FTR-B2NA4.5Z

4 Pole (2 FORM C+ 2 FORM A) Signal Relay for Central Switching/ Data Transmission FTR-B2 SERIES n FEATURES l RoHS compliant 4 POLE MINIATURE RELAY Mounting space of 75mm2 with 4 pole relay, suitable for high density mounting. l SAFETY STANDARD - UL/CSA recognized - Conforms to Bellcore specification & FCC part 68 - Conforms to IEC 60950 / UL1950 / EN60950 spacing and high breakdown voltage Clearance: 1.0mm Creepage: 1.6mm l HIGH RELIABILITY Bifurcated gold overlay silver alloy l HIGH HEAT RESISTANCE, FLAMMABILITY Flammability grade of 94V-0 materials employed l AIR TIGHT CONSTRUCTION Air tight construction allows high resistance to various environments and to clean the relay l SMT VERSION Surface mount type available on request l RoHS compliant since date code: 0430B8 Please see page 7 for more information D IS C O N TI N U ED n ORDERING INFORMATION [Example] FTR-B2 M A 012 Z – ** (a) (b) (c) (d) (e) (f ) Remarks: Actual marking on relay would not carry code FTR and be as below: Ordering code Actual marking FTR-B2MA012Z → B2MA012Z  FTR-B2 Series n SAFETY STANDARD AND FILE NUMBERS UL508, 1950 (File No. E63615) C22.2 No. 14, No. 950 (File No. LR40304) Please request when the approval markings are required on the cover. Nominal voltage 4.5 to 12 VDC Contact rating 0.2 A 125 VAC 1 A 30 VDC 0.3 A 110 VDC resistive Clearance D 1.0mm coil a- contacts IS C Creepage Remarks - working voltage: 150V - relay inside and outside - pollution degree "2" 1.6mm coil - contacts n COIL DATA CHART MODEL FTR-F2 Ser i es FTR-F2AK005T FTR-F2AK006T FTR-F2AK009T FTR-F2AK012T FTR-F2AK024T FTR-F2AK048T O N FTR-H2 Ser i es FTR-H2AK005T FTR-H2AK006T FTR-H2AK009T FTR-H2AK012T FTR-H2AK024T FTR-H2AK048T No m i n al V o l t ag e 5VDC 6VDC 9VDC 12VDC 24VDC 48VDC TI N Co i l Res i s t an c e (± 10%) U Mu s t Op er at e Vo l t ag e 3.5VDC 4.2VDC 6.3VDC 8.4VDC 16.8VDC 33.6VDC Mu s t Rel eas e V o l t ag e 0.25VDC 0.3VDC 0.45VDC 0.6VDC 1.2VDC 2.4VDC 47 Ω 68 Ω 155 Ω 27 0 Ω 1,200 Ω 4,400 Ω ED 2 FTR-B2 Series n SPECIFICATIONS It em Contact Arrangement FTR-B 2 Ser i es 2 Form C + 2 Form A Gold overlay Silver alloy Maximum 75mΩ (at 1A 6VDC) 30VDC 1A / 125VAC 0.2A 30W / 25VA 110VDC / 125VAC 1A 1.25A D Time Value Coil Insulation Material Resistance (initial) IS Rating (resistive) Maximum Switching Power Maximum Switching Voltage Maximum Switching Current Maximum Carrying Current C Operate Time (at nominal voltage) Maximum 10ms Release Time (at nominal voltage) Maximum 5ms Operating Temperature O N Resistance (at 500VDC) Dielectric Strength TI N U -40° C to +85° C (no frost) Minimum 1,000 MΩ 750 VAC 1 Min. (open contacts) 500 VAC 1 Min. (adjacent contacts) 1,500 VAC 1 Min. (coil-contacts) 10 x 106 operations minimum 50 x 103 operations minimum at 30VDC 1A 100 x 103 operations minimum at 125VDC 0.2A 10-55 Hz (double amplitude of 1.5mm) 10-55 Hz (double amplitude of 1.5mm) 100m/s2 (11±1ms) 500m/s2 (6±1ms) Approximately 3.9g Life Mechanical Electrical ED Vibration Misoperation Endurance Shock Weight Misoperation Endurance 3 FTR-B2 Series n CHARACTERISTIC DATA 10 Coil Temperature Rise (°C) Nominal Voltage Multiplying Factor (%) Operation (return time