FCN-260

Differential COnneCtOr fCn-260(D) Series roHS Compliant microGiGaCnTM Stacking Connector n featureS • High speed matched impedance (100Ω) differential signal connector • Low cross talk • 2-step sequential mating of contacts • Self alignment feature • Hot plugable • RoHS compliant n SpeCifiCatiOnS It em Sp ec i f i c at i o n s -55˚ C to +105˚ C AC 0.1A (signal) AC 0.5 A (ground) AC 30 V 80m ohms max. (signal) 40m ohms max.(ground) 1000Mohms minimu m AC 500V for 1 minute 100 cycle s 50 N maximum (24 pair ) 5 N minimum (24 pair ) Operating temperature range Current rating Voltage rating Contact resistance Insulation resistance Dielectric withstanding voltage Durability Insertion force Withdrawl force fujitsu's fCn-260(D) Differential Signal Connector As network speeds increase, designers are moving to differential interconnects for network switches and hubs, as well as for connections between components in high-speed computer clusters, video systems, test equipment, and real-time medical equipment (MRI, etc.). Conventional connectors do not support the speed and signal integrity requirements of these applications. By implementing a connector specifically for high-speed, high-density, board-toboard differential applications, designers can take advantage of a differential interconnect instead of more costly fiber optic or coax alternatives. Differential signals use two conductors to carry signals that are compliments of one another. This arrangement reduces noise effects because any noise introduced by interference or crosstalk appears in both signals (common-mode noise) and is ignored by differential http://us.fujitsu.com/components  n MaterialS It em Insulator Conductor Plating Specifications subject to change Mat er i al s LCP Resin (UL94V-0 ) Copper Allo y Contact: Au Plating (PAGOS) Au over Pd-Ni plating Dimensions are in millimeters (inches) microGiGaCnTM fCn-260 (D) Series receivers. With noise voltages less of a problem, differential signals can use a small voltage swing that switches between LOW and HIGH values extremely quickly --hence the appeal of differential signals for high-speed networking and clustering. Differential connector characteristics can exceed the requirements of upcoming 1-Gbit applications and extend to next-generation applications at speeds upwards of 4.4 Gbps. As a result, system and board vendors who adopt such a connector can look forward to legacy usage that spans multiple product generations. The signal transmission path of connectors has not always been a critical issue when choosing an interconnect method because the connector's electrical signal path is short compared to cables or printed circuit board assemblies. In applications utilizing high-frequency signals, however, connectors can have a significant effect on signal integrity. Connectors for high-speed applications must be designed to achieve optimal performance through the minimization of crosstalk and susceptibility to noise influences. networking hubs incorporate many boards that must be interconnected via short-run cables. These internal cables often have to transfer data at speeds significantly higher than those of the actual network, so even today's 10/100-Mbit networks need high-speed internal interconnects with excellent signal