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GL817E

GL817E

  • 厂商:

    GENESYS(创惟科技)

  • 封装:

  • 描述:

    GL817E - USB 2.0 MS/ MS PRO/ SD/ MMC Controller - GENESYS LOGIC

  • 数据手册
  • 价格&库存
GL817E 数据手册
Genesys Logic, Inc. GL817E USB 2.0 MS/ MS PRO/ SD/ MMC Controller Datasheet Revision 1.38 Apr. 19, 2006 GL817E USB2.0 MS/MS PRO/SD/MMC Controller Copyright: Copyright © 2006 Genesys Logic Incorporated. All rights reserved. No part of the materials may be reproduced in any form or by any means without prior written consent of Genesys Logic Inc.. Disclaimer: ALL MATERIALS ARE PROVIDED "AS IS" WITHOUT EXPRESS OR IMPLIED WARRANTY OF ANY KIND. NO LICENSE OR RIGHT IS GRANTED UNDER ANY PATENT OR TRADEMARK OF GENESYS LOGIC INC.. GENESYS LOGIC HEREBY DISCLAIMS ALL WARRANTIES AND CONDITIONS IN REGARD TO MATERIALS, INCLUDING ALL WARRANTIES, IMPLIED OR EXPRESS, OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF INTELLECTUAL PROPERTY. IN NO EVENT SHALL GENESYS LOGIC BE LIABLE FOR ANY DAMAGES INCLUDING, WITHOUT LIMITATION, DAMAGES RESULTING FROM LOSS OF INFORMATION OR PROFITS. PLEASE BE ADVISED THAT THE MATERIALS MAY CONTAIN ERRORS OR OMMISIONS. GENESYS LOGIC MAY MAKE CHANGES TO THE MATERIALS OR TO THE PRODUCTS DESCRIBED THEREIN AT ANY TIME WITHOUT NOTICE. Trademarks: is a registered trademark of Genesys Logic, Inc. All trademarks are the properties of their respective owners. Office: Genesys Logic, Inc. 12F, No. 205, Sec. 3, Beishin Rd., Shindian City, Taipei, Taiwan Tel: (886-2) 8913-1888 Fax: (886-2) 6629-6168 http://www.genesyslogic.com ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 2 GL817E USB2.0 MS/MS PRO/SD/MMC Controller Revision History Revision 1.00 1.10 1.11 1.20 Date 09/25/2003 01/19/2004 04/14/2004 04/21/2004 First formal release. 1. Added LQFP-48 pin diagram, list and description. 2. Removed LQFP-64 pin diagram, list and description. 3. Added Chapter 8 Ordering Information. Updated package dimension. Removed NAND Flash interface 1. Added media memory card type in Chapter 1 And 2 2. Updated Table 6.1 - Absolute Maximum Ratings value 3. Updated Table 6.2 - DC Characteristics value 4. Added Chapter 6.3.5 Reset Timing 5. Updated IC Marking in package dimension diagram 1. Added USB2.0 certified Test ID in Chapter 2 Features 2. Changed Table 6.1 - Absolute Maximum Ratings 3. Added Table 6.2 - Operating Conditions Added Chapter 6.4.6 93C46 Timing Changed power pin description in Table 3.2 Changed pin# 13,14 pin description Update Datasheet to meet GL817E-09 with different pin out Add pin#11 pin description Modify pin#24 description to Power LED Add Reset timing chart Description 1.30 07/02/2004 1.31 1.32 1.33 1.34 1.35 1.36 1.38 01/18/2005 01/21/2005 02/01/2005 03/06/2005 04/06/2005 06/21/2005 04/19/2006 ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 3 GL817E USB2.0 MS/MS PRO/SD/MMC Controller TABLE OF CONTENTS CHAPTER 1 CHAPTER 2 CHAPTER 3 GENERAL DESCRIPTION................................................. 6 FEATURES ........................................................................... 7 PIN ASSIGNMENT .............................................................. 8 3.1 PINOUTS .................................................................................................. 8 3.2 PIN LIST .................................................................................................. 9 3.3 PIN DESCRIPTIONS .................................................................................. 9 CHAPTER 4 CHAPTER 5 BLOCK DIAGRAM............................................................ 12 FUNCTION DESCRIPTION ............................................. 13 5.1 UTM ..................................................................................................... 