AFBR-709SMZ
10Gb Ethernet, 850 nm, 10GBASE-SR/SW,
SFP+ Transceiver
Data Sheet
MZ
9S
-70
BR
AF
Description
Features
The Avago AFBR-709SMZ transceiver is part of a family of
SFP+ products. This transceiver utilizes Avago’s 850nm
VCSEL and PIN Detector technology to provide an IEEE
10Gb Ethernet design compliant with the 10GBASE-SR
and 10GBASE-SW standards. The AFBR-709SMZ transceiver is designed to enable 10Gb Ethernet equipment
designs with very high port density based on the new
electrical and mechanical specification enhancements
to the well known SFP specifications developed by the
SFF Committee. These specifications are referred to as
SFP+ to recognize these enhancements to previous SFP
specifications used for lower speed products. Avago
Technologies is a an active participant in the SFF Committee specification development activities.
• Avago 850nm VCSEL source and Transmitter Optical
Subassembly technology
Related Products
• Link lengths at 10.3125 GBd:
300m with 50um OM3 MM fiber
400m with 50um OM4 MM fiber
• The AFBR-709ASMZ is an SFP+ 10 Gigabit Ethernet
10GBASE-SR/SW transceiver with case temperature
operated at 0-85 °C for use on multimode fiber cables.
It is best suited for OM3 high bandwidth MMF link
applications with link lengths up to 300 meters.
• AFBR-707SDZ SFP+ 10 Gigabit Ethernet 10GBASELRM transceiver for 220 meter operation in all MMF
link applications including OM1 and OM2 legacy fiber
cables and new high bandwidth OM3 fiber cables.
• AFCT-701SDZ (AFCT-701ASDZ) with case temperature
0-70 (0-85) °C SFP+ 10 Gigabit Ethernet 10GBASE-LR
transceiver for operation in SMF link applications to
10 km
• AFCT-5016Z SFP+ Evaluation Board The purpose of
this SFP+ evaluation board is to provide the designer
with a convenient means for evaluating SFP+ fiber
optic transceivers.
Patent - www.avagotech.com/patents
• Avago PIN detector and Receiver Optical Subassembly
technology
• Typical power dissipation 600mW
• Full digital diagnostic management interface
• Avago SFP+ package design enables equipment EMI
performance in high port density applications with
margin to Class B limits
Specifications
• Optical interface specifications per IEEE 802.3ae
10GBASE-SR and 10GBASE-SW
• Electrical interface specifications per SFF Committee
SFF 8431 Specifications for Enhanced 8.5 and 10
Gigabit Small Form Factor Pluggable Module “SFP+”
• Management interface specifications per SFF
Committee SFF 8431 and SFF 8472 Diagnostic
Monitoring Interface for Optical Transceivers
• Mechanical specifications per SFF Committee SFF
8432 Improved Pluggable Formfactor “IPF”
• LC Duplex optical connector interface confirming to
ANSI TIA/EA 604-10 (FOCIS 10A)
• Compliant to Restriction on Hazardous Substances
(RoHS) per EU and China requirements
• Class 1 Eye safe per requirements of IEC 60825-1 /
CDRH
Description, continued
Installation
Compliance Prediction
The AFBR-709SMZ transceiver package is compliant
with the SFF 8432 Improved Pluggable Formfactor housing specification for the SFP+. It can be installed in any
INF-8074 or SFF-8431/2 compliant Small Form Pluggable
(SFP) port regardless of host equipment operating status
The AFBR-709SMZ is hot-pluggable, allowing the module to be installed while the host system is operating and
on-line. Upon insertion, the transceiver housing makes
initial contact with the host board SFP cage, mitigating
potential damage due to Electro-Static Discharge (ESD).
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-709SMZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify potential component compliance issues. Received optical
power is also available to assess compliance of a cable
plant and remote transmitter. When operating out of requirements, the link cannot guarantee error free transmission.
Digital Diagnostic Interface and Serial Identification
Fault Isolation
The two-wire interface protocol and signaling detail
are based on SFF-8431. Conventional EEPROM memory, bytes 0-255 at memory address 0xA0, is organized
in compliance with SFF-8431. New digital diagnostic
information, bytes 0-255 at memory address 0xA2, is
compliant to SFF-8472. The new diagnostic information
provides the opportunity for Predictive Failure Identification, Compliance Prediction, Fault Isolation and Component Monitoring.
The fault isolation feature allows a host to quickly pinpoint the location of a link failure, minimizing downtime.
For optical links, the ability to identify a fault at a local
device, remote device or cable plant is crucial to speeding service of an installation. AFBR-709SMZ real-time
monitors of Tx_Bias, Tx_Power, Vcc, Temperature and
Rx_Power can be used to assess local transceiver current
operating conditions. In addition, status flags TX_DISABLE and Rx Loss of Signal (LOS) are mirrored in memory
and available via the two-wire serial interface.
Predictive Failure Identification
The AFBR-709SMZ predictive failure feature allows a host
to identify potential link problems before system performance is impacted. Prior identification of link problems
enables a host to service an application via “fail over”
to a redundant link or replace a suspect device, maintaining system uptime in the process. For applications
where ultra-high system uptime is required, a digital SFP
provides a means to monitor two real-time laser metrics
associated with observing laser degradation and predicting failure: average laser bias current (Tx_Bias) and
average laser optical power (Tx_Power).
2
Component Monitoring
Component evaluation is a more casual use of the AFBR-709SMZ real-time monitors of Tx_Bias, Tx_Power,
Vcc, Temperature and Rx_Power. Potential uses are as
debugging aids for system installation and design, and
transceiver parametric evaluation for factory or field
qualification. For example, temperature per module can
be observed in high density applications to facilitate
thermal evaluation of blades, PCI cards and systems.
