GL823

Genesys Logic, Inc. GL823 USB 2.0 SD/MMC Card Reader Controller Datasheet Revision 1.03 Jun. 28, 2010 GL823 Datasheet Copyright Copyright © 2010 Genesys Logic, Inc. All rights reserved. No part of the materials shall be reproduced in any form or by any means without prior written consent of Genesys Logic, Inc. Ownership and Title Genesys Logic, Inc. owns and retains of its right, title and interest in and to all materials provided herein. Genesys Logic, Inc. reserves all rights, including, but not limited to, all patent rights, trademarks, copyrights and any other propriety rights. No license is granted hereunder. Disclaimer All Materials are provided “as is”. Genesys Logic, Inc. makes no warranties, express, implied or otherwise, regarding their accuracy, merchantability, fitness for any particular purpose, and non-infringement of intellectual property. In no event shall Genesys Logic, Inc. be liable for any damages, including, without limitation, any direct, indirect, consequential, or incidental damages. The materials may contain errors or omissions. Genesys Logic, Inc. may make changes to the materials or to the products described herein at anytime without notice. Genesys Logic, Inc. 12F, No. 205, Sec. 3, Beishin Rd., Shindian City, Taipei, Taiwan Tel : (886-2) 8913-1888 Fax : (886-2) 6629-6168 http://www.genesyslogic.com ©2010 Genesys Logic, Inc. - All rights reserved. Page 2 GL823 Datasheet Revision History Revision Date Description 1.00 09/18/2009 First formal release 1.01 12/15/2009 Add QFN 24 package 1.02 03/11/2010 Remove USB DP/DM port swap feature, p.7 & p.11 Modify Ch6 Package Dimension, p.19 Modify Ch7 Ordering Information, p.21 1.03 06/28/2010 Add Table 2.1: Product Difference Overview, p.7 ©2010 Genesys Logic, Inc. - All rights reserved. Page 3 GL823 Datasheet Table of Contents CHAPTER 1 GENERAL DESCRIPTION...................................................................... 6 CHAPTER 2 FEATURES ................................................................................................. 7 CHAPTER 3 PIN ASSIGNMENT.................................................................................... 8 3.1 SSOP-24 Pinout ............................................................................................................ 8 3.2 QFN-24 Pinout .............................................................................................................. 9 3.3 Pin List/Descriptions .................................................................................................. 11 CHAPTER 4 BLOCK DIAGRAM................................................................................. 13 4.1 OCCS USB PHY......................................................................................................... 13 4.2 SIE................................................................................................................................ 13 4.3 EPFIFO ....................................................................................................................... 13 4.4 MCU............................................................................................................................. 13 4.5 MHE............................................................................................................................. 14 4.6 Regulator ..................................................................................................................... 14 4.7 PMOS........................................................................................................................... 14 CHAPTER 5 ELECTRICAL CHARACTERISTICS .................................................. 15 5.1 Absolute Maximum Ratings ...................................................................................... 15 5.2 Operating Conditions................................................................................................. 15 5.3 DC Characteristics ..................................................................................................... 15 5.4 5V to 3.3V Regulator Characteristics ....................................................................... 16 5.5 PMOS Characteristics................................................................................................ 17 5.6 AC Characteristics ..................................................................................................... 17 5.6.1 Reset Timing........................................................................................................ 17 5.6.2 SD/MMC Card Clock Frequency ..................................................................... 18 CHAPTER 6 PACKAGE DIMENSION.......................................................................... 19 CHAPTER 7 ORDERING INFORMATION.................................................................. 