ASAA826-E8SB0-7H

1 2 3 4 5 CL OF CONNECTOR 3.63 0.90 ±0.05 0.15 ±0.02 TYP. 0.60(2X) 1 2 0.50 TYP. 2.50(2X) 68.8 B 4.78 1.45 ±0.05 A YEAR MONTH 4 APPD. Bruce Wu Bruce Wu A DAY A S A A8 2 * - E 8 S B 0 - * H 68.80 ±0.05 C ECN. NO. * * * * * LINE NO. MEMORY MODULE SOCKET HORIZONTAL TYPE SINGLE ROW NO. OF POS. A8=260 POS. SMT CONTACT AREA PLATING 1=GOLD FLASH Y=5u" GOLD PLATING 6=10u" GOLD PLATING TE TA 7=15u" GOLD PLATING O R 3=30u" GOLD PLATING EN TH T ° R 30.0 SE 76.4 ±0.5 3.50 8 NOTES: A BC-15-0028584 1. ELECTRICAL CHARACTERISTICS: B BC-16-0008757 1.1. CONTACT CURRENT RATING: 0.5 AMPERE MAX. PER PIN. 1.2. VOLTAGE RATING: 25V AC. 1.3. INSULATION RESISTANCE: 100 MEGAOHMS MIN. AT 500V DC. 1.4. DIELECTRIC WITHSTANDING VOLTAGE: 250V AC RMS AT 60Hz,FOR 1 MINUTE. 1.5. CONTACT RESISTANCE: 60 MILLIOHMS MAX. PER PIN INITIAL 10 MILLIOHMS PER PIN AFTER FULL ENVIRONMENTAL TESTING. 2. MECHANICAL CHARACTERISTICS:DURABILITY: 60 MATING CYCLES. 3. OPERATION TEMPERATURE: -55 C TO +85 C. 4. RECOMMENDED PROCESS CONDITION:SMT,PEAK TEMPERATURE:260 C 10~20S. 5. PLEASE CONTACT FOXCONN SALES REPRESENTATIVE TO VERIFY PRODUCT DETAILS & AVAILABILITY. DATE CODE: 3 0.94 7 REV. SOLIDWORKS GENERATED DRAWING, DON'T CHANGE BY HAND. 1.00 ±0.05 6 0.00 - 0.05 COMPONENT KEEP OUT ZONE 78.0 MAX. (LATCH OPEN) H=HALOGEN FREE & LEAD FREE 7=TAPE REEL 4=SOFT TRAY 0=EXTENSION CODE B=NORMAL TYPE,BLACK COLOR S=STANDARD 8=8.0MM HEIGHT E=DDR SODIMM B 8.8MAX (BETWEEN RAM TOP SURFACE AND SMT SURFACE) IN C RAM MODULE 72.1 0.80 66.6 35.50 5.40 7.25 DATE CODE DDR4 STD PIN #1 PIN #143 A PIN #145 35.50 6.1 D 12.0 PIN #260 A 8.0 PIN #146 25.6 PIN #144 10.6(2X) PIN #2 26.0 MIN. 28.50 D 0.10 PIN #259 8.0 28.50 0.40 260X CONTACT PLUS 2X SOLDER PADS 0.00 - 0.10 70.00 ±0.15(SLOT WIDTH) 71.5 0.7 0.7 4.1 4.1 SECTION A-A 73.8 4 METAL SPRING 2 STAINLESS STEEL ULTRASONIC CLEANING 3 METAL PAD 2 STAINLESS STEEL E 2 1 ITEM CONTACT HOUSING DESCRIPTION 1 260 1 Q'TY PHOSPHOR BRONZE LCP METERIAL 2 10u" NICKEL UNDER PLATING 100u" MATTE TIN PLATING OVER SOLDER PAD AREA. 50u" NICKEL UNDER PLATING GOLD FLASH OR 5u" OR 10u" AT CONTACT AREA; 90u" NICKEL UNDER PLATING 15u" OR 30u" GOLD PLATING AT CONTACT AREA; GOLD FLASH PLATING AT TAIL UL94V-0, HALOGEN FREE, BLACK COLOR TREATMENT X. ± 0.30 X. ± .X ± 0.25 .X ± .XX ± 0.15 .XX ± .XXX ± .