ECLAMP2410P.TCT

EClamp2410P ESD Protection Device for T-Flash/MicroSD Interfaces PRELIMINARY PROTECTION PRODUCTS - EMIClampTM Description Features The EClampTM2410P is combination EMI filter and line termination device with integrated TVS diodes for use on Multimedia Card interfaces. This state-of-the-art device utilizes solid-state silicon-avalanche technology for superior clamping performance and DC electrical characotection of TT-teristics. They have been optimized for pr pro er oSD int Flash/Micr erffaces in cellular phones and other inter Flash/MicroSD portable electronics. The device consists of six circuits that include series impedance matching resistors and pull up resistors as required by the SD specification. TVS diodes are included on each line for ESD protection. An additional TVS diode connection is included for protection of the voltage (Vdd) bus. Termination resistor value of 45 Ohms is included on the DAT0, DAT1, DAT2, DAT3, CMD, and CLK lines. Pull up resistors of 15k Ohms are included on DAT0, DAT1, DAT2, and CMD lines while a 50k Ohm pull up is inlcuded on the DAT3 line. These may be configured for devices operating in SD or SPI mode . The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. Bidirectional EMI/RFI filtering and line termination with integrated ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) TVS working voltage: 5V Termination Resistors: 45Ω Pull Up Resistors: 15kΩ (3 each) and 50kΩ Typical Capacitance per Line: 12pF (VR = 2.5V) Protection and termination for six lines + Vdd Solid-state technology Mechanical Characteristics SLP4016P16 16-pin package RoHS/WEEE Compliant Nominal Dimensions: 4.0 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead finish: NiPdAu Marking: Marking Code Packaging: Tape and Reel Applications T-Flash / MicroSD Interfaces MMC Interfaces CDMA, GSM, 3G Cell Phones The EClamp2410P is in a 16-pin, RoHS/WEEE compliant, SLP4016P16 package. It measures 4.0 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. Package Configuration Pin Configuration 4.00 DAT1 In DAT0 In CLK In 1 16 DAT1 Out 1 2 DAT0 Out 1.60 CLK Out Rup1 Rup3 Vdd Rup2 CMD In CMD Out DAT3 In DAT3 Out DAT2 In DAT2 Out 0.50 BSC 0.58 Pin Designation (Top View) Revision 10/26/2007 16 Pin SLP package (Bottom Side View) Nominal Dimensions in mm 1 EClamp2410P PRELIMINARY PROTECTION PRODUCTS Pin Identification and Configuration Pin Symbol Identification 1, 16 DAT1 Data line #1 input/output with pull-up resistor 2, 15 DAT0 Data line #0 Input/Output 3, 14 Clock Clock line Input/Output 4 Rup1 15K Pull-up resistor from DAT1 & DAT2 5 Vdd Power Supply ESD Protection 6, 11 CMD Command Line Input/Output 7, 10 DAT3 Data line #3 input/output with pull-up resistor 8, 9 DAT2 Data line #2 input/output with pull-up resistor 12 Rup2 50K Pull-Up Resistor from DAT3 13 Rup3 VCC Circuit 3A Center tab GND Ground connection 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 Pin Configuration (Top View) Schematics & Component Values Pin 1, 8 45 Ohms Pin 4 Pin 12 Rup 15K Rup 50K Pin 7 Pin 9, 16 45 Ohms DAT1, DAT2 Pin 10 DAT3 DAT0, CMD Line Pin 13 Rup 15K Pin 3 45 Ohms CLK  2007 Semtech Corp. Pin 14 Pin 5 Vdd 2 Pin 2, 6 45 Ohms DAT0, CMD Pin 11, 15 8 EClamp2410P PRELIMINARY PROTECTION PRODUCTS Maximum Ratings R ating Symbol Value Units VESD +/- 17 +/- 12 kV Junction Temp erature TJ 125 o Op erating Temp erature Top -40 to +85 o Storage Temp erature TSTG -55 to +150 o ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) C C C Electrical Characteristics (T = 25oC) P ar am et er S y m b ol Con d i t i on s T VS Reverse Stand-Off Voltage VRWM T VS Reverse Breakdown Voltage V BR It = 1mA T VS Reverse Leakage Current IR VRWM = 3.0V Series Resistors R Each Line Mi n i mu m 6 Ty p i c a l 8 M ax i m u m Units 5 V 10 V 0.5 µA 38 45 52 Ohms DAT Pull Up Resistor 1 Rup 1 12 15 17 k Ohms DAT Pull Up Resistor 2 Rup 2 42 50 58 k Ohms Total Cap acitance Cin 10 12 15 pF  2007 Semtech Corp. Inp ut to Gnd, Each Line VR = 2.5V, f = 1MHz 3 EClamp2410P PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1 S21 LOG ESD Clamping (8kV Contact per IEC 61000-4-2) 6 dB / REF 0 dB 1: -6.145 dB 300 MHz 2: -14.437 dB 900 MHz 0 dB 3: -23.847 dB 1.8 GHz -6 dB 1 -12 dB 4: -32.024 dB 2.5 GHz 2 -18 dB -24 dB 3 -30 dB 4 -36 dB -42 dB -48 dB 1 MHz 10 MHz 3 1 GHz GHz 100 MHz STOP 3 000. 000000 MHz START. 