21 ©2010 Genesys Logic, Inc. - All rights reserved. Page 4 GL823 Datasheet List of Figures Figure 3.1 - 24 Pin SSOP Pin out Diagram ............................................................................ 8 Figure 3.2 - 24 Pin QFN (A) Pin out Diagram ....................................................................... 9 Figure 3.3 - 24 Pin QFN (B) Pin out Diagram ..................................................................... 10 Figure 4.1 - Functional Block Diagram................................................................................ 13 Figure 5.1 - 5V to 3.3V Regulator Architecture .................................................................. 16 Figure 5.2 - Embedded PMOS Switch Architecture........................................................... 17 Figure 5.3 - Timing Diagram of Reset Width ...................................................................... 17 Figure 5.4 - Timing Diagram of Power Good to USB Command Receive Ready ............ 18 Figure 6.1 - SSOP 24 Pin Package ........................................................................................ 19 Figure 6.2 - QFN 24 Pin Package.......................................................................................... 20 List of Tables Table 2.1 - Product Difference Overview............................................................................... 7 Table 3.1 - GL823 Pin List/Descriptions .............................................................................. 11 Table 5.1 - Absolute Maximum Ratings............................................................................... 15 Table 5.2 - Operating Conditions.......................................................................................... 15 Table 5.3 - DC Characteristics .............................................................................................. 15 Table 5.4 - Regulator Output Current ................................................................................. 16 Table 5.5 - PMOS I-V Table.................................................................................................. 17 Table 5.6 - Reset Timing ........................................................................................................ 18 Table 5.7 - SD/MMC Card Clock Frequency ...................................................................... 18 Table 7.1 - Ordering Information ......................................................................................... 21 ©2010 Genesys Logic, Inc. - All rights reserved. Page 5 GL823 Datasheet CHAPTER 1 GENERAL DESCRIPTION The GL823 is a USB 2.0 SD/MMC Flash Card Reader single chip. It supports USB 2.0 high-speed transmission to Secure DigitalTM (SD), SDHC, SDXC, miniSD, microSD (T-Flash), MultiMediaCardTM (MMC), RS-MMC, MMCmicro, MMCmobile on one chip. As a single chip solution for USB 2.0 flash card reader, the GL823 complies with Universal Serial Bus specification rev. 2.0, USB Storage Class specification ver.1.0, and SD/MMC card interface specification. The GL823 integrates a high speed 8051 microprocessor and a high efficiency hardware engine for the best data transfer performance between USB and flash card interfaces. Its’ pin assignment design fits to card sockets to provide easier PCB layout. Inside the chip, it integrates 5V to 3.3V and 3.3V to 1.8V regulators and power MOSFETs and it enables the function of on-chip clock source (OCCS) which means no external 12MHz XTAL is needed and that effectively reduces the total BOM cost. ©2010 Genesys Logic, Inc. - All rights reserved. Page 6 GL823 Datasheet CHAPTER 2



FEATURES USB specification compliance - Comply with 480Mbps Universal Serial Bus specification rev. 2.0 - Comply with USB Storage Class specification rev. 1.0 Support one device address and up to four endpoints: Control (0)/ Bulk Read (1)/ Bulk Write (2)/Interrupt (3) Integrated USB building blocks - USB2.0 transceiver macro (UTM), Serial Interface Engine (SIE), Build-in power-on reset (POR) and low-voltage detector (LVD) Embedded 8051 micro-controller - Operate @ 60 MHz clock, 12 clocks per instruction cycle - Embedded mask ROM and internal SRAM TM TM Secure Digital (SD) and MultiMediaCard (MMC) - Support SD specification v1.0 / v1.1 / v2.0/ SDHC (Up to 32GB) Compatible with SDXC (Up to 2TB) Support MMC specification v3.x / v4.0 / v4.1 / v4.2. x1 / x4 bit data bus
On chip clock source and no need of 12MHz Crystal Clock input.
On-Chip 5V to 3.3V and 3.3V to 1.8V regulators
Support 5V to 3.3V Band Gap Regulator for stable voltage supply
Provide Over-Current protection mechanism for safety power supply
On-Chip power MOSFETs for supplying flash media card power
Support Power Saving mode/ Selective suspend mode for better power management. Only available in QFN-24(A) package.