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED AND SHALL NOT BE REPRODUCED. COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. UNITS R mm NAME(INTENDED USE) DDR4 SO DIMM CONN. MAT'L PART NO.(INTENDED USE) ASAA82*-E8SB0-*H FINISH Q'TY APPD: Bruce Wu CHKD: C.S Li DRAW: 3 4 5 6 Brooks Yang FOXCONN INTERCONNECT TECHNOLOGY LIMITED. CLASS: CONFIDENTIAL SECRET GENERAL TITLE: CUSTOMER DRAWING 260PIN SODDR4 8.0 STD. DWG NO.: 317-0000-2535 SCALE N/A 2016/3/16 7 REV. SHEET 1/6 B 8 E 2 3 4 5 6 7 8 SOLIDWORKS GENERATED DRAWING, DON'T CHANGE BY HAND. REV. 0.10 M C B A 1.20 MAX. 1.20 MAX. A B B 1.425 PIN #145 DETAIL A 3.50 1.675 4.00 ±0.10 1.00 ±0.05 A 1.375 DETALC 0.80 MAX.（2X） 1.20 ±0.10 0.15 M 2.50 DETAIL A C 28.50 2X 35.50 PIN #259 DETAIL B B C OR R 0.25 MAX 2X OPTIONAL 1.80(2X) 0.10 M C B A A RULL R 4.00 MIN. 4.20 MIN. 3.00 MIN.(4X) 4.00 MIN. (2X) 5.10 MIN. (2X) COMPONENT AREA FRONT 6.00 30.00 ±0.15 4.00 PIN #143 APPD. 3.70 MAX. 69.60 ±0.15 PIN #1 ECN. NO. 0.25 0.05 1 36.30 C 35.50 0.35 ±0.03 28.50 0.50 0.10 C B A 0.05 C DETAIL C 0.30 MAX. 2.50 1.125 PIN #2 PIN #144 1.425 PIN #146 2.55 1.675 COMPONENT AREA BACK R0.65 E D 4.00 ±0.10(2X) D 18.00 ±0.10(2X) PIN #260 EDGE OF CONTACT PADS SHALL BE FREE OF BURRS DETAIL B 1.75(2X) 2.00 MIN. (4X) 65.60 X. ± 0.25 X. ± .X ± 0.10 .X ± .XX ± 0.05 .XX ± DDR4 SO DIMM MODULE BOARD LAYOUT .XXX ± .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED AND SHALL NOT BE REPRODUCED. COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. UNITS R NAME(INTENDED USE) mm DDR4 SO DIMM CONN. MAT'L PART NO.(INTENDED USE) ASAA82*-E8SB0-*H FINISH Q'TY APPD: Bruce Wu CHKD: C.S Li DRAW: 1 2 3 C 0.35 2X 0.05 4 5 6 FOXCONN INTERCONNECT TECHNOLOGY LIMITED. CLASS: CONFIDENTIAL SECRET GENERAL TITLE: CUSTOMER DRAWING 260PIN SODDR4 8.0 STD. DWG NO.: 317-0000-2535 SCALE N/A Brooks Yang 2016/3/16 7 REV. SHEET 2/6 B 8 E 1 2 3 4 5 6 7 8 SOLIDWORKS GENERATED DRAWING, DON'T CHANGE BY HAND. REV. ECN. NO. APPD. A 34.7 46.7 A 12.0 DDR4 STD B B DDR4 STD 75.50 ASAA82*-E8SB0-*H 2.50 0.30 ±0.03 0.05 U - V PIN #2 PIN #144 PIN #146 PIN #260 PIN #1 PIN #143 PIN #145 PIN #259 3.35 1.10 ±0.05 D 1.60 ±0.05 (HOLE) 2.50 1.025 PIN #144 PIN #143 PIN #2 PIN #1 PIN #144 PIN #143 PIN #146 PIN #145 P.C.B. LAYOUT(RECOMMEND THICKNESS =1.40MM) PIN #260 X. ± 0.25 X. ± .X ± 0.10 .X ± .XX ± 0.05 .XX ± PIN #259 .XXX ± .