OPTICAL INTERFACE
ELECTRICAL INTERFACE
RECEIVER
LIGHT FROM FIBER
PHOTO-DETECTOR
AMPLIFICATION
& QUANTIZATION
RD+ (RECEIVE DATA)
RD– (RECEIVE DATA)
RX_LOS
RS0
RS1
CONTROLLER & MEMORY
SDA
SCL
MOD-ABS
TRANSMITTER
LIGHT TO FIBER
VCSEL
LASER
DRIVER &
SAFETY
CIRCUITRY
TX_DISABLE
TD+ (TRANSMIT DATA)
TD– (TRANSMIT DATA)
TX_FAULT
Figure 1. Transceiver functional diagram
Transmitter Section
Transmit Fault (TX_FAULT)
The transmitter section includes the Transmitter Optical Sub-Assembly (TOSA) and laser driver circuitry. The
TOSA, containing an Avago designed and manufactured
850 nm VCSEL (Vertical Cavity Surface Emitting Laser)
light source, is located at the optical interface and mates
with the LC optical connector. The TOSA is driven by an
IC which uses the incoming differential high speed logic
signal to modulate the laser diode driver current. This Tx
laser driver circuit regulates the optical power at a constant level provided the incoming data pattern is DC balanced.
A catastrophic laser fault will activate the transmitter
signal, TX_FAULT, and disable the laser. This signal is
an open collector output (pull-up required on the host
board). A low signal indicates normal laser operation
and a high signal indicates a fault. The TX_FAULT will
be latched high when a laser fault occurs and is cleared
by toggling the TX_DISABLE input or power cycling the
transceiver. The transmitter fault condition can also be
monitored via the two-wire serial interface (address A2,
byte 110, bit 2).
Transmit Disable (TX_DISABLE)
The AFBR-709SMZ accepts an LVTTL compatible transmit disable control signal input which shuts down the
transmitter optical output. A high signal implements this
function while a low signal allows normal transceiver operation. In the event of a fault (e.g. eye safety circuit activated), cycling this control signal resets the module as
depicted in Figure 6. An internal pull up resistor disables
the transceiver transmitter until the host pulls the input
low. TX_DISABLE can also be asserted via the two-wire
interface (address A2h, byte 110, bit 6) and monitored
(address A2h, byte 110, bit 7).
The contents of A2h, byte 110, bit 6 are logic OR’d with
hardware TX_DISABLE (contact 3) to control transmitter
operation.
3
Receiver Section
Caution
The receiver section includes the Receiver Optical SubAssembly (ROSA) and the amplification/quantization circuitry. The ROSA, containing a PIN photodiode and custom transimpedance amplifier, is located at the optical
interface and mates with the LC optical connector. The
ROSA output is fed to a custom IC that provides postamplification and quantization.
The post-amp IC also includes transition detection circuitry which monitors the AC level of incoming optical
signals and provides a LVTTL/CMOS compatible status
signal to the host. A high status signal indicates loss of
modulated signal, indicating link failures such as broken
fiber or failed transmitter. Rx_LOS can also be monitored
via the two-wire serial interface(address A2h, byte 110,
bit 1).
There are no user serviceable parts nor maintenance
requirements for the AFBR-709SMZ. All mechanical adjustments are made at the factory prior to shipment.
Tampering with, modifying, misusing or improperly handling the AFBR-709SMZ will void the product warranty. It
may also result in improper operation and possibly overstress the laser source. Performance degradation or device failure may result. Connection of the AFBR-709SMZ
to a light source not compliant with IEEE Std. 802.3ae
Clause 52 and SFF-8341 specifications, operating above
maximum operating conditions or in a manner inconsistent with it’s design and function may result in exposure
to hazardous light radiation and may constitute an act
of modifying or manufacturing a laser product. Persons
performing such an act are required by law to recertify
and re-identify the laser product under the provisions of
U.S. 21 CFR (Subchapter J) and TUV.
Functional Data I/O
Customer Manufacturing Processes
The AFBR-709SMZ interfaces with the host circuit board
through the twenty contact SFP+ electrical connector.
See Table 2 for contact descriptions. The module edge
connector is shown in Figure 4. The host board layout for
this interface is depicted in Figure 8.
This module is pluggable and is not designed for aqueous wash, IR reflow, or wave soldering processes.
Receiver Loss of Signal (Rx_LOS)
The AFBR-709SMZ high speed transmit and receive in
terfaces require SFF-8431 compliant signal lines on the
host board. To simplify board requirements, biasing resistors and AC coupling capacitors are incorporated into
the SFP+ transceiver module (per SFF-8431) and hence
are not required on the host board. The TX_DISABLE, TX_
FAULT and RX_LOS signals require LVTTL signals on the
host board (per SFF-8431) if used. If an application does
not take advantage of these functions, care must be taken to ground TX_DISABLE to enable normal operation.
Figure 2 depicts the recommended interface circuit to
link the AFBR-709SMZ to supporting physical layer ICs.
Timing for the dedicated SFP+ control signals implemented in the transceiver are listed in Figure 6.
Application Support
An Evaluation Kit and Reference Designs are available to
assist in evaluation of the AFBR-709SMZ. Please contact
your local Field Sales representative for availability and
ordering details.
4
Ordering Information
Please contact your local field sales engineer or one of
Avago Technologies franchised distributors for ordering
information. For technical information, please visit Avago Technologies’ WEB page at www.avagotech.com For
information related to SFF Committee documentation
visit www.sffcommittee.org.
