FUJITSU SEMICONDUCTOR DATA SHEET
DS05-11435-1E
MEMORY Mobile FCRAMTM
CMOS
128 M Bit (8 M word×16 bit) MB82DBS08164C-70L
■ DESCRIPTION
Mobile Phone Application Specific Memory
The FUJITSU MB82DBS08164C is a CMOS Fast Cycle Random Access Memory (FCRAM*) with asynchronous Static Random Access Memory (SRAM) interface containing 134,217,728 storages accessible in a 16-bit format. MB82DBS08164C is utilized using a FUJITSU advanced FCRAM core technology and improved integration in comparison to regular SRAM. The MB82DBS08164C adopts asynchronous mode and synchronous burst mode for fast memory access as user configurable options. This MB82DBS08164C is suited for mobile applications such as Cellular Handset and PDA. * : FCRAM is a trademark of Fujitsu Limited, Japan
■ FEATURES
• Asynchronous SRAM Interface • COSMORAM Revision 3 Compliance (COSMORAM : Common Specifications of Mobile RAM) • Fast Access Time : tCE = 70 ns Max • Burst Read/Write Access Capability : tCK = 9.5 ns Min /104 MHz Max tAC = 6 ns Max • Low Voltage Operating Condition : VDD = 1.7 V to 1.95 V • Wide Operating Temperature : TA = − 30 °C to + 85 °C Junction Temperature : TJ = − 30 °C to + 90 °C • Byte Control by LB and UB • Low-Power Consumption : IDDA1 = 40 mA Max IDDS1 = 300 µA Max • Various Power Down mode : Sleep 16 M-bit Partial 32 M-bit Partial 64 M-bit Partial • Shipping Form : Wafer/Chip
Copyright©2006 FUJITSU LIMITED All rights reserved
MB82DBS08164C-70L
■ PRODUCT LINEUP
Parameter Access Time (Max) (tCE, tAA) RL = 6, 7 CLK Access Time (Max) (tAC) Active Current (Max) (IDDA1) Standby Current (Max) (IDDS1) Power Down Current (Max) (IDDPS) MB82DBS08164C-70L 70 ns 6 ns 40 mA 300 µA 10 µA
■ PIN DESCRIPTION
Pin Name A22 to A0 CE1 CE2 WE OE LB UB CLK ADV WAIT DQ7 to DQ0 DQ15 to DQ8 VDD VSS Address Input Chip Enable 1 (Low Active) Chip Enable 2(High Active) Write Enable (Low Active) Output Enable (Low Active) Lower Byte Control (Low Active) Upper Byte Control (Low Active) Clock Input Address Valid Input (Low Active) Wait Output Lower Byte Data Input/Output Upper Byte Data Input/Output Power Supply Voltage Ground Description
Note : Refer to "■PACKAGE FOR ENGINEERING SAMPLES" for additional pin descriptions of FBGA package supply.
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MB82DBS08164C-70L
■ BLOCK DIAGRAM
VDD VSS A22 to A0
ADDRESS LATCH & BUFFER X CONTROLLER Y CONTROLLER
MODE CONTROLLER
BURST ADDRESS COUNTER
MEMORY CELL ARRAY 134,217,728 bits
CE2 CE1 ADV WE OE LB UB CLK WAIT DQ15 to DQ8
COMMAND DECODER
ADDRESS CONTROLLER READ AMP WRITE AMP
MEMORY CORE CONTROLLER BURST CONTROLLER
BUS CONTROLLER
PARALLEL SERIAL TO SERIAL TO PARALLEL CONVERSION CONVERSION CONVERTER
I/O BUFFER
DQ7 to DQ0
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MB82DBS08164C-70L
■ FUNCTION TRUTH TABLE
1. Asynchronous Operation
Mode Standby (Deselect) Output Disable*1 Output Disable (No Read) Read (Upper Byte) Read (Lower Byte) Read (Word) No Write Write (Upper Byte) Write (Lower Byte) Write (Word) Power Down*2 L X H L CE2 CE1 CLK ADV H H X X X X X X X X X X X X *3 *3 *3 H *3 *3 *3 *3 *3 *3 X X X L H*4 L L L H H L L X H L H L H L X Valid Valid Valid Valid Valid Valid X WE X H OE X H LB X X H H UB A22 to A0 DQ7 to DQ0 DQ15 to DQ8 X X H L X *5 Valid Valid High-Z High-Z High-Z High-Z Output Valid Output Valid Invalid Invalid Input Valid Input Valid High-Z High-Z High-Z High-Z Output Valid High-Z Output Valid Invalid WAIT High-Z High-Z High-Z High-Z High-Z High-Z High-Z
Input Valid High-Z Invalid High-Z
Input Valid High-Z High-Z High-Z
Note : L = VIL, H = VIH, X can be either VIL or VIH, High-Z = High Impedance *1 : Should not be kept this logic condition longer than 1 µs. *2 : Power Down mode can be entered from Standby state and all output are in High-Z state. Data retention depends on the selection of Partial Size for Power Down Program. Refer to "Power Down" in "■FUNCTIONAL DESCRIPTION" for the details. *3 : "L" for address pass through and "H" for address latch on the rising edge of ADV. *4 : OE can be VIL during write operation if the following conditions are satisfied; (1) Write pulse is initiated by CE1. Refer to "(11) Asynchronous Read/Write Timing 1-1 (CE1 Control)" in "■TIMING DIAGRAMS". (2) OE stays VIL during Write cycle. *5 : Can be either VIL or VIH but must be valid before Read or Write.
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MB82DBS08164C-70L
2. Synchronous Operation (Burst Mode)
Mode Standby(Deselect) Start Address Latch*
1
CE2 CE1 CLK ADV WE H X X X X*
3
OE X X* L
3
LB X
UB A22 to A0 DQ7 to DQ0 DQ15 to DQ8 X X Valid*
6
WAIT High-Z High-Z*10 Output Valid High*11 High*12 High*11 High-Z High-Z High-Z
High-Z High-Z* Output Valid*8 High-Z
7
High-Z High-Z* Output Valid*8 High-Z Input Valid*9 Input Invalid High-Z High-Z High-Z
7
Advance Burst Read to Next Address*1 Burst Read Suspend*1 Advance Burst Write to Next Address*1 Burst Write Suspend*
1
H H L H L*4 H H* X X L X X X H X X
4
H X*5 X*5 X
Input Valid*9 Input Invalid High-Z High-Z
Terminate Burst Read Terminate Burst Write Power Down*
2
X H X X X X
High-Z
Note : L = VIL, H = VIH, X can be either VIL or VIH, High-Z = High impedance *1 *2
= valid edge,
= rising edge of Low pulse,
: Should not be kept this logic condition longer than 4 µs. : Power Down mode can be entered from Standby state and all output are in High-Z state. Data retention depends on the selection of Partial Size for Power Down Program. Refer to "Power Down" in “■FUNCTIONAL DESCRIPTION” for the details. : Can be either VIL or VIH except for the case the both of OE and WE are VIL. It is prohibited to bring the both of OE and WE to VIL. : When device is operating in "WE Single Clock Pulse Control" mode, WE is a “don't care” once write operation is determined by WE Low Pulse at the beginning of write access together with address latching. Burst write suspend feature is not supported in "WE Single Clock Pulse Control" mode. : Can be either VIL or VIH. During burst write operation, byte write control by LB and UB can be performed at each clock cycle. During read operation, LB and UB must be valid before read operation is initiated. And once LB and UB input levels are determined, they must not be changed until the end of burst. : Once a valid address is determined, the input address must not be changed during ADV = L. : If OE = L, output is either Invalid or High-Z depending on the level of LB and UB input. If WE = L, input is Invalid. If OE = WE = H, output is High-Z. : Outputs is either Valid or High-Z depending on the level of LB and UB input. : Input is either Valid or Invalid depending on the level of LB and UB input.
*3 *4
*5
*6 *7 *8 *9
*10 : Output is either High-Z or Invalid depending on the level of OE and WE input. *11 : Keep the level from previous cycle except for suspending on last data. Refer to "WAIT Output Function" in "■FUNCTIONAL DESCRIPTION" for the details. *12 : WAIT output is driven in High level during burst write operation.
