AS0A826-H2SB-7H

1 2 3 4 5 6 7 8 REV. SOLIDWORKS GENERATED DRAWING, DO NOT CHANGE BY HAND 1.00 ±0.05 3.62 4.77 CL OF CONNECTOR 0.15 ±0.02 TYP. 3.0(2X) 90 5 .0 ±0 0.50 TYP. 1 0. 1.45 ±0.05 A 2 APPD. NOTES: A BC-13-0069767 1. ELECTRICAL CHARACTERISTICS: 1.1. CONTACT CURRENT RATING: 0.5 AMPERE MAX. PER PIN. 1.2. VOLTAGE RATING: 25V AC. 1.3. INSULATION RESISTANCE: 100 MEGAOHMS MIN. AT 500V DC. 1.4. DIELECTRIC WITHSTANDING VOLTAGE: 250V AC RMS AT 60Hz,FOR 1 MINUTE. 1.5. CONTACT RESISTANCE: 60 MILLIOHMS MAX. PER PIN INITIAL 10 MILLIOHMS PER PIN AFTER FULL ENVIRONMENTAL TESTING. 2. MECHANICAL CHARACTERISTICS:DURABILITY: 60 MATING CYCLES. 3. OPERATION TEMPERATURE: -55 C TO +85 C. 4. RECOMMENDED PROCESS CONDITION:SMT,PEAK TEMPERATURE:260 C 10~20S. 5. PLEASE CONTACT FOXCONN SALES REPRESENTATIVE TO VERIFY PRODUCT DETAILS & AVAILABILITY. 1.9(2X) 3 ECN. NO. A S 0 A8 2 * - H 2 S B - 7 C.S Li A H H=HALOGEN/LEAD FREE 4 MEMORY MODULE SOCKET HORIZONTAL TYPE B 7=TAPE REEL B SINGLE ROW 68.80 ±0.05 B=NORMAL TYPE,BLACK COLOR NO. OF POS. A8 = 260 POS. 3.50 S=STANDARD SMT 2=5.2mm HEIGHT H=DDR SODIMM CONTACT AREA PLATING 1=GOLD FLASH Y=5u" GOLD PLATING 6=10u" GOLD PLATING 7=15u" GOLD PLATING 3=30u" GOLD PLATING 0.00 0.94 - 0.05 72.1 C 6.0MAX. 65.7 ±0.5 DATE CODE DDR4 STD A PIN#143 PIN#1 35.50 I PIN#259 28.50 0.10 4 METAL SPRING 2 STAINLESS STEEL ULTRASONIC CLEANING 3 METAL PAD 2 STAINLESS STEEL 10u" NICKEL UNDER PLATING 100u" MATTE TIN PLATING OVER SOLDER PAD AREA HOUSING 1 ITEM DESCRIPTION Q'TY 1 UL94V-0, HALOGEN FREE, BLACK COLOR MATERIAL X. ± 0.30 X. ± UNITS mm .X ± 0.25 .X ± MAT'L .XXX ± .XXX ± 3 4 TITLE: CUSTOMER DRAWING 260PIN SODDR4 5.2 STD. AS0A82*-H2SB-7H FINISH APPD: CHKD: DR: 6 DWG NO.: C.S Li 317-0000-2252 Alex Wang Gary Xu E FOXCONN INTERCONNECT TECHNOLOGY LIMITED. PART NO.(INTENDED USE) THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. AND SHALL NOT BE Q'TY REPRODUCED.COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. 5 SECTION A-A DDR4 SO DIMM CONN. TREATMENT 2 0.7 4.2 NAME(INTENDED USE) .XX ± .XX ± 0.15 50u" NICKEL UNDER PLATING GOLD FLASH OR 5u"OR 10u" OR 15u"OR 30u" GOLD PLATING AT CONTACT AREA;GOLD FLASH PLATING AT TAIL THERMOPLASTIC 0.7 4.2 260X CONTACT PLUS 2X SOLDER PADS E 1 D 5.2 73.3 COPPER ALLOY (BETWEEN RAM BOTTOM SURFACE AND SMT SURFACE) 0.35 - 0.10 71.6 260 1.4MIN. 3 0° RAM MODULE 70.00 ±0.15(SLOT WIDTH) CONTACT N HE E AT +0.05 PIN#145 1.125 1.375 2 TT ER NS T RO 0.80 D PIN#260 12.0 PIN#2 PIN#146 25.7 PIN#144 A 28.50 8.4 35.50 1.375 5.4 7.3 1.125 (BETWEEN RAM TOP SURFACE AND SMT SURFACE) 3.3 C REV. A SCALE SHEET N/A 1/5 2013/10/11 7 8 1 2 3 4 5 6 7 8 REV. ECN. NO. APPD. 3.70 MAX. 69.60 ±0.15 4.00 RULL R 0.10 M C B A B 3.00 MIN.