Regulatory Compliance
Electromagnetic Interference (EMI)
The AFBR-709SMZ complies with all applicable laws
and regulations as detailed in Table 1. Certification level
is dependent on the overall configuration of the host
equipment. The transceiver performance is offered as a
figure of merit to assist the designer.
Equipment incorporating 10 gigabit transceivers is
typically subject to regulation by the FCC in the United
States, CENELEC EN55022 (CISPR 22) in Europe and VCCI
in Japan. The AFBR-709SMZ enables equipment compliance to these standards detailed in Table 1. The metal
housing and shielded design of the AFBR-709SMZ minimizes the EMI challenge facing the equipment designer.
For superior EMI performance it is recommended that
equipment designs utilize SFP+ cages per SFF 8432.
Electrostatic Discharge (ESD)
The AFBR-709SMZ is compatible with ESD levels found
in typical manufacturing and operating environments
as described in Table 1. In the normal handling and operation of optical transceivers, ESD is of concern in two
circumstances.
The first case is during handling of the transceiver prior
to insertion into an SFP compliant cage. To protect the
device, it’s important to use normal ESD handling precautions. These include use of grounded wrist straps,
work-benches and floor wherever a transceiver is handled.
The second case to consider is static discharges to the
exterior of the host equipment chassis after installation.
If the optical interface is exposed to the exterior of host
equipment cabinet, the transceiver may be subject to
system level ESD requirements.
RF Immunity (Susceptibility)
Due to its shielded design, the EMI immunity of the AFBR-709SMZ exceeds typical industry standards.
Eye Safety
The AFBR-709SMZ provides Class 1 (single fault tolerant)
eye safety by design and has been tested for compliance
with the requirements listed in Table 1. The eye safety
circuit continuously monitors the optical output power
level and will disable the transmitter upon detecting a
condition beyond the scope of Class 1 certification Such
conditions can be due to inputs from the host board
(Vcc fluctuation, unbalanced code) or a fault within the
transceiver. US CDRH and EU TUV certificates are listed
in table 1.
Flammability
The AFBR-709SMZ optical transceiver is made of metal
and high strength, heat resistant, chemical resistant and
UL 94V-0 flame retardant plastic.
5
Table 1. Regulatory Compliance
Feature
Test Method
Performance
Electrostatic Discharge (ESD)
to the Electrical Pins
MIL-STD-883C
Method 3015.4
Class 1 (> 2000 Volts)
Electrostatic Discharge (ESD)
to the Duplex LC Receptacle
IEC 61000-4-2
Typically, no damage occurs with 25 kV when
the duplex LC connector receptacle is contacted by a Human Body Model probe.
IEC 61000-4-2
10 contacts of 8 kV on the electrical faceplate
with device inserted into a panel.
Electrostatic Discharge (ESD)
to the Optical Connector
IEC 61000-4-2
Air discharge of 15 kV (min.)
contact to connector without damage.
Electromagnetic Interference
(EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class A
System margins are dependent on customer
board and chassis design.
Immunity
IEC 61000-4-3
Typically shows no measurable effect from a
10 V/m field swept from 10 MHz to 1 GHz.
Laser Eye Safety and
Equipment Type Testing
US FDA CDRH AEL Class 1
US21 CFR, Subchapter J per
Paragraphs 1002.10
and 1002.12
CDRH Certification No.: 9720151-128
TUV file: R 72121699
BAUART
¬
GEPRUFT
¬
TUV
Rheinland
Product Safety
TYPE
APPROVED
(IEC) EN 60825-1: 2007
(IEC) EN 60825-2: 2004+A1
(IEC) EN 60950-1: 2006+A11
Component Recognition
Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment including Electrical Business
Equipment
UL file: E173874, Vol. 1
RoHS Compliance
RoHS Directive 2002/95/EC and
it’s amendment directives 6/6
SGS Test Report No. LPC/13392 (AD-1)/07
CTS Ref. CTS/07/3283/Avago
6
V CC ,T
GND,T
10 kΩ
Tx DIS
Tx_DISABLE
Tx FAULT
Tx_FAULT
TD+
0.1 µF
100 Ω
TD0.1 µF
4.7 k to 10 kΩ
4.7 µH
0.1 µF
LASER DRIVER
V CC ,T
22 µF
0.1 µF
3.3 V
SERDES IC
PROTOCOL IC
4.7 µH
0.1 µF
22 µF
0.1 µF
µF
50 Ω
4.7 k to
10 kΩ
RD+
100 Ω
Rx LOS
3.3 V
4.7 µH
V CC T
0.1 µF
22 µF
3.3 V
4.7 µH
SFP MODULE
22 µF
0.1 µF
HOST BOARD
NOTE: INDUCTORS MUST HAVE LESS THAN 1Ω SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFP MODULE.
Figure 3. Recommended power supply filter.
7
POST AMPLIFIER
MOD_DEF0
Figure 2. Typical application configuration.
0.1 µF
0.1 µF
GND,R
4.7 k to 10 kΩ
V CC R
50 Ω
0.1 µF
4.7 k to 10 kΩ
MODULE DETECT
SCL
SDA
0.1 µF
V CC ,R
RD-
LOSS OF SIGNAL
4.7 k to 10 kΩ
V CC ,R
V CC ,R
MOD_DEF1
MOD_DEF2
Table 2. Contact Description
Contact Symbol
Function/Description
Notes
1
VeeT
Transmitter Signal Ground
Note 1
2
TX_FAULT
Transmitter Fault (LVTTL-O) – High indicates a fault condition
Note 2
3
TX_DISABLE
Transmitter Disable (LVTTL-I) – High or open disables the transmitter
Note 3
4
SDA
Two Wire Serial Interface Data Line (LVCMOS – I/O)
(same as MOD-DEF2 in INF-8074)
Note 4
5
SCL
Two Wire Serial Interface Clock Line (LVCMOS – I/O)
(same as MOD-DEF1 in INF-8074)
Note 4
6
MOD_ABS
Module Absent (Output), connected to VeeT or VeeR in the module
Note 5
7
RS0
Rate Select 0 - Not used, Presents high input impedance.
