FTR-B2MA012Z

4 POLE (2 FORM C+ 2 FORM A) SIGNAL RELAY FOR CENTRAL SWITCHING/ DATA TRANSMISSION FTR-B2 Series s FEATURES q RoHS Compliant 4 POLE MINIATURE RELAY Mounting space of 175mm2 with 4 pole relay, suitable for high density mounting. q SAFETY STANDARD - UL/CSA recognized - Conforms to Bellcore specification & FCC part 68 - Conforms to IEC 60950 / UL1950 / EN60950 spacing and high breakdown voltage Clearance: 1.0mm Creepage: 1.6mm q HIGH RELIABILITY Bifurcated gold overlay silver alloy q HIGH HEAT RESISTANCE, FLAMMABILITY Flammability grade of 94V-0 materials employed q AIR TIGHT CONSTRUCTION Air tight construction allows high resistance to various environments and to clean the relay q SMT VERSION Surface mount type available on request q RoHS compliant since date code: 0430B8 Please see page 7 for more information N O T FO R N EW D s ORDERING INFORMATION [Example] FTR-B2 (a) M A 012 Z – ** (b) (c) (d) (e) (f ) FTR-B2 M : 2 Form C + 2 Form A - through hole N: 2 Form C + 2 Form A - SMT A : Standard (400mW) 4.5: 4.5VDC 012: 12VDC Z : Gold overlay silver alloy ES IG (a) Series Name (b) Contact Arrangement (c) Coil Type (d) Coil Nominal Voltage (e) Contact Material (f) Custom Designation N Special Number for Customized Products Remarks: Actual marking on relay would not carry code FTR and be as below: Ordering code Actual marking FTR-B2MA012Z → B2MA012Z 1 FTR-B2 Series s SAFETY STANDARD AND FILE NUMBERS UL508, 1950 (File No. E63615) C22.2 No. 14, No. 950 (File No. LR40304) Please request when the approval markings are required on the cover. Nominal voltage 4.5 to 12 VDC 0.2 A 1A 0.3 A Contact rating 125 VAC 30 VDC 110 VDC resistive Clearance N 1.0mm coil a- contacts O Creepage Remarks - working voltage: 150V - relay inside and outside - pollution degree "2" T 1.6mm coil - contacts s COIL DATA CHART MODEL FTR-B2 ( ) A4.5Z FTR-B2 ( ) A012Z Nominal Voltage 4.5VDC 12VDC FO R Coil Resistance 50Ω 355Ω Operate Voltage 3.38VDC 9.0VDC Release Voltage Nominal Power 0.45VDC 1.2VDC 400mw 400mw N EW D ES IG N 2 FTR-B2 Series s SPECIFICATIONS Item Contact Arrangement Material Resistance (initial) FTR-B2 Series 2 Form C + 2 Form A Gold overlay Silver alloy Maximum 75mΩ (at 1A 6VDC) 30VDC 1A / 125VAC 0.2A 30W / 25VA 110VDC / 125VAC 1A 1.25A N Time Value Coil Insulation Rating (resistive) O Maximum Switching Power Maximum Switching Voltage Maximum Switching Current Maximum Carrying Current T Operate Time (at nominal voltage) Maximum 10ms Release Time (at nominal voltage) Maximum 5ms Operating Temperature -40° C to +85° C (no frost) FO R Resistance (at 500VDC) Dielectric Strength N Minimum 1,000 MΩ Life Mechanical Electrical EW 750 VAC 1 Min. (open contacts) 500 VAC 1 Min. (adjacent contacts) 1,500 VAC 1 Min. (coil-contacts) 10 x 106 operations minimum 50 x 103 operations minimum at 30VDC 1A 100 x 103 operations minimum at 125VDC 0.2A 10-55 Hz (double amplitude of 1.5mm) 10-55 Hz (double amplitude of 1.5mm) 100m/s2 (11±1ms) 500m/s2 (6±1ms) Approximately 3.9g Vibration Misoperation Endurance Misoperation D Shock Endurance Weight ES IG N 3 s CHARACTERISTIC DATA Coil Temperature Rise (˚C) 10 8 6 4 2 0 0 3       
, N 0.2 FTR-B2 Series Nominal Voltage Multiplying Factor (%) Operation (return time characteristics) Coil Temperature Rise 80 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0 Ambient Temperature (maximum applied voltage, operating voltage characteristics) 60 ren A t: 1 nt: 0A Time (ms) Co Co nta nta ct ca 40 Co nta c ct Operation time ar n ryi gc ur rry ct c ing urr arr cu Coil Power (W) O 0.4 20 n Co tac tc arr yin gc e urr yin rre gc nt: 0A ent : 1A Operating Voltage (hot coil) Operating Voltage (cool coil) 20 40 60 80 100 Release T 0.6 0.8 0 0.2 0.4 0.6 0.8 Coil Power (W) Ambient Temperature (˚C) Maximum Switching Power FO Life Curve Contact Current (A) Operation (x104) 2 DC Resistive R 100 50 30 20 10 5 0 1 0.5 0.4 0.3 0.2 AC Resistive N 0.2 125 VAC Resistive 0.1 1 5 10 30 50 100 200 0.4 EW 0.6 0.8 30 VDC Resistive 1.0 s REFERENCE DATA Nominal Voltage Multiplying Factor (%) Q~ P Q Q~ ~P   Contact Voltage (V) Distribution of Operate and Release Voltage FTR-B2MA4.5Z n=100 Operate Release Contact Current (A) D 1.2 ES 100 100 Distribution of Operate and Release Time FTR-B2MA4.5Z n=100 Operate Release Distribution of Contact Resistance 100 IG 10 20 Distribution (%) Distribution (%) 80 60 Distribution (%) 80 80 N 40 FBR-B2MA4.5Z n=100 Break Make 60 60 40 40 40 20 20 20 0 10 20 30 40 50 60 70 80 90 100 0 1 2 3 4 5 6 0 30 50 60 70 Time (ms) Contact Resistance (mΩ) 4 FTR-B2 Series s REFERENCE DATA Nominal Voltage Multiplying Factor (%) Contact Nominal Voltage Resistance (m‰) Multiplying Factor (%) Mechanical Life Test 4.0 Operating