(4X) B PIN #143 1.425 PIN #145 3.50 DETAIL A 2.50 35.50 PIN #259 DETAIL B 1.375 0.80 MAX.（2X） 1.20 ±0.10 A DETAIL A C 0.15 M B 1.00 ±0.05 1.675 28.50 0.35 ±0.03 65.60 0.50 0.15 C B A 0.05 C C 28.50 2.55 35.50 2.50 C 0.30 MAX. PIN #1 4.00 ±0.10 C OR R 0.25 MAX 2X OPTIONAL C 0.25X0.05 MAX 2X OPTIONAL 1.80(2X) 4.0 MIN. 4.20 MIN. 4.00 MIN. (2X) COMPONENT AREA FRONT 5.10 MIN. (2X) A 6.00 30.00 ±0.15 A 1.125 1.675 PIN #2 PIN #144 1.425 PIN #146 D R0.65 E DDRIV SO DIMM MODULE BOARD LAYOUT 1.75(2X) X. ± 0.25 X. ± UNITS mm .X ± 0.10 .X ± MAT'L NAME(INTENDED USE) .XXX ± .XXX ± APPD: 2 3 4 5 CUSTOMER DRAWING 260PIN SODDR4 5.2 STD. AS0A82*-H2SB-7H THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT Q'TY TECHNOLOGY LIMITED. AND SHALL NOT BE REPRODUCED.COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. DDRIV SO DIMM MODULE BOARD LAYOUT TITLE: PART NO.(INTENDED USE) FINISH CHKD: DR: 6 DWG NO.: C.S Li 317-0000-2252 Alex Wang Gary Xu E FOXCONN INTERCONNECT TECHNOLOGY LIMITED. DDR4 SO DIMM CONN. .XX ± .XX ± 0.05 2.00 MIN. (4X) 1 D 4.00 ±0.10(2X) 18.00 ±0.10(2X) COMPONENT AREA BACK EDGE OF CONTACT PADS SHALL BE FREE OF BURRS DETAIL B PIN #260 REV. A SCALE SHEET N/A 2/5 2013/10/11 7 8 1 2 3 4 5 6 7 8 REV. ECN. NO. A APPD. A 46.7 AS0A82*-H2SB-7H 12.0 34.7 DDR4 STD B B 3.50 ±0.10(2X) 0.05 U - V CONNECTOR OUTLINE 67.60 35.50 CL OF CONNECTOR PIN# 2 PIN# 1 2.50 28.50 PIN# 144 PIN# 143 PIN# 146 PIN# 145 PIN# 260 PIN# 259 D 1.10 0.05 4.10 12.0 2.0 C 12.00 0.05 U - V 1.75 ±0.03 4.10 C 4.60 ±0.10(2X) 77 MAX. 0.05 U - V DDR4 STD 1.025 1.60 0.05 (HOLE) 0.30 ±0.03(260X) 0.05 U - V 2.50 35.50 0.50 TYP. 0.10 V D U 28.50 V 68.60 P.C.B. LAYOUT(RECOMMEND THICKNESS =1.40MM) X. E P.C.B. LAYOUT(STACKED ORIENTATION) ± 0.25 X. ± .X± 0.15 .X ± .XX ± 0.05 .XX ± .XXX ± .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. AND SHALL NOT BE REPRODUCED.COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. 1 2 3 4 5 UNITS mm NAME(INTENDED USE) DDR4 SODIMM CONN MAT'L PART NO.