8
RX_LOS
Receiver Loss of Signal (LVTTL-O)
9
RS1
Rate Select 1 - Not used, Presents high input impedance.
10
VeeR
Receiver Signal Ground
Note 1
11
VeeR
Receiver Signal Ground
Note 1
12
RD-
Receiver Data Out Inverted (CML-O)
13
RD+
Receiver Data Out (CML-O)
14
VeeR
Receiver Signal Ground
15
VccR
Receiver Power + 3.3 V
16
VccT
Transmitter Power + 3.3 V
17
VeeT
Transmitter Signal Ground
18
TD+
Transmitter Data In (CML-I)
19
TD-
Transmitter Data In Inverted (CML-I)
20
VeeT
Transmitter Signal Ground
Notes:
1. The module signal grounds are isolated from the module case.
2. This is an open collector/drain output that on the host board requires a 4.7 kΩ to 10 kΩ pullup resistor to VccHost. See Figure 2.
3. This input is internally biased high with a 4.7 kΩ to 10 kΩ pullup resistor to VccT.
4. Two-Wire Serial interface clock and data lines require an external pullup resistor dependent on the capacitance load.
5. This is a ground return that on the host board requires a 4.7 kΩ to 10 kΩ pullup resistor to VccHost.
10
11
BOTTOM OF
BOARD AS
VIEWED FROM
TOP THROUGH
BOARD
TOWARD
HOST
1
Figure 4. Module edge connector contacts
8
TOP VIEW
OF BOARD
20
Note 2
Note 1
Note 1
Table 3. Absolute Maximum Ratings
Stress in excess of any of the individual Absolute Maximum Ratings can cause immediate catastrophic damage to
the module even if all other parameters are within Recommended Operating Conditions. It should not be assumed
that limiting values of more than one parameter can be applied concurrently. Exposure to any of the Absolute Maximum Ratings for extended periods can adversely affect reliability.
Parameter
Symbol
Minimum
Storage Temperature
TS
-40 85 C
Case Operating Temperature
TC
-40 85 C
Relative Humidity (Non condensing)
RH
5
95
%
Supply Voltage
VccT, VccR
-0.3
3.8
V
Low Speed Input Voltage
-0.5
Vcc+0.5
V
Two-Wire Interface Input Voltage
-0.5
Vcc+0.5
V
High Speed Input Voltage, Single Ended
-0.3
Vcc+0.5
V
High Speed Input Voltage, Differential
2.5
V
Low Speed Output Current
20
mA
0
dBm
-20
Optical Receiver Input Average Power
Maximum
Unit Notes
Note 1
Note;
1. The module supply voltages, VccT and VccR must not differ by more than 0.5 V or damage to the device may occur.
Table 4. Recommended Operating Conditions
Recommended Operating Conditions specify parameters for which the electrical and optical characteristics hold
unless otherwise noted. Optical and electrical charactristics are not defined for operation outside the Recommended Operating Conditions, reliability is not implied and damage to the module may occur for such operation over an
extended period of time.
Parameter
Symbol
Minimum Maximum Unit Notes
Case Operating Temperature
TC
0
70
°C
Note 1
Module Supply Voltage
VccT, VccR
3.135
3.465
V
Fig. 3
Host Supply Voltage
VccHost
3.14
3.46
V
9.8
Signal Rate
10.313
GBd
Power Supply Noise Tolerance
66
10Hz to 10MHz
mVp-p
Tx Input Single Ended DC
Voltage Tolerance (Ref VeeT)
V
-0.3
4.0
V
Rx Output Single Ended Voltage Tolerance
V
-0.3
4.0
V
Fig. 3
Notes:
1. Ambient operating temperature limits are based on the Case Operating Temperature limits and are subject to the host system thermal design.
See Figure 7 for the module Tc reference point.
9
Table 5. Low Speed Signal Electrical Characteristics
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted.
Typical values are for Tc = 40°C. VccT and VccR = 3.3 V.
Parameter
Symbol
Minimum
Module Supply Current
ICC
Typical
Maximum
Unit
180
289
mA
Power Dissipation
PDISS
TX_FAULT, RX_LOS
IOH
VOL - 0.3 0.4
mA
+ 37.5
2.0
VccT + 0.3
V
-0.3
0.8
V
Note 2
V
TX_DISABLE VIH
VIL
Note 1
mW
600 1000
- 50
Notes
Note 3
Notes:
1. Supply current includes both VccT and VccR connections.
2. Measured with a 4.7 k Ω load to VccHost.
3. TX_DISABLE has an internal 4.7 kΩ to 10 kΩ pull-up to VccT
Table 6. High Speed Signal Electrical Characteristics
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted.
Typical values are for Tc = 40°C. VccT and VccR = 3.3 V.
Parameter
Symbol Minimum Typical Maximum Unit
Notes
Tx Input Differential Voltage (TD +/-)
VI
Note 1
180
700
mV
Tx Input AC Common Mode Voltage Tolerance
15
mV(RMS)
Tx Input Differential S-parameter (100 Ω Ref.)
SDD11
-10
Note 3
dB
dB
0.01-1.0 GHz
1.0-11.1 GHz
Tx Input Differential to Common
Mode Conversion (25 Ω Ref.)