Support external serial EEPROM interface for the flexibility to load the vendor information and system options
Operating system supported: Windows 7/Vista32&64/XP/2000/Me/98/98SE, Mac OS 9.X/10.X, Linux Kernel 2.4.X/2.6.X - Pass Windows Vista/ Windows 7 (Submission ID: 1355289)

USB-IF Logo (Submission TID: 40000940) Package available in 24 pin SSOP (209 mil) and 24 pin QFN (4x4 mm) Table 2.1 - Product Difference Overview Package Type Version Power Source Power Management SSOP 24 04, 06, …N 5V Not Support QFN-24 (A) 04, 06, …N 3.3V Power Saving Mode/ Selective Suspend Mode QFN-24 (B) 05, 07, …N+1 5V Not Support ©2010 Genesys Logic, Inc. - All rights reserved. Page 7 GL823 Datasheet CHAPTER 3 PIN ASSIGNMENT 3.1 SSOP-24 Pinout Figure 3.1 - 24 Pin SSOP Pin out Diagram ©2010 Genesys Logic, Inc. - All rights reserved. Page 8 GL823 Datasheet D3 GPIO9 SD_CMD GPIO8 PMOS DVDD 18 17 16 15 14 13 3.2 QFN-24 Pinout GPIO3 22 GL823 9 SD_CDZ DVDD 23 QFN-24 (A) 8 SD_WP GND 24 7 RSTZ 6 D1 AVDD 10 5 21 RREF TEST 4 D0 DP 11 3 20 DM LED 2 SD_CLK SDA 12 1 19 SCL D2 Figure 3.2 - 24 Pin QFN (A) Pin out Diagram ©2010 Genesys Logic, Inc. - All rights reserved. Page 9 SD_CLK 6 AVDD 13 GPIO6 5 RREF 14 DVDD 4 DP 15 PMOS 3 DM 16 SD_CMD 2 SDA 17 1 SCL 18 D3 GL823 Datasheet Figure 3.3 - 24 Pin QFN (B) Pin out Diagram ©2010 Genesys Logic, Inc. - All rights reserved. Page 10 GL823 Datasheet 3.3 Pin List/Descriptions Table 3.1 - GL823 Pin List/Descriptions Pin Name SSOP 24 pin QFN 24 pin (A) QFN Type 24 pin (B) Description Power/Ground DVDD 6, 14 13,23 15,23 P 3.3V Digital power AVDD 21 6 6 P 3.3V Analog power VBUS 15 - 24 P 5V Power source GND 5, 22 24 7 P PMOS 7 14 16 P Ground Card power: 300mA, Drain-Source On-Resistance (RDS)= 1 (Max.) @3.3V, 25°C G1 - Die Pad Die Pad P Ω Ground USB PHY Interface DM 18 3 3 A USB D- DP 19 4 4 A RREF 20 5 5 A USB D+ USB reference resistor. This pin is used to control the level of USB signal. A 680Ohm, 1% resistor is recommended to be laid between RREF and GND SD Card Interface SD Write Protect signal 9 I, pu 0: Write enable 1: Write protect SD/MMC Card Detect signal 10 I, pu 0: Card insert 1: No card SD_WP 24 8 SD_CDZ 1 9 SD_CLK 4 12 13 SD_CMD 8 16 17 D[3:0] O SD/MMC Clock signal B, pu SD/MMC Command signal 9, 10, 2, 3 18,19,10,11 18,19,11,12 B, pu SD/MMC Data signal Others RSTZ 23 7 8 I, pu This pin is used to reset the chip, active-low TEST 12 21 21 This pin is used to test the chip. I, pd 0: Normal operation 1: Test mode GPIO3 13 22 22 B Hardware configuration GPIO6 5 - 14 B Hardware configuration GPIO8 - 15 - B Hardware configuration GPIO9 - 17 - B Hardware configuration LED 11 20 20 O Power & Access LED SCL 16 1 1 B Serial EEPROM Clock signal SDA 17 2 2 B Serial EEPROM Data signal Notation: ©2010 Genesys Logic, Inc. - All rights reserved. Page 11 GL823 Datasheet Type O I B pu pd P A Output Input Bi-directional Internal pull-up when input