AS0BC21-S30BM-7H

1 4 3 2 2.50 DIM.C 0.12 ±0.02 TYP. 5 A PIN75 DATA CODE 4 PI-FILM 0.06 THICKNESS 1 PIN 2 0.50 2.50 DIM.D B 0.12 ±0.02 ECN. NO. APPD. BC-12-0064384 Bruce Wu NOTES: B BC-12-0079540 Bruce Wu 1. ELECTRICAL CHARACTERISTICS: C BC-13-0006035 C.S Li 1.1 CONTACT CURRENT RATING: 0.5 AMPERE MAX. PER PIN. D BC-13-0035269 C.S Li 1.2 VOLTAGE RATING: 50V AC. E BC-13-0048480 C.S Li 1.3 INSULATION RESISTANCE :500 MEGAOHMS MIN. AT 500V DC. A 1.4 DIELECTRIC WITHSTANDING VOLTAGE: 300V AC RMS AT 60Hz,FOR 1 MINUTE. F BC-14-0024195 C.S Li 1.5 CONTACTRESISTANCE: 55 MILLIOHMS MAX.PER PIN INITIAL. R=20 MILLIOHMS MAX.PER PIN AFTER FULL ENVIRONMENT TESTING. 2. MECHANICAL CHARACTERISTICS: DURABILITY:60 MATING CYCLES. 3. OPERATION TEMPERATURE:-40 C TO +80 C. 4. PLEASE CONTACT FOXCONN SALES REPRESENTATIVE TO VERIFY PRODUCT DETAIL &AVAILABILITY. 5. KEY LABLE "*" IS A CAPITAL LETTER PER THE PART NO. 6. RECOMMENDED PROCESS CONDITION: SMT,PEAK TEMPERATURE: 260 C, 10~20S. PIN 74 4.00MIN TYP. DIM.E 8 B 20° DIM.F 7 A H DIM.B PIN 1 6 REV. SOLIDWORK GENERATED DRAWING,DON'T CHANGE BY HAND DIM.G 5 21.9 ±0.10 20.15 1.10 ±0.05 A B DIM.A 1.80 20.0 C 2 0.40 1.45 ±0.05 2.17 0.95 ±0.05 1.10 2.00 0.60 5.40 5.70 2.70 D 0.25 ±0.05(2X) 10.35 PART NO. DESCRIPTION: A S 0 BC 2 * - S 30 B * - 7 HORIZONTAL TYPE B=BLACK COLOR SMT CONTACT AREA PLATING 1=GOLD FLASH Y=5u" GOLD PLATING 6=10u" GOLD PLATING 7=15u" GOLD PLATING 3=30u" GOLD PLATING 2 30=3.0mm HEIGHT 2.0 3.0 4.0 5.0 6.0 7.0 9.50 10.50 11.50 12.50 13.50 14.50 14.0 13.0 12.0 11.0 10.0 9.0 6.0 5.0 4.0 3.0 2.0 1.0 1.5 2.5 3.5 4.5 5.5 6.5 9.5 10.5 11.5 12.5 13.5 14.5 1.125 1.125 1.125 1.125 1.125 1.125 1.375 1.375 1.375 1.375 1.375 1.375 1.375 1.375 1.375 1.375 1.375 1.375 1.125 1.125 1.125 1.125 1.125 1.125 59-66 55-62 51-58 47-54 43-50 39-46 28-35 24-31 20-27 16-23 12-19 8-15 AS0BC2*-S30BM-7H AS0BC2*-S30BL-7H AS0BC2*-S30BK-7H AS0BC2*-S30BJ-7H AS0BC2*-S30BH-7H AS0BC2*-S30BG-7H AS0BC2*-S30BF-7H AS0BC2*-S30BE-7H AS0BC2*-S30BD-7H DIM.A DIM.B DIM.C DIM.D DIM.E DIM.F DIM.G PIN LOCATION P/N 4 POLYIMIDE 2 CONTACT COPPER ALLOY 67 1 HOUSING DESCRIPTION THERMOPLASTIC MATERIAL Q'TY X. ± .X ± 0.25 .X 2 ±1 .XX ± 0.15 .XX ± .XXX ± .XXX ± 5 UNITS AS0BC2*-S30BA-7H BROWN COLOR 2 0.30 AS0BC2*-S30BB-7H 10u" NICKEL UNDER PLATING 100u"MATTE TIN PLATING OVER ALL 50u" NICKEL UNDER PLATING GOLD FLASH PLATING AT TAIL AREA GOLD FLASH OR 5u" GOLD PLATING OR 10" GOLD PLATING OR 15u" GOLD PLATING OR 30u" GOLD PLATING AT CONTACT AREA STAINLESS STEEL 1 MAT'L R M.2 (NGFF) CONNECTOR FOXCONN INTERCONNECT TECHNOLOGY LIMITED. PART NO.