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MB82DBS08164C-70L
■ STATE DIAGRAM
• Initial/Standby State
Asynchronous Operation (Page Mode)
Power Up CR Set
@M = 1 @M = 0
Synchronous Operation (Burst Mode) Common State
Pause Time Power Down
CE2 = H
CE2 = H
Power Down
CE2 = L
Standby
CE2 Low Pulse @RA = 0
Standby
CE2 = L @RA = 1
• Asynchronous Operation
Standby
CE1 = L & WE = L CE1 = H
CE1 = L CE1 = H
CE1 = L & OE = L CE1 = H OE = L
Output Disable
Byte Control Write
WE = H WE = L OE = H
Address Change or Byte Control Read
Byte Control @OE = L
• Synchronous Operation
Standby
CE1 = H CE1 = H CE1 = H CE1 = H
Write Suspend
Read Suspend
WE = H WE = L
CE1 = L, ADV Low Pulse, & WE = L
CE1 = L, ADV Low Pulse, & OE = L
OE = H OE = L
Write
Read
Note : Assuming all the parameters specified in AC CHARACTERISTICS are satisfied. Refer to the "■FUNCTIONAL DESCRIPTION", "2. AC Characteristics" in "■ELECTRICAL CHARACTERISTICS", and "■TIMING DIAGRAMS" for details. 6
MB82DBS08164C-70L
■ FUNCTIONAL DESCRIPTION
This device supports asynchronous read & normal write operation and synchronous burst read and burst write operations for faster memory access and features four kinds of power down modes for power saving as user configurable option. • Power-up It is required to follow the power-up timing to start executing proper device operation. Refer to "Power-up Timing". After Power-up, the device defaults to asynchronous read & normal write operation mode with sleep power down feature. • Configuration Register The Configuration Register(CR) is used to configure the type of device function among optional features. Each selection of features is set through CR Set sequence after power-up. If CR Set sequence is not performed after power-up, the device is configured for asynchronous operations with sleep power down feature as default configuration. The content of CR can be confirmed using CR Verify sequence. • CR Set & Verify Sequence The CR Set and CR Verify requires total 6 read/write operations with unique address. The device should be in standby mode in the interval between each read/write operation. The following table shows the detail sequence of CR Set and CR Verify. CR Set Operation Read Write Write Write Write Write Data Read Data (RDa) RDa RDa CR Key 0 CR Key 1 CR Key 2 Operation Read Write Write Write Read Read CR Verify Data Read Data (RDa) RDa RDa CR Key 0 CR Key 1 CR Key 2
Cycle # 1st 2nd 3rd 4th 5th 6th
Address 7FFFFFh (MSB) 7FFFFFh 7FFFFFh 7FFFFFh 7FFFFFh 7FFFFFh
The first cycle is to read from most significant address(MSB). The second and third cycles are to write to MSB. If the second or third cycle is written into the different address, the CR Set is cancelled and the data written by the second or third cycle is valid as a normal write operation. It is recommended to write back the data(RDa) read by first cycle to MSB in order to secure the data. The fourth cycle is to write the appropriate “CR Key 0” to select the CR Set or CR Verify. The fifth and sixth cycle is to access into MSB to set the “CR Keys” or to verify the “CR Keys”. Refer to the "CR Key Table". If the fourth to sixth cycle are not access into MSB , the CR Set or CR Verify are cancelled and CR input or output data will be invalid. Once this CR Set sequence is performed from an initial CR Set to the other new CR Set, the written data stored in the memory cell array may be lost. Therefore CR Set sequence should be performed prior to regular read/ write operation if necessary to change from the default configuration.
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MB82DBS08164C-70L
• CR Key Table CR Key 0 CR Key 0 should be set at 4th cycle of the CR Set or Verify sequence. Register Pin Name Function Key Name DQ0 DQ7 to DQ1 DQ15 to DQ8 CR Key 1 CR Key 1 should be set or read at 5th cycle of the CR Set or Verify sequence. Register Pin Name Function Key Description Name 00 DQ1, DQ0 PS Partial Size 01 10 11 000, 001 010 DQ4 to DQ2 BL Burst Length 011 111 0 DQ5 M Mode 1 00 DQ7, DQ6 DS Driver Size 01 10 11 DQ15 to DQ8 ⎯ ⎯ 1 32M-bit Partial 16M-bit Partial 64M-bit Partial Sleep [Default] Reserved for future use 8 words 16 words *1 Continuous Synchronous Mode (Burst Read/Write) Asynchronous Mode [Default] (Random Read/Write) + Reserved for future use − Center [Default] Unused bits must be 1 *2 *1 *4 *5 *3 *3 *3 *3 *1 CRSV ⎯ ⎯ CR Set/Verify ⎯ ⎯ 0 1 1 1 CR Verify CR Set Reserved for future use Unused bits must be 1 *1 *2
Description
Note
Note
100 to 110 Reserved for future use
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MB82DBS08164C-70L
CR Key 2 CR Key 2 should be set or read at 6th cycle of the CR Set or Verify sequence. Register Pin Name Function Key Description Name 000, 001 010 DQ2 to DQ0 RL Read Latency 011 100 101 110, 111 DQ3 DQ4 DQ5 DQ6 ⎯ SW VE RA ⎯ Single Write Valid Clock Edge Reset to Asynchronous 1 0 1 0 1 0 1 0 DQ7 WC Write Control 1 DQ15 to DQ8 ⎯ ⎯ 1 Reserved for future use 4 clocks 5 clocks 6 clocks 7 clocks Reserved for future use Reserved for future use Burst Read & Burst Write Reserved for future use Reserved for future use Rising Clock Edge Reset to Asynchronous mode Remain the previous mode WE Single Clock Pulse Control without Write Suspend Function WE Level Control with Write Suspend Function Unused bits must be 1 *2 *6 *3 *1 *1 *1 *2 *1
Note
*1 : It is prohibited to apply this key. *2 : Must be set to “1”. *3 : Sleep and Partial power down mode are effective only when RA = 1. *4 : If M = 0, all the registers must be set with appropriate Key input at the same time. *5 : If M = 1, PS and DS must be set with appropriate Key input at the same time. Except for PS and DS, all the other key inputs must be “1”. *6 : In case of RA = 0, CE2 brought to Low reset the device to asynchronous standby state regardless PS set value therefore Sleep and Partial power down mode are not available.
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MB82DBS08164C-70L
• Power Down The Power Down is low power idle state controlled by CE2. CE2 Low drives the device in power down mode and maintains low power idle state as long as CE2 is kept Low. CE2 High resumes the device from power down mode. This device has four power down modes, Sleep, 16 M-bit Partial, 32 M-bit Partial, and 64 M-bit Partial. Those power down modes are effective when RA = 1. The selection of power down mode is set through CR Set sequence. Each mode has following data retention features. Mode Sleep [default] 16 M-bit Partial 32 M-bit Partial 64 M-bit Partial Data Retention Size No 16 M bits 32 M bits 64 M bits Retention Address N/A 000000h to 0FFFFFh 000000h to 1FFFFFh 000000h to 3FFFFFh
The default state after power-up is Sleep and it is the lowest power consumption. However all data will be lost once CE2 is brought to Low for Power Down. It is not required to perform CR Set sequence to set to Sleep mode after power-up in case of asynchronous operation. When RA = 0, CE2 brought to Low reset the device to asynchronous standby state regardless PS set value. • Burst Read/Write Operation Synchronous burst read/write operation provides faster memory access that synchronized to the microcontroller or system bus frequency. Configuration Register(CR) Set is required to perform a burst read & write operation after power-up. Once CR Set sequence is performed to select the synchronous burst mode, the device is configured to synchronous burst read/write operation mode with corresponding RL and BL that is set through CR Set sequence together with the operation mode. In order to perform synchronous burst read & write operation, it is required to control new signals, CLK, ADV and WAIT that Low Power SRAMs don’t have.