characteristics) 80 Coil Temperature Rise 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0 Ambient Temperature (maximum applied voltage, operating voltage characteristics) 8 60 e urr nt: 1A 0A nt: Time (ms) Co Co nta 6 4 2 D 0 0.2 nta ct ca 0 Coil Power (W) IS Release 0.4 Operation time 40 n Co tac tc arr yin gc ct c rry in 20 C 0.6 Co nta ct ca in rry u gc rre arr y gc ing urr en cur r t: 0 ent : A 1A Operating Voltage (hot coil) Operating Voltage (cool coil) Maximum Switching Power 3 DC Resistive O 0.8 0 0.2 0.4 0.6 0.8 Coil Power (W) Ambient Temperature (°C) 20 40 60 80 100 Contact Current (A) Operation (x104) 2 1 0.5 0.4 0.3 0.2 0.1 N 100 TI 50 30 20 10 5 0 Life Curve AC Resistive N 0.4 125 VAC Resistive U 0.6 30 VDC Resistive 1 5 10 30 50 100 200 0.2 Contact Voltage (V) Contact Current (A) ED 0.8 1.0 1.2 n REFERENCE DATA Distribution of Operate and Release Voltage 100 FTR-B2MA4.5Z n=100 Operate Release 100 Distribution of Operate and Release Time Contact Current (A) FTR-B2MA4.5Z n=100 Operate Release 3 2 1 0.5 0.4 0.3 0.2 0.1 Maximum Switching Power DC Resistive Distribution (%) 80 60 Distribution (%) 80 60 40 40 AC Resistive 20 20 0 10 20 30 40 50 60 70 80 90 100 Nominal Voltage Multiplying Factor (%) 0 1 2 3 4 5 Time (ms) 6 1 5 10 30 50 100 200 Contact Voltage (V) 4 FTR-B2 Series n REFERENCE DATA Nominal Voltage Multiplying Factor (%) Nominal Voltage Multiplying Factor (%) Contact Nominal Voltage Resistance (m‰) Multiplying Factor (%) Mechanical Life Test 4.0 3.0 2.0 1.0 Operating Voltage Electrical Life Test 4.0 3.0 2.0 1.0 Release Voltage FBR-B2MA4.5Z n=10 30 operations/min. 125 VAC 0.2A (resistive load) Make Break Initial 10 Operating Voltage Electrical Life Test 4.0 3.0 2.0 1.0 Release Voltage FBR-B2MA4.5Z n=10 30 operations/min. 30 VDC 1A (resistive load) Make Break Initial 5 Operating Voltage 0 500 200 100 50 20 10 5 2 Contact Resistance (m‰) 0 500 200 100 50 20 10 5 2 Contact Resistance (m‰) D 1 Initial Release Voltage Operation (x104) 5 10 IS FBR-B2MA4.5Z n=10 1200 operations/min. Make Break 0 500 200 100 50 20 10 5 2 50 100 C 500 1000 n DIMENSIONS l Dimensions O N Operation (x104) Operation (x104) Through hole type TI N l Schematics (BOTTOM VIEW) U Orientation mark ED l PC board mounting hole layout (BOTTOM VIEW) l Dimensions Surface mount type l Schematics (TOP VIEW) l PC board mounting hole layout (TOP VIEW) Orientation mark 5 FTR-B2 Series n RECOMMENDED CONDITION (Temperature Profile) IRS (Infrared Reflow Soldering) VPS (Vapor Phase Soldering) Temperature (C) T 3 T2 T 0 D preheating T 3 = 245C max. T 2 = 200C max. cooling T  = 165C max. Temperature (C) soldering T 3 T2 T 25C maximum soldering cooling preheating T 3 = 200C maximum T 2 = 165C maximum T  = 100C maximum 120 sec maximum Note: 1.Temperature profiles show the temperature of PC board surface. 