MB86K23

MB86K23 The Fujitsu IEEE 802.16e-2005 Mobile WiMAX SoC USB 2.0 MAC Processor Memory Interface SDRAM Flash PMM SDIO/SPI PMU Peripherals PHY Processors AFE RF Simplified block diagram of the Fujitsu Mobile WiMAX SoC. D escription The Fujitsu MB86K23 WiMAX baseband SoC is compliant with the Wave 2 IEEE 802.16e-2005 standard with optimized PHY and MAC processors for high performance. The MB86K23 is a successor to the first generation mobile WiMAX baseband IC that was certified by the WiMAX Forum. A total WiMAX solution is available by combining related chips and supporting software: • MB86K52: Tri-band RF chip supports 2.3GHz, 2.5GHz and 3.5GHz bands. • MB39C316: Power Management IC Applications The Fujitsu MB86K23 Mobile WiMAX SoC is optimized for a wide range of full mobile applications: • Handheld terminals • Low-power battery-driven applications • Mobile internet devices • WiMAX mobile terminals like USB dongles MB86K23 Features • Features compliant with IEEE 802.16e-2005 Mobile WiMAX (Mobile station) – OFDMA PHY with TDD – 512/1024/2048 points FFT – Supports channel bandwidths 3.5MHz/7MHz/10MHz/20MHz – 64 QAM (DL), 16 QAM, QPSK adaptive modulation – Optional space time coding with 2-antenna matrix A/B – HARQ chase combining with CTC • A/D converter and D/A converter for the baseband analog IQ interface • RF control function – Programmable AGC control for supporting broad range of RF LSI and alternative RF front-ends – RF control Logic programs the Rx and Tx gain when the radio switches between receive and transmit • Multi-function peripheral interface – I2C – UART – SDIO – SPI – USB 2.0 – SPI flash – SDR SDRAM • Internal power control function – Built-in power management unit (PMU) supporting idle mode and sleep mode – Smart power management unit works with external power management IC to efficiently manage power utilization – CoolAdjust Power Gating technique to turn off unused portions of baseband and other external components to substantially reduce overall power consumption • 65nm low-leak technology • Package size: 10mm x 10mm MB86K23 WiMAX Chip: 10mm x 10mm FUJITSU MICROELECTRONICS AMERICA, INC. Corporate Headquarters 1250 E. Arques Avenue, M/S 333, Sunnyvale, CA 94085-5401 Tel: (800) 866-8608 Fax: (408) 737-5999 E-mail: inquiry@fma.fujitsu.com Web Site: http://us.fujitsu.com/micro © 2009 Fujitsu Microelectronics America, Inc. All company and product names are trademarks or registered trademarks of their respective owners. Printed in the U.S.A. EPS-FS-21349-02/2009