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MB82DBS08164C-70L
• Burst Read Operation
CLK
Address
Valid address
ADV CE1
OE WE DQ High RL High-Z Q1 BL WAIT High-Z Q2 QBL
• Burst Write Operation
CLK
Address
Valid address
ADV CE1 High
OE WE
RL-1 DQ High-Z D1 BL WAIT High-Z D2 DBL
• CLK Input Function The CLK is input signal to synchronize the memory to the microcontroller or system bus frequency during synchronous burst read & write operation. The CLK input increments the device internal address counter and the valid edge of CLK is referred for latency counts from address latch, burst write data latch, and the burst read data output. During synchronous operation mode, CLK input must be supplied except for standby state and power down state. CLK is a “don't care” during asynchronous operation.
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MB82DBS08164C-70L
• ADV Input Function The ADV is input signal to latch the valid address. It is applicable to the synchronous operation as well as asynchronous operation. ADV input is active during CE1 = L and CE1 = H disables ADV input. All addresses are determined on the rising edge of ADV. During synchronous burst read/write operation, ADV = H disables all address inputs. Once ADV is brought to High after the valid address latch, it is inhibited to bring ADV Low until the end of burst or until the burst operation is terminated. ADV Low pulse is mandatory for the synchronous burst read/write operation mode to latch the valid address input. During asynchronous operation, ADV = H also disables all address inputs. ADV can be tied to Low during asynchronous operations and it is not necessary to control ADV to High. • WAIT Output Function The WAIT is output signal to indicate the data bus status when the device is operating in the synchronous burst mode. During burst read operation, WAIT output is enabled after specified time duration from OE = L or CE1 = L whichever occurs last. WAIT output Low indicates data output at next clock cycle is invalid, and WAIT output becomes High one clock cycle prior to valid data output. During OE read suspend, WAIT output doesn’t indicate the data bus status but carries the same level from previous clock cycle (kept High) except for the burst read suspend on the final data output. If final read data output is suspended, WAIT output becomes high impedance after specified time duration from OE = H. During burst write operation, WAIT output is enabled to High level after specified time duration from WE = L or CE1 = L whichever occurs last and kept High for entire write cycles including WE write suspend. The actual write data latching starts on the appropriate clock edge with respect to Read Latency, and Burst Length. During WE write suspend, WAIT output doesn’t indicate the data bus status but carries the same level from previous clock cycle (kept High) except for write suspend on the final data input. If final write data input is suspended, WAIT output becomes high impedance after specified time duration from WE = H. This device doesn’t incur additional output delay against crossing device-row boundary or internal refresh operation. Therefore, the burst operation is always started after the fixed latency with respect to Read Latency. And there is no waiting cycle asserted in the middle of burst operation except for the burst read or write suspend by OE brought to High or WE brought to High. Thus, once WAIT output is enabled and brought to High, WAIT output keeps High level until the end of burst or until the burst operation is terminated. When the device is operating in the asynchronous mode, WAIT output is always in High Impedance. • Latency Read Latency (RL) is the number of clock cycles between the address being latched and first read data becoming available during synchronous burst read operation. It is set through CR Set sequence after power-up. Once specific RL is set through CR Set sequence, write latency, that is the number of clock cycles between address being latched and first write data being latched, is automatically set to RL-1. The burst operation is always started after the fixed latency with respect to Read Latency set in CR.
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MB82DBS08164C-70L
CLK 0
Address
1
2
3
4
5
6
7
Valid address
ADV CE1
OE or WE
RL = 4 DQ [Output] WAIT High-Z D1 High-Z RL = 5 DQ [Output] WAIT High-Z D1 High-Z RL = 6 DQ [Output] WAIT High-Z D1 High-Z RL = 7 DQ [Output] WAIT DQ [Input] WAIT High-Z High-Z D1 D2 Q1 D2 D3 Q1 Q2 D2 D3 D4 Q1 Q2 Q3 D2 D3 D4 D5 Q1 Q2 Q3 Q4
DQ [Input] WAIT
DQ [Input] WAIT
DQ [Input] WAIT
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MB82DBS08164C-70L
• Address Latch by ADV The ADV latches the valid address presence on address inputs. During synchronous burst read/write operation mode, all the addresses are determined on the rising edge of ADV when CE1 = L. The specified minimum value of ADV = L setup time and hold time against valid edge of clock where RL count is begun must be satisfied. Valid address must be determined with specified setup time against either the falling edge of ADV or falling edge of CE1 whichever comes late. And the determined valid address must not be changed during ADV = L period. • Burst Length Burst Length is the number of word to be read or written during synchronous burst read/write operation as the result of a single address latch cycle. It can be set on 8,16 words boundary or continuous for entire address through CR Set sequence. The burst type is sequential that is incremental decoding scheme within a boundary address. Starting from an initial address being latched, the device internal address counter assigns +1 to the previous address until reaching the end of boundary address and then wrap round to least significant address (= 0). After completing read data output or write data latch for the set burst length, operation automatically ended except for continuous burst length. When continuous burst length is set, read/write is endless unless it is terminated by the rising edge of CE1. • Write Control The device has two types of WE signal control method, "WE Level Control" and "WE Single Clock Pulse Control", for synchronous burst write operation. It is configured through CR Set sequence.
CLK 0
Address
1
2
3
4
5
6
Valid address
RL = 5
ADV CE1 tCLTH WAIT High-Z tWLTH
WE Level Control
WE
[Input]
tWLD
DQ
D1
D2
D3
D4
WE Single Clock Pulse Control
WE
tWSCK
tCKWH DQ
[Input]
D1
D2
D3
D4
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MB82DBS08164C-70L
• Burst Read Suspend Burst read operation can be suspended by OE High pulse. During burst read operation, OE brought to High from Low suspends the burst read operation. Once OE is brought to High with the specified setup time against clock where the data being suspended, the device internal counter is suspended, and the data output becomes high impedance after specified time duration. It is inhibited to suspend the first data output at the beginning of burst read. OE brought to Low from High resumes the burst read operation. Once OE is brought to Low, data output becomes valid after specified time duration, and the internal address counter is reactivated. The last data output being suspended as the result of OE = H and first data output as the result of OE = L are from the same address. In order to guarantee to output last data before suspension and first data after resumption, the specified minimum value of OE = L hold time and setup time against clock edge must be satisfied respectively.
CLK tCKOH tOSCK OE tCKOH tOSCK
tAC DQ tCKTV WAIT Q1 tCKQX
tOHZ Q2 tOLZ
tAC Q2
tAC Q3
tAC Q4
tCKQX
tCKQX
• Burst Write Suspend Burst write operation can be suspended by WE High pulse. During burst write operation, WE brought to High from Low suspends the burst write operation. Once WE is brought to High with the specified setup time against clock where the data being suspended, the device internal counter is suspended, data input is ignored. It is inhibited to suspend the first data input at the beginning of burst write. WE brought to Low from High resumes the burst write operations. Once WE is brought to Low, data input becomes valid after specified time duration, and the internal address counter is reactivated. The write address of the cycle where data being suspended and the first write address as the result of WE = L are the same address. In order to guarantee to latch the last data input before suspension and first data input after resumption, the specified minimum value of WE = L hold time and setup time against clock edge must be satisfied respectively. Burst write suspend function is available when the device is operating in WE level controlled burst write only.
CLK tCKWH tWSCK WE tCKWH tWSCK
tDSCK DQ D1 tDHCK WAIT High D2
tDSCK D2
tDSCK D3
tDSCK D4
tDHCK
tDHCK
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MB82DBS08164C-70L
• Burst Read Termination Burst read operation can be terminated by CE1 brought to High. If BL is set on Continuous, the burst read operation is continued endlessly unless terminated by CE1 = H. It is inhibited to terminate the burst read before first data output is completed. In order to guarantee last data output, the specified minimum value of CE1 = L hold time from the clock edge must be satisfied. After termination, the specified minimum recovery time is required to start a new access.