(INTENDED USE) TITLE: CUSTOMER DRAWING 260PIN SODDR4 5.2 STD. AS0A82*-H2SB-7H FINISH Q'TY APPD: C.S Li CHKD: ZH.Wang DR: 6 E FOXCONN INTERCONNECT TECHNOLOGY LIMITED. DWG NO.: Gary Xu 10/08'13 7 317-0000-2252 SCALE SHEET REV. N/A 3/5 A 8 1 2 3 4 5 6 7 8 REV. ECN. NO. APPD. A A AS0A82*-H2SB-7H AS0A82*-H2SB-7H DDR4 STD DDR4 STD B B DDR4 STD DDR4 STD C C PIN #2 PIN #260 PIN #143 PIN #145 PIN #259 PIN #144 PIN #143 PIN #2 PIN #1 PIN #146 PIN #260 PIN #259 PIN #145 12.0 D PIN #146 12.0 PIN #1 PIN #144 PIN #2 PIN #144 PIN #143 PIN #1 PIN #146 PIN #2 PIN #260 PIN #259 PIN #145 PIN #144 PIN #143 PIN #1 PIN #146 PIN #260 PIN #145 PIN #259 D 3.35 3.35 P.C.B. LAYOUT(DUAL COMPRESSED STACKED ORIENTATION) E X. ± 0.25 X. ± .X ± 0.10 .X ± .XX ± 0.05 .XX ± .XXX ± .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. AND SHALL NOT BE REPRODUCED.COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. 1 2 3 4 5 UNITS mm NAME(INTENDED USE) DDR4 SODIMM CONN MAT'L PART NO.(INTENDED USE) TITLE: CUSTOMER DRAWING 260PIN SODDR4 5.2 STD. AS0A82*-H2SB-7H FINISH Q'TY APPD: C.S Li CHKD: ZH.Wang DR: 6 E FOXCONN INTERCONNECT TECHNOLOGY LIMITED. DWG NO.: Gary Xu 10/08'13 7 317-0000-2252 SCALE SHEET REV. N/A 4/5 A 8 1 2 2.0 ±0.2 4.0 ±0.1 5 ROUND SPROCKET HOLES 6 2 SKEW 0.1 MAX. DDR4 STD DDR4 STD 42.2 ±0.3 1.75 ±0.10 ECN. NO. APPD. CARRIER TAPE .05 +0 .00 0 400mm MIN. A EPE 1 LABEL 5 0.7 R L 0.20 ±0.05 84.4 ±0.1 3 POCKETS MIN. ELONGATED SPROCKET HOLES CONNECTOR LOADED AREA B DETAIL: ELONGATION AND SKEW OF SPROCKET HOLES SHIPPING CARTON 150 ±1.0 5 POCKETS MIN. 8 REV. L FU B 7 COVER TAPE A DDR4 STD 88.0 ±0.3 4 .1 +0 . 0 0 5 5 . 1 32.0 ±0.1 DDR4 STD A 3 FEEDING DIRECTION EPE 2 TRANSPARENT SEAL TAPE C 20.2 MIN. 2.0 ±0.5 3 FOLDER PAPER BOARD 381 ±2.0 1 C WATER PROOF BAG 89.50 ±1.0 105(MAX.) D D LABEL NOTES: 1. 10 POCKETS HOLE PITCH CUMULATIVE TOLERANCE ±0.20mm. 2. COVER TAPE PEELING STRENGTH : 0.01 kgf MIN. 0.15 kgf MAX. AT 300mm/min. 16 5° COVER TAPE ~1 80 E 3 REEL 2 COVER TAPE 1 CARRIER TAPE ITEM DESCRIPTION PEELING DIRECTION CARRIER TAPE X. ± 1.5 X. ± UNITS mm .X ± 1.0 .X ± MAT'L .XXX ± 3 4 5 CUSTOMER DRAWING 260PIN SODDR4 5.2 STD. AS0A82*-H2SB-7H THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT Q'TY TECHNOLOGY LIMITED. AND SHALL NOT BE REPRODUCED.COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. CONNECTOR P/N AS0A82*-H2RB-7H 2 .XXX ± TITLE: PART NO.(INTENDED USE) FINISH CHKD: DR: 6 DWG NO.: C.S Li 317-0000-2252 Alex Wang Gary Xu E FOXCONN INTERCONNECT TECHNOLOGY LIMITED. DDR4 SODIMM CONN. APPD: 3. PACKING CAPACITY :310 PCS/REEL, 3 REELS/BOX, TOTAL 930 PCS/BOX. 1 NAME(INTENDED USE) .XX ± .XX ± 0.2 FEEDING DIRECTION POLYSTYRENE POLYESTER POLYSTYRENE MATERIAL REV. A SCALE SHEET N/A 5/5 2013/10/11 7 8