integrity. In addition, any system that uses an external fiber optic connector probably requires an internal, board-to-board connector system that works at the highest possible speeds. Fiber optic and coax interconnect systems obviously meet the internal performance requirements, but the cost is high. Differential interconnects meet both the performance and cost goals but until recently, no connectors were available that provided high-density connections at gigabit speeds. In addition, connector test methodologies from the past cannot give reliable and repeatable results of the differential connector's performance in high-speed systems. Therefore, new test methodologies must be developed based on the unique characteristics of these emerging high-speed applications. Differential signal applications The shift from mainframe environments to networked client/server enterprises has made networks a critical bottleneck for improving system performance. Emerging technologies such as high-speed server farms, video conferencing, and greater use of graphical interfaces is pushing networks toward performance of 1 Gbit/sec and higher. The IEEE 802 committee is releasing 1.028Gbit Ethernet standards to meet this requirement. One of the key challenges for switch, hub, video equipment, and server manufacturers is to find a board-to-board connector system that allows signals to transfer at gigabit speeds over an affordable interconnect system that furnishes specific matched-impedance characteristics. Applications such as servers are now moving to extremely high-speed interfaces (often based on Fibre Channel) between computer backplanes and disk subsystems that require advance interconnects between boards. Similarly, High-speed differential interconnect characterization In the past, connector manufacturers "deimbedded" the connector from the test PCB's to show just the electrical characteristics of the connector and did not include any parasitic effects associated with solder joints on a through hole contact lead, or the effects of the contact post (compliant or non-compliant pin) in a plated through hole. While this test methodology was acceptable for slower system speeds, today's differential interconnects demand much more focused attention on system and board effects. The requirements for testing today's high-speed differential interconnects are demanding with good reason. Connectors and other traditionally "electrically small" components are no longer small when considering presently available signaling technologies with 100ps risetimes and multi-gigabit data rates. Among these requirements are very well-designed test boards needed for accurate measurement and characterization. This data is Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components 2 microGiGaCnTM fCn-260 (D) Series used to develop SPICE or other models and to provide detailed data to the design community. Typical high-frequency test boards designed by Fujitsu include: l well-controlled impedance, matched-Iength test traces (with "real-world" widths and spacings) calibration/reference lines that mimic the test traces connector region entities (pads, pins, vias) that reflect actual system board implementations low discontinuity test connectors (these give access to the measurement equipment) of