CLK Address ADV tCKCLH CE1 tCKOH OE WAIT DQ Q1 tAC High-Z Q0 tCKQX tAC tCKQX tOHZ Vaild
tTRB tCHZ
tCHTZ Q2
• Burst Write Termination Burst write operation can be terminated by CE1 brought to High. If BL is set on Continuous, the burst write operation is continued endlessly unless terminated by CE1 = H. It is inhibited to terminate the burst write before first data input is completed. In order to guarantee last data input being latched, the specified minimum values of CE1 = L hold time from the clock edge must be satisfied. After termination, the specified minimum recovery time is required to start a new access.
CLK Address ADV tCKCLH tCKWH tWSCK Vaild
tTRB tCHCK
CE1
WE WAIT DQ tDSCK D1
tDSCK D2 tDHCK
tCHTZ
High-Z tDSCK D0 tDHCK
tDHCK
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MB82DBS08164C-70L
■ ABSOLUTE MAXIMUM RATINGS
Parameter Voltage of VDD Supply Relative to VSS * Voltage at Any Pin Relative to VSS * Short Circuit Output Current Storage Temperature * : All voltages are referenced to VSS = 0 V. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. Symbol VDD VIN, VOUT IOUT Tstg Rating Min − 0.5 − 0.5 − 50 − 55 Max + 2.6 + 2.6 + 50 + 125 Unit V V mA °C
■ RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage*1 Ground High Level Input Voltage* * Ambient Temperature Junction Temperature *1 : All voltages are referenced to VSS = 0 V. *2 : Maximum DC voltage on input and I/O pins is VDD + 0.2 V. During voltage transitions, inputs may overshoot to VDD + 1.0 V for the periods of up to 5.0 ns. *3 : Minimum DC voltage on input or I/O pins is -0.3 V. During voltage transitions, inputs may undershoot VSS to -1.0 V for the periods of up to 5.0 ns. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand.
1, 2
Symbol VDD VSS VIH VIL TA TJ
Value Min 1.7 0 VDD × 0.8 − 0.3 − 30 − 30 Max 1.95 0 VDD + 0.2 VDD × 0.2 + 85 + 90
Unit V V V V °C °C
Low Level Input Voltage*1, *3
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MB82DBS08164C-70L
■ ELECTRICAL CHARACTERISTICS
1. DC Characteristics
Parameter Input Leakage Current Output Leakage Current Output High Voltage Level Output Low Voltage Level Symbol ILI ILO VOH VOL IDDPS VDD Power Down Current IDDP16 IDDP32 IDDP64 IDDS VDD = VDD (Max), VIN = VIH or VIL, CE2 ≤ 0.2 V (At recommended operating conditions unless otherwise noted) Value Test Conditions Unit Min Max VSS ≤ VIN ≤ VDD 0 V ≤ VOUT ≤ VDD, Output Disable VDD = VDD (Min), IOH = − 0.5 mA IOL = 1 mA Sleep 16 M-bit Partial 32 M-bit Partial 64 M-bit Partial VDD = VDD (Max), VIN (including CLK) = VIH or VIL, CE1 = CE2 = VIH VDD = VDD (Max), VIN (including CLK) ≤ 0.2 V or VIN (including CLK) ≥ VDD − 0.2 V, CE1 = CE2 ≥ VDD − 0.2 V VDD = VDD (Max), tCK = tCK (Min) VIN ≤ 0.2 V or VIN ≥ VDD − 0.2 V, CE1 = CE2 ≥ VDD − 0.2 V VDD = VDD (Max), VIN = VIH or VIL, CE1 = VIL and CE2 = VIH, IOUT = 0 mA tRC/tWC = Min tRC/tWC = 1 µs − 1.0 − 1.0 1.4 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ + 1.0 + 1.0 ⎯ 0.4 10 130 160 210 1.5 µA µA V V µA µA µA µA mA
VDD Standby Current
IDDS1
⎯
300
µA
IDDS2
⎯ ⎯ ⎯
400
µA mA mA
IDDA1 VDD Active Current IDDA2
40 5
VDD Burst Access Current
IDDA4
VDD = VDD (Max), VIN = VIH or VIL, CE1 = VIL and CE2 = VIH, tCK = tCK (Min), BL = Continuous, IOUT = 0 mA
⎯
40
mA
Notes : • All voltages are referenced to VSS = 0 V. • IDD depends on the output termination, load conditions, and AC characteristics. • After power on, initialization following POWER-UP timing is required. DC characteristics are guaranteed after the initialization.
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MB82DBS08164C-70L
2. AC Characteristics
(1) Asynchronous Read Operation (At recommended operating conditions unless otherwise noted) Value Symbol Unit Notes Min Max tRC tCE tOE tAA tAV tBA tOH tCLZ tOLZ tBLZ tCHZ tOHZ tBHZ tASO tASVL tASC tAHV tVPL tAX tCHAH tOHAH tWHOL tCP 70 ⎯ ⎯ ⎯ ⎯ ⎯ 3 10 10 10 ⎯ ⎯ ⎯ 5 −2 −5 5 10 ⎯ −5 −5 10 10 1000 70 40 70 70 30 ⎯ ⎯ ⎯ ⎯ 10 10 10 ⎯ ⎯ ⎯ ⎯ ⎯ 10 ⎯ ⎯ 1000 ⎯ ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns *9 *6 *5, *7 *8 *6 *6 *1, *2 *3 *3 *3, *5 *3 *3 *3 *4 *4 *4 *3 *3 *3
Parameter Read Cycle Time CE1 Access Time OE Access Time Address Access Time ADV Access Time LB, UB Access Time Output Data Hold Time CE1 Low to Output Low-Z OE Low to Output Low-Z LB, UB Low to Output Low-Z CE1 High to Output High-Z OE High to Output High-Z LB, UB High to Output High-Z Address Setup Time to OE Low Address Setup Time to ADV Low Address Setup Time to CE1 Low Address Hold Time from ADV High ADV Low Pulse Width Address Invalid Time Address Hold Time from CE1 High Address Hold Time from OE High WE High to OE Low Time for Read CE1 High Pulse Width
*1 : Maximum value is applicable if CE1 is kept at Low without change of address input. *2 : Address should not be changed within a minimum tRC. *3 : The output load 50 pF with 50 Ω termination to VDD × 0.5 V. *4 : The output load 5 pF without any other load. *5 : Applicable when CE1 is kept at Low. *6 : tVPL is specified from the falling edge of either CE1 or ADV whichever comes late. The sum of actual tVPL and tASVL (or tASC) must be equal or greater than the specified minimum value of tVPL. *7 : Applicable to address access when at least two of address inputs are switched from the previous state. *8 : tRC (Min) must be satisfied. *9 : Applicable to Write to Read sequence controlled by WE and OE, Read operation is initiated after tWHOL (Min) from the rising edge of WE therefore tAA is specified after tWHOL (Min) . 19
MB82DBS08164C-70L
(2) Asynchronous Write Operation (At recommended operating conditions unless otherwise noted) Value Symbol Unit Notes Min Max tWC tAS tASVL tAHV tVPL tCW tWP tBW tBS tBH tWR tCP tWHP tBHP tDS tDH tOHCL tOES 70 0 −2 5 10 45 45 45 −5 −5 0 10 10 10 15 0 −5 0 1000 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 1000 1000 ⎯ ⎯ ⎯ ⎯ ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns *8 *9 *4 *3 *3 *3 *5 *6 *7 *1, *2 *3 *4
Parameter Write Cycle Time Address Setup Time Address Setup Time to ADV Low Address Hold Time from ADV High ADV Low Pulse Width CE1 Write Pulse Width WE Write Pulse Width LB, UB Write Pulse Width LB, UB Byte Mask Setup Time LB, UB Byte Mask Hold Time Write Recovery Time CE1 High Pulse Width WE High Pulse Width LB, UB High Pulse Width Data Setup Time Data Hold Time OE High to CE1 Low Setup Time for Write OE High to Address Setup Time for Write
*1 : Maximum value is applicable if CE1 is kept at Low without any address change. *2 : Minimum value must be equal or greater than the sum of write pulse width (tCW, tWP or tBW) and write recovery time (tWR). *3 : Write pulse width is defined from High to Low transition of CE1, WE, LB, or UB, whichever occurs last. *4 : tVPL is specified from the falling edge of either CE1 or ADV whichever comes late. The sum of actual tVPL and tASVL must be equal or greater than the specified minimum value of tVPL. *5 : Applicable for byte mask only. Byte mask setup time is defined to the High to Low transition of CE1 or WE whichever occurs last. *6 : Applicable for byte mask only. Byte mask hold time is defined from the Low to High transition of CE1 or WE whichever occurs first. *7 : Write recovery time is defined from Low to High transition of CE1, WE, LB, or UB, whichever occurs first. *8 : If OE is Low after minimum tOHCL, read cycle is initiated. In other word, OE must be brought to High within 5 ns after CE1 is brought to Low. *9 : If OE is Low after a new address input, read cycle is initiated. In other word, OE must be brought to High at the same time or before a new address becomes valid.