SCD11
-10
dB
0.01-11.1 GHz
Rx Output Differential Voltage (RD +/-)
Vo
850
mV
Note 2
Rx Output Termination Mismatch @ 1MHz
DZm
5
%
7.5
mV(RMS)
300
Rx Output AC Common Mode Voltage
28
Note 5
Rx Output Output Rise and Fall Time
(20% to 80%)
tr, tf
ps
Rx Output Total Jitter
TJ
0.70
Ulp-p
Rx Output 99% Jitter
J2
0.42
Ulp-p
Rx Output Differential S-parameter
SDD22
(100 Ω Ref.)
-12
Note 4
dB
dB
0.01-1.0 GHz
1.0-11.1 GHz
Rx Output Common Mode Reflection
SCC22
Coefficient (25 Ω Ref.)
-6
-3
dB
dB
0.01-2.5 GHz
2.5-11.1 GHz
Receiver Output Eye Mask
Notes:
See Figure 5a
1. Internally AC coupled and terminated (100 Ohm differential).
2. Internally AC coupled but requires an external load termination (100 Ohm differential).
3. Maximum reflection coefficient is expressed as SDD11=Max(-12+2*sqrt(f ) , -6.3+13*log10(f/5.5)), for f in GHz.
4. Maximum reflection coefficient is expressed as SDD22=Max(-12+2*sqrt(f ) , -6.3+13*log10(f/5.5)), for f in GHz.
5. The RMS value is measured by calculating the standard deviation of the histogram for one UI of the common mode signal.
10
1.40
1.0
NORMALIZED AMPLITUDE
ABSOLUTE AMPLITUDE - mV
425
150
0
-150
0.75
0.73
0.5
0.28
0.25
0
-425
-0.40
0.35
0
0.65
0
1.0
NORMALIZED TIME (UNIT INTERVAL)
Figure 5a. Receiver Electrical Optical Eye Mask Definition
0.25 0.40 0.45 0.55 0.60 0.75
1
NORMALIZED TIME (UNIT INTERVAL)
Figure 5b. Transmitter Optical Eye Mask Definition
Table 7. Two-Wire Interface Electrical Characteristics
Parameter
Symbol
Min.
Max.
Unit Conditions
Host Vcc Range
VccHTWI
3.135 3.465 V
V Rp[1] pulled to VccHTWI,
measured at host side of
VOH
VccHTWI - 0.5
VccHTWI + 0.3
V
connector
SCL and SDA
VOL
SCL and SDA
VIL -0.3
VIH
0.0
VccT*0.7
0.40
VccT*0.3 V
VccT + 0.5
V
Input Current on the
SCL and SDA Contacts
Il -10 10
µA
Capacitance on SCL
and SDA Contacts
Ci[2]
pF
14
Total bus capacitance
Cb[3]
100
pF
for SCL and for SDA
At 400 kHz, 3.0 kΩ Rp, max
At 100 kHz, 8.0 kΩ Rp, max
290
pF
At 400 kHz, 1.1 kΩRp, max
At 100 kHz, 2.75 kΩ Rp, max
Notes:
1. Rp is the pull up resistor. Active bus termination may be used by the host in place of a pullup resistor. Pull ups can be connected to various
power supplies, however the host board design shall ensure that no module contact has voltage exceeding VccT or VccR by 0.5 V nor requires
the module to sink more than 3.0 mA current.
2. Ci is the capacitance looking into the module SCL and SDA contacts
3. Cb is the total bus capacitance on the SCL or SDA bus.
11
Table 8. Optical Specifications
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted.
Typical values are for Tc = 40°C. VccT and VccR = 3.3 V.
Parameter
Minimum
Typical
Maximum
Units
Notes
Transmitter
Laser OMA output power
-4.3
dBm
1, 2, 3, Table 9
Laser mean output power
-1.0
dBm
1, 2, 4
Laser off power
-30
dBm
1
dB
1, 2
Extinction ratio
3.0
Transmitter and dispersion penalty (TDP)
3.9
dB
1
Center Wavelength
860
nm
1,3, Table 9
840
RMS spectral width, standard deviation
1,3, Table 9
RIN12OMA
-128
dB/Hz
1
Optical Return Loss Tolerance
12
dB
1
Encircled Flux
5
Transmitter Output Eye Mask
1, See Figure 5b
Receiver
Stressed sensitivity (OMA)
–
Receive sensitivity (OMA)
Receive Power (Pave) Overload
-7.5
dBm
-11.1
dBm
-1.0
1
dBm
1
Reflectance
-12
dB
1
Center Wavelength
840
860
nm
1
RX_LOS (OMA) Off
-12
dBm
RX_LOS (OMA) On
-30
dBm
RX_LOS (OMA) Hysteresis
0.5
dB
Vertical eye closure penalty
3.5
dB
6
Stressed eye jitter
0.3
UI p-p
6
General Specification Considerations (Notes):
1. IEEE 802.3ae Clause 52 compliant.
2. These parameters are interrelated: see IEEE 802.3ae, Clause 52.
3. See Table 9. Trade-offs are available among spectral width, center wavelength, and minimum optical modulation amplitude.
4. The 10GBASE-SR/SW launch power shall be the lesser of the Class 1 safety limit as defined in IEEE 802.3ae 52.10.2 or the average receive
power maximum defined by IEEE 802.3ae -2002 Table 52-9.
5. The transceiver’s launch condition meets the requirement of 10 Gigabit Ethernet multimode fiber as detailed in TIA 492AAAC.