13 5.2 SIE ........................................................................................................ 13 5.3 EP0 FIFO ............................................................................................. 13 5.4 BULK FIFO ........................................................................................... 13 5.4.1 TXFIFO ........................................................................................ 13 5.4.2 RXFIFO ........................................................................................ 13 5.5 MHE (MEDIA INTERFACE) ................................................................... 13 5.6 USB REGISTERS / FIFO CONTROL ....................................................... 13 CHAPTER 6 ELECTRICAL CHARACTERISTICS.............................. 14 6.1 ABSOLUTE MAXIMUM RATINGS ............................................................ 14 6.2 OPERATING CONDITIONS ...................................................................... 14 6.3 DC CHARACTERISTICS.......................................................................... 14 6.4 AC CHARACTERISTICS.......................................................................... 15 6.4.1 UTMI Transceiver........................................................................ 15 6.4.2 Secure Digital / MultiMediaCard ................................................ 15 6.4. 3 Memory Stick .............................................................................. 15 6.4. 4 Memory Stick Pro ....................................................................... 15 6.4.5 Reset Timing ................................................................................. 16 6.4.6 93C46 Timing ............................................................................... 16 CHAPTER 7 PACKAGE DIMENSION...................................................... 18 CHAPTER 8 ORDERING INFORMATION........................................... 19 Page 4 ©2000-2006 Genesys Logic Inc. - All rights reserved. GL817E USB2.0 MS/MS PRO/SD/MMC Controller LIST OF FIGURES FIGURE 3.1 - 48 PIN LQFP PINOUT DIAGRAM .................................................................8 FIGURE 4.1 - BLOCK DIAGRAM ......................................................................................12 FIGURE 6.2 - TIMING DIAGRAM OF SD / MMC INTERFACE ...........................................15 FIGURE 6.3 - TIMING DIAGRAM OF MEMORYSTICK ......................................................15 FIGURE 6.4 - TIMING DIAGRAM OF MEMORYSTICK PRO ...............................................15 FIGURE 6.5 - TIMING DIAGRAM OF RESET WIDTH .........................................................16 FIGURE 6.6 - TIMING DIAGRAM OF 93C46 .....................................................................17 FIGURE 7.1 - GL817E 48 PIN LQFP PACKAGE ..............................................................18 LIST OF TABLES TABLE 3.1 - 48 PIN LIST ...................................................................................................9 TABLE 3.2 - 48 PIN DESCRIPTIONS ...................................................................................9 TABLE 6.1 - ABSOLUTE MAXIMUM RATINGS .................................................................14 TABLE 6.2 - OPERATING CONDITIONS ............................................................................14 TABLE 6.3 - DC CHARACTERISTICS ...............................................................................14 TABLE 8.1 - ORDERING INFORMATION...........................................................................19 ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 5 GL817E USB2.0 MS/MS PRO/SD/MMC Controller CHAPTER 1 GENERAL