MB88346BPFV

FUJITSU SEMICONDUCTOR DATA SHEET DS04-13501-3E Linear IC General purpose Converter CMOS D/A Converter for Digital Tuning (12 channels. 8-bit, with OP amplifier) MB88346B ■ DESCRIPTION The MB88346B features 12 channels of 8-bit D/A converters with output amplifier for digital tuning. The output amplifier provides high current drive capability. As the MB88346B inputs data in serial, it requires only three control lines and can also be cascade-connected with the MB88340 series. The MB88346B is suitable for electronic volumes and replacement for potentiometers for adjustment, in addition to normal D/A converter applications. ■ FEATURES • Low power consumption • Small package • Integrating 12 channels of R-2R type 8-bit D/A converter (Continued) ■ PACKAGES 20-pin plastic DIP 20-pin plastic SOP 20-pin plastic SSOP (DIP-20P-M02) (FPT-20P-M01) (FPT-20P-M03) MB88346B (Continued) • Built-in analog output amplifier (Max +1.0 mA sink/source current) • Analog output range : 0 to VCC • The range of D/A conversion can be independently set by separated the power supply for MCU interface and OP amplifier and the power supply for D/A converter. • Capable of being controlled directly by a 3-V MCU (input voltage : “H” = 0.5 VCC, “L” = 0.2 VCC) • Serial data input, 2.5 MHz operation • CMOS process • Package lineup : DIP 20-pin, SOP 20-pin, SSOP 20-pin 2 MB88346B ■ PIN ASSIGNMENTS (TOP VIEW) VSS AO3 AO4 AO5 AO6 AO7 AO8 AO9 AO10 VDD 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 GND AO2 AO1 DI CLK LD DO AO12 AO11 VCC VSS AO3 AO4 AO5 AO6 AO7 AO8 AO9 AO10 VDD 1 2 3 4 5 6 7 8 9 10 (TOP VIEW) 20 19 18 17 16 15 14 13 12 11 GND AO2 AO1 DI CLK LD DO AO12 AO11 VCC (DIP-20P-M02) (FPT-20P-M01) (FPT-20P-M03) ■ PIN DESCRIPTION Pin No. 17 14 16 15 18, 19, 2, 3, 4, 5, 6, 7, 8, 9, 12, 13 11 20 10 1 Symbol DI* DO CLK* LD* AO1, AO2, AO3, AO4, AO5, AO6, AO7, AO8, AO9, AO10, AO11, AO12 VCC GND VDD VSS I/O I O I I Pin name Data input pin Data output pin Shift clock input pin Load signal input pin Function This pin inputs 12-bit serial data. This pin outputs MSB bit data of 12-bit shift register. Input signal from DI pin is inputted to 12-bit shift register at rising of shift clock. If input “H” level to LD pin, the data of 12-bit shift register is loaded to the decoder and the register for D/A output. O D/A output pin These pins output analog data of 8-bit D/A converter with OP amplifier. ⎯ ⎯ ⎯ ⎯ Power supply pin Ground pin Power supply pin Ground pin Power supply pin of MCU interface and OP amplifier Ground pin of MCU interface and OP amplifier Power supply pin of D/A converter Ground pin of D/A converter * : When three pins, DI, CLK, and LD pins are connected to 3-V MCU, they are fixed to “L” level at non transfer. 