(INTENDED USE) CLASS: CONFIDENTIAL AS0BC2*-S30B*-7H FINISH Q'TY 6 D UL94V-0, HALOGEN FREE,BLACK COLOR TREATMENT NAME(INTENDED USE) mm C AS0BC2*-S30BC-7H 1 METAL TAB THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. AND SHALL NOT BE REPRODUCED, COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. STANDARD TYPE 3 14.0 13.0 12.0 11.0 10.0 9.0 6.5 5.5 4.5 3.5 2.5 1.5 PI-FILM X. ± MODULE TYPE S1&D1 S2&D2 S3&D3&D4 -6.125 -5.125 -4.125 -3.125 -2.125 -1.125 1.625 2.625 3.625 4.625 5.625 6.625 3 ITEM KEY NAME BC=0.5P NGFF 1 KEY A KEY NAME 4 7=TAPE&REEL SINGLE ROW KEY D KEY B H=HALOGEN FREE&LEAD FREE DIM.Z MAX.(mm) 3.55 3.70 3.85 KEY M KEY L KEY K KEY J KEY H KEY G KEY F KEY E KEY C H MEMORY MODULE SOCKET E 0.70 SECTION:A-A 3 10.35 1.75 5.20MIN 0.10 67X CONTACTS PLUS 2X METAL TABS 7.2 CL OF CONNECTOR 1.45 0.65 (3.2MAX) 3.0 ±0.20 B DIM.Z 1.91 A APPD: C.S Li CHKD: Alex Wang DR: Liping Yang 2014/5/21 TITLE: SECRET GENERAL CUSTOMER DRAWING DWG NO.: 317-0000-2149 7 SCALE SHEET REV. N/A 1/4 F 8 E 1 2 3 4 5 6 7 8 REV. SOLIDWORK GENERATED DRAWING,DON'T CHANGE BY HAND ECN. NO, APPD X 0.15 Z Y M 0.35 ±0.04(34X) Z 3.50 ±0.08 0.20 Z Y M 6.00 ±0.10 3.80 ±0.15 5.50 ±0.10 1.00 ±0.10 DIM.N BOTTOM SIDE TOP SIDE DIM.G 2.50 DIM.L B 0.35 ±0.04(33X) 0.13 Z Y X 0.05 Z 0.13 Z Y X 0.05 Z DETAIL M 2.00 ±0.15(34X) PLATED GND PAD A 1.20 ±0.05 DIM.M DIM.F 2.50 ±0.15(33X) DIM.W 3.50 ±0.15 A 2.50 DETAIL N B 20° ±5 °(2X) M Pin 2 DIM.B 0.50 TYP. C Pin 74 DIM.E DIM.D Y DIM.A DIM.C 19.85 ±0.15 D 5.20MIN. Pin 75 N R0.50 ±0.15(2X) 0.80 ±0.08 TYPE XX XX-XX-X 0.15 DETAIL S COMPONENT MAX HEIGHT(mm) LENGTH(mm) 30 DIM.L 42 60 80 WIDTH(mm) 22 110 DIM.W 30 E DIM.N DIM.M S1 1.2 0 S2 1.35 0 X. ± 0.15 X. ± S3 1.5 0 .X ± 0.10 .X ± D1 1.2 1.35 D2 D3 D4 1 2 M 0.20MIN. KEY ID 1.35 .XX ± 0.05 .XX ± .XXX ± .XXX ± 1.35 1.5 1.35 1.5 THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. AND SHALL NOT BE REPRODUCED, COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. 0.7 3 D 0.30 ±0.25(2X) S Pin 1 4.00MIN.(FOR TOP SIDE COMPONENT ZONE LIMIT) C M 4.00 ±0.15(FOR PCB) CL OF CARD 4 5 UNITS mm NAME(INTENDED USE) MAT'L Q'TY M.2 (NGFF) CONNECTOR FOXCONN INTERCONNECT TECHNOLOGY LIMITED. PART NO.