6. Vertical eye closure penalty and Stressed eye jitter are test conditions for Stressed sensitivity (OMA) measurements.
12
Table 9. Minimum Optical Modulation Amplitude
Center
Wavelength
Up to
(nm)
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45
840 to 842
-4.2
-4.2
-4.1
-4.1
-3.9
-3.8
-3.5
-3.2
-2.8
842 to 844
-4.2
-4.2
-4.2
-4.1
-3.9
-3.8
-3.6
-3.3
-2.9
844 to 846
-4.2
-4.2
-4.2
-4.1
-4.0
-3.8
-3.6
-3.3
-2.9
846 to 848
-4.3
-4.2
-4.2
-4.1
-4.0
-3.8
-3.6
-3.3
-2.9
848 to 850
-4.3
-4.2
-4.2
-4.1
-4.0
-3.8
-3.6
-3.3
-3.0
850 to 852
-4.3
-4.2
-4.2
-4.1
-4.0
-3.8
-3.6
-3.4
-3.0
852 to 854
-4.3
-4.2
-4.2
-4.1
-4.0
-3.9
-3.7
-3.4
-3.1
854 to 856
-4.3
-4.3
-4.2
-4.1
-4.0
-3.9
-3.7
-3.4
-3.1
856 to 858
-4.3
-4.3
-4.2
-4.1
-4.0
-3.9
-3.7
-3.5
-3.1
858 to 860
-4.3
-4.3
-4.2
-4.2
-4.1
-3.9
-3.7
-3.5
-3.2
13
RMS Spectral Width (nm)
0.05 to
0.1 to
0.15 to
0.2 to
0.25 to
0.3 to
0.35 to
0.4 to
Table 10. Control Functions: Low Speed Signals Timing Characteristics
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted.
Parameter
Symbol
Minimum Maximum Unit Notes
TX_DISABLE Assert Time
t_off
10
µs
Note 1 , Fig. 6
TX_DISABLE Negate Time
t_on
2
ms
Note 2 , Fig. 6
Time to initialize, including reset of TX_FAULT
t_init
300
ms
Note 3 , Fig. 6
TX_FAULT Assert Time
t_fault
1
TX_DISABLE to Reset
t_reset
RX_LOS Assert Time
t_los_on
RX_LOS Deassert Time
t_los_off
ms
Note 4 , Fig. 6
µs
Note 5 , Fig. 6
100
µs
Note 6 , Fig. 6
100
µs
Note 7 , Fig. 6
10
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal. A 10 ms interval between assertions of TX_
DISABLE is required.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal and the Two-Wire
interface is available.
4. From power on or negation of TX_FAULT using TX_DISABLE.
5. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
6. Time from loss of optical signal to Rx_LOS Assertion.
7. Time from valid optical signal to Rx_LOS De-Assertion.
Table 11. Control Functions: Two-Wire Interface Timing Characteristics
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted.
Parameter
Symbol
Minimum Maximum Unit Notes
TX_DISABLE Assert Time
t_off_twi
100
ms
Note 1
TX_DISABLE Negate Time
t_on_twi
100
ms
Note 2
TX_FAULT Assert Time
t_fault_twi
100
ms
Note 3
Rx_LOS Assert Time
t_loss_on_twi
100
ms
Note 4
Rx_LOS Deassert Time
t_loss_off_twi
100
ms
Note 5
Analog parameter data ready
t_data
1000
ms
Note 6
Two-Wire Interface Ready
t_serial
300
ms
Note 7
Write Cycle Time Parameter
t_write
80
ms
Note 8
Two-Wire Interface Clock Rate
f_serial_clock
400
kHz
Note 9
Time bus free before new
transmission can start
Notes:
t_BUF
ms
Note 10
20
1. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured
from falling clock edge after stop bit of write transaction.
2. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of
nominal.
3. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
4. Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal.
5. Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal.
6. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
7. Time from power on until module is ready for data transmission over the two-wire interface (reads or writes over A0h and A2h).
8. Time from stop bit to completion of a 1-8 byte write command. For a one to four byte write the maximum cycle time is 40ms and for a five to
eight byte write the maximum cycle time is 80ms.
9. Module may clock stretch for f_serial_clock greater than 100 kHz.
10. Between STOP and START. See SFF 8431 Section 4.3
14
Table 12. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
The following characteristics are defined over the Recommended Operating Conditions unless otherwise noted.
Typical values are for Tc = 40°C. VccT and VccR = 3.3 V.
Parameter
Symbol Min. Units Notes
Transceiver Internal Temperature
TINT
±3.0
°C
Accuracy
Temperature is measured internal to the transceiver.
Valid from = -10°C to 85°C case temperature.
Transceiver Internal Supply
VINT
±0.1
V
Voltage Accuracy
Supply voltage is measured internal to the transceiver
and can, with less accuracy, be correlated to
voltage at the VccT contact. Valid over 3.3 V ± 10%.
Transmitter Laser DC Bias Current
Accuracy
IINT
±10 % IINT accuracy is better than ±10% of the nominal value.
Transmitted Average Optical
PT
±3.0
dB
Output Power Accuracy
Average Power coupled into 50/125 µm multi-mode
fiber. Valid from100 µW to 500 µW.
Received Average Optical Input
PR
±3.0
dB
Power Accuracy
Average Power coupled from 50/125 µm multi-mode
fiber. Valid from 77 µW to 500 µW.
