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MB15E05

MB15E05

  • 厂商:

    FUJITSU(富士通)

  • 封装:

  • 描述:

    MB15E05 - ASSP Single Serial Input PLL Frequency Synthesizer On-Chip 2.0GHz Prescaler - Fujitsu Comp...

  • 数据手册
  • 价格&库存
MB15E05 数据手册
FUJITSU SEMICONDUCTOR DATA SHEET DS04-21330-1E ASSP Single Serial Input PLL Frequency Synthesizer On-Chip 2.0GHz Prescaler MB15E05 s DESCRIPTION The Fujitsu MB15E05 is serial input Phase Locked Loop (PLL) frequency synthesizers with a 2.0 GHz prescaler. A 64/65 or a 128/129 can be selected for the prescaler that enables pulse swallow operation. The latest BiCMOS process technology is used, resuItantly a supply current is limited as low as 6mA typ. This operates with a supply voltage of 3.0V (typ.). Furthermore, a super charger circuit is included to get a fast tuning as well as low noise performance. As a result of this, MB15E05 is ideally suitable for digital mobile communications, such as PCN (Personal Communication Network), PCS (Personal Communication Service), etc. s FEATURES • • • • • • • High frequency operation: 2.0 GHz max Low power supply voltage: VCC = 2.7 to 3.6V Very Low power supply current : ICC = 6.0 mA typ. (Vcc = 3V) Power saving function : IPS = 10 µA max. Pulse swallow function: 64/65 or 128/129 Serial input 14-bit programmable reference divider: R = 5 to 16,383 Serial input 18-bit programmable divider consisting of: - Binary 7-bit swallow counter: 0 to 127 - Binary 11-bit programmable counter: 5 to 2,047 • Wide operating temperature: Ta = –40 to 85°C • Plastic 16-pin SSOP package (FPT-16P-M05) s PACKAGE 16-pin, Plastic SSOP (FPT-16P-M05) This device contains circuitry to protect the inputs against damage due to high static voltages or electroc fields. However, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. 1 MB15E05 s PIN ASSIGNMENT OSCin OSCout Vp Vcc Do GND Xfin fin 1 2 3 4 16 15 14 φR φP LD/fout ZC PS LE Data Clock TOP 13 VIEW 5 12 6 7 8 11 10 9 2 MB15E05 s PIN DESCRIPTIONS Pin No. 1 Pin Name OSCIN I/O I Descriptions Programmable reference divider input. Oscillator input. Connection for an crystal or a TCXO. TCXO should be connected with a coupling capacitor. Oscillator output. Connection for an external crystal. Power supply voltage input for the charge pump. Power supply voltage input. Charge pump output. Phase of the charge pump can be reversed by FC input. Ground. Prescaler complementary input, and should be grounded via a capacitor. Prescaler input. Connection with an external VCO should be done with AC coupling. Clock input for the 19-bit shift register. Data is shifted into the shift register on the rising edge of the clock. (Open is prohibited.) Serial data input using binary code. The last bit of the data is a control bit. (Open is prohibited.) Control bit = ”H” ; Data is transmitted to the programmable reference counter. Control bit = ”L” ; Data is transmitted to the programmable counter. Load enable signal input (Open is prohibited.) When LE is high, the data in the shift register is transferred to a latch, according to the control bit in the serial data. Power saving control input. This pin should be set at ”L” at Power-ON. (Open is prohibited.) PS = ”H” ; Normal mode PS = ”L” ; Power saving mode Forced high-impedance control for the charge pump (with internal pull up resistor.) ZC = ”H” ; Normal Do output. ZC = ”L” ; Do becomes high impedance. Lock detect signal output(LD)/ phase comparator monitoring output (fout). The