20
MB82DBS08164C-70L
(3) Synchronous Operation - Clock Input (Burst Mode) (At recommended operating conditions unless otherwise noted) Value Parameter Symbol Unit Notes Min Max RL = 7 Clock Period RL = 6 RL = 5 RL = 4 Clock High Time Clock Low Time Clock Transition Time tCKH tCKL tCKT tCK 9.5 12 13 18 3 3 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 1.5 ns ns ns ns ns ns ns *2 *1 *1 *1 *1
*1 : Clock period is defined between valid clock edges. *2 : Clock transition time is defined between VIH (Min) and VIL (Max) (4) Synchronous Operation - Address Latch (Burst Mode) (At recommended operating conditions unless otherwise noted) Value Parameter Symbol Unit Notes Min Max Address Setup Time to CE1 Low Address Setup Time to ADV Low Address Hold Time from ADV High ADV Low Pulse Width ADV Low Setup Time to CLK CE1 Low Setup Time to CLK ADV Low Hold Time from CLK RL = 6, 7 RL = 4, 5 RL = 6, 7 RL = 4, 5 tASCL tASVL tAHV tVPL tVSCK tCLCK tCKVH −2 −2 0 7 3 5 3 5 1 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ns ns ns ns ns ns ns *3 *4 *4 *4 *1 *2
*1 : tASCL is applicable if CE1 is brought to Low after ADV is brought to Low. *2 : tASVL is applicable if ADV is brought to Low after CE1 is brought to Low. *3 : tVPL is specified from the falling edge of either CE1 or ADV whichever comes late. The sum of actual tVPL and tASVL (or tASCL) must be equal or greater than the specified minimum value of tVPL. *4 : Applicable to the 1st valid clock edge.
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MB82DBS08164C-70L
(5) Synchronous Read Operation (Burst Mode) (At recommended operating conditions unless otherwise noted) Value Parameter Symbol Unit Notes Min Max Burst Read Cycle Time CLK Access Time Output Hold Time from CLK CE1 Low to WAIT Low OE Low to WAIT Low CLK to WAIT Valid Time WAIT Valid Hold Time from CLK CE1 Low to Output Low-Z OE Low to Output Low-Z LB, UB Low to Output Low-Z CE1 High to Output High-Z OE High to Output High-Z LB, UB High to Output High-Z CE1 High to WAIT High-Z OE High to WAIT High-Z OE Low Setup Time to 1st Data-output LB, UB Setup Time to 1st Data-output OE Setup Time to CLK OE Hold Time from CLK Burst End CE1 Low Hold Time from CLK Burst End LB, UB Hold Time from CLK CE1 High Pulse Width Burst Terminate Recovery Time BL = 8, 16 BL = Continuous RL = 6, 7 RL = 4, 5 tRCB tAC tCKQX tCLTL tOLTL tCKTV tCKTX tCLZ tOLZ tBLZ tCHZ tOHZ tBHZ tCHTZ tOHTZ tOLQ tBLQ tOSCK tCKOH tCKCLH tCKBH tCP tTRB ⎯ ⎯ ⎯ 2 5 5 ⎯ 2 10 10 10 ⎯ ⎯ ⎯ ⎯ ⎯ 34 26 3 1 1 1 9.5 9.5 70 8000 6 9 ⎯ 15 15 6 ⎯ ⎯ ⎯ ⎯ 9.5 9.5 9.5 9.5 9.5 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns *6 *6 *5 *1 *1 *1 *1 *1, *2 *1, *3 *1 *4 *4 *4 *1 *1 *1 *1 *1
*1 : The output load 50 pF with 50 Ω termination to VDD × 0.5 V. *2 : WAIT drives High at the beginning depending on OE falling edge timing. *3 : tCKTV is guaranteed after tOLTL (Max) from OE falling edge and tOSCK must be satisfied. *4 : The output load 5 pF without any other load. *5 : Once LB, UB are determined, LB, UB must not be changed until the end of burst read. *6 : Defined from the Low to High transition of CE1 to the High to Low transition of either ADV or CE1 whichever occurs late.
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MB82DBS08164C-70L
(6) Synchronous Write Operation (Burst Mode) (At recommended operating conditions unless otherwise noted) Value Parameter Symbol Unit Notes Min Max Burst Write Cycle Time Data Setup Time to CLK Data Hold Time from CLK WE Low Setup Time to 1st Data Input WE Setup Time to CLK WE Hold Time from CLK LB, UB Setup Time to CLK LB, UB Hold Time from CLK CE1 Low to WAIT High WE Low to WAIT High CE1 High to WAIT High-Z WE High to WAIT High-Z Burst End CE1 Low Hold Time from CLK Burst End CE1 High Setup Time to next CLK CE1 High Pulse Width Burst Terminate Recovery Time BL = 8, 16 BL = Continuous tWCB tDSCK tDHCK tWLD tWSCK tCKWH tBSCK tCKBH tCLTH tWLTH tCHTZ tWHTZ tCKCLH tCHCK tCP tTRB ⎯ 3 1 45 3 1 3 1 5 5 ⎯ ⎯ 1 3 9.5 9.5 70 8000 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 15 15 9.5 9.5 ⎯ ⎯ ⎯ ⎯ ⎯ ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns *3 *3 *1 *1 *2 *2 *2 *2
*1 : tBSCK and tCKBH should be satisfied for byte mask control. *2 : The output load 50 pF with 50 Ω termination to VDD × 0.5 V. *3 : Defined from the Low to High transition of CE1 to the High to Low transition of either ADV or CE1 whichever occurs late for the next access.
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MB82DBS08164C-70L
(7) Power Down Parameters (At recommended operating conditions unless otherwise noted) Value Symbol Unit Notes Min Max tCSP tC2LP tC2LPR tCHH tCHHP tCHS 10 70 70 300 70 0 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ns ns ns µs ns ns *1 *2 *3 *2
Parameter CE2 Low Setup Time for Power Down Entry CE2 Low Hold Time after Power Down Entry
CE2 Low Hold Time for Reset to Asynchronous Mode CE1 High Hold Time following CE2 High after Power Down Exit [Sleep mode only] CE1 High Hold Time following CE2 High after Power Down Exit [not in Sleep mode] CE1 High Setup Time following CE2 High after Power Down Exit *2 : Applicable also to power-up. *3 : Applicable when Partial mode is set. (8) Other Timing Parameters
*1 : Applicable when RA = 0 (Reset to Asynchronous mode) .
Parameter CE1 High to OE Invalid Time for Standby Entry CE1 High to WE Invalid Time for Standby Entry CE2 Low Hold Time after Power-up
(At recommended operating conditions unless otherwise noted) Value Symbol Unit Notes Min Max tCHOX tCHWX tC2LH tCHH tT 10 10 50 300 1 ⎯ ⎯ ⎯ ⎯ 25 ns ns µs µs ns *2, *3 *1
CE1 High Hold Time following CE2 High after Power-up Input Transition Time (except for CLK)
*1 : Some data might be written into any address location if tCHWX (Min) is not satisfied. *2 : Except for the CLK input transition time. *3 : The Input Transition Time (tT) at AC testing is 3 ns for Asynchronous operation and 1.5 ns for Synchronous operation respectively. If actual tT is longer than 3 ns or 1.5 ns specified as AC test condition, it may violate AC specification of some timing parameters. Refer to " (9) AC Test Conditions".