VCCT, VCCR > 2.97 V
VCCT, VCCR > 2.97 V
TX_FAULT
TX_FAULT
TX_DISABLE
TX_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_init
t_init
t-init: TX DISABLE NEGATED
t-init: TX DISABLE ASSERTED
VCCT, VCCR > 2.97 V
TX_FAULT
TX_FAULT
TX_DISABLE
TX_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_off
t_init
t_on
INSERTION
t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED
t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
OCCURANCE OF FAULT
OCCURANCE OF FAULT
TX_FAULT
TX_FAULT
TX_DISABLE
TX_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_fault
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED
t_reset
t_init*
t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
OCCURANCE OF FAULT
TX_FAULT
LOS
TRANSMITTED SIGNAL
t_fault
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
t_loss_on
t_reset
t_init*
t-fault: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL NOT RECOVERED
t-los-on & t-los-off
Figure 6. Transceiver timing diagrams (module installed and power applied except where noted)
15
OCCURANCE
OF LOSS
OPTICAL SIGNAL
TX_DISABLE
t_loss_off
Table 13. EEPROM Serial ID Memory Contents – Conventional SFP Memory (Address A0h)
Byte #
Decimal
Data
Hex
Notes
Byte #
Decimal
Data
Hex
Notes
0
03
SFP physical device
37
00
Hex Byte of Vendor OUI[1]
1
04
SFP function defined by serial ID only
38
17
Hex Byte of Vendor OUI[1]
2
07
LC optical connector
39
6A
Hex Byte of Vendor OUI[1]
3
10
10G Base-SR
40
41
“A” - Vendor Part Number ASCII character
4
00
41
46
“F” - Vendor Part Number ASCII character
5
00
42
42
“B” - Vendor Part Number ASCII character
6
00
43
52
“R” - Vendor Part Number ASCII character
7
00
44
2D
“-” - Vendor Part Number ASCII character
8
00
45
37
“7” - Vendor Part Number ASCII character
9
00
46
30
“0” - Vendor Part Number ASCII character
10
00
47
39
“9” - Vendor Part Number ASCII character
11
06
64B/66B
48
53
“S” - Vendor Part Number ASCII character
12
67
10312.5 Mbit/sec nominal bit rate
(10.3125 Gbit/s)
49
4D
“M” - Vendor Part Number ASCII character
13
00
Unspecified
50
5A
“Z” - Vendor Part Number ASCII character
14
00
51
20
“ ” - Vendor Part Number ASCII character
15
00
52
20
“ ” - Vendor Part Number ASCII character
16
08
82 m of OM2 50/125 µm fiber
53
20
“ ” - Vendor Part Number ASCII character
17
03
33 m of OM1 62.5/125 µm fiber
54
20
“ ” - Vendor Part Number ASCII character
18
00
55
20
“ ” - Vendor Part Number ASCII character
19
1E
300 m of OM3 50/125 µm fiber
56
20
“ ” - Vendor Revision Number ASCII character
20
41
“A” - Vendor Name ASCII character
57
20
“ ” - Vendor Revision Number ASCII character
21
56
“V” - Vendor Name ASCII character
58
20
“ ” - Vendor Revision Number ASCII character
22
41
“A” - Vendor Name ASCII character
59
20
“ ” - Vendor Revision Number ASCII character
23
47
“G” - Vendor Name ASCII character
60
03
Hex Byte of Laser Wavelength[2]
24
4F
“O” - Vendor Name ASCII character
61
52
Hex Byte of Laser Wavelength[2]
25
20
“ ” - Vendor Name ASCII character
62
00
26
20
“ ” - Vendor Name ASCII character
63
27
20
“ ” - Vendor Name ASCII character
64
00
Receiver limiting output. 1 Watt power class.
28
20
“ ” - Vendor Name ASCII character
65
1A
Hardware SFP TX_DISABLE, TX_FAULT,
& RX_LOS
29
20
“ ” - Vendor Name ASCII character
66
00
30
20
“ ” - Vendor Name ASCII character
67
00
31
20
“ ” - Vendor Name ASCII character
68-83
Vendor Serial Number ASCII characters[4]
32
20
“ ” - Vendor Name ASCII character
84-91
Vendor Date Code ASCII characters[5]
33
20
“ ” - Vendor Name ASCII character
92
68
Digital Diagnostics, Internal Cal, Rx Pwr Avg
34
20
“ ” - Vendor Name ASCII character
93
F0
A/W, Soft SFP TX_DISABLE, TX_FAULT,
& RX_LOS, RATE_SELECT
35
20
“ ” - Vendor Name ASCII character
94
03
SFF-8472 Compliance to revision 10.0
36
00
Checksum for Bytes 0-62[3]
Checksum for Bytes 64-94[3]
95
96 - 255
00
Notes:
1. The IEEE Organizationally Unique Identifier (OUI) assigned to Avago Technologies is 00-17-6A (3 bytes of hex).
2. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.