sufficient bandwidth to meet the testing needs (e.g. SMA, 55MB, etc.) l include signal edge and amplitude losses, skews, propagation delays, and interconnect bandwidth. At times, frequency domain data (such as S-parameters) adds insight into these measurements and may be preferred by some customers. However, differential measurements in the frequency domain must be approached with caution and specialized knowledge. l l Differential pairs must be well-matched in order to minimize skew and maintain the proper impedance. Calibration lines of lengths "L" (where L is the length of the test traces between the article under test and the test connectors) and 2L provide the opportunity to calibrate out the board effects (if necessary) as well as to make "reference" measurements to test the goodness of an interconnect. These reference measurements are especially important when determining transmission fidelity. Fujitsu Components attempts to use standard, commonly available FR-4 type board materials (better performers than some believe) whenever possible; however, there are times when so-called "low loss" board materials may be required, such as for long paths running at gigabit speeds. In addition to very good test articles, test equipment must be selected that will provide for the measurements required at the bandwidths needed. Measurements may be completed for differential interconnects running at 100 Mbps, 625 Mbps, 1 Gbps, 2.5 Gbps or beyond depending on the system being designed. Fujitsu Components typically measures for single-ended and differential impedance (using a "TDR"), transmission fidelity, crosstalk, and eye pattern performance among other measures of quality. Typical transmission parameters quantified Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components  microGiGaCnTM fCn-260 (D) Series Figure 1 Basic Concept for Differential Transfer Sectional View (Connection area) 1.5 mm 0.75 mm Patent pending Virtual ground plane + + + 1.27 mm Differential pair contact - - Ground/Power contact Figure 2 PCB Routing -Test Card Measurement pair S1+ S1S2+ Drive pairs S2S3+ S3- SMA connector footprints Edge coupled differential pairs PCB Routing - Test Card Measurement pair S1+ S1Drive pairs S2+ S2S3+ S3- SMA connector foot print 6“ test pattern Edge coupled differential pairs Adapter card socket foot printcard 3” test pattern Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components  microGiGaCnTM fCn-260 (D) Series TDR Results (Impedance Tr 50ps) (Test Card + Stacking Connector) (Area of connector) Test Card Area of connector Test Card 92.3 to 109.8 Ohms TDR data includes connector footprint and test board Single Pair Cross talk @ 50 ps T rise Aggressor Differential Signal Components (Tr=46.4 ps, 3 inches PCB calibration line) Adjacent Connector Pair Near End Cross talk (~6.0 mV /500mV=1.2%) Adjacent Connector Pair Far End Crosstalk (~3.5 mV /500mV=0.7%) Aggresssor line + Victim line + Victim line Differential Near End Cross talk Aggresssor line Victim line + Victim line Differential Far End Cross talk Data includes test SMA connector and test boards Cross talk data includes connector footprint and test board Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components  microGiGaCnTM fCn-260 (D) Series Attenuation(S21) (A)Calibration