(INTENDED USE) CLASS: CONFIDENTIAL AS0BC2*-S30B*-7H FINISH APPD: C.S Li CHKD: Alex Wang DR: Liping Yang 2014/5/21 6 R TITLE: SECRET GENERAL CUSTOMER DRAWING DWG NO.: 317-0000-2149 7 SCALE SHEET REV. N/A 2/4 F 8 E 1 2 3 4 5 6 7 8 SOLIDWORK GENERATED DRAWING,DON'T CHANGE BY HAND REV. ECN. NO. APPD. (22) 10.35 10.35 18.50 A A DIM.C 0.50 0.30 ±0.03(34X) 2.75 ±0.03(2X) 0.10 Z X-Y X B PIN 1 PIN 75 0.10 Z X-Y X CL (1.75) 2.275 C B 1.20 ±0.03(2X) 4.50 5.275 (9.1) CONNECTOR OUTLINE 0.10 Z X-Y X 2.50 0.10 Z X-Y X DIM.B 1.55 ±0.03(34X) 9.25 MODULE SEATING PLANE 1.10 ±0.05 0.30 ±0.03(33X) PIN 2 0.10 Z X 0.10 Z X-Y X C 1.60 ±0.05 PIN 74 X DIM.E 2.50 9.00 D 10.00 18.00 DIM.P DIM.D 1.55 ±0.03(33X) 0.50 0.10 Z X-Y X Y 20.00 6.50 ±0.05 0.10 X Y Z 4.20 ±0.05 22110 108.25 2280 78.25 2260 58.25 2242 40.25 2230 28.25 3042 40.25 3030 28.25 TYPE E DATUM Z IS THE PCB SOLDER SURFACE X. ± 0.15 X. ± .X ± 0.10 .X ± .XX ± 0.05 .XX ± .XXX ± .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. AND SHALL NOT BE REPRODUCED, COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. 1 2 3 4 5 UNITS mm FOXCONN INTERCONNECT TECHNOLOGY LIMITED. PART NO.(INTENDED USE) CLASS: CONFIDENTIAL APPD: C.S Li CHKD: Alex Wang DR: Liping Yang 2014/5/21 6 R M.2 (NGFF) CONNECTOR AS0BC2*-S30B*-7H FINISH Q'TY DIM.P NAME(INTENDED USE) MAT'L D TITLE: SECRET GENERAL CUSTOMER DRAWING DWG NO.: 317-0000-2149 7 SCALE SHEET REV. N/A 3/4 F 8 E 1 2 3 4 5 6 7 8 SOLIDWORKS GENERATED DRAWING, DO NOT CHANGE BY HAND REV. ECN. NO. APPD. 14.2 ±0.10 1.75 ±0.10 FEEDING DIRECTION 4.00 ±0.10 2.00 ±0.10 COVER TAPE CARRIER TAPE 2 A LABEL BUBBLE SHEET 2 PCS 32.0 ±0.30 A +0.10 1.50 0.00 16.00 ±0.10 ELONGATED SPROCKET HOLES LEAD TAPE (EMPTY) 10 POCKETS MIN. B LEAD TAPE (EMPTY) CONNECTOR (LOADED AREA) 7 POCKETS MIN. 400mm MIN. B SHIPPING CARTON +0.5 28.40 ±0.10 FEEDING DIRECTION 1 +0.05 0.00 BUBBLE SHEET 2 PCS TRANSPARENT SEAL TAPE 100.0 ±1.5 +0.05 0.00 21.5 2.0 ±0.5 381.0 ±1.5 C R0.75 0.05MAX. 0.20 ±0.05 32.5 - 0.2 C WATER PROOF BAG FOLDER PAPER BOARD 37.5 ±0.5 3 D D NOTES: LABEL 1. COVER TAPE PEELING STRENGTH : 0.01 kgf MIN & 0.13 kgf MAX. AT 300mm/min. 2. 10 POCKETS HOLE PITCH CUMULATIVE TOLERANCE ±0.20mm. COVER TAPE 165 °~1 80° PEELING DIRECTION FEEDING DIRECTION CARRIER TAPE E AS0BC2*-S30B*-7H 1200 7 PCS/REEL P/N 1 REEL/BOX 2 0.30 X. ± .X ± 0.20 .X ± .XX ± 0.15 .XX ± .XXX ± .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. AND SHALL NOT BE REPRODUCED, COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. 8400 PCS/BOX 3 X. ± 4 5 UNITS mm REEL COVER TAPE 1 CARRIER TAPE ITEM DESCRIPTION POLYSTYRENE POLYESTER POLYSTYRENE MATERIAL NAME(INTENDED USE) MAT'L FOXCONN INTERCONNECT TECHNOLOGY LIMITED. PART NO.(INTENDED USE) CLASS: CONFIDENTIAL APPD: C.S Li CHKD: Alex Wang DR: Liping Yang 2014/5/21 6 R M.2 (NGFF) CONNECTOR AS0BC2*-S30B*-7H FINISH Q'TY 3 2 TITLE: SECRET GENERAL CUSTOMER DRAWING DWG NO.: 317-0000-2149 7 SCALE SHEET REV. N/A 4/4 F 8 E