3. Addresses 63 and 95 are checksums calculated (per SFF-8472) and stored prior to product shipment.
4. Addresses 68-83 specify the AFBR-709SMZ ASCII serial number and will vary on a per unit basis.
5. Addresses 84-91 specify the AFBR-709SMZ ASCII date code and will vary on a per date code basis.
16
Table 14. EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h)
Byte #
Decimal Notes
Byte #
Decimal Notes
Byte #
Decimal Notes
0
Temp H Alarm MSB[1]
26
Tx Pwr L Alarm MSB[4]
104
Real Time Rx Pwr MSB[5]
1
Temp H Alarm LSB[1]
27
Tx Pwr L Alarm LSB[4]
105
Real Time Rx Pwr LSB[5]
2
Temp L Alarm MSB[1]
28
Tx Pwr H Warning MSB[4]
106 Reserved
3
Temp L Alarm LSB[1]
29
Tx Pwr H Warning LSB[4]
107 Reserved
4
Temp H Warning MSB[1]
30
Tx Pwr L Warning MSB[4]
108 Reserved
5
Temp H Warning LSB[1]
31
Tx Pwr L Warning LSB[4]
109 Reserved
6
Temp L Warning MSB[1]
32
Rx Pwr H Alarm MSB[5]
110 Status/Control
- See Table 15
7
Temp L Warning LSB[1]
33
Rx Pwr H Alarm LSB[5]
111 Reserved
8
Vcc H Alarm MSB[2]
34
Rx Pwr L Alarm MSB[5]
112
Flag Bits - See Table 16
9
Vcc H Alarm LSB[2]
35
Rx Pwr L Alarm LSB[5]
113
Flag Bits - See Table 16
10
Vcc L Alarm MSB[2]
36
Rx Pwr H Warning MSB[5]
114 Reserved
11
Vcc L Alarm LSB[2]
37
Rx Pwr H Warning LSB[5]
115 Reserved
12
Vcc H Warning MSB[2]
38
Rx Pwr L Warning MSB[5]
116
Flag Bits - See Table 16
13
Vcc H Warning LSB[2]
39
Rx Pwr L Warning LSB[5]
117
Flag Bits - See Table 16
14
Vcc L Warning MSB[2]
40-55
Reserved
118-127 Reserved
15
Vcc L Warning LSB[2]
56-94
External Calibration Constants[6]
128-247
Customer Writeable
16
Tx Bias H Alarm MSB[3]
95
Checksum for Bytes 0-94[7]
248-255
Vendor Specific
17
Tx Bias H Alarm LSB[3]
96
Real Time Temperature MSB[1]
18
Tx Bias L Alarm MSB[3]
97
Real Time Temperature LSB[1]
19
Tx Bias L Alarm LSB[3]
98
Real Time Vcc MSB[2]
20
Tx Bias H Warning MSB[3]
99
Real Time Vcc LS[2]
21
Tx Bias H Warning LSB[3]
100
Real Time Tx Bias MSB[3]
22
Tx Bias L Warning MSB[3]
101
Real Time Tx Bias LSB[3]
23
Tx Bias L Warning LSB[3]
102
Real Time Tx Power MSB[4]
24
Tx Pwr H Alarm MSB[4]
103
Real Time Tx Power LSB[4]
25
Tx Pwr H Alarm LSB[4]
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256°C.
2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 µV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 µA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
5. Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
6. Bytes 56-94 are not intended for use with AFBR-709SMZ, but have been set to default values per SFF-8472.
7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
17
Table 15. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110)
Status/
Bit #
Control Name
Description
Notes
7
TX_ DISABLE State
Digital state of SFP TX_ DISABLE Input (1 = TX_DISABLE asserted)
Note 1
6
Soft TX_ DISABLE
Read/write bit for changing digital state of TX_DISABLE function
Note 1, 2
5 Reserved
4 Reserved
3 Reserved
2
TX_FAULT State
Digital state of the SFP TX_FAULT Output (1 = TX_FAULT asserted)
Note 1
1
RX_LOS State
Digital state of the SFP RX_LOS Output (1 = RX_LOS asserted)
Note 1
0
Notes:
Data Ready (Bar)
Indicates transceiver is powered and real time sense data is ready. (0 = Ready)
1. The response time for soft commands of the AFBR-709SMZ is 100 msec as specified by SFF-8472.
2. Bit 6 is logic OR’d with the SFP TX_DISABLE input on contact 3; either asserted will disable the SFP+ transmitter.
Table 16. EEPROM Serial ID Memory Contents – Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117)
Byte
Bit
Flag Bit Name Description
112
7
Temp High Alarm
Set when transceiver internal temperature exceeds high alarm threshold
6
Temp Low Alarm
Set when transceiver internal temperature exceeds low alarm threshold
5
Vcc High Alarm
Set when transceiver internal supply voltage exceeds high alarm threshold
4
Vcc Low Alarm
Set when transceiver internal supply voltage exceeds low alarm threshold
3
Tx Bias High Alarm
Set when transceiver laser bias current exceeds high alarm threshold
2
Tx Bias Low Alarm
Set when transceiver laser bias current exceeds low alarm threshold
1
Tx Power High Alarm
Set when transmitted average optical power exceeds high alarm threshold
0
Tx Power Low Alarm
Set when transmitted average optical power exceeds low alarm threshold
113
7
Rx Power High Alarm
Set when received average optical power exceeds high alarm threshold
6
Rx Power Low Alarm
Set when received average optical power exceeds low alarm threshold
0-5 Reserved
116
7
Temp High Warning
Set when transceiver internal temperature exceeds high warning threshold
6
Temp Low Warning
Set when transceiver internal temperature exceeds low warning threshold
5
Vcc High Warning
Set when transceiver internal supply voltage exceeds high warning threshold
4
Vcc Low Warning
Set when transceiver internal supply voltage exceeds low warning threshold
3
Tx Bias High Warning
Set when transceiver laser bias current exceeds high warning threshold
2
Tx Bias Low Warning
Set when transceiver laser bias current exceeds low warning threshold
1
Tx Power High Warning
Set when transmitted average optical power exceeds high warning threshold
0
Tx Power Low Warning
Set when transmitted average optical power exceeds low warning threshold
117
7
Rx Power High Warning
Set when received average optical power exceeds high warning threshold
6
Rx Power Low Warning
Set when received average optical power exceeds low warning threshold
0-5 Reserved
18
TOP LABEL RECESS
47.5
8.9
TCASE REFERENCE POINT
12.2
13.9
30.8
13.4±0.1
13.6
0.64 UNCOMPRESSED
13
8.55±0.1
6.25
0.69 UNCOMPRESSED
BOTTOM LABEL RECESS
25.2
12
TX
RX
15.14 UNCOMPRESSED
Figure 7. Module drawing
Figure 8. Module label
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-3399EN - January 25, 2013
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