Internal pull-down when input Power / Ground Analog Note: 1. AVDD connect to DVDD through Bead 2. All I/O pads are Schmitt trigger and 8mA drive current ©2010 Genesys Logic, Inc. - All rights reserved. Page 12 GL823 Datasheet CHAPTER 4 BLOCK DIAGRAM Figure 4.1 - Functional Block Diagram 4.1 OCCS USB PHY The USB 2.0 Transceiver Macrocell is the analog circuitry that handles the low level USB protocol and signaling, and shifts the clock domain of the data from the USB 2.0 rate to one that is compatible with the general logic. On chip clock source and no need of 12MHz Crystal Clock input. 4.2 SIE The Serial Interface Engine, which contains the USB PID and address recognition logic, and other sequencing and state machine logic to handle USB packets and transactions. 4.3 EPFIFO Endpoint FIFO includes Control FIFO (FIFO0), interrupt FIFO (FIFO3), Bulk In/Out FIFO (BULKFIFOA/B)
Control FIFO FIFO of control endpoint 0. It is 64-byte FIFO and used for endpoint 0 data transfer.
Interrupt FIFO 64-byte depth FIFO of endpoint 3 for status interrupt
Bulk In/Out FIFO It can be in the TX mode or RX mode: 1. It contains ping-pong FIFO (512 bytes each bank) for transmit/receive data continuously. 2. It can be directly accessed by uC 4.4 MCU 8051 micro-controller inside.
8051 Core Compliant with Intel 8051 high speed micro-controller
ROM FW code on ROM
SRAM Internal RAM area for MCU access ©2010 Genesys Logic, Inc. - All rights reserved. Page 13 GL823 Datasheet 4.5 MHE
MIF
MCFIFO Media Interface: SD/MMC It can access by MCU for memory card short data packet. 4.6 Regulator
5V to 3.3V
3.3V to 1.8V Band Gap Regulator for stable voltage supply for USB PHY, PMOS. When Power source is 3.3V, the 5V to 3.3V regulator will be disabled. For core logic and internal memory. 4.7 PMOS On-Chip power MOSFETs provide Over-Current protection mechanism. ©2010 Genesys Logic, Inc. - All rights reserved. Page 14 GL823 Datasheet CHAPTER 5 ELECTRICAL CHARACTERISTICS 5.1 Absolute Maximum Ratings Table 5.1 - Absolute Maximum Ratings Parameter Value Storage Temperature -65°C to +150 °C Ambient Temperature -40°C to +80 °C 5.2 Operating Conditions Table 5.2 - Operating Conditions Parameter Value Ta (Ambient Temperature Under Bias) 0°C to 70°C Supply Voltage SSOP-24 & QFN-24(B) 4.75V to 5.25V QFN-24(A) 3.14V to 3.46V Ground Voltage 0V 5.3 DC Characteristics Table 5.3 - DC Characteristics Symbol V5 V3.3 Parameter Supply Voltage for SSOP-24 & QFN-24(B) Supply Voltage for QFN-24(A) Condition Min. Typ. Max. Unit 5V power source 4.75 - 5.25 V 3.3V power source 3.14 - 3.46 V VIH Input High Voltage 2.0 - - V VIL Input Low Voltage - - 0.4 V II Input Leakage Current 0 < VIN < DVDD -10 - 10 µA VOH Output High Voltage DVDD = 3.3V 3.0 - - V VOL Output Low Voltage - - 0.4 V IOH Output Current High - 8 - mA IOL Output Current Low - 8 - mA CIN Input Pin Capacitance - 5 - pF - 33 - mA - 16 - mA - 38 - mA - 11 - mA - - 450 µA - - 300 µA INORMAL IRESET ISUS AVDD Supply current DVDD Supply current AVDD Reset current 5V/3.3V power source 5V/3.3V power source DVDD Reset current SSOP-24 & QFN-24(B) 1.5K pull-up included Suspend current QFN-24(A) ©2010 Genesys Logic, Inc. - All rights reserved. Page 15 GL823 Datasheet IPS Rpu Rpd SSOP-24 & QFN-24(B) QFN-24(A) - - 200 µA - - 30 µA Reset Pad pull-up - 10 - SD_CMD/GPIO Pad pull-up - 20 - SD_DATA Pad pull-up - 50 - SD_CMD/GPIO Pad pull-down - 20 - SD_DATA Pad pull-down - 50 - Power saving current Ω KΩ KΩ KΩ KΩ K 5.4 5V to 3.3V Regulator Characteristics Table 5.4 - Regulator Output Current Parameters Description Test Conditions Min. Typ. Max. Unit Iq Quiescent current No loading - 18 - uA Io Output driving capability DVDD > 3.2V - - 350 mA Io_0mA DVDD without loading - 3.38 - V Io_200mA DVDD with 200mA loading - 3.31 - V Io_350mA DVDD with 350mA loading - 3.24 - V ( VBUS = 5V, Temperature 25 °C) Figure 5.1 - 5V to 3.3V Regulator Architecture ©2010 Genesys Logic, Inc. - All rights reserved. Page 16 GL823 Datasheet 5.5 PMOS Characteristics Table 5.5 - PMOS I-V Table Driving Loading (I) PMOS Output Voltage 100mA 3.21V 200mA 3.12V 300mA 3.01V 330mA Turn Off * ( DVDD = 3.3V, Temperature 25 °C) Note: PMOS turn off by over-current protection mechanism when loading over 330mA. Figure 5.2 - Embedded PMOS Switch Architecture 5.6 AC Characteristics 5.6.1 Reset Timing Figure 5.3 - Timing Diagram of Reset Width ©2010 Genesys Logic, Inc. - All rights reserved. Page 17 GL823 Datasheet Figure 5.4 - Timing Diagram of Power Good to USB Command Receive Ready Table 5.6 - Reset Timing Parameter Description Min. Unit Trst Chip reset sense timing width 2 us T1 AVDD power up to reset de-assert 500 us T2 Reset de-assert to respond USB command ready 42 ms 5.6.2 SD/MMC Card Clock Frequency Table 5.7 - SD/MMC Card Clock Frequency Parameter Description Typ. Unit FID Clock frequency Identification Mode 387 KHz FDS Clock frequency Default Speed Mode 24 MHz FHS Clock frequency High Speed Mode 48 MHz ©2010 Genesys Logic, Inc. - All rights reserved. Page 18 GL823 Datasheet CHAPTER 6 PACKAGE DIMENSION Internal No. Green Package + AU Wire GL823 Version No. AAAAAAAGAA YWWXXXXXXXX Date Code Lot Code Figure 6.1 - SSOP 24 Pin Package ©2010 Genesys Logic, Inc. - All rights reserved. Page 19 GL823 Datasheet GL823 Version AAAAAAA No. YWWXXXX Internal No. Date Code Lot Code Figure 6.2 - QFN 24 Pin Package ©2010 Genesys Logic, Inc. - All rights reserved. Page 20 GL823 Datasheet CHAPTER 7 ORDERING INFORMATION Table 7.1 - Ordering Information Part Number Package Green/Wire Material Version Status GL823-HGGXX SSOP 24 Green Package + AU Wire XX Available GL823-OGG*XX QFN 24 Green Package + AU Wire XX Available *The marking of "OGG" will not be shown on the IC due to QFN 24 package size limitation. ©2010 Genesys Logic, Inc. - All rights reserved. Page 21