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MB82DBS08164C-70L
(9) AC Test Conditions Description Input High Level Input Low Level Input Timing Measurement Level Input Transition Time Async. Sync.
Symbol VIH VIL VREF tT
Test Setup ⎯ ⎯ ⎯ Between VIL and VIH
Value VDD × 0.8 VDD × 0.2 VDD × 0.5 3 1.5
Unit V V V ns ns
Notes
• AC MEASUREMENT OUTPUT LOAD CIRCUIT
VDD 0.5 V
VDD 0.1 µF VSS
50
Device under Test
50 pF
Output
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MB82DBS08164C-70L
■ TIMING DIAGRAMS
(1) Asynchronous Read Timing 1-1 (Basic Timing)
tRC
Address
Address Valid
ADV
Low tASC tCHAH tASC
tCE
CE1
tOE
tCP tCHZ
OE
tOHZ tBA
LB, UB
tBLZ tOLZ tOH tBHZ
DQ
(Output) Valid Data Output Note : This timing diagram assumes CE2 = H and WE = H.
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MB82DBS08164C-70L
(2) Asynchronous Read Timing 1-2 (Basic Timing)
tRC
Address
Address Valid
tAHV tAV
ADV
tASVL tVPL tCE tASVL tASC
CE1
tASC tOE
tCP tCHZ
OE
tOHZ tBA
LB, UB
tBLZ tOLZ tBHZ
DQ
(Output)
tOH
Valid Data Output Note : This timing diagram assumes CE2 = H and WE = H.
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MB82DBS08164C-70L
(3) Asynchronous Read Timing 2 (OE Control & Address Access)
tRC
tAX
tRC
Address
Address Valid
Address Valid
tAA tOHAH
tAA
CE1
Low tASO tOE
OE
LB, UB
tOHZ tOLZ tOH
Valid Data Output
tOH
Valid Data Output
DQ
(Output)
Note : This timing diagram assumes CE2 = H, ADV = L and WE = H.
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MB82DBS08164C-70L
(4) Asynchronous Read Timing 3 (LB, UB Byte Control Access)
tAX tRC tAX
Address
tAA
Address Valid
CE1, OE
Low
tBA
tBA
LB
tBA
UB
tBHZ tBLZ tOH tBLZ tBHZ tOH
DQ7 to DQ0 (Output) Valid Data Output
tBLZ
Valid Data Output
tBHZ tOH
DQ15 to DQ8 (Output) Valid Data Output
Note : This timing diagram assumes CE2 = H, ADV = L and WE = H.
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MB82DBS08164C-70L
(5) Asynchronous Write Timing 1-1 (Basic Timing)
tWC
Address
Address Valid
ADV
Low tAS tCW tWR tAS
CE1
tAS tWP tWR
tCP tAS
WE
tAS tBW tWR
tWHP tAS
LB, UB
tOHCL
tBHP
OE
tDS tDH
(Input) Valid Data Input
DQ
Note : This timing diagram assumes CE2 = H and ADV = L.
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MB82DBS08164C-70L
(6) Asynchronous Write Timing 1-2 (Basic Timing)
tWC
Address
Address Valid
tAHV
ADV
tASVL tAS
tVPL tASVL tCW tWR tAS
CE1
tAS tWP
tCP tWR tAS
WE
tAS tBW tWR
tWHP tAS
LB, UB
tOHCL
tBHP
OE
tDS tDH
DQ
(Input) Valid Data Input Note : This timing diagram assumes CE2 = H.
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MB82DBS08164C-70L
(7) Asynchronous Write Timing 2 (WE Control)
tWC
tWC
Address
Address Valid
Address Valid
tOHAH
CE1
Low tAS tWP tWR tAS tWP tWR
WE
tWHP
LB, UB
tOES
OE
tOHZ tDS tDH tDS tDH
DQ
(Input) Valid Data Input Valid Data Input
Note : This timing diagram assumes CE2 = H and ADV = L.
32
MB82DBS08164C-70L
(8) Asynchronous Write Timing 3-1 (WE, LB, UB Byte Write Control)
tWC tWC
Address
Address Valid
Address Valid
CE1
Low tAS tWP tAS tWP
WE
tWR
tWHP tBS tBH
LB
tBS tBH tWR
UB
tDS tDH
DQ7 to DQ0 (Input)
tDS tDH
DQ15 to DQ8 (Input)
Valid Data Input
Valid Data Input
Note : This timing diagram assumes CE2 = H, ADV = L and OE = H.
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MB82DBS08164C-70L
(9) Asynchronous Write Timing 3-2 (WE, LB, UB Byte Write Control)
tWC
tWC
Address
Address Valid
Address Valid
CE1
Low tWR tWR
WE
tAS tBW
tWHP tBS tBH
LB
tBH tAS tBW
tBS
UB
tDS tDH
DQ7 to DQ0 (Input)
tDS tDH
DQ15 to DQ8 (Input)
Valid Data Input
Valid Data Input
Note : This timing diagram assumes CE2 = H, ADV = L and OE = H.
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MB82DBS08164C-70L
(10) Asynchronous Write Timing 3-3 (WE, LB, UB Byte Write Control)
tWC tWC
Address
Address Valid
Address Valid
CE1
Low
WE
tAS tBW tWR
tWHP
tBS
tBH
LB
tBS tBH tAS tBW tWR
UB
tDS tDH
DQ7 to DQ0 (Input)
tDS tDH
DQ15 to DQ8 (Input)
Valid Data Input
Valid Data Input
Note : This timing diagram assumes CE2 = H, ADV = L and OE = H.
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MB82DBS08164C-70L
(11) Asynchronous Read/Write Timing 1-1 (CE1 Control)
tWC
tRC
Address
tCHAH CE1 tCP tAS
Write Address
tWR tCW tASC
Read Address
tCHAH tCE
tCP
WE
LB, UB tOHCL OE tCHZ tOH DQ tDS tDH tCLZ tOH
Read Data Output
Write Data Input
Read Data Output
Notes : • This timing diagram assumes CE2 = H and ADV = L. • Write address is valid from either CE1 or WE of last falling edge.
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MB82DBS08164C-70L
(12) Asynchronous Read/Write Timing 1-2 (CE1, WE, OE Control)
tWC
tRC
Address
tCHAH CE1 tCP tAS
Write Address
tWR tASC
Read Address
tCHAH tCE
tCP tWP
WE
LB, UB tOHCL OE tCHZ tOH DQ tDS tDH tOLZ tOH
tOE
Read Data Output
Write Data Input
Read Data Output
Notes : • This timing diagram assumes CE2 = H and ADV = L. • OE can be fixed Low during write operation if it is CE1 controlled write at Read-Write-Read sequence.
37
MB82DBS08164C-70L
(13) Asynchronous Read/Write Timing 2 (OE, WE Control)
tWC
tRC
Address
Write Address
Read Address
tAA
tOHAH CE1 Low tAS WE tOES tWP tWR
tOHAH
LB, UB tASO OE tOHZ tOH DQ tDS tDH tWHOL tOLZ tOH tOHZ tOE
Read Data Output
Write Data Input
Read Data Output
Notes : • This timing diagram assumes CE2 = H and ADV = L. • CE1 can be tied to Low for WE and OE controlled operation.
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MB82DBS08164C-70L
(14) Asynchronous Read/Write Timing 3 (OE, WE, LB, UB Control)
tWC
tRC
Address
Write Address
Read Address
tAA
tOHAH CE1 Low
tOHAH
WE tOES LB, UB tBHZ tASO tAS tBW tWR tBA
OE tOH DQ tDS tDH
tWHOL tBHZ tBLZ tOH
Read Data Output
Write Data Input
Read Data Output
Notes : • This timing diagram assumes CE2 = H and ADV = L. • CE1 can be tied to Low for WE and OE controlled operation.