Voltage 3.0 2.0 1.0 Release Voltage FBR-B2MA4.5Z n=10 1200 operations/min. Nominal Voltage Multiplying Factor (%) Electrical Life Test 4.0 Operating Voltage 3.0 2.0 1.0 0 500 200 100 50 20 10 5 2 Release Voltage FBR-B2MA4.5Z n=10 30 operations/min. 125 VAC 0.2A (resistive load) Make Break Initial 10 Electrical Life Test 4.0 Operating Voltage 3.0 2.0 1.0 0 500 200 100 50 20 10 5 2 Initial Release Voltage FBR-B2MA4.5Z n=10 30 operations/min. 30 VDC 1A (resistive load) Make Break 5 0 500 200 100 50 20 10 5 2 N 1 Initial Operation (x104) O 5 10 Make Break T 50 100 500 1000 Contact Resistance (m‰) Contact Resistance (m‰) Operation (x104) Operation (x104) s DIMENSIONS q Dimensions FO R Through hole type N q Schematics (BOTTOM VIEW) EW q PC board mounting hole layout (BOTTOM VIEW) Orientation mark D q Dimensions q Schematics (TOP VIEW) Surface mount type ES q PC board mounting hole layout (TOP VIEW) IG N Orientation mark 5 FTR-B2 Series s RECOMMENDED CONDITION (Temperature Profile) IRS (Infrared Reflow Soldering) VPS (Vapor Phase Soldering) Temperature (°C) T3 T2 T1 preheating soldering T 3 = 245°C max. T 2 = 200°C max. cooling T 1 = 165°C max. Temperature (°C) 215°C maximum soldering T3 T2 T1 preheating cooling T 3 = 200°C maximum T 2 = 165°C maximum T 1 = 100°C maximum 0 N 120 sec maximum O Note: 1.Temperature profiles show the temperature of PC board surface. 2.Please perform soldering test with your actual PC board before mass production, since the temperatures of PC board surfaces vary according to the size of PC board, status of parts mounting and heating method. T 16 30 sec Max. 0 60 sec Max. 60 sec Max. 90 sec Max. FO 2 4 s PACKAGING Tape dimensions ø 1.55 ø 2.2 R 14.2 N 28.4 32 EW 0.4 1.75 D 17.9 10.7 11.7 Tape feeding ES Reel Dimensions IG N ø 380 Top cover tape Embossed carrying tape Perforation Parts box Dimensions: mm General tolerance: ±0.2 Quantity of one reel: 250 pieces ø 13 6 FTR-B2 Series RoHS Compliance and Lead Free Relay Information 1. General Information Relays produced after the specific date code that is indicated on each data sheet are lead-free now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info. (http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf) q Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays. q Most signal and some power relays also comply with RoHS. Please refer to individual data sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE). q It has been verified that using lead-free relays in leaded assembly process will not cause any problems (compatible). q “LF” is marked on each outer and inner carton. (No marking on individual relays). q To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office. We will ship leaded relays as long as the leaded relay inventory exists. q N O 2. Recommended Lead Free Solder Profile q T Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005) Reflow Solder condtion FO R Flow Solder condtion: Peak Temp.: max. 250˚C Soldering 250 N Pre-heating: Soldering: temperature (˚C) 220 Pre-heating EW maximum 120˚C dip within 5 sec. at 260˚C soler bath Solder by Soldering Iron: Cooling 170 130 D Soldering Iron Temperature: maximum 360˚C Duration: maximum 3 sec. 90~120 sec. max. 120 sec. 20~30 sec. (duration) ES IG We highly recommend that you confirm your actual solder conditions N 3. Moisture Sensitivity q Moisture Sensitivity Level standard is not applicable to electromechanical realys. 4. Tin Whisker q SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house test. 5. Solid State Relays Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating is between the terminal and the Sn plating to avoid whisker. q 7 FTR-B2 Series Japan Fujitsu Component Limited Gotanda-Chuo Building 3-5, Higashigotanda 2-chome, Shinagawa-ku Tokyo 141, Japan Tel: (81-3) 5449-7010 Fax: (81-3) 5449-2626 Email: promothq@ft.ed.fujitsu.com Web: www.fcl.fujitsu.com North and South America Fujitsu Components America, Inc. 250 E. Caribbean Drive Sunnyvale, CA 94089 U.S.A. Tel: (1-408) 745-4900 Fax: (1-408) 745-4970 Email: marcom@fcai.fujitsu.com Web: www.fcai.fujitsu.com Europe Fujitsu Components Europe B.V. Diamantlaan 25 2132 WV Hoofddorp Netherlands Tel: (31-23) 5560910 Fax: (31-23) 5560950 Email: info@fceu.fujitsu.com Web: www.fceu.fujitsu.com Asia Pacific Fujitsu Components Asia Ltd. 102E Pasir Panjang Road #04-01 Citilink Warehouse Complex Singapore 118529 Tel: (65) 6375-8560 Fax: (65) 6273-3021 Email: fcal@fcal.fujitsu.com www.fcal.fujitsu.com Fujitsu Components International Headquarter Offices N © 2005 Fujitsu Components America, Inc. All company and product names are trademarks or registered trademarks of their respective owners. Rev. 06/07/2005. O T FO R N EW D ES IG N 8