DESCRIPTION The GL817E is a highly compatible, best performance USB 2.0 Flash Card Reader Controller. It supports TM TM USB 2.0 high-speed transmission to Secure Digital (SD), Mini SDTM, MultiMediaCard (MMC), RS TM TM TM MultiMediaCard (RS MMC), Memory Stick (MS), Memory Stick Duo (MS Duo), High Speed TM Memory StickTM (HS MS), Memory Stick Pro (MS Pro), Memory Stick ProTM Duo (MS Pro Duo) Memory Stick ROM interface on one chip. The GL817E integrates Genesys Logic own design USB 2.0 high-speed UTMI (USB 2.0 Transceiver Macrocell Interface) transceiver, the Serial Interface Engine (SIE), and compatible 8-bit micro-controller. By complies with Universal Serial Bus specification rev. 2.0 and USB Storage Class specification ver.1.0, the GL817E can be supported by Windows XP/ 2000/ Me default driver. Also it is supported in Windows 98/ 98SE, Mac, and Linux operating system. For the power consumption consideration, the GL817E complies with USB power specification for bus-powered devices. The GL817E is available in 48-pin LQFP (Internal Mask ROM code), and it is the best cost / performance solution for your USB 2.0 high-speed Flash Card Reader application. ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 6 GL817E USB2.0 MS/MS PRO/SD/MMC Controller CHAPTER 2 • • • • • • • • • • l FEATURES TM TM Supports USB 2.0 to Memory Stick (MS) and Memory Stick PRO TM and MultiMediaCard (MMC) interface on one chip. (MS PRO), Secure Digital TM (SD) Supports all combinations of MS/ MS PRO/ SD/ MMC application design. Complies with 480Mbps Universal Serial Bus specification rev. 2.0.vc Complies with USB Storage Class specification rev. 1.0. (Bulk only protocol). USB 2.0 certified (Test ID=40390390) Operating System supported: Windows XP/ 2000/ Me/ 98/ 98SE, Mac OS 9.x/ X, Linux. Supports customized storage device icon under Windows 98/ 98SE/ 2000 (SP2, SP3 and SP4) by Genesys Logic own driver. Integrated USB 2.0 Transceiver Macrocell Interface (UTMI) transceiver and Serial Interface Engine (SIE). Integrated MCU compatible 8-bit micro-controller. Hardware ECC generation and verification. Memory StickTM (MS) / Memory Stick DuoTM (MS Duo) / High Speed Memory StickTM (HS MS) / TM Memory Stick Pro (MS Pro) / Memory Stick ProTM Duo (MS Pro Duo) Memory Stick ROM interface - Complies with Memory Stick Standard Memory Stick PRO Format Specifications ver 1.00-01 - Complies with Memory Stick Format Specifications ver 1.40-00 - Hardware support 4-bit HS Memory Stick PRO interface - Supports INS signal - Supports automatic CRC16 generation and verification - Supports different clock rate up to 40 MHz Secure DigitalTM , Mini SDTM and MultiMediaCardTM - Complies with Secure DigitalTM / MultiMediaCardTM interface specification - Supports both SD / MMC mode access CLK/CMD/DAT0/DAT1/DAT2/DAT3 - Command transmit and response receive can be enabled separately - Automatic CRC7 generation for command and CRC7 verification for response on CMD - Support automatic CRC16 generation and verification on DAT3-0 In addition to full packet transaction, optional single byte / bit operation on both CMD and DAT line / lines l - Data processing in block or byte Supports different clock rate from 375 KHz to 24 MHz • High efficient hardware engine - Automatic data read / write with card by hardware engine. - Easier firmware development. - Media interface signals output low automatically when suspend. - Supports automatic CRC16 generation and verification. Supports firmware correct page ECC error capability. Supports automatic page copy (source page read + destination page write). Complies with USB power specification for bus-powered devices. Supports Suspend and Wake-up Resume. 