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MB82DBS08164C-70L
(15) Clock Input Timing
tCK
CLK
tCK
tCKH
tCKL
tCKT
tCKT
Notes : • Stable clock input must be required during CE1 = L. • tCK is defined between valid clock edges. • tCKT is defined between VIH (Min) and VIL (Max).
(16) Address Latch Timing (Synchronous Mode) Case #1
CLK
Case #2
Address
tASCL tVSCK
Valid
tAHV tCKVH tASVL tVSCK
Valid
tAHV tCKVH
ADV
tVPL tVPL
tCLCK
CE1
Low
Notes : • Case #1 is the timing when CE1 is brought to Low after ADV is brought to Low. Case #2 is the timing when ADV is brought to Low after CE1 is brought to Low. • tVPL is specified from the falling edge of either CE1 or ADV whichever comes late. At least one valid clock edge must be input during ADV = L. • tVSCK and tCLCK are applied to the 1st valid clock edge during ADV=L.
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MB82DBS08164C-70L
(17) Synchronous Read Timing 1 (OE Control)
RL = 5 CLK
tRCB
Address
tASVL
Address Valid
Address Valid
tAHV tVSCK tCKVH
tASVL tVSCK tCKVH
ADV
tVPL tASCL tVPL tASCL
CE1
tCLCK tCKOH tCP tCLCK
OE
tOLQ
WE
High
tCKBH tBLQ
LB, UB
tCKTV tOHTZ
WAIT
High-Z
tOLTL tCKTX tAC tAC tAC tOHZ
DQ
High-Z
tOLZ
Q1
tCKQX
QBL
tCKQX
Note : This timing diagram assumes CE2 = H, the valid clock edge on rising edge and BL = 8 or 16.
41
MB82DBS08164C-70L
(18) Synchronous Read Timing 2 (CE1 Control)
RL = 5 CLK
tRCB
Address
tASVL
Address Valid
Address Valid
tAHV tVSCK tCKVH tVPL
tASVL
tAHV tVSCK tCKVH
ADV
tASCL tVPL tASCL tCP tCLCK tCKCLH tCLCK
CE1
OE
WE
High
tCKBH
LB, UB
tCKTV tCHTZ tCLTL
WAIT
tCLTL tCKTX tAC tAC tAC tCLZ tCHZ
DQ
tCLZ
Q1
tCKQX
QBL
tCKQX
Note : This timing diagram assumes CE2 = H, the valid clock edge on rising edge and BL = 8 or 16.
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MB82DBS08164C-70L
(19) Synchronous Write Timing 1 (WE Level Control)
RL = 5 CLK
tWCB
Address
tASVL
Address Valid
Address Valid
tAHV tVSCK tCKVH tVPL
tASVL tVSCK
tAHV tCKVH tVPL tCLCK
ADV
tASCL
tASCL tCP tCKCLH
CE1
tCLCK
OE
High
tWLD tCKWH
WE
tBSCK tCKBH
LB, UB
WAIT
High-Z
tWLTH tDSCK tDSCK tDSCK tWHTZ
DQ
D1
tDHCK
D2
DBL
tDHCK
Note : This timing diagram assumes CE2 = H, the valid clock edge on rising edge and BL = 8 or 16.
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MB82DBS08164C-70L
(20) Synchronous Write Timing 2 (WE Single Clock Pulse Control)
RL = 5 CLK
tWCB
Address
tASVL
Address Valid
Address Valid
tAHV tVSCK tCKVH tVPL
tASVL tVSCK
tAHV tCKVH
ADV
tASCL tVPL tCLCK tASCL
CE1
tCLCK tCKCLH tCP
OE
High
tWSCK tCKWH tWSCK tCKWH
WE
tBSCK tCKBH
LB, UB
WAIT
High-Z
tWLTH tDSCK tDSCK tDSCK tCHTZ tWLTH
DQ
D1
tDHCK
D2
DBL
tDHCK
Note : This timing diagram assumes CE2 = H, the valid clock edge on rising edge and BL = 8 or 16.
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MB82DBS08164C-70L
(21) Synchronous Write Timing 3 (LB, UB Byte Mask Control)
RL = 5 CLK
tWCB
Address
tASVL
Address Valid
Address Valid
tAHV tVSCK tCKVH tVPL
tASVL tVSCK
tAHV tCKVH
ADV
tASCL tCLCK tASCL tVPL tCLCK
CE1
tCKCLH tCP
OE
High
tCKWH
tWLD
WE
tCKBH tCKBH
LB, UB
tBSCK tBSCK tBSCK
High-Z WAIT
tWLTH tDSCK tDSCK tWHTZ
DQ
D1
tDHCK
DBL
tDHCK
Note : This timing diagram assumes CE2 = H, the valid clock edge on rising edge and BL = 8 or 16.
45
MB82DBS08164C-70L
(22) Synchronous Read to Write Timing 1 (CE1 Control)
RL = 5 CLK
tWCB
Address
tASVL
Address Valid
tAHV tVSCK tCKVH tVPL tCLCK tCKCLH
ADV
CE1
tCKCLH
tASCL tCP
OE
WE
tCKBH tBSCK tCKBH
LB,UB
tCHTZ
WAIT
tAC tCHZ tCLTH tDSCK tDSCK tDSCK tDSCK
DQ
QBL-1
tCKQX
QBL
tCKQX
D1
tDHCK
D2
tDHCK
D3
tDHCK
DBL
tDHCK
Note : This timing diagram assumes CE2 = H, the valid clock edge on rising edge and BL = 8 or 16.
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MB82DBS08164C-70L
(23) Synchronous Write to Read Timing 1 (CE1 Control)
RL = 5 CLK
Address
tASVL
Address Valid
tAHV tVSCK tCKVH
ADV
tASCL tVPL tCLCK
CE1
tCKCLH
tCP
OE
WE
LB,UB
tCKTV tCLTL
WAIT
tDSCK tDSCK DBL-1 tDHCK tCHTZ tCKTX tAC tAC tAC tAC
DQ
DBL
tDHCK tCLZ
Q1
tCKQX
Q2
tCKQX
Q3
tCKQX
Q4
tCKQX
Note : This timing diagram assumes CE2 = H, the valid clock edge on rising edge and BL = 8 or 16.
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MB82DBS08164C-70L
(24) Power-up Timing 1
CE1 tCHS tC2LH CE2 tCHH
VDD
0V
VDD (Min)
Note : The tC2LH specifies after VDD reaches specified minimum level.
(25) Power-up Timing 2
CE1 tCHH CE2
VDD
0V
VDD (Min)
Note : The tCHH specifies after VDD reaches specified minimum level and applicable to both CE1 and CE2. If transition time of VDD (from 0 V to VDD (Min)) is longer than 50 ms, Power-up Timing 1 must be applied.
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MB82DBS08164C-70L
(26) Power Down Entry and Exit Timing
CE1
tCHS
CE2
tCSP tC2LP High-Z tCHH (tCHHP)
DQ
Power Down Entry
Power Down Mode
Power Down Exit
Note : This Power Down mode can be also used as a reset timing if “Power-up timing” above could not be satisfied and Power Down program was not performed prior to this reset.
(27) Standby Entry Timing after Read or Write
CE1
tCHOX tCHWX
OE
WE
Active (Read)
Standby
Active (Write)
Standby
Note : Both tCHOX and tCHWX define the earliest entry timing for Standby mode.