Network Analyzer Balun 6 inches card Balun (A) (B) Measurement Network Analyzer (B) 3 inches card Balun Stacking Analyzer Balun Balunis Picosecond Pulse Labs 5315. Eye Pattern@625 Mbps Measurement Input : 250mV 800ps(50% bit time) 800ps(50% bit time) 1584ps 1580ps 6 inches test card Jitter: 16ps(Pk-Pk) Height: 241mV Pseudo-Random Bit Stream (PRBS) excitation from HP8133A-02 3GHz Pulse Generator Test Card + Stacking Connector Jitter: 20ps(Pk-Pk) Height: 238 mV All data includes connector footprint and test board Eye Pattern@1.25 Gbps Measurement Input : 250mV 400ps (50% bit time) 400ps(50% bit time) 784ps 782ps 6 inches test card Jitter: 16ps(Pk-Pk) Height: 227 mV Pseudo-Random Bit Stream (PRBS) excitation from HP8133A-02 3GHz Pulse Generator Test Card + Stacking Connector Jitter: 18ps(Pk-Pk) Height : 230mV All data includes connector footprint and test board Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components 6 microGiGaCnTM fCn-260 (D) Series Eye Pattern@2.5 Gbps Measurement Input : 250mV 200ps (50% bit time) 200ps (50% bit time) 368ps 364ps 6 inches test card Jitter: 32ps(Pk-Pk) Height: 193 mV Pseudo-Random Bit Stream (PRBS) excitation from HP8133A-02 3GHz Pulse Generator Test Card + Stacking Connector Jitter: 36ps(Pk-Pk) Height: 203 mV All data includes connector footprint and test board Eye Pattern @ 3.125 Gbps Measurement Input: 250mV 160ps (50% bit time) 160ps (50% bit time) 274ps 273ps 6 inches test card Jitter: 46ps(Pk-Pk) Height: 181mV Pseudo-random Bit Stream (PRBS) exitation from HP8133A-02 3 GHz Pulse Generator Test Card + Stacking Connector Jitter: 47ps(Pk-Pk) Height: 183 mV All data includes connector footprint and test board Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components  microGiGaCnTM fCn-260 (D) Series n StaCkinG SpeCifiCatiOnS FCN-268M***-G/BD FCN-268F***-G/0D FCN-268F***-G/BD FCN-268F***-G/0D FCN-268M***-G/*D FCN-268M***-G/*D FCN-268M***-G/*D FCN-268F***-G/BD FCN-268F***-G/0D FCN-268M***-G/BD FCN-268M***-G/BD FCN-268F***-G/BD n StaCkinG SpeCifiCatiOnS Board interval (mm)  0 2  Mounting dimensions 8 mm (0.315) 10 mm (0.394) 12 mm (0.472) 14 mm (0.551) Part number Socket Plug FCN-268F0xx-G/0D Note: This socket is used for all dimensions. FCN-268Mxxx-G/0D FCN-268Mxxx-G/1D FCN-268Mxxx-G/2D FCN-268Mxxx-G/3D Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components  microGiGaCnTM fCn-260 (D) Series BOarD tO BOarD, SOCket n DiMenSiOnS X Insulator S(mx2) Y X S2 7.5 (.30) 3.35 (.132) 5 (.197) 5.5(.217) 6.55(.258) 0.05 (.002) B 4.2 (.165) Section Y-Y 0.05 (.002) Unit: mm (in.) n reCOMMenDeD p.W.B. DiMenSiOn DATUM 1.5x(n-1)-0.75±0.03 [.060x(n-1)-.026±.001] Ground contact 2-Ø1.4±0.1 (2-Ø.055±.004) P.T.H. 0.5±0.05 (.020-.002) S(mx2-1) G(n) S(mx2) 1.5x(m-1)±0.03 [.060x(m-1)±.001] Signal Contact S1 -.004 8.6+0.1 (.134 ) 0 0 2 2 B±0.05 (B±.002) 0.25+0.05(.001+.002) 0 0 0.25+0.05(.001+.002) 0 0 S2 G1 4.2±0.05 (.165±.002) (.339+.004) 0 Unit: mm (in.) n part nuMBerS anD DiMenSiOnS Number of Differential Number of Contacts Pair Signals 12 24 36 24 signal 13 ground 48 signal 25 ground 72 signal 37 ground Part Number m FCN-268F012-G/0D 1-12 FCN-268F024-G/0D 1-24 FCN-268F036-G/0D 1-36 n 1-13 1-25 1-37 Dimensions: mm (in.) A 24.0 (.944) 42.0 (1.653) 60.0 (2.362) B 20.7 (.814) 38.7 (1.523) 56.7 (2.232) C 31.5 (1.240) 49.5 (1.948) 67.5 (2.657) Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components 1 (.040) 7 (.276) A C Section X-X Ground contact 2 1 (.040) 7 (.276) G(n) S(mx2-1) 1.5x(n-1)-0.75 [.060x(n-1)-.026] Ground contact 1.5x(m-1) [.060x(m-1)] Signal Contact Differential signal contacts S1 G1 2 Y  microGiGaCnTM fCn-260 (D) Series riGHt anGle, SOCket n DiMenSiOnS 1.5 x (n-1) -0.75 (0.059 X (N-1) -0.030) 1.5 x (m-1) [0.059 x (m-1)] 2.875 (0.113) 1.275(0.050) A (B) 7.5 (0.295) 2.575 (0.101) 5.375(0.212) 4.1 (0.161) ¯1.8 (0.070) 5 (0.197) 7.4 (0.291) 9.5 (0.374) 2.5 (0.098) 5.3 (0.209) 1.275(0.050) 0.5 (0.039) 0.5 x (p-1) +1.6 (0.039 x (p-1)+0.063) Terminal pitch D C 2.9 (0.114) ¯1 (0.039) Unit: mm (in.) n reCOMMenDeD p.W.B. DiMenSiOn C ±0.05 (±0.002) D ±0.05 (±0.002) 4.5±0.03 (0.177±0.001) 6.9±0.05 (0.272±0.002) ¯1.82 +0.05 (T.H.) 0 (¯0.072+0.002) 0 (0.220 0 ) -0.002 0 5.6 -0.05 2.9±0.03 (0.114±0.001) 2.6 +0.05 0 (0.1022+0.002) 0 0.305±0.025 (0.012±0.001) 2.6±0.1 (0.102±0.004) (T.H.) 0.5±0.03 (0.020) 2 -¯1.4±0.1 (0.055±0.004) ¯1.82 +0.05 (T.H.) 0 (¯0.072+0.002) 0 0.5 x (p-1)+1.6±0.05 (0.020 x (p-1)+0.063±0.002) Unit: mm (in.) n part nuMBerS anD DiMenSiOnS Part Number FCN-268F012-G/B D FCN-268F024-G/B D FCN-268F036-G/B D Dimensions: mm (in.) m n p 1-3 7 1-7 3 A (B) C 24. 1 (0.949) 42. 1 (1.657) 60.1 (2.366) D 21. 2 (0.835) 39. 2 (1.543) 57. 2 (2.252) 24. 0 31.5 (0.941) (1.240) 42. 0 49.5 (1.654) (1.949) 60. 0 67.5 (2.362) (2.657) Number of Differential Pair Signals 12 24 36 1-1 2 1-1 3 1-2 4 1-2 5 1-3 6 1-3 7 1-10 9 Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components 0 microGiGaCnTM fCn-260 (D) Series BOarD tO BOarD, pluG, StaCkinG HeiGHt  mm n DiMenSiOnS DATUM 1.5(.060) x (n-1) -0.75 (.030) Ground pitch 1.5(.060) x (m-1) Signal pitch Differential signal contacts 7 (.276) S(mx2) G(n) Y X S2 G1 2 Insulator 5 (.197) S(mx2-1) A B Y X 3.39(.133) 6.5 (.256) S1 Section X-X Ground contact H 5.45 0.05 (2.146) (.002) 7 (.276) 3.25 (.128) D Section Y-Y 0.05 (.002) n reCOMMenDeD p.W.B. DiMenSiOn DATUM 1.5x(n-1)-0.75±0.03 [.060x(n-1)-.026±.001] Ground contact 1.5x(m-1)±0.03 [.060x(m-1)±.001] Signal Contact 2-Ø1.4±0.1 (2-Ø.055±.004) P.T.H. S2 1.3±0.05 (.051-.002) 2 G(n) 0.3+0.05 (.012+.002) 0 0 0.3+0.05(.012+.002) 0 0 C±0.05 (C±.002) G1 S1 S(mx2-1) 4.2±0.05 (.165±.002) (.134 0 ) -.004 0 3.4 -0.1 (.339+.004) 0 S(mx2) 8.6+0.1 0 Unit: mm (in.) n part nuMBerS anD DiMenSiOnS Number of Contacts 24 signal 13 ground 48 signal 25 ground 72 signal 37 ground Part Number m FCN-268M012-G/0D FCN-268M024-G/0D FCN-268M036-G/0D n Number of Differential Pair Signals 12 24 36 Dimensions: mm (in.) A 19.89 (.783) B 23.0 (.906) C 20.7 (.814) 38.7 (1.523) 56.7 (2.232) D 29.5 (1.161 47.5 (1.870) 65.5 (2.578)  1-1 2 1-1 3 1-2 4 1-2 5 1-3 6 1-3 7 37.89 41.0 (1.491) (1.614) 55.89 59.0 (2.200) (2.322) Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components 1 (.040) 4.2 (.165) Unit: mm (in.) 1 (.040) microGiGaCnTM fCn-260 (D) Series BOarD tO BOarD, pluG, StaCkinG HeiGHt 0mm n DiMenSiOnS DATUM Differential signal contacts 1.5(.060) x (n-1) -0.75 (.030) Ground pitch 1.5(.060) x (m-1) Signal pitch G(n) Y X Insulator S2 G1 7.45 (0.293) Section X-X 5 (.197) 0.05 (.002) S(mx2-1) A (55.89) [2.200] B (59) [2.323] Y X 3.39 (.133) 6.5 (.256) S1 Ground contact Section