output signal is selected by LDS bit in the serial data. LDS = ”H” ; outputs fout (fr/fp monitoring output) LDS = ”L” ; outputs LD (”H” at locking, ”L” at unlocking.) Phase comparator output for an external charge pump. Phase comparator output for an external charge pump. 2 3 4 5 6 7 8 9 OSCOUT VP VCC DO GND Xfin fin Clock O – – O – I I I 10 Data I 11 LE I 12 PS I 13 ZC I 14 LD/fout φP φR O 15 16 O O 3 MB15E05 s BLOCK DIAGRAM 1 OSCIN 1 fr Crystal Oscillator circuit OSCOUT 2 fp Programmable reference divider Binary 14-bit reference counter fr LD Phase comparator 16 φR 15 φP Lock detector PS 12 Intermittent mode control (power save) LE SW LDS 17-bit latch FC 14-bit latch 1-bit control latch 3-bit latch fp LD/fr/fp selector 14 LD/fout LE 11 19-bit shift register Data 10 C N T 19-bit shift register Charge pump 13 ZC 3 VP Clock 9 Super charger LE 5 DO 18-bit latch 7-bit latch 11-bit latch SW Programmable divider XfIN 7 fIN 8 Prescaler 64/65, 128/129 Binary 7-bit swallow counter Binary 11-bit programmable counter fp GND 6 VCC 4 MD Control Circuit 4 MB15E05 s ABSOLUTE MAXIMUM RATINGS Parameter Power supply voltage Input voltage Output voltage Storage temperature Symbol VCC VP VI VO Tstg Rating –0.5 to +4.0 VCC to +6.0 –0.5 to VCC +0.5 –0.5 to VCC +0.5 –55 to +125 Unit V V V V °C Remark Note: Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. s RECOMMENDED OPERATING CONDITIONS Parameter Symbol VCC VP VI Ta Value Min 2.7 VCC GND –40 Typ 3.0 – – – Max 3.6 6.0 VCC +85 Unit V V V °C Remark Power supply voltage Input voltage Operating temperature Notes: To protect against damage by electrostatic discharge, note the following handling precautions: -Store and transport devices in conductive containers. -Use properly grounded workstations, tools, and equipment. -Turn off power before inserting or removing this device into or from a socket. -Protect leads with conductive sheet, when transporting a board mounted device. 5 MB15E05 s ELECTRICAL CHARACTERISTICS Parameter Symbol Condition finIF = 2000MHz, fosc = 12MHz Vcc current at PS =”L” and ZC = ”H” min. 500mVp-p 50Ω termination (Refer to the test circuit.) Value Min – Typ 6.0 Max – Unit Power supply current*1 ICC mA µA MHz MHz dBm mVp–p V µA µA µA V V V µA mA mA Power saving current*2 Operating frequency Crystal oscillator operating frequency fin OSCin Input voltage Data, Clock, LE, PS, ZC Data, Clock, LE, PS Input current ZC OSCin φP Output voltage φR, LD/fout Do High impedance cutoff current Do φP φR, LD/fou Output current Ips fin fOSC VfinIF VOSC VIH VIL IIH IIL IIH IIL IIH IIL VOL VOH VOL VDOH VDOL IOFF IOL IOH IOL IDOH Do IDOL – 100 3 –10 500 Vccx0.7 – –1.0 –1.0 –1.0 – – – – – – – – – – – – – – – – – – – – – – –10.0*2 10 2000 40 +2 VCC – Vccx0.3 +1.0 +1.0 +1.0 0 +100 0 0.4 – 0.4 – 0.4 1.1 – –1.0 – – Input sensitivity Pull up input –100 0 –100 Open drain output – Vcc-0.4 – Vcc-0.4 – – Open drain output 1.0 – 1.0 Vcc = 3.0V, Vp = 5V, VDOH = 4.0V Vcc = 3.0V, Vp = 5V, VDOL = 1.0V – mA – 10.0*2 – *1: Conditions ; Vcc = 3.0V, Ta = 25°C, in locking state. *2: Conditions ; Ta = 25°C 6 MB15E05 s FUNCTION DESCRIPTIONS Pulse Swallow Function The divide ratio can be calculated using the following equation: fVCO = [(M x N) + A] x fOSC ÷ R (A < N) fVCO : Output frequency of external voltage controlled oscillator (VCO) N : Preset divide ratio of binary 11-bit programmable counter (5 to 2,047) A : Preset divide ratio of binary 7-bit swallow counter (0 ≤ A ≤ 127) fOSC : Output frequency of