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED AND SHALL NOT BE REPRODUCED. COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. UNITS R NAME(INTENDED USE) mm DDR4 SO DIMM CONN. MAT'L PART NO.(INTENDED USE) ASAA82*-E8SB0-*H FINISH Q'TY APPD: Bruce Wu CHKD: C.S Li DRAW: 2 3 U 28.50 68.80 P.C.B. LAYOUT(STACKED ORIENTATION) 1 D 0.10 V V PIN #260 PIN #259 PIN #146 PIN #145 12.0 PIN #2 PIN #1 0.50 TYP. 35.50 E 2.00 ±0.10(2X) 0.05 U - V C 8.00 4.10 1.275 4.10 12.00 3.35 1.75 ±0.03 0.05 U - V C 0.05 U - V 28.50 3.50 ±0.10(2X) 35.50 CONNECTOR OUTLINE 4 5 6 FOXCONN INTERCONNECT TECHNOLOGY LIMITED. CLASS: CONFIDENTIAL SECRET GENERAL TITLE: CUSTOMER DRAWING 260PIN SODDR4 8.0 STD. DWG NO.: 317-0000-2535 SCALE N/A Brooks Yang 2016/3/16 7 REV. SHEET 3/6 B 8 E 1 2 3 4 5 6 7 8 SOLIDWORKS GENERATED DRAWING, DON'T CHANGE BY HAND. REV. ECN. NO. APPD. A A B DDR4 STD DDR4 STD DDR4 STD DDR4 STD B ASAA82*-E8SB0-*H ASAA82*-E8SB0-*H C C PIN #144 PIN #143 PIN #2 PIN #1 PIN #146 PIN #145 PIN #2 PIN #260 PIN #259 PIN #144 PIN #143 PIN #1 PIN #260 PIN #259 PIN #146 PIN #145 D 12.0 D PIN #144 PIN #143 PIN #2 PIN #1 PIN #146 PIN #145 PIN #2 PIN #1 PIN #260 PIN #259 3.35 PIN #144 PIN #143 PIN #260 PIN #259 PIN #146 PIN #145 3.35 P.C.B. LAYOUT(DUAL COMPRESSED STACKED ORIENTATION) E X. ± 0.25 X. ± .X ± 0.10 .X ± .XX ± 0.05 .XX ± .XXX ± .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED AND SHALL NOT BE REPRODUCED. COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. UNITS R NAME(INTENDED USE) mm DDR4 SO DIMM CONN. MAT'L PART NO.(INTENDED USE) ASAA82*-E8SB0-*H FINISH Q'TY APPD: Bruce Wu CHKD: C.S Li DRAW: 1 2 3 4 5 6 Brooks Yang FOXCONN INTERCONNECT TECHNOLOGY LIMITED. CLASS: CONFIDENTIAL SECRET GENERAL TITLE: CUSTOMER DRAWING 260PIN SODDR4 8.0 STD. DWG NO.: 317-0000-2535 SCALE N/A 2016/3/16 7 REV. SHEET 4/6 B 8 E 1 2 3 4 5 6 7 8 SOLIDWORKS GENERATED DRAWING, DON'T CHANGE BY HAND. 330 REV. ECN. NO. APPD. ±2 A A EPE EPE TRAY 22 0 ±2 WATER PROOFF BAG B B 20PCS/TRAY C C TRANSPARENT SEAL TAPE SHIPPING CARTON D D LABLE TOTAL 25 LAYERS TRAY THE TOP TRAY IS EMPTY E PACKING CAPACITY : 20 PCS/TRAY, 24 TRAYS/BOX, TOTAL 480 PCS/BOX. X. ± 1.5 X. ± .X ± 1.0 .X ± .XX ± 0.2 .XX ± .XXX ± .