2.Please perform soldering test with your actual PC board before mass production, since the temperatures of PC board surfaces vary according to the size of PC board, status of parts mounting and heating method. IS C 30 sec Max. 0 60 sec Max. 60 sec Max. 90 sec Max. O 4 N n PACKAGING Tape dimensions ø 1.55 ø 2.2 16 2 TI 1.75 14.2 28.4 N U 0.4 ED 17.9 32 10.7 11.7 Tape feeding Reel Dimensions ø 380 Top cover tape Embossed carrying tape Perforation Parts box Dimensions: mm General tolerance: ±0.2 Quantity of one reel: 250 pieces ø 13 6 FTR-B2 Series 1. General Information l RoHS Compliance and Lead Free Relay Information Relays produced after the specific date code that is indicated on each data sheet are lead-free now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info. (http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf) l Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays. l Most signal and some power relays also comply with RoHS. Please refer to individual data sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE). l It has been verified that using lead-free relays in leaded assembly process will not cause any problems (compatible). l “LF” is marked on each outer and inner carton. (No marking on individual relays). l To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office. We will ship leaded relays as long as the leaded relay inventory exists. D IS 2. Recommended Lead Free Solder Profile l C Reflow Solder condtion Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005) O N 250 Temperature ( C) 220 Pre-heating TI Peak Temp.: max. 250 C Soldering N U Flow Solder condtion: Pre-heating: Soldering: 170 130 30 ED maximum 120˚C dip within 5 sec. at 260˚C solder bath Solder by Soldering Iron: Cooling Soldering Iron Temperature: maximum 360˚C Duration: maximum 3 sec. 90~120 sec. max. 120 sec. 20~30 sec. (duration) We highly recommend that you confirm your actual solder conditions 3. Moisture Sensitivity l Moisture Sensitivity Level standard is not applicable to electromechanical realys. SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house test. 4. Tin Whisker l 7 FTR-B2 Series Fujitsu Components International Headquarter Offices Japan Fujitsu Component Limited Gotanda-Chuo Building 3-5, Higashigotanda 2-chome, Shinagawa-ku Tokyo 4, Japan Tel: (81-3) 5449-7010 Fax: (81-3) 5449-2626 Email: promothq@ft.ed.fujitsu.com Web: www.fcl.fujitsu.com North and South America Fujitsu Components America, Inc. 250 E. Caribbean Drive Sunnyvale, CA 94089 U.S.A. Tel: (1-408) 745-4900 Fax: (1-408) 745-4970 Email: marcom@fcai.fujitsu.com Web: http://www.fujitsu.com/us/services/edevices/components/ Europe Fujitsu Components Europe B.V. Diamantlaan 25 2132 WV Hoofddorp Netherlands Tel: (31-23) 5560910 Fax: (31-23) 5560950 Email: info@fceu.fujitsu.com Web: http://www.fujitsu.com/emea/services/components/ Asia Pacific Fujitsu Components Asia Ltd. 102E Pasir Panjang Road #04-01 Citilink Warehouse Complex Singapore 118529 Tel: (65) 6375-8560 Fax: (65) 6273-3021 Email: fcal@fcal.fujitsu.com Web: http://www.fujitsu.com/sg/services/micro/components/ D IS ©2006 Fujitsu Components America, Inc. All rights reserved. All trademarks or registered trademarks are the property off their respective owners. Fujitsu Components America does not warrant that the content of datasheet is error free. In a continuing effort to improve our products Fujitsu Components America, Inc. reserves the right to change specifications/datasheets without prior notice. Rev. 03/21/2006. C O N TI N U ED 8