the reference frequency oscillator R : Preset divide ratio of binary 14-bit programmable reference counter (5 to 16,383) M : Preset divide ratio of modules prescaler (64 or 128) Serial Data Input Serial data is processed using the Data, Clock, and LE pins. Serial data controls the programmable reference divider and the programmable divider separately. Binary serial data is entered through the Data pin. One bit of data is shifted into the shift register on the rising edge of the clock. When the load enable pin is high, stored data is latched according to the control bit data as follows: Table.1 Control Bit Control bit (CNT) H L Destination of serial data 17 bit latch (for the programmable reference divider) 18 bit latch (for the programmable divider) Shift Register Configuration Programmable Reference Counter LSB Data Flow MSB 1 C N T CNT R1 to R14 SW FC LDS 2 R 1 3 R 2 4 R 3 5 R 4 6 R 5 7 R 6 8 R 7 9 R 8 10 R 9 11 R 10 12 R 11 13 R 12 14 R 13 15 16 17 18 R 14 SW FC LDS : Control bit : Divide ratio setting bit for the programmable reference counter (5 to 16,383) : Divide ratio setting bit for the prescaler (64/65 or 128/129) : Phase control bit for the phase comparator : LD/fout signal select bit [Table. 1] [Table. 2] [Table. 5] [Table. 7] [Table. 6] Note: Start data input with MSB first 7 MB15E05 Programmable Reference Counter LSB Data Flow MSB 1 C N T 2 A 1 3 A 2 4 A 3 5 A 4 6 A 5 7 A 6 8 A 7 9 N 1 10 N 2 11 N 3 12 N 4 13 N 5 14 N 6 15 N 7 16 N 8 17 N 9 18 N 10 19 N 11 CNT : Control bit N1 to N11 : Divide ratio setting bits for the programmable counter (5 to 2,047) A1 to A7 : Divide ratio setting bits for the swallow counter (0 to 127) Note: Start data input with MSB first [Table. 1] [Table. 3] [Table. 4] Table2. Binary 14-bit Programmable Reference Counter Data Setting Divide ratio (R) 5 6 ⋅ 16383 R 14 0 0 ⋅ 1 R 13 0 0 ⋅ 1 R 12 0 0 ⋅ 1 R 11 0 0 ⋅ 1 R 10 0 0 ⋅ 1 R 9 0 0 ⋅ 1 R 8 0 0 ⋅ 1 R 7 0 0 ⋅ 1 R 6 0 0 ⋅ 1 R 5 0 0 ⋅ 1 R 4 0 0 ⋅ 1 R 3 1 1 ⋅ 1 R 2 0 1 ⋅ 1 R 1 1 0 ⋅ 1 Note: • Divide ratio less than 5 is prohibited. Table.3 Binary 11-bit Programmable Counter Data Setting Divide ratio (N) 5 6 ⋅ 2047 N 11 0 0 ⋅ 1 N 10 0 0 ⋅ 1 N 9 0 0 ⋅ 1 N 8 0 0 ⋅ 1 N 7 0 0 ⋅ 1 N 6 0 0 ⋅ 1 N 5 0 0 ⋅ 1 N 4 0 0 ⋅ 1 N 3 1 1 ⋅ 1 N 2 0 1 ⋅ 1 N 1 1 0 ⋅ 1 Note: • Divide ratio less than 5 is prohibited. • Divide ratio (N) range = 5 to 2,047 8 MB15E05 Table.4 Binary 7-bit Swallow Counter Data Setting Divide ratio (A) 0 1 ⋅ 127 A 7 0 0 ⋅ 1 A 6 0 0 ⋅ 1 A 5 0 0 ⋅ 1 A 4 0 0 ⋅ 1 A 3 0 0 ⋅ 1 A 2 0 0 ⋅ 1 A 1 0 1 ⋅ 1 Note: • Divide ratio (A) range = 0 to 127 Table. 5 Prescaler Data Setting SW H L Prescaler Divide ratio 64/65 128/129 Table. 6 LD/fout Output Select Data Setting LDS H L fout signal LD signal LD/fout output signal Relation between the FC input and phase characteristics The FC bit changes the phase characteristics of the phase comparator. Both the internal charge pump output level (DO) and the phase comparator output (φR, φP) are reversed according to the FC bit. Also, the monitor pin (fOUT) output is controlled by the FC bit. The relationship between the FC bit and each of DO, φR, and φP is shown below. Table. 