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED AND SHALL NOT BE REPRODUCED. COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. R mm NAME(INTENDED USE) DDR4 SO DIMM CONN. MAT'L PART NO.(INTENDED USE) ASAA82*-E8SB0-*H FINISH Q'TY APPD: Bruce Wu CHKD: C.S Li DRAW: CONNECTOR P/N ASAA82*-E8SB0-4H 1 UNITS 2 3 4 5 6 Brooks Yang FOXCONN INTERCONNECT TECHNOLOGY LIMITED. CLASS: CONFIDENTIAL SECRET GENERAL CUSTOMER DRAWING TITLE: 260PIN SODDR4 8.0 STD. DWG NO.: 317-0000-2535 SCALE N/A 2016/3/16 7 REV. SHEET 5/6 B 8 E 1 2 3 4 5 6 7 8 1.75 ±0.10 SOLIDWORKS GENERATED DRAWING, DON'T CHANGE BY HAND. 4.0 ±0.1 REV. 1.5 32.0 ±0.1 ROUND SPROCKET HOLES +0.1 0.0 ECN. NO. APPD. COVER TAPE CARRIER TAPE 2.0 ±0.2 A A LABEL 42.2 ±0.3 88.0 ±0.3 2 EPE 1 B B ELONGATED SPROCKET HOLES 100 mmMin 160 mmMin CONNECTOR LOADED AREA 400 mmMin SKEW 0.10 MAX. FEEDING DIRECTION 150.0 ±0.1 SHIPPING CARTON D 105 MAX. 3 NOTES: C WATER PROOF BAG EPE 2 DETAIL: ELONGATION AND SKEW OF SPROCKET HOLES 89.5 ±0.1 +0.05 0.00 0.20 ±0.05 84.4 ±0.1 20.2 MIN. 1 2.0 ±0.5 FULL R0.75 381.0 ±2.0 C FPLDER PAPER BOARD D TRANSPARENT SEAL TAPE 1. 10 POCKETS HOLE PITCH CUMULATIVE TOLERANCE ±0.20mm. 2. COVER TAPE PEELING STRENGTH : 0.01 kgf MIN. 0.15 kgf MAX. AT 300mm/min. 165° ~180 COVER TAPE ° LABEL 3 2 1 ITEM PEELING DIRECTION E X. ± 1.5 X. ± .X ± 1.0 .X ± .XX ± 0.2 .XX ± FEEDING DIRECTION CARRIER TAPE 3. PACKING CAPACITY : 260 PCS/REEL, 3 REELS/BOX, TOTAL 780 PCS/BOX. .XXX ± CONNECTOR P/N 1 .XXX ± THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED AND SHALL NOT BE REPRODUCED. COPIED OR USED IN ANY MANNER WITHOUT THE PRIOR WRITTEN CONSENT OF FOXCONN INTERCONNECT TECHNOLOGY LIMITED. ASAA82*-E8SB0-7H UNITS 3 4 5 POLYSTYRENE POLYESTER POLYSTYRENE MATERIAL R NAME(INTENDED USE) mm DDR4 SO DIMM CONN. MAT'L PART NO.(INTENDED USE) ASAA82*-E8SB0-*H FINISH Q'TY APPD: Bruce Wu CHKD: C.S Li DRAW: 2 REEL COVER TAPE CARRIER TAPE DESCRIPTION 6 FOXCONN INTERCONNECT TECHNOLOGY LIMITED. CLASS: CONFIDENTIAL SECRET GENERAL TITLE: CUSTOMER DRAWING 260PIN SODDR4 8.0 STD. DWG NO.: 317-0000-2535 SCALE N/A Brooks Yang 2016/3/16 7 REV. SHEET 6/6 B 8 E