Y-Y 3.25 (.128) 0.05 (.002) C (56.7) [2.232] D (65.5) [2.579] 4.2 (.165) Unit: mm (in.) n reCOMMenDeD p.W.B. DiMenSiOn DATUM 2-Ø1.4±0.1 (2-Ø.055±.004) P.T.H. S2 1.5x(n-1)-0.75±0.03 [.060x(n-1)-.026±.001] Ground contact 1.5x(m-1)±0.03 [.060x(m-1)±.001] Signal Contact S(mx2) G(n) 1.3±0.05 (0.051±.002) S(mx2-1) C±0.05 (56.7±0.05) [C±.002 (2.232±0.002)] 0.3+0.05 (.012+.002) 0 0 4.2±0.05 (.165±.002) 0 3.4-0.1 0.3+0.05 (.012+.002) 0 0 (0.1340 -0.004 ) (.339+.004) 0 8.6+0.1 0 Unit: mm (in.) Recommended P.W.B. Dimension n part nuMBerS anD DiMenSiOnS Number of Differential Pair Signals 12 24 36 Number of Contacts 24 signal 13 ground 48 signal 25 ground 72 signal 37 ground Part Number m FCN-268M012-G/1D FCN-268M024-G/1D FCN-268M036-G/1D n Dimensions: mm (in.) A 19.89 (.783) B 23.0 (.906) C 20.7 (.814) 38.7 (1.523) 56.7 (2.232) D 29.5 (1.161 47.5 (1.870) 65.5 (2.578) 1-1 2 1-1 3 1-2 4 1-2 5 1-3 6 1-3 7 37.89 41.0 (1.491) (1.614) 55.89 59.0 (2.200) (2.322) Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components 1 (.040) 7 (.276) 1 (.040) 7 (.276) S(mx2) 2 microGiGaCnTM fCn-260 (D) Series BOarD tO BOarD, pluG, StaCkinG HeiGHt 2mm n DiMenSiOnS DATUM 1.5(.060) x (n-1) -0.75 (.030) Ground pitch 1.5(.060) x (m-1) Differential signal contacts G(n) Y X Insulator S2 G1 5 (.197) 9.45 (0.372) Section X-X 0.05 (.002) S(mx2-1) A (55.89) [2.200] B (59) [2.323] X Y 6.5 (.256) 3.39 (.133) S1 Ground contact Section Y-Y 0.05 (.002) D (65.5) [2.579] 4.2 (.165) 3.25 (.128) C (56.7) [2.232] Unit: mm (in.) n reCOMMenDeD p.W.B. DiMenSiOn DATUM 1.5x(n-1)-0.75±0.03 [.060x(n-1)-.026±.001] Ground contact 1.5x(m-1)±0.03 [.060x(m-1)±.001] 2-Ø1.4±0.1 (2-Ø.055±.004) P.T.H. S2 S(mx2) G(n) Signal Contact 1.3±0.05 (0.051±.002) S(mx2-1) C±0.05 (56.7±0.05) [C±.002 (2.232±0.002)] Recommended P.W.B. Dimension 0.3+0.05 0 (.012+.002) 0 4.2±0.05 (.165±.002) 0 3.4-0.1 0.3+0.05 (.012+.002) 0 0 (0.1340 -0.004 ) (.339 8.6+0.1 0 +.004 0) Unit: mm (in.) n part nuMBerS anD DiMenSiOnS Number of Differential Pair Signals 12 24 36 Number of Contacts 24 signal 13 ground 48 signal 25 ground 72 signal 37 ground Part Number m FCN-268M012-G/2D FCN-268M024-G/2D FCN-268M036-G/2D n Dimensions: mm (in.) A 19.89 (.783) B 23.0 (.906) C 20.7 (.814) 38.7 (1.523) 56.7 (2.232) D 29.5 (1.161 47.5 (1.870) 65.5 (2.578) 1-1 2 1-1 3 1-2 4 1-2 5 1-3 6 1-3 7 37.89 41.0 (1.491) (1.614) 55.89 59.0 (2.200) (2.322) Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components 1 (.040) 7 (.276) 1 (.040) 7 (.276) S(mx2) Signal pitch  microGiGaCnTM fCn-260 (D) Series BOarD tO BOarD, pluG, StaCkinG HeiGHt mm n DiMenSiOnS 1.5(.060) x (n-1) -0.75 (.030) Ground pitch 1.5(.060) x (m-1) Signal pitch DATUM Differential signal contacts S(mx2) G(n) Y X Insulator S2 G1 5 (.197) 11.45 (0.451) Section X-X 0.05 (.002) S(mx2-1) A (55.89) [2.200] B (59) [2.323] X Y 6.5 (.256) S1 3.39 (.133) Ground contact 7 (.276) 0.05 (.002) Section Y-Y D (65.5) [2.579] 3.25 (.128) C (56.7) [2.232] 4.2 (.165) Unit: mm (in.) n reCOMMenDeD p.W.B. DiMenSiOn DATUM 2-Ø1.4±0.1 (2-Ø.055±.004) P.T.H. Ground contact 1.5x(m-1)±0.03 [.060x(m-1)±.001] Signal Contact S(mx2) G(n) 1.3±0.05 (0.051±.002) 1.5x(n-1)-0.75±0.03 [.060x(n-1)-.026±.001] S(mx2-1) C±0.05 (56.7±0.05) [B±.002 (2.232±0.002)] 0.3+0.05 (.012+.002) 0 0 0 3.4-0.1 0.3+0.05 (.012+.002) 0 0 (0.1340 -0.004 ) (.339 8.6+0.1 0 +.004 0) 4.2±0.05 (.165±.002) Unit: mm (in.) Recommended P.W.B. Dimension n part nuMBerS anD DiMenSiOnS Number of Differential Pair Signals 12 24 36 Number of Contacts 24 signal 13 ground 48 signal 25 ground 72 signal 37 ground Part Number m FCN-268M012-G/3D FCN-268M024-G/3D FCN-268M036-G/3D n Dimensions: mm (in.) A 19.89 (.783) B 23.0 (.906) C 20.7 (.814) 38.7 (1.523) 56.7 (2.232) D 29.5 (1.161 47.5 (1.870) 65.5 (2.578) 1-1 2 1-1 3 1-2 4 1-2 5 1-3 6 1-3 7 37.89 41.0 (1.491) (1.614) 55.89 59.0 (2.200) (2.322) Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components 1 (.040) 1 (.040) 7 (.276)  microGiGaCnTM fCn-260 (D) Series BOarD tO BOarD, pluG, riGHt anGle n DiMenSiOnS 2.875 (0.113) 5.375 (0.212) 2.5 (0.098) 2.35 (0.093) 2.15 (0.085) 8.25 (0.325) 4.9 (0.193) 1.325 (0.052) 2.575 (0.101) 0.5±0.05 (0.012±0.002) Unit: mm (in.) n reCOMMenDeD p.W.B. DiMenSiOn 2.15±0.05 (0.085±0.002) 2¯1.4±0.1 (0.055±0.004) D±05 (0.020) [23.35 (0.919)] C±05 (0.020) [21.2 (0.835)] 0.305±0.025 (0.012±0.0001) (0.071+0.002) 0 2.6+0.05 0 (0.102+0.002) 0 1.82+0.05 0 0 0 (0.181 -0.02 -0.05 5.9±0.05 (0.114±0.002) 2.5±0.05 (0.098±0.002) 0.5±0.03 (0.012±0.001) 2.6±0.1 (0.102±0.004) 0.5x(p-1)+1.6±0.05 (0.063±0.002) ¯1.82+0.05 0 ¯(0.071+0.002) 0 4.6 ) Unit: mm (in.) n part nuMBerS anD DiMenSiOnS Number of Differential Pair Signals 12 24 36 Number of Contacts 24 signal 13 ground 48 signal 25 ground 72 signal 37 ground Part Number m n Dimensions: mm (in.) p A 19.89 (.783) (B) 29.5 (1.161) C 21.2 (0.835) 39.2 (1.543) 57.2 (2.252) D 23.35 (0.919) 41.35 (1.628) 59.35 (2.237)  FCN-268M012-G/BD 1-1 2 1-1 3 1-3 7 FCN-268M024-G/BD 1-2 4 1-2 5 1-7 3 FCN-268M036-G/BD 1-3 6 1-3 7 37.89 47.5 (1.491) (1.870) 1-1- 55.89 65.5 0(2.200) (2.579) Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components microGiGaCnTM fCn-260 (D) Series Fujitsu Components International Headquarter Offices Japan Fujitsu Component Limited Gotanda-Chuo Building 3-5, Higashigotanda 2-chome, Shinagawa-ku Tokyo 141, Japan Tel: (81-3) 5449-7010 Fax: (81-3) 5449-2626 Email: promothq@ft.ed.fujitsu.com Web: www.fcl.fujitsu.com north and South america Fujitsu Components America, Inc. 250 E. Caribbean Drive Sunnyvale, CA 94089 U.S.A. Tel: (1-408) 745-4900 Fax: (1-408) 745-4970 Email: components@us.fujitsu.com Web: http://www.fujitsu.com/us/services/edevices/components/ europe Fujitsu Components Europe B.V. Diamantlaan 25 2132 WV Hoofddorp Netherlands Tel: (31-23) 5560910 Fax: (31-23) 5560950 Email: info@fceu.fujitsu.com Web: emea.fujitsu.com/components/ Asia Pacific Fujitsu Components Asia Ltd. 102E Pasir Panjang Road #01-01 Citilink Warehouse Complex Singapore 118529 Tel: (65) 6375-8560 Fax: (65) 6273-3021 Email: fcal@fcal.fujitsu.com Web: http://www.fujitsu.com/sg/services/micro/components/ ©2008 Fujitsu Components America, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective owners. Fujitsu Components America or its affiliates do not warrant that the content of datasheet is error free. In a continuing effort to improve our products Fujitsu Components America, Inc. or its affiliates reserve the right to change specifications/datasheets without prior notice. Rev. September 24, 2008 Specifications subject to change Dimensions are in millimeters (inches) http://us.fujitsu.com/components 6