030 MHz Note: Data is taken with a 10x attenuator Normalized Capacitance vs. Reverse Voltage Series Resistance vs. Temperature 50 1.2 f =1MHz 49 Series Resistance (Ohm) CJ(V R) / CJ(V R=0) 1 0.8 0.6 0.4 0.2 48 47 46 45 44 43 42 41 0 40 0 0.5 1 1.5 2 2.5 3 ReverseVoltage- VR(V) 3.5 4 4.5 -40 5 -10 5 20 35 0 Temperature ( C) 50 65 80 Pull Up Resistance (Rup2) vs. Temperature 16200 58000 16100 57000 16000 56000 Pull Up Resistance (Ohm) Pull Up Resistance (Ohm) Pull Up Resistance (Rup1) vs. Temperature -25 15900 15800 15700 15600 15500 15400 15300 55000 54000 53000 52000 51000 50000 49000 15200 -40 -30 -20 -10 0 10 20 30 o 40 50 60 70 48000 80 -40 Temperature ( C)  2007 Semtech Corp. -30 -20 -10 0 10 20 30 o 40 Temperature ( C) 4 50 60 70 80 EClamp2410P PRELIMINARY PROTECTION PRODUCTS Applications Information Device Connection Figure 1 - Pin Identification and Configuration (Top Side View) The EClamp2410P is a microSD/T-Flash interface device designed for use in cell phones and other portable electronic devices. The EClamp2410P is comprised of series and pull up resistors required on the microSD interface. Each line also includes TVS diodes for ESD protection. The device may be configured for SD or SPI mode operation. In SD mode for example, the 15k Ohm pull up resistors (Rup 1 and Rup 3) are connected to VDD. In SPI mode pin 4 is not connected (Rup 1) since these are reserved lines. The 50k Ohm pull up resistor is used for card detection or SPI mode selection during power up and is disconnected by the user during regular data transfer. The EClamp2410P is in a 16-pin SLP package. Electrical connection is made to the 16 pins located at the bottom of the device. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. A center tab serves as the ground connection. Recommendations for the ground connection are given below. Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering and ESD performance of the device. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Figure 2 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance. DAT1 In DAT0 In CLK In 16 DAT1 Out DAT0 Out CLK Out Rup1 Rup3 Vdd Rup2 CMD In CMD Out DAT3 In DAT3 Out DAT2 In DAT2 Out Figure 2 - Recommended Layout using Ground Vias The ESD transient return path to ground should be kept as short as possible. Whenever possible, use multiple micro vias connected directly from the device ground pad to the ground plane. Avoid running critical signals near board edges. Layout Guidelines for Optimum ESD Protection Good circuit board layout is critical not only for signal integrity, but also for effective suppression of ESD induced transients. For optimum ESD protection, the following guidelines are recommended: Place the device as close to the connector as possible. This practice restricts ESD coupling into adjacent traces and reduces parasitic inductance.  2007 Semtech Corp. 1 5 EClamp2410P PRELIMINARY MicroSD Connector PROTECTION PRODUCTS Applications Information DAT 1 IN DAT 1 OUT DAT 0 IN DAT 0 OUT CLK IN CLK OUT Rup 15KΩ Rup 15KΩ VDD Rup 50KΩ CMD IN CMD OUT DAT 3 IN DAT 3 OUT DAT 2 IN DAT 2 OUT EClamp2410P Figure 3 - MicroSD Protection  2007 Semtech Corp. 6 Host IC EClamp2410P PRELIMINARY PROTECTION PRODUCTS Applications Information - Spice Model Pin 12 Pin 4, 13 Rup 50K Rup 15K Pin 1, 8, 2, 6 45 Ohms D1 Pin 7 Pin 9, 16, 11, 15 45 Ohms Pin 10 D1 D1 D1 DAT3 DAT1, DAT2, DAT0, CMD Pin 5 Pin 3 45 Ohms Pin 14 D1 D1 D1 CLK Vdd EClamp2410P Spice Model EClamp2410P Spice Parameters  2007 Semtech Corp. Parameter Unit D1 (T VS) IS A mp 2E-15 BV Volt 7.46 VJ Volt 0.777 RS Ohm 1.00 IB V Amp 1E-3 CJO Farad 10E-12 TT sec 2.541E-9 M -- 0.246 N -- 1.1 EG eV 1.11 7 EClamp2410P PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SLP4016P16 A B D DIM E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C A2 C A1 D1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 0.50 0.58 0.65 .000 .001 .002 0.00 .003 0.05 (0.13) (.005) .007 .010 .012 0.20 0.25 0.30 .153 .157 .161 3.90 4.00 4.10 .122 .126 .130 3.10 3.20 3.30 .059 .063 .067 1.50 1.60 1.70 .010 .016 .020 0.25 0.40 0.50 0.50 BSC .020 BSC .011 .013 .015 0.28 0.33 0.38 16 16 0.08 .003 0.10 .004 1 2 LxN E/2 E1 N bxN e bbb C A B D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP4016P16 P X Z F G Y (C) DIM B C F G P X Y Z DIMENSIONS INCHES MILLIMETERS .130 3.30 .060 1.52 .018 0.45 .035 0.89 .020 0.50 .012 0.30 .025 0.63 .085 2.15 B NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET  2007 Semtech Corp. 8 EClamp2410P PRELIMINARY PROTECTION PRODUCTS Marking Ordering Information 2410P YX PIN 1 INDICATOR (LASER MARK) Part Number Qty per Reel Reel Size EClamp2410P.TCT 3000 7 Inch EMIClamp and EClamp are marks of Semtech Corporation Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.78 +/-0.10 mm B0 K0 4.30 +/-0.10 mm 0.74 +/-0.10 mm Tape Width B, (Max) D D1 12 mm 8.2 mm (.476) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 1.0 mm ±0.05 (.039)  2007 Semtech Corp. E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 5.5±0.05 mm (.217±.002) 4.5 mm (.177) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 12.0 mm + 0.3 mm - 0.1 mm (.472±.012) 9