3 MB88346B ■ BLOCK DIAGRAM VCC GND DI CLK D0 D1 D2 D3 12-bit shift register D4 D5 D6 D7 D8 D9 D10 D11 DO 8 12 Address decoder 1234 D0 12 12 D7 LD D0 1 D7 8-bit latch 8-bit R-2R D/A converter 8-bit latch 8-bit R-2R D/A converter + _ + − VCC GND AO1 AO12 VDD VSS 4 MB88346B ■ DATA FOR CHIP CONTROL 1. Data for Shift Register • The chip is controlled by 12 bits of data input to the shift register. • The shift register inputs a total of 12 bits of data consisting of a four-bit address selection signal and an eightbit D/A converter control signal. • A data to the shift register is inputted to the DI pin in the order of D11 (MSB) to D0 (LSB) . Last (LSB) D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 First (MSB) D10 D11 D/A converter control signal Address selected signal 2. D/A Converter Control Signal Input data signal D0 0 1 0 1 0 1 D1 0 0 1 1 1 1 D2 0 0 0 0 1 1 D3 0 0 0 0 1 1 D4 0 0 0 0 1 1 D5 0 0 0 0 1 1 D6 0 0 0 0 1 1 D7 0 0 0 0 1 1 D/A converter output voltage ≅ VSS ≅ VREF / 255 × 1 + VSS ≅ VREF / 255 × 2 + VSS ≅ VREF / 255 × 3 + VSS ≅ VREF / 255 × 254 + VSS ≅ VDD VREF = VDD - VSS 5 MB88346B 3. Address Selected Signal Input data signal D8 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 D9 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D10 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D11 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Address selected sequence Don't Care AO1 selected AO2 selected AO3 selected AO4 selected AO5 selected AO6 selected AO7 selected AO8 selected AO9 selected AO10 selected AO11 selected AO12 selected Don't Care Don't Care Don't Care 6 MB88346B ■ TIMING CHART AT DATA SETTING MSB LSB D10 D9 D8 D2 D1 D0 DI D11 CLK LD D/A output (AO1 to AO12) ■ ANALOG OUTPUT VOLTAGE RANGE R-2R ladder output VDD OP amplifier output VCC VAOH (VCC) D/A output range (linear area) VAOL (GND) VSS GND Note : VCC = VDD, GND = VSS 7 MB88346B ■ ABSOLUTE MAXIMUM RATINGS Parameter Power supply voltage Input voltage Output voltage Power consumption Operating temperature Storage temperature Symbol VCC VDD VIN VOUT PD Ta Tstg ⎯ ⎯ ⎯ The case that GND is referred. Ta = +25 °C Condition Rating Min − 0.3 − 0.3 − 0.3 − 0.3 ⎯ − 40 − 55 Max + 7.0 + 7.0 VCC + 0.3 VCC + 0.3 250 + 85 + 150 Unit V V V V mW °C °C VCC ≥ VDD Remarks WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING CONDITIONS Parameter Power supply Voltage Analog output source current Analog output sink current Oscillation limited output capacitance Operating temperature Symbol VCC GND Isource Isink COL Ta Value Min 4.5 ⎯ ⎯ ⎯ ⎯ − 40 Max 5.5 0 1.0 1.0 1.0 + 85 Unit V V mA mA µF °C WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 8 MB88346B ■ ELECTRICAL CHARACTERISTICS 1. DC Characteristics (1) Digital block (VDD, VCC = + 5 V ± 10% (VCC ≥ VDD) , GND, VSS = 0 V, Ta = − 40 °C to + 85 °C) Value Symbol Pin name Conditions Unit Min Typ Max VCC ICC IILK VIL VIH VOL VOH VCC ⎯ At CLK = 1 MHz operating (at no load) VIN = 0 to VCC ⎯ ⎯ IOL = 2.5 mA IOH = − 400 µA 4.5 ⎯ − 10 ⎯ 0.5 VCC ⎯ VCC − 0.4 5.0 2.5 ⎯ ⎯ ⎯ ⎯ ⎯ 5.5 4.5 10 0.2 VCC ⎯ 0.4 ⎯ V mA µA V V V V Parameter Power supply voltage Power supply current Input leakage current “L” level input voltage “H” level input voltage “L” level output voltage “H” level output voltage CLK