3.3 Volt operation. Available in 48-pin LQFP package. • • • • • • ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 7 GL817E USB2.0 MS/MS PRO/SD/MMC Controller CHAPTER 3 3.1 Pinouts PIN ASSIGNMENT 93C46_D O EX TRSTZ 93C46_D I DGND2 DVDD2 MS_D1 MS_D0 MS_D2 MS_D3 SD_D0 36 35 34 33 32 31 30 29 28 27 26 MS_INS MS_BS SDPCTL/GPIO9 MSPCTL/GPIO10 37 38 39 40 41 42 43 44 45 46 47 48 25 SD_D1 GPI O2 24 23 22 21 20 19 MVMCSZ SD_WPZ SD_CDZ DGND1 DVCC1 MS_CLK GPIO3 UDVSS1 UDVCC1 UGND2 XO XI SD_CLK SD_CMD SD_D3 SD_D2 DVCC3 DGND3 93C46_SK 93C46_CS GL817E LQFP - 48 18 17 16 15 14 13 10 11 RREF DG ND 0 UDG ND 0 AV DD 1 AG ND 1 U DV CC1/NC RPU/NC VPF/NC VMF/NC Figure 3.1 - 48 Pin LQFP Pinout Diagram ©2000-2006 Genesys Logic Inc. - All rights reserved. AV DD 2 VPH V MH 12 1 2 3 4 5 6 7 8 9 Page 8 GL817E USB2.0 MS/MS PRO/SD/MMC Controller 3.2 Pin List Table 3.1 - 48 Pin List Pin# 1 2 3 4 5 6 7 8 9 Pin Name Type Pin# DGND0 UDVCC1/ NC UDGND0 RPU/ NC AVDD1 VPF/ NC VPH VMF/ NC VMH P P P A P A A A A P A P Pin Name Type Pin# I O P P P Pin Name Type Pin# Pin Name Type B/I O B/O B/O O B/SO 13 XI 14 XO 15 UGND2 16 UDVCC1 17 UDVSS1 18 GPIO3 19 MS_CLK 20 DVCC1 21 DGND1 22 SD_CDZ 23 SD_WPZ 24 NVMCSZ 25 SD_D1 26 GPIO2 27 SD_D0 28 93C46_DO 29 93C46_DI B/SO 37 MS_INS B/O 38 MS_BS B/SO 39 SDPCTL/ GPIO9 MSPCTL/ B/I 40 GPIO10 B/O 41 SD_CLK I 42 SD_CMD B/O 30 EXTRSTZ O P P B/I B/I O 31 MS_D3 32 DVDD2 33 MS_D2 34 MS_D0 35 DGND2 36 MS_D1 B/SO 43 SD_D3 B B P P B/O B/O P 44 SD_D2 B/SO 45 DVCC3 B/SO 46 DGND3 10 AGND1 11 RREF 12 AVDD2 P 47 93C46_SK B/SO 48 93C46_CS 3.3 Pin Descriptions Table 3.2 - 48 Pin Descriptions Pin Name DGND0~3 Pin# 1,21,35,46 Type P Digital GND #0~3 GL817E-07: UDVCC1 2 P UTMI Digital VDD #1. GL817E-08/GL817E-09: NC: No connection. UDVCC1 UGND0 16 3 P P UTMI Digital VDD #1 UTMI GND #0 GL817E-07: RPU/ NC 4 A USB resistor pulls up when GL817E-07 mounted. GL817E-08 ~ High: NC: No connection. AVDD1 VPF 5,12 6 P A Analog VDD #1 GL817E-07: FS D+ Description ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 9 GL817E USB2.0 MS/MS PRO/SD/MMC Controller GL817E-08/GL817E-09: NC: No connection. VPH 7 A HS D+ GL817E-07: VMF 8 FS DA GL817E-08/GL817E-09: NC: No connection. VMH AGND1 RREF XI 9 10 11 13 A P A I HS DAnalog GND #1 Reference resistor 12MHz Crystal This pin can be connected to one terminal of the crystal or can be connected to an external 12MHz clock when a crystal is not used. 12MHz Crystal This is the other terminal of the crystal, or left open when an external clock source is used to drive XTAL/CLK. It may not be used to drive any external circuitry other than the crystal circuit. UTMI GND XO 14 O UGND2 UDVSS1 15 17 P GPIO2~3,9,10 26,18,39,40 MS_CLK DVCC1,3 SD_CDZ SD_WPZ NVMCSZ SD_D0~3 93C46_DO 93C46_DI EXTRSTZ MS_D0~3 DVDD2 MS_INS MS_BS SD_PCTL MS_PCTL 19 20,45 22 23 24 27,25,44,43 28 29 30 34,36,33,31 32 37 38 39 40 P UTMI Digital GND B/O GPIO2~3,9,10 (odpu) O P B/I (pu) B/I (pu) O (pu) B/SO (pu) B/I B/O I (pu) B/SO (pu) P B/I (pu) O B/O B/O Memory Stick SCLK Digital VDD #1,3 SD CD# SD Write Protect Detect Power LED SD DAT0~3 93C46 Data out 93C46 Data in External reset Internal pull-up : 65K ohm (+/- 50% ) MS DAT3~0 Digital VDD #2 Memory Stick INS Memory Stick BS SD power control MS power control Page 10 ©2000-2006 Genesys Logic Inc. - All rights reserved. GL817E USB2.0 MS/MS PRO/SD/MMC Controller SD_CLK SD_CMD 93C46_SK 93C46_CS Notation: Type O I B B/I B/O P A SO pu pd odpu 41 42 47 48 O B/SO (pu) B/O B/O SD/MMC CLK SD/MMC CMD 93C46 Clock 93C46 CS Output Input Bi-directional Bi-directional, default input Bi-directional, default output Power / Ground Analog Automatic output low when suspend Internal pull up Internal pull down Open drain with internal pull up ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 11 GL817E USB2.0 MS/MS PRO/SD/MMC