FAR-M2DB-27M000-F100

FUJITSU SEMICONDUCTOR DATA SHEET DS04-21709-1E ASSP Piezoelectric VCO (4 to 30 MHz) M2 Series (F100) s DESCRIPTION The M2 series (F100) of VCO (Voltage Controlled Oscillator) apply to the frequency range 4-30 MHz. The M2 series of VCO have a high reliability and wide controllable frequency ranges using a LiTaO3 piezoelectric single crystal with high electromechanical coupling coefficient. Output level applies to CMOS type for digital interface. s FEATURES • • • • • Wide frequency controllable range (Over than ±2000 ppm) High carrier noise ratio Excellent temperature stability CMOS output level High reliability due to hermetic seal s PACKAGE 14 pin DIP size, Metal can package F 1 M2 Series (F100) s PIN ASSIGNMENT (BOTTOM VIEW) 1 7 14 8 s PIN DESCRIPTIONS Pin Number 1 7 8 14 Symbol VIN GND VOUT VCC Input (Control voltage) Ground Output VCC Functions 2 M2 Series (F100) s ABSOLUTE MAXIMUM RATINGS (See WARNING) Parameter Symbol VCC VIN Ta Tstg — Rating –0.5 to +7.0 –0.5 to +7.0 –10 to +70 –40 to +100 +4 to +30 Unit V V °C °C MHz Power supply voltage Control voltage Operating temperature Storage temperature Frequency range WARNING: Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. s RECOMMENDED OPERATING CONDITIONS Parameter Symbol VCC VIN Ta Value +4.75 to +5.25 +0.0 to +5.0 –10 to +70 Unit V V °C Power supply voltage Control voltage Operating temperature s STANDARD FREQUENCIES Frequency 12.288 MHz 13.500 MHz 14.318 MHz 18.432 MHz 21.053 MHz 24.576 MHz 25.175 MHz 27.000 MHz 28.636 MHz Application For audio For video For video For audio For video For audio For video For video For video Part number FAR-M2DB-12M288-F100 FAR-M2DB-13M500-F100 FAR-M2DB-14M318-F100 FAR-M2DB-18M432-F100 FAR-M2DB-21M053-F100 FAR-M2DB-24M576-F100 FAR-M2DB-25M175-F100 FAR-M2DB-27M000-F100 FAR-M2DB-27M636-F100 3 M2 Series (F100) s ELECTRICAL CHARACTERISTICS Unless otherwise specified Ta = +25 °C, VCC = +5.0 V Parameter Symbol ICC “H” “L” VOH VOL DUTY ∆f O fH fL ∆f(VCC) Condition Without load VIN = 2.5 V VIN = 2.5 V VIN = 2.5 V VIN = 2.5 V VIN = 4.5 V VIN = 0.5 V VCC = 4.75 V to 5.25 V VIN = 2.5 V VIN = 2.5 V (fO < 23 MHz) VIN = 2.5 V (fO ≥ 23 MHz) Value Min. — VCC –0.5 — 40 –500 +1600 — –100 –500 –400 Typ. 9.0 5.0 0 50 — — — — — — Max. 15 — +0.5 60 +500 — –1600 +100 +500 +600 Unit mA V V % ppm ppm ppm ppm ppm ppm Nominal frequency reference VCC = 5.0 V reference 25°C reference Ta = –10 to +70°C * Remarks Current consumption Output voltage Duty ratio Initial deviation of oscillation frequency Oscillation frequency Frequency stability Frequency stability with temperature * : Duty Ratio ∆f(Ta) V OH 2.5 V DC V OL T W Duty (%) = T W × 100 s MEASURMENT CIRCUIT Vcc OUTPUT C L = 22 pF±3 pF (CL includes capacitor of probe and test fixture) 4 M2 Series (F100) s TYPICAL CHARACTERISTICS Part number : FAR-M2DB-27M000-F100 1. Oscillation Frequency vs. Control Votage Oscillation Frequency (ppm) 5.000 4.000 3.000 2.000 1.000 0 − 1.000 − 2.000 − 3.000 − 4.000 − 5.000 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Control Voltage (V) 27.000 MHz 2. Frequency Stability With Temperature 500 400 Oscillation Frequency (ppm) 300 200 100 0 − 100 − 200 − 300 − 400 − 500 –20 –10 0 10 20 30 40 50 60 (Ta = +25°C reference) V IN = +2.5 V 70 80 Temperature (°C) 3. Frequency Stability vs. Vcc 200 Oscillation Frequency (ppm) 150 100 50 0 –50 –100 –150 –200 4.50 4.75 Vcc (V) 5.00 5.25 (VCC = +50 reference) V IN = +2.5 V 5.50 5 M2 Series (F100) s PART NUMBER DESIGNATION [Designation example] FAR – M2DB – * * : Frequency designation : Specify the nominal frequency in six alphanumeric characters. Enter M at the decimal point. [Example] 27.000 MHz → 27M000 – F100 s MARKING Logo Frequency F V − 27 M 0 0 0 F100 X X X X X X INDEX Lot. No. 6 M2 Series (F100) s PACKAGE DIMENSION F V − 27 M 0 0 0 F100 X X X X X X 20.8 18.3 0.9 MAX 15.2 7 φ 0.5 1 6.3 13.1 7.6 14 8 4.9 MAX Dimensions in mm. 7 FUJITSU LIMITED For further information please contact: Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-88, Japan Tel: (044) 754-3763 Fax: (044) 754-3329 North and South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street San Jose, CA 95134-1804, U.S.A. Tel: (408) 922-9000 Fax: (408) 432-9044/9045 Europe FUJITSU MIKROELEKTRONIK GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122 Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LIMITED #05-08, 151 Lorong Chuan New Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220 All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. 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