7 FC Bit Data Setting (LDS = ”H”) FC = High Do fr > fp fr < fp fr = fp H L Z* φR L H L φP L Z* Z* LD/fout (fr) (fr) (fr) Do L H Z* H L L FC = Low φR φP Z* L Z* LD/fout (fp) (fp) (fp) * : High impedance 9 MB15E05 When designing a synthesizer, the FC pin setting depends on the VCO and LPF characteristics. ∗: When the LPF and VCO characteristics are similar to x , set FC bit high. ∗: When the VCO characteristics are similar to y, set FC bit low. VCO Output Frequency PLL LPF VCO LPF Input Voltage x y Power Saving Mode (Intermittent Mode Control Circuit) Setting a PS pin to Low, the IC enters into power saving mode resultatly current sonsumption can be limited to 10µA (max.). Setting PS pin to High, power saving mode is released so that the IC works normally. In addition, the intermittent operation control circuit is included which helps smooth start up from the power saving mode. In general, the power consumption can be saved by the intermittent operation that powering down or waking up the synthesizer. Such case, if the PLL is powered up uncontrolled, the resulting phase comparator output signal is unpredictable due to an undefined phase relation between reference frequency (fr) and comparison frequency (fp) and may in the worst case take longer time for lock up of the loop. To prevent this, the intermittent operation control circuit enforces a limited error signal output of the phase detector during power up, thus keeping the loop locked. During the power saving mode, the corresponding section except for indispensable circuit for the power saving function stops working, then current consumption is reduced to 10µA per one PLL section. At that time, the Do and LD become the same state as when a loop is locking. That is, the Do becomes high impedance. A VCO control voltage is naturally kept at the locking voltage which defined by a LPF”s time constant. As a result of this, VCO’s frequency is kept at the locking frequency. Note: • While the power saving mode is executed, ZC pin should be set at ”H” or open. If ZC is set at ”L” during power saving mode, approximately 10 µA current flows. • PS pin must be set ”L” at Power-ON. • The power saving mode can be released (PS : L → H) 1µs later after power supply remains stable. • During the power saving mode, it is possible to input the serial data. Table.8 PS Pin Setting PS pin H L Normal mode Power saving mode Status Table.9 ZC Pin Setting ZC pin H L Do output Normal output High impedance 10 MB15E05 s SERIAL DATA INPUT TIMING Data MSB LSB Clock LE t2 t1 t7 On rising edge of the clock, one bit of the data is transferred into the shift register. t5 t3 t6 t4 Parameter t1 t2 t3 t4 Min. 20 20 30 20 Typ. – – – – Max. – – – – Unit ns ns ns ns Parameter t5 t6 t7 Min. 30 100 100 Typ. – – – Max. – – – Unit ns ns ns 11 MB15E05 s PHASE COMPARATOR OUTPUT WAVEFORM fr fp tWU LD tWL [ FC = ”H” ] φP φR H Do Z L [ FC = ”L” ] φP φR H Do L Z Notes: 1. Phase error detection range: –2π to +2π 2. Pulses on Do output signal during locked state are output to prevent dead zone. 3. LD output becomes low when phase is tWU or more. LD output becomes high when phase error is tWL or less and continues to be so for three cysles or more. 4. tWU and tWL depend on OSCin input frequency. tWU > 8/fosc (e. g. tWU > 625ns, foscin = 12.8 MHz) tWL < 16/fosc (e. g. tWL < 1250ns, foscin = 12.8 MHz) 5. LD becomes high during the power saving mode (PS = ”L”.) 12 MB15E05 s TEST CIRCUIT (for Measuring Input Sensitivity fin/OSCin) VCC VP 0.1µ 1000p P•G 50 Ω 1000p 8 7 6 5 4 3 2 1 0.1µ 1000p P•G 50 Ω 9 10 11 12 13 14 15 16 Oscilloscope Controller (setting divide ratio) Vcc 13 MB15E05 s APPLICATION EXAMPLE Output LPF 10k 12k 12k VCO To a lock detect. 