DI LD DO Note : IOL and IOH are output load current. (2) Analog block (VDD, VCC = + 5 V ± 10% (VCC ≥ VDD) , GND, VSS = 0 V, Ta = − 40 °C to + 85 °C) Value Symbol Pin name Conditions Unit Min Typ Max IDD VDD VSS Res LE DLE VAOL1 VAOL2 VAOL3 AO 1 to AO 12 AO1 to AO12 VDD VDD VSS No load VDD − VSS ≥ 2.0 V Monotonic increase No load VDD ≤ VCC − 0.1 V VSS ≥ 0.1 V No load VDD ≤ VCC − 0.1 V VSS ≥ 0.1 V No load, VSS = 0 V When digital setting is #00. ⎯ 2.0 GND ⎯ − 1.5 − 1.0 VSS 0.2 ⎯ ⎯ 8 0 ⎯ ⎯ VSS ⎯ 0.5 VCC VCC − 2.0 ⎯ 1.5 1.0 VSS + 0.1 VSS + 0.2 VSS + 0.2 mA V V bit LSB LSB V V V Parameter Consumption current Analog power supply voltage Resolution Non linearity error Differential linearity error Output minimum voltage 1 Output minimum voltage 2 Output minimum voltage 3 Output minimum voltage 4 Isource = 500 µA VSS − 2.0 When digital setting is #00. Isink = 500 µA When digital setting is #00. VSS VAOL4 VDD = VCC = 5.0 V VSS = GND = 0.0 V VSS − 0.3 Isource = 1.0 mA When digital setting is #00. VDD = VCC = 5.0 V VSS = GND = 0.0 V Isink = 1.0 mA When digital setting is #00. VSS V SS + 0.3 V Output minimum voltage 5 VAOL5 VSS ⎯ V SS + 0.3 V (Continued) 9 MB88346B (Continued) Parameter Output maximum voltage 1 Output maximum voltage 2 Output maximum voltage 3 Output maximum voltage 4 (VDD, VCC = + 5 V ± 10% (VCC ≥ VDD) , GND, VSS = 0 V, Ta = − 40 °C to + 85 °C) Value Symbol Pin name Conditions Unit Min Typ Max VAOH1 VAOH2 VAOH3 AO 1 to AO 12 No load, VDD = VCC VDD − 0.1 When digital setting is #FF. Isource = 500 µA VDD − 0.2 When digital setting is #FF. Isink = 500 µA VDD − 0.2 When digital setting is #FF. VDD = VCC = 5.0 V VSS = GND = 0.0 V VDD − 0.3 Isource = 1.0 mA When digital setting is #FF. VDD = VCC = 5.0 V VSS = GND = 0.0 V VDD − 0.3 Isink = 1.0 mA When digital setting is #FF. ⎯ ⎯ V DD V DD V DD V DD + 0.2 V V V VAOH4 ⎯ V DD V Output maximum voltage 5 Non linearity error VAOH5 V DD V DD + 0.3 V : The error of the I/O curve from the ideal straight line between output voltages at "00" and "FF". Differential linearity error : The error from the ideal increment given when the digital value is incremented by one bit. Analog output VAOH Ideal straight line VAOL Non linearity error Digital setting #00 #FF Note : VAOH and VAOL do not always match VDD and VSS, respectively. 10 MB88346B 2. AC Characteristics Parameter “L” level clock pulse width “H” level clock pulse width Clock rising time Clock falling time Data setup time Data hold time Load setup time Load hold time “H” level load pulse width Data output delay time D/A output settling time • Load condition (1) (VDD, VCC = + 5 V ± 10% (VCC ≥ VDD) , GND, VSS = 0 V, Ta = − 40 °C to + 85 °C) Value Symbol Conditions Unit Min Max tCKL tCKH tCr tCf tDCH tCHD tCHL tLDC tLDH tDO tLDD ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Refer to “Load condition (1) ”. Refer to “Load condition (2) ”. 