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MB82DBS08164C-70L
(28) Configuration Register Set Timing 1 (Asynchronous Operation)
tRC
tWC MSB*1
tWC MSB*1
tWC MSB*1
tWC MSB*1
tWC MSB*1
Address
MSB*1
tCP
tCP
tCP
tCP
tCP
tRC*6
CE1
OE
WE
LB, UB
*2
*2
*2
*3
*3
*3
DQ
RDa
RDa
RDa
CR Key 0*4
CR Key 1*5
CR Key 2*5
Cycle #1
Cycle #2
Cycle #3
Cycle #4
Cycle #5
Cycle #6
*1 : The all address inputs must be High from Cycle #1 to #6. *2 : At least either LB or UB must be brought to Low during Cycle #1 to #3. *3 : LB must be brought to Low in order to input the CR Keys during Cycle #4 to #6. *4 : The CR Key 0 must be set “1” for the CR Set as specified in “■FUNCTIONAL DESCRIPTION”. *5 : The CR Keys must conform to the format specified in “■FUNCTIONAL DESCRIPTION”. If not, any operations and data are not guaranteed. *6 : After tRC following Cycle #6, the Configuration Register Set is completed and returned to the normal operation.
50
MB82DBS08164C-70L
(29) Configuration Register Verify Timing 1 (Asynchronous Operation)
tRC
tWC MSB*1
tWC MSB*1
tWC MSB*1
tRC MSB*1
tRC MSB*1
Address
MSB*1
tCP
tCP
tCP
tCP
tCP
tRC*6
CE1
OE
WE
LB, UB
*2
*2
*2
*3
*3
*3
DQ*3
RDa
RDa
RDa
CR Key 0*4
CR Key 1*5
CR Key 2*5
Cycle #1
Cycle #2
Cycle #3
Cycle #4
Cycle #5
Cycle #6
*1 : The all address inputs must be High from Cycle #1 to #6. *2 : At least either LB or UB must be brought to Low during Cycle #1 to #3. *3 : LB must be brought to Low in order to input or output the CR Keys during Cycle #4 to #6. *4 : The CR Key 0 must be set “0” for the CR Verify as specified in “■FUNCTIONAL DESCRIPTION”. *5 : The CR Keys must conform to the format specified in “■FUNCTIONAL DESCRIPTION”. If not, any operations and data are not guaranteed. *6 : After tRC following Cycle #6, the Configuration Register Verify is completed and returned to the normal operation.
51
MB82DBS08164C-70L
(30) Configuration Register Set Timing 2 (Synchronous Operation)
CLK
Address
MSB *
1
MSB *
1
MSB *
1
MSB *
1
MSB *
1
MSB *1
tRCB
tWCB
tWCB
tWCB
tWCB
tWCB
ADV
tTRB tTRB tTRB tTRB tTRB tRC*
6
CE1
OE
WE
*2
*2
*2
*3
*3
*3
LB,UB
RL RL-1 RDa RDa RL-1 RDa RL-1
CR Key 0
RL-1
CR Key 1
RL-1
CR Key 2
DQ
Cycle #1
Cycle #2
Cycle #3
Cycle #4
*4
Cycle #5
*5
Cycle #6
*5
*1 : The all address inputs must be High from Cycle #1 to #6. *2 : At least either LB or UB must be brought to Low during Cycle #1 to #3. *3 : LB must be brought to Low in order to input the CR Keys during Cycle #4 to #6. *4 : The CR Key 0 must be set “1” for the CR Set as specified in “■FUNCTIONAL DESCRIPTION”. *5 : The CR Keys must conform to the format specified in “■FUNCTIONAL DESCRIPTION”. If not, any operations and data are not guaranteed. *6 : After tRC following Cycle #6, the Configuration Register Set is completed and returned to the normal operation.
52
MB82DBS08164C-70L
(31) Configuration Register Verify Timing 2 (Synchronous Operation)
CLK
Address
MSB *1
MSB *1
MSB *1
MSB *1
MSB *1
MSB *1
tRCB
tWCB
tWCB
tWCB
tRCB
tRCB
ADV
tTRB tTRB tTRB tTRB tTRB tRC*
6
CE1
OE
WE
*2
*2
*2
*3
*3
*3
LB,UB
RL RL-1 RDa RDa RL-1 RDa RL-1
CR Key 0
RL
CR Key 1
RL
CR Key 2
DQ
*4
*5
*5
Cycle #1
Cycle #2
Cycle #3
Cycle #4
Cycle #5
Cycle #6
*1 : The all address inputs must be High from Cycle #1 to #6. *2 : At least either LB or UB must be brought to Low during Cycle #1 to #3. *3 : LB must be brought to Low in order to input or output the CR Keys during Cycle #4 to #6. *4 : The CR Key 0 must be set “0” for the CR Verify as specified in “■FUNCTIONAL DESCRIPTION”. *5 : The CR Keys must conform to the format specified in “■FUNCTIONAL DESCRIPTION”. If not, any operations and data are not guaranteed. *6 : After tRC following Cycle #6, the Configuration Register Verify is completed and returned to the normal operation.
53
MB82DBS08164C-70L
■ PACKAGE FOR ENGINEERING SAMPLES
• Pin Assignment
(TOP VIEW)
A B C D E F G H J K L M N P
10 9 8 7 6 5 4 3 2 1
NC NC
NC NC
NC NC NC NC NC NC NC VSS
NC NC A11 A8 WE CLK LB A7 NC NC
NC A15 A12 A19 CE2
NC A21 A13 A9 A20
VDD A22 A14 A10 NC NC A17 A4 A1 VDD
VSS A16 NC DQ6 NC VDD DQ1 VSS A0 VSS
NC NC DQ15
NC VSS
NC NC
NC NC NC NC NC VDD VSS NC NC NC
NC NC
NC NC
DQ7 DQ14
DQ13 DQ12 DQ5 DQ4 DQ3 DQ9 OE NC NC VDD VDD DQ10 DQ0 CE1 NC NC DQ11 DQ2 DQ8 NC NC
ADV WAIT UB A6 A3 NC A18 A5 A2 NC
NC NC
NC NC
NC
NC NC
NC NC
(BGA-115P-M03)
54
MB82DBS08164C-70L
• Pin Description Pin Name A22 to A0 CE1 CE2 WE OE LB UB CLK ADV WAIT DQ7 to DQ0 DQ15 to DQ8 VDD VSS NC Address Input Chip Enable 1 (Low Active) Chip Enable 2 (High Active) Write Enable (Low Active) Output Enable (Low Active) Lower Byte Control (Low Active) Upper Byte Control (Low Active) Clock Input Address Valid Input (Low Active) Wait Output Lower Byte Data Input/Output Upper Byte Data Input/Output Power Supply Voltage Ground No Connection
Description
55
MB82DBS08164C-70L
• Package Capacitance (f = 1 MHz, TA = +25 °C) Parameter Address Input Capacitance Control Input Capacitance Data Input/Output Capacitance Symbol CIN1 CIN2 CI/O Test conditions VIN = 0 V VIN = 0 V VIO = 0 V Value Min ⎯ ⎯ ⎯ Typ ⎯ ⎯ ⎯ Max 5 5 8 Unit pF pF pF
• Package View 115-ball plastic FBGA
(BGA-115P-M03)
56
MB82DBS08164C-70L
• Package Dimension 115-ball plastic FBGA (BGA-115P-M03)
12.00±0.10(.472±.004) 0.20(.008) S B 1.25±0.10 (Seated height) (.049±.004) 0.80(.031) REF A 9.00±0.10 (.354±.004) B 0.40(.016) REF 0.80(.031) REF 10 9 8 7 6 5 4 3 2 1 PNMLKJHGFEDCBA
+.010
0.40(.016) REF 0.08(.003) S
INDEX-MARK AREA
0.10±0.05 (Stand off) (.004±.002) S
115-ø0.40 –0.05 0.20(.008) S A 115-ø.016
+.004 –.002
ø0.08(.003)
M
SAB
0.08(.003) S
C
2003 FUJITSU LIMITED B115003S-c-1-1
Dimensions in mm (inches) Note : The values in parentheses are reference values.
■ ORDERING INFORMATION
Part Number MB82DBS08164C-70LWT Shipping Form wafer Remarks
57
MB82DBS08164C-70L
FUJITSU LIMITED
All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of Fujitsu semiconductor device; Fujitsu does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. Fujitsu assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of Fujitsu or any third party or does Fujitsu warrant non-infringement of any third-party’s intellectual property right or other right by using such information. Fujitsu assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. Edited Business Promotion Dept.
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