case Channel to Ambient min. typ. max. 0.930 40.0 Unit °C/W °C/W Note *1 : Tch≤150°C. Note *2 : Stating Tch=25°C, IAS =9A, L=16.2mH, Vcc=50V, RG =50Ω. E AS limited by maximum channel temperature and avalanche current. See to 'Avalanche Energy' graph. Note *3 : Repetitive rating : Pulse width limited by maximum channel temperature. See to the 'Transient Themal impeadance' graph. Note *4 : I F ≤ -I D, -di/dt=100A/μs, Vcc ≤ BVDSS, Tch≤150°C. Note *5 : I F ≤ -I D, dv/dt=5.7kV/μs, Vcc ≤ BVDSS, Tch≤150°C. 1 FMR21N50ES Allowable Power Dissipation PD=f(Tc) Safe Operating Area ID=f(VDS):Duty=0(Single pulse),Tc=25 °c FUJI POWER MOSFET 200 10 2 t= 1µs 10µs 150 10 1 100µs PD [W] ID [A] 100 10 0 1m s 50 10 -1 P o w e r l o s s w a v e fo r m : Squ a r e w a v e f o r m PD t 0 0 25 50 75 Tc [°C] 100 125 150 10 -2 10 -1 10 0 10 VDS [V] 1 10 2 10 3 70 Typical Output Characteristics ID=f(VDS):80 µs pulse test,Tch=25 °C 100 Typical Transfer Characteristic ID=f(VGS):80 µs pulse test,VDS=25V,Tch=25 °C 60 50 10V 10 ID [A] 30 7 .5 V 1 20 7 .0 V 6 .5 V VGS=6.0V 0.1 10 0 0 4 8 12 VDS [V] 16 20 24 0 2 4 6 VGS[V] 8 10 12 100 Typical Transconductance gfs=f(ID):80 µs pulse test,VDS=25V,Tch=25 °C ID[A] 40 8.0V 0.7 Typical Drain-Source on-state Resistance RDS(on)=f(ID):80 µs pulse test,Tch=25 °C VGS=6.0V 6.5V 7V 0.6 10 RDS(on) [ Ω ] 0.5 8V 10V 20V gfs [S] 0.4 1 0.3 0.2 0.1 0.1 1 ID [A] 10 100 0.1 0 10 20 30 ID [A] 40 50 60 2 FMR21N50ES Drain-Source On-state Resistance RDS(on)=f(Tch):ID=10.5A,VGS=10V Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=250µA FUJI POWER MOSFET 1.0 8 7 0.8 6 5 4 3 RDS(on) [ Ω ] 0.6 VGS(th) [V] max. typ. min. 0.4 max. typ. 0.2 2 1 0.0 -50 -25 0 25 50 Tch [°C] 75 100 125 150 0 -50 -25 0 25 50 75 Tch [°C] 100 125 150 14 Typical Gate Charge Characteristics VGS=f(Qg):ID=21A,Tch=25 °C Typical Capacitance C=f(VDS):VGS=0V,f=1MHz 12 10 Vcc= 100V 250V 400V 10 4 Ciss 10 3 VGS [ V ] 6 C [pF] 8 10 2 Coss 4 10 2 1 Crss 0 0 20 40 Qg [nC] 60 80 100 10 0 10 -2 10 -1 10 0 10 1 10 2 VDS [V] 100 Typical Forward Characteristics of Reverse Diode IF=f(VSD):80 µs pulse test,Tch=25 °C 10 3 Typical Switching Characteristics vs. ID t=f(ID):Vcc=300V,VGS=10V,RG=10 Ω 10 10 2 td(off) tf IF [A] td(on) t [ns] tr 1 10 1 0.1 0.00 0.25 0.50 0.75 VSD [V] 1.00 1.25 1.50 1.75 10 0 10 -1 10 0 10 1 10 2 ID [A] 3 FMR21N50ES Maximum Avalanche Energy vs. starting Tch E(AV)=f(starting Tch):Vcc=50V,I(AV)