200 200 ⎯ 30 60 200 100 100 70 ⎯ ⎯ ⎯ 200 ⎯ ⎯ ⎯ ⎯ ⎯ 350 20 µs ns Measurement point (2) Measurement point DO CL (20 pF ≤ CL ≤ 100 pF) D/A output (AO1 to AO12) RAL = 10 kΩ CAL = 50 pF 11 MB88346B • Input/output timing tCr tCKH tCf CLK tCKL tLDC DI tDCH tCHD tCHL tLDH LD tLDD D/A output (AO1 to AO12) tDO DO Note : The D/A output evaluation level is 90% and 10% of VCC. The other evaluation level is 80% and 20% of VCC. 12 MB88346B ■ EXAMPLE CHARACTERISTICS Example of analog output voltage vs. sink/source current characteristics (V) +0.3 +0.2 +0.1 VDD Analog output voltage −0.1 −0.2 −0.3 +0.3 +0.2 +0.1 VSS −0.1 −0.2 −0.3 −0.1 −0.5 0 0.5 1.0 (mA) Sink current ISINK ← → Source current ISOURCE 13 MB88346B ■ ORDERING INFORMATION Part No. MB88346BP MB88346BPF MB88346BPFV Package 20-pin plastic DIP (DIP-20P-M02) 20-pin plastic SOP (FPT-20P-M01) 20-pin plastic SSOP (FPT-20P-M03) Remarks 14 MB88346B ■ PACKAGE DIMENSIONS 20-pin plastic DIP (DIP-20P-M02) 24.64 –0.30 .970 +.008 –.012 +0.20 INDEX-1 INDEX-2 6.20±0.25 (.244±.010) 4.36(.172)MAX 0.51(.020)MIN 0.25±0.05 (.010±.002) 3.00(.118)MIN 0.46±0.08 (.018±.003) +0.30 +.012 +0.30 0.86 –0 1.27(.050) MAX 1.27 –0 .034 –0 .050 –0 2.54(.100) TYP +.012 7.62(.300) TYP 15˚MAX C 1994 FUJITSU LIMITED D20003S-3C-4 Dimensions in mm (inches). Note : The values in parentheses are reference values. (Continued) 15 MB88346B 20-pin plastic SOP (FPT-20P-M01) Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. +0.25 +.010 *112.70 –0.20 .500 –.008 20 0.17 –0.04 11 +0.03 +.001 .007 –.002 INDEX *2 5.30±0.30 7.80±0.40 (.209±.012) (.307±.016) Details of "A" part 2.00 –0.15 .079 –.006 +0.25 +.010 (Mounting height) 1 10 "A" 0.25(.010) 0~8˚ 1.27(.050) 0.47±0.08 (.019±.003) 0.13(.005) M 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.10 –0.05 +0.10 +.004 .004 –.002 (Stand off) 0.10(.004) C 2002 FUJITSU LIMITED F20003S-c-7-7 Dimensions in mm (inches). Note: The values in parentheses are reference values. (Continued) 16 MB88346B (Continued) 20-pin plastic SSOP (FPT-20P-M03) Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max). Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. 0.17±0.03 (.007±.001) 11 *1 6.50±0.10(.256±.004) 20 INDEX *24.40±0.10 6.40±0.20 (.173±.004) (.252±.008) Details of "A" part 1.25 –0.10 .049 –.004 LEAD No. 1 10 +0.20 +.008 (Mounting height) 0.65(.026) "A" 0.24±0.08 (.009±.003) 0.13(.005) M 0~8˚ 0.10±0.10 (Stand off) (.004±.004) 0.25(.010) 0.10(.004) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) C 2003 FUJITSU LIMITED F20012S-c-4-6 Dimensions in mm (inches). Note: The values in parentheses are reference values. 17 MB88346B FUJITSU LIMITED All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of Fujitsu semiconductor device; Fujitsu does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. Fujitsu assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of Fujitsu or any third party or does Fujitsu warrant non-infringement of any third-party’s intellectual property right or other right by using such information. Fujitsu assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. F0503 © 2005 FUJITSU LIMITED Printed in Japan