10k From a controller φR 16 15 φP LD/FOUT ZC 14 13 PS 12 LE 11 Data 10 9 Clock MB15E05 1 OSCIN 2 OSCOUT 3 VP 4 VCC 5 DO 6 GND 7 XfIN 1000p X’ tal C1 C2 0.1µ 0.1µ 8 fIN 1000p C1, C2 : Depend on the crystal parameters 14 MB15E05 s TYPICAL CHARACTERISTICS Do Output Current [Ta = +25°C] [VCC = 3 V, Vp =3 V, 5 V] 5.0 4.0 VOH (V) VOL (V) 3.0 2.0 1.0 0 0 –5 –10 IOH (mA) –15 –20 Vp = 3 V Vp = 5 V [Ta = +25°C] [VCC = 3 V, Vp =3 V, 5 V] 5.0 4.0 3.0 2.0 1.0 0 0 5 10 IOL (mA) 15 20 Vp = 3 V Vp = 5 V fin Input Sensitivity Vfin vs. fin [Ta = +25°C] +10 0 Main. counter div. ratio = 4104 Swallow="ON" VCC = Vp SPEC Vfin (dBm) –10 –20 –30 –40 0 1000 VCC=2.7 V VCC=3.0 V VCC=3.6 V OSCin Input Characteristics Vfiosc vs. fosc [Ta = +25°C] +10 2000 fin (MHz) 3000 4000 Ref. counter div. ratio = 767 fin, Xfin : OPEN SPEC 0 Vfosc (dBm) –10 –20 VCC=2.7 V –30 –40 0 50 100 150 VCC=3.0 V VCC=3.6 V fosc (MHz) 200 (Continued) 15 MB15E05 (Continued) fin Input Impedance 4: 18.13 Ω 14.664 Ω 1.1669 nH 2 000.000 000 MHz 1: 19.508 Ω –124.4 Ω 500 MHz 10.139 Ω –47.135 Ω 1 GHz 10.783 Ω –11.995 Ω 1.5 GHz 4 2: fin 3: 3 1 2 OSCin Input Impedance 3: 484.25 Ω –2.8518 kΩ 2.7905 pF 20.000 000 MHz 1: 28.348 kΩ –19.661 kΩ 1 MHz 593.25 Ω –5.615 kΩ 10 MHz 152.56 Ω –1.2722 kΩ 50 MHz 2: 3 1 2 4 OSCin 4: 16 MB15E05 s REFERENCE INFORMATION Typical plots measured with the test circuit are shown below. Each plot shows lock up time, phase noise and reference leakage. Test Circuit S.G OSCin Do fin LPF • • • • • fvco = 1835 MHz Kv = 87 MHz/v fr = 200 kHz fosc = 13 MHz LPF: 15 kΩ 910 Ω Spectrum Analyzer VCO 3000 pF 0.03 µF 400 pF PLL Lock Up Time = 500 µs (1797.6 MHz → 1872.4 MHz, within ± 1kHz) ∆ MKr x : 500.01844 µs y : –74.8009 MHz 38.00500 MHz REF 10dB/ PLL Phase Noise @ within loop band = 69.4 dBc/Hz 0.0 dBm ATT 10 dB 2.000 kHz/div RBW 300 Hz VBW 300 Hz 18.1339 µs 1.9903829 ms SPAN 50.0 kHz CENTER 1.8350000 GH z 29.99500 MHz ∆ MKr x : 500.01844 µs y : –74.8009 MHz 250.0000 MHz REF 10dB/ 50.00000 MHz/div PLL Reference Leakage @ 200 kHz offset = 74.6 dBc 0.0 dBm ATT 10 dB 0 Hz 18.1339 µs 1.9903829 ms RBW 10 kHz VBW 10 kHz SPAN 1.00 MHz CENTER 1.8350000 GHz 17 MB15E05 s ORDERING INFORMATION Part number MB15E05PFV1 Package 16-pin Plastic SSOP (FPT-16P-M05) Remarks 18 MB15E05 s PACKAGE DIMENSION 16 pins, Plastic SSOP (FPT-16P-M05) * : These dimensions do not include resin protrusion. * 5.00±0.10(.197±.004) 1.25 –0.10 +.008 .049 –.004 +0.20 0.10(.004) INDEX *4.40±0.10 (.173±.004) 6.40±0.20 (.252±.008) 5.40(.213) NOM 0.65±0.12 (.0256±.0047) 0.22 –0.05 +.004 .009 –.002 +0.10 "A" 0.15 –0.02 +.002 .006 –.001 +0.05 Details of "A" part 0.10±0.10(.004±.004) (STAND OFF) 4.55(.179)REF 0 10° 0.50±0.20 (.020±.008) C 1994 FUJITSU LIMITED F16013S-2C-4 Dimensions in mm (inches) 19 FUJITSU LIMITED For further information please contact: Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-88, Japan Tel: (044) 754-3763 Fax: (044) 754-3329 North and South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street San Jose, CA 95134-1804, U.S.A. Tel: (408) 922-9000 Fax: (408) 432-9044/9045 Europe FUJITSU MIKROELEKTRONIK GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122 Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LIMITED #05-08, 151 Lorong Chuan New Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220 All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Control Law of Japan, the prior authorization by Japanese government should be required for export of those products from Japan. F9703 © FUJITSU LIMITED Printed in Japan 24
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