Controller CHAPTER 4 BLOCK DIAGRAM TXFIFO DATA A UTM SIE RXFIFO DATA A DATA B DATA B EP0FIFO RXFIFO TXFIFO MHE USB Register + FIFO Control SD/ MMC MS/ MS PRO SRAM MCU ROM Figure 4.1 - Block Diagram ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 12 GL817E USB2.0 MS/MS PRO/SD/MMC Controller CHAPTER 5 5.1 UTM FUNCTION DESCRIPTION The USB 2.0 Transceiver Macrocell, it’s the analog circuitry that handles the low level USB protocol and signaling, and shifts the clock domain of the data from the USB 2.0 rate to one that is compatible with the general logic. 5.2 SIE The Serial Interface Engine, which contains the USB PID and address recognition logic, and other sequencing and state machine logic to handle USB packets and transactions. 5.3 EP0 FIFO Endpoint 0 FIFO: The Control FIFO. It is composed of TX0FIFO and RX0FIFO, with 64-byte FIFO each, and it is used for endpoint 0 data transfer. 5.4 Bulk FIFO It is composed of TXFIFO and RXFIFO for data transmission and receiving respectively, also with different modes support: 5.4.1 TXFIFO To ensure the continuous data transmission, TXFIFO includes 512 bytes DATA-A FIFO, 512 bytes DATA-B FIFO, and two 16 bytes corresponding redundant areas. All can be directly accessed by MCU. Normally SIE popes data, SME pushes data for DATA A/B FIFOs, and redundant area is pushed by SME and popped by MCU. Supports MCU single byte access for SmartMedia ECC error correction. Supports transmit mode SIE won’t transmit data filled in TXFIFO before MCU complete the data integrity checking. - 5.4.2 RXFIFO To ensure the continuous data transmission, RXFIFO includes 512 bytes DATA-A FIFO, 512 bytes DATA-B FIFO, and 16 bytes single redundant area. All can be directly accessed by MCU. Normally SME popes data, SIE pushes data for DATA A/B FIFOs, and redundant area is pushed by MCU and popped by SME. 5.5 MHE (Media Interface) SD/MMC Engine. MS/MS PRO Engine. 5.6 USB Registers / FIFO Control It is a register space to store status information and to control the functions of GL817E by MCU. ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 13 GL817E USB2.0 MS/MS PRO/SD/MMC Controller CHAPTER 6 ELECTRICAL CHARACTERISTICS 6.1 Absolute Maximum Ratings Table 6.1 - Absolute Maximum Ratings Parameter Storage Temperature Ambient Temperature Supply Voltage to Ground Potential DC Input Voltage to Any Pin Value -65°C to +150 °C -40°C to +80 °C -0.5V to +4.0V -0.5V to +5.8V 6.2 Operating Conditions Table 6.2 - Operating Conditions Parameter Ta (Ambient Temperature Under Bias) Supply Voltage Ground Voltage FOSC (Oscillator or Crystal Frequency) Value 0°C to 70°C +3.0V to +3.6V 0V 12 MHz ± 0.25% 6.3 DC Characteristics Table 6.3 - DC Characteristics Symbol VCC VIH VIL II VOH VOL IOH IOL CIN ISUSP ICC Parameter Supply Voltage Input High Voltage Input Low Voltage Input Leakage current Output High Voltage Output Low Voltage Output Current High Output Current Low Input Pin Capacitance Suspend current Supply current 1.5K external pull-up included Connect to USB with MCU operating 0 < VIN < VCC Condition Min. 3.0 2.6 0.0 -10 3.0 Typ. 3.3 8.3 7.8 Max. 3.6 5 0.7 10 0.2 2.0 280 85 Unit V V V µA V V mA mA pF µA mA ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 14 GL817E USB2.0 MS/MS PRO/SD/MMC Controller 6.4 AC Characteristics 6.4.1 UTMI Transceiver The GL817E is fully compatible with Universal Serial Bus specification rev. 2.0 and USB 2.0 Transceiver Macercell Interface (UTMI) specification rev. 1.01. Please refer to the specifications for more information. 6.4.2 Secure Digital / MultiMediaCard CMD CLK DAT dddxdxdxdddddddddddddddddxdddd rfrfrfrfrfrfrfrfrfrfrfrfrfrfrf dddddddddddddxdddddddddddxdddd Figure 6.2 - Timing Diagram of SD / MMC Interface Parameter Description Mode 0 1 2 3 Typ 375K 6M 15M 24M Unit Remark Fck CLK frequency Hz 6.4. 3 Memory Stick BS SCLK SDIO llrhhhhhhhhhhhhhhhfllllllllll lllrfrfrfrfrfrfrfrfrfrfrfrfrf ddddxdddddddddddddddxdddddddd Figure 6.3 - Timing Diagram of MemoryStick Parameter Description Mode 0 Typ 1.5M 6M 15M 24M Unit Remark Fck SCLK frequency 1 2 3 Hz 6.4. 4 Memory Stick Pro BS SCLK DATA llrhhhhhhhhhhhhhhhfllllllllll lllrfrfrfrfrfrfrfrfrfrfrfrfrf dddxdxdxdxdxdxdxdxdxdxdxdxdxd Figure 6.4 - Timing Diagram of MemoryStick Pro Parameter Fck Description SCLK frequency Mode 0 1 Typ 30M 40M Unit Hz Remark ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 15 GL817E USB2.0 MS/MS PRO/SD/MMC Controller 6.4.5 Reset Timing Trst Extrstz Figure 6.5 - Timing Diagram of Reset width Figure 6.6- Timing Diagram of Power Good to USB command receive ready Parameter Trst T1 T2 Description Chip reset sense timing width External reset valid from power up to high Reset Deassertion to respond USB command ready Min 2 1.03 72 Typ Max Unit us ms ms 6.4.6 93C46 Timing \\;\\@’\\\\\\\\\\\\\\\\\;\@;\\@’ llrhhhhhhhhhhhhhhhhhhhhhhhhflllr Tskh Tskl \\\\\\;\\\\@;\\\\@’\\\\\\\\\\\\\ llllllahhhhhblllllahhhhhflllllll Tdis Tdih \\\;z@;z@’\\\\\\\\\\\\\\\\\\\\\\ dddxdddddxdddddxdddddxdddddddddd Tpd0 Tpd1 \\\\\\;@’\\\\\\\\\;@’\\\\\\\\\\\ hhhhhhhhflllllllllllrhhhhhh^zzzz Tdf Tsv \\;\\@’\\\\\\\\\\\\\\\\\\\\;@’\\ STATUS VALID zzzzzznddddddddddddddddddddddozz Page 16 Tcss Tcsh Tcs CS SK DI DO READ DO PROGRAM ©2000-2006 Genesys Logic Inc. - All rights reserved. GL817E USB2.0 MS/MS PRO/SD/MMC Controller Figure 6.6 - Timing Diagram of 93C46 Parameter Tskh Tskl Tcs Tcss Tdis Tcsh Tdih Tpd1 Tpd0 Tsv Tdf Description SK High Time SK Low Time Minimum CS Low Time CS Setup Time DI Setup Time CS Hold Time DI Hold Time Output Delay to “1” Output Delay to “0” CS to Status Valid CS to DO in High Impedance Min 250 250 250 50 100 0 100 Typ Max 250 250 250 100 ns Unit ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 17 GL817E USB2.0 MS/MS PRO/SD/MMC Controller CHAPTER 7 PACKAGE DIMENSION D D1 D2 D A A2 A1 36 37 25 24 A E1 E2 E Internal No. GL817E AAAAAAAGAA YWWXXXXXXXX Date Code Lot Code Green Package B Code No. 48 1 e b 4X 13 12 4X bbb H A B D L1 c aaa C A B D 01 0 ddd M C A B s D s C ccc C SEATING PLANE 02 R1 H R2 0.25mm GAGE PLANE S L 03 - NOTES : 1. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 mm PER SIDE. D1 AND E1 ARE MAXIMUM PLASTIC BODY SIZE DIMENSIONS INCLUDING MOLD MISMATCH. 2. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED THE MAXIMUM b DIMENSION BY MORE THAN 0.08mm. DAMBAR CAN NOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND AN ADJACENT LEAD IS 0.07mm. CONTROL DIMENSIONS ARE IN MILLIMETERS. MILLIMETER INCH SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. A 1.60 0.063 A1 0.05 0.15 0.002 0.006 1.35 A2 1.40 1.45 0.053 0.055 0.057 D 9.00 BASIC 0.354 BASIC E 9.00 BASIC 0.354 BASIC D1 7.00 BASIC 0.276 BASIC E1 7.00 BASIC 0.276 BASIC D2 5.50 BASIC 0.217 BASIC E2 5.50 BASIC 0.217 BASIC R1 0.08 0.003 R2 0.08 0.20 0.003 0.008 0 0° 3.5° 7° 0° 3.5° 7° 01 0° 0° 02 11° 12° 13° 11° 12° 13° 03 11° 12° 13° 11° 12° 13° c 0.09 0.20 0.004 0.008 L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.00 REF 0.039 REF S 0.20 0.008 b 0.17 0.20 0.27 0.007 0.008 0.011 e 0.50 BASIC 0.020 BASIC TOLERANCES OF FORM AND POSITION aaa 0.20 0.008 bbb 0.20 0.008 ccc 0.08 0.003 ddd 0.08 0.003 Figure 7.1 - GL817E 48 Pin LQFP Package ©2000-2006 Genesys Logic Inc. - All rights reserved. 0.05 S Page 18 GL817E USB2.0 MS/MS PRO/SD/MMC Controller CHAPTER 8 ORDERING INFORMATION Table 8.1 - Ordering Information Part Number GL817E Package 48-pin LQFP Status